APTGF50H60T3 [MICROSEMI]

Insulated Gate Bipolar Transistor, 65A I(C), 600V V(BR)CES, N-Channel, MODULE-25;
APTGF50H60T3
型号: APTGF50H60T3
厂家: Microsemi    Microsemi
描述:

Insulated Gate Bipolar Transistor, 65A I(C), 600V V(BR)CES, N-Channel, MODULE-25

晶体 晶体管 电动机控制 双极性晶体管 局域网
文件: 总6页 (文件大小:294K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APTGF50H60T3G  
VCES = 600V  
Full - Bridge  
IC = 50A @ Tc = 80°C  
NPT IGBT Power Module  
Application  
13 14  
Welding converters  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
Q1  
Q3  
CR1  
22  
CR3  
11  
10  
18  
19  
Features  
Non Punch Through (NPT) Fast IGBT®  
7
8
-
-
-
-
-
-
-
-
Low voltage drop  
23  
Low tail current  
Q2  
29  
Q4  
Switching frequency up to 50 kHz  
Soft recovery parallel diodes  
Low diode VF  
CR2  
CR4  
26  
27  
4
3
Low leakage current  
Avalanche energy rated  
RBSOA and SCSOA rated  
Symmetrical design  
30  
31  
32  
-
15  
16  
R1  
Kelvin emitter for easy drive  
Very low stray inductance  
High level of integration  
Internal thermistor for temperature monitoring  
28 27 26 25  
23 22  
20 19 18  
29  
30  
16  
Benefits  
15  
Outstanding performance at high frequency  
operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal  
for easy PCB mounting  
31  
32  
14  
13  
2
3
4
7
8
10 11  
12  
Low profile  
Easy paralleling due to positive TC of VCEsat  
Each leg can be easily paralleled to achieve a  
phase leg of twice the current capability  
RoHS compliant  
All multiple inputs and outputs must be shorted together  
Example: 13/14 ; 29/30 ; 22/23 …  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
600  
65  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
IC  
Continuous Collector Current  
A
50  
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
230  
±20  
250  
V
W
TC = 25°C  
Tj = 125°C  
RBSOA Reverse Bias Safe Operating Area  
100A @ 500V  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 - 6  
www.microsemi.com  
APTGF50H60T3G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
250  
VGE = 0V  
ICES  
Zero Gate Voltage Collector Current  
µA  
VCE = 600V  
500  
1.7  
4
2.0  
2.2  
2.45  
VGE =15V  
VCE(sat) Collector Emitter Saturation Voltage  
VGE(th) Gate Threshold Voltage  
IGES  
V
IC = 50A  
VGE = VCE , IC = 1mA  
6
400  
V
nA  
Gate – Emitter Leakage Current  
VGE = 20V, VCE = 0V  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Qg  
Qge  
Qgc  
Input Capacitance  
2200  
VGE = 0V  
VCE = 25V  
f = 1MHz  
pF  
Output Capacitance  
323  
200  
166  
20  
Reverse Transfer Capacitance  
Total gate Charge  
Gate – Emitter Charge  
Gate – Collector Charge  
VGE = 15V  
VBus = 300V  
IC = 50A  
nC  
100  
40  
Inductive Switching (25°C)  
VGE = 15V  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
Tf Fall Time  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
9
120  
VBus = 400V  
ns  
IC = 50A  
RG = 2.7  
12  
42  
Inductive Switching (125°C)  
VGE = 15V  
10  
130  
21  
ns  
VBus = 400V  
IC = 50A  
Tf  
Fall Time  
RG = 2.7Ω  
VGE = 15V  
Tj = 125°C  
VBus = 400V  
Eon  
Turn-on Switching Energy  
0.5  
mJ  
IC = 50A  
Eoff  
Turn-off Switching Energy  
Tj = 125°C  
RG = 2.7Ω  
1
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
VRRM  
IRM  
IF  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
600  
V
µA  
A
Tj = 25°C  
VR=600V  
250  
500  
Tj = 125°C  
DC Forward Current  
Tc = 70°C  
IF = 30A  
30  
1.6  
1.9  
1.4  
1.8  
IF = 60A  
VF  
Diode Forward Voltage  
V
IF = 30A  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
85  
160  
130  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
IF = 30A  
VR = 400V  
di/dt =200A/µs  
Qrr  
nC  
Tj = 125°C  
700  
2 - 6  
www.microsemi.com  
APTGF50H60T3G  
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).  
Symbol Characteristic  
R25 Resistance @ 25°C  
B25/85 T25 = 298.15 K  
Min Typ Max Unit  
50  
kΩ  
K
3952  
R25  
T: Thermistor temperature  
RT: Thermistor value at T  
RT  
=
1
1
T
25/85   
exp B  
T25  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.5  
RthJC  
Junction to Case Thermal Resistance  
°C/W  
1.2  
VISOL  
TJ  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
2500  
-40  
-40  
-40  
2.5  
V
150  
125  
100  
4.7  
°C  
TSTG  
TC  
Operating Case Temperature  
Torque Mounting torque  
Wt  
To heatsink  
M4  
N.m  
g
Package Weight  
110  
SP3 Package outline (dimensions in mm)  
2 8  
1 7  
1
12  
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com  
3 - 6  
www.microsemi.com  
APTGF50H60T3G  
Typical Performance Curve  
Output characteristics (VGE=15V)  
Output Characteristics (VGE=10V)  
150  
100  
50  
0
150  
100  
50  
TJ=-55°C  
250µs Pulse Test  
< 0.5% Duty cycle  
250µs Pulse Test  
TJ=-55°C  
< 0.5% Duty cycle  
TJ=25°C  
TJ=25°C  
TJ=125°C  
TJ=125°C  
3
0
0
1
2
3
4
0
1
2
4
VCE, Collector to Emitter Voltage (V)  
VCE, Collector to Emitter Voltage (V)  
Transfer Characteristics  
Gate Charge  
150  
125  
100  
75  
18  
16  
14  
12  
10  
8
250µs Pulse Test  
< 0.5% Duty cycle  
VCE=120V  
VCE=300V  
IC = 50A  
J = 25°C  
T
VCE =480V  
6
50  
TJ=125°C  
4
2
25  
TJ=-55°C  
TJ=25°C  
0
0
0
25  
50  
75 100 125 150 175 200  
0
1
2
3
4
5
6
7
8
9
10  
VGE, Gate to Emitter Voltage (V)  
Gate Charge (nC)  
On state Voltage vs Junction Temperature  
On state Voltage vs Gate to Emitter Volt.  
8
7
6
5
4
3
2
1
0
4
3.5  
3
TJ = 25°C  
250µs Pulse Test  
< 0.5% Duty cycle  
Ic=100A  
Ic=50A  
Ic=100A  
2.5  
2
1.5  
1
Ic=50A  
Ic=25A  
Ic=25A  
250µs Pulse Test  
< 0.5% Duty cycle  
0.5  
0
V
GE = 15V  
6
8
10  
12  
14  
16  
-50 -25  
0
25  
50  
75  
100 125  
V
GE, Gate to Emitter Voltage (V)  
TJ, Junction Temperature (°C)  
Breakdown Voltage vs Junction Temp.  
DC Collector Current vs Case Temperature  
80  
70  
60  
50  
40  
30  
20  
10  
0
1.20  
1.10  
1.00  
0.90  
0.80  
0.70  
-50 -25  
0
25  
50  
75 100 125  
-50 -25  
0
25 50 75 100 125 150  
TJ, Junction Temperature (°C)  
TC, Case Temperature (°C)  
4 - 6  
www.microsemi.com  
APTGF50H60T3G  
Turn-On Delay Time vs Collector Current  
Turn-Off Delay Time vs Collector Current  
60  
50  
40  
30  
20  
200  
175  
150  
125  
100  
75  
VGE = 15V  
VGE=15V,  
TJ=125°C  
Tj = 125°C  
V
R
CE = 400V  
G = 2.7  
VGE=15V,  
TJ=25°C  
VCE = 400V  
G = 2.7Ω  
R
50  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
ICE, Collector to Emitter Current (A)  
ICE, Collector to Emitter Current (A)  
Current Rise Time vs Collector Current  
Current Fall Time vs Collector Current  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
VCE = 400V  
VCE = 400V, VGE = 15V, RG = 2.7Ω  
R
G = 2.7Ω  
TJ = 125°C  
VGE=15V,  
TJ=125°C  
TJ = 25°C  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
ICE, Collector to Emitter Current (A)  
I
CE, Collector to Emitter Current (A)  
Turn-Off Energy Loss vs Collector Current  
Turn-On Energy Loss vs Collector Current  
2.5  
2
2
VCE = 400V  
TJ=125°C,  
VGE=15V  
VCE = 400V  
VGE = 15V  
TJ = 125°C  
R
G = 2.7Ω  
1.5  
1
RG = 2.7Ω  
1.5  
1
0.5  
0
0.5  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
ICE, Collector to Emitter Current (A)  
ICE, Collector to Emitter Current (A)  
Switching Energy Losses vs Gate Resistance  
Reverse Bias Safe Operating Area  
3
120  
100  
80  
60  
40  
20  
0
VCE = 400V  
V
GE = 15V  
2.5  
2
TJ= 125°C  
Eon, 50A  
Eoff, 50A  
1.5  
1
0.5  
0
Eon, 50A  
0
200  
400  
600  
0
5
10  
15  
20  
25  
VCE, Collector to Emitter Voltage (V)  
Gate Resistance (Ohms)  
5 - 6  
www.microsemi.com  
APTGF50H60T3G  
Capacitance vs Collector to Emitter Voltage  
10000  
Operating Frequency vs Collector Current  
240  
200  
160  
120  
80  
VCE = 400V  
D = 50%  
RG = 2.7  
Cies  
T = 125°C  
J
TC= 75°C  
1000  
100  
Coes  
ZCS  
ZVS  
60  
hard  
40  
switching  
Cres  
0
0
10  
20  
30  
40  
50  
0
20  
40  
80  
100  
V
CE, Collector to Emitter Voltage (V)  
IC, Collector Current (A)  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.9  
0.7  
0.5  
0.3  
0.1  
0.05  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
6 - 6  
www.microsemi.com  

相关型号:

APTGF50H60T3G

Full - Bridge NPT IGBT Power Module
ADPOW

APTGF50H60T3G

Full - Bridge NPT IGBT Power Module
MICROSEMI

APTGF50SK120T

Buck chopper NPT IGBT Power Module
ADPOW

APTGF50SK120T1G

Buck chopper NPT IGBT Power Module
MICROSEMI

APTGF50SK120TG

Buck chopper NPT IGBT Power Module
MICROSEMI

APTGF50TA120P

Triple phase leg NPT IGBT Power Module
ADPOW

APTGF50TA120PG

Triple phase leg NPT IGBT Power Module
MICROSEMI

APTGF50TDU120P

Triple dual Common Source NPT IGBT Power Module
ADPOW

APTGF50TDU120PG

Triple dual Common Source NPT IGBT Power Module
MICROSEMI

APTGF50TL60T3G

Three level inverter NPT IGBT Power Module
MICROSEMI

APTGF50VDA120T3G

Dual Boost chopper NPT IGBT Power Module
MICROSEMI

APTGF50VDA60T3G

Dual Boost Chopper NPT IGBT Power Module
MICROSEMI