CSPEMI307AG [ONSEMI]

4-Channel ESD/EMI Filter Array Plus 4-Channel ESD Array for USB; 4通道ESD / EMI滤波器阵列加4通道ESD阵列的USB
CSPEMI307AG
型号: CSPEMI307AG
厂家: ONSEMI    ONSEMI
描述:

4-Channel ESD/EMI Filter Array Plus 4-Channel ESD Array for USB
4通道ESD / EMI滤波器阵列加4通道ESD阵列的USB

文件: 总12页 (文件大小:372K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
4-Channel ESD/EMI Filter Array Plus  
4-Channel ESD Array for USB  
CSPEMI307A  
Features  
Product Description  
Four channels of combined EMI/RFI filtering +  
ESD protection  
Four additional channels of ESD-only protection  
EMI/ESD channels provide greater than 32dB  
attenuation at 1GHz  
The CSPEMI307A is a multichannel EMI/ESD array  
offering a combination of four low-pass filter + ESD  
channels to reduce EMI/RFI emissions on a data port  
and four dedicated ESD-only channels intended  
specifically for ESD protection on a USB port. Each  
EMI/RFI channel integrates a high quality pi-style  
filter (C-R-C) which provides greater than 30dB  
attenuation in the 800-2700 MHz range. These pi-  
style filters support bidirectional filtering, controlling  
EMI both to and from a data port connector.  
15kV ESD protection on all channels  
(IEC 61000-4-2 Level 4, contact discharge)  
30kV ESD protection on all channels (HBM)  
Chip Scale Package features extremely low  
lead inductance for optimum filter and ESD  
performance  
15-bump, 2.960mm X 1.330mm footprint  
Chip Scale Package (CSP)  
Lead-free version available  
The CSPEMI307A provides a high-level of ESD  
protection on all eight channels for sensitive  
electronic components that may be subjected to  
electrostatic discharge (ESD). The input pins are  
designed and characterized to safely dissipate ESD  
Applications  
EMI filtering and ESD protection for both data  
and I/O ports  
strikes of  
15kV, exceeding the maximum  
requirement of the IEC 61000-4-2 international  
standard. Using the MIL-STD-883 (Method 3015)  
specification for Human Body Model (HBM) ESD, the  
device provides protection for contact discharges to  
greater than 30kV.  
Outer 4 channels provide ESD protection for  
USB lines and other I/O port applications  
Wireless Handsets  
Handheld PCs / PDAs  
MP3 Players  
Notebooks  
Desktop PCs  
The CSPEMI307A is particularly well suited for  
portable electronics (e.g., cellular telephones, PDAs,  
notebook computers) because of its small package  
footprint and low weight. The CSPEMI307A is  
available in a space-saving, low-profile Chip Scale  
Package with optional lead-free finishing.  
©2010 SCILLC. All rights reserved.  
May 2010 Rev. 2  
Publication Order Number:  
CSPEMI307A/D  
CSPEMI307A  
Electrical Schematic  
Lead-free devices are specified by using a "+" character for the top side orientation mark.  
Rev. 2 | Page 2 of 12 | www.onsemi.com  
CSPEMI307A  
PIN DESCRIPTIONS  
PIN(s)  
NAME  
DESCRIPTION  
A1  
ESD_1  
ESD Channel 1  
A2  
A3  
FILTER+ESD_1  
FILTER+ESD_2  
FILTER+ESD_3  
FILTER+ESD_4  
ESD_2  
Filter + ESD Channel 1  
Filter + ESD Channel 2  
Filter + ESD Channel 3  
Filter + ESD Channel 4  
ESD Channel 2  
A4  
A5  
A6  
B1-B3  
C1  
GND  
Device Ground  
ESD_3  
ESD Channel 3  
C2  
FILTER+ESD_1  
FILTER+ESD_2  
FILTER+ESD_3  
FILTER+ESD_4  
ESD_4  
Filter + ESD Channel 1  
Filter + ESD Channel 2  
Filter + ESD Channel 3  
Filter + ESD Channel 4  
ESD Channel 4  
C3  
C4  
C5  
C6  
Ordering Information  
PART NUMBERING INFORMATION  
Standard Finish  
Lead-free Finish2  
Ordering Part  
Number1  
Ordering Part  
Number1  
Bumps  
Package  
Part Marking  
Part Marking  
15  
CSP  
CSPEMI307A  
307A  
CSPEMI307AG  
307A  
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.  
Note 2: Lead-free devices are specified by using a " " character for the top side orientation mark.  
+
Rev. 2 | Page 3 of 12 | www.onsemi.com  
CSPEMI307A  
Specifications  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
RATING  
UNITS  
Storage Temperature Range  
-65 to +150  
°C  
DC Power per Resistor  
100  
600  
mW  
mW  
DC Package Power Rating  
STANDARD OPERATING CONDITIONS  
PARAMETER  
RATING  
UNITS  
Operating Temperature Range  
-40 to +85  
°C  
Rev. 2 | Page 4 of 12 | www.onsemi.com  
CSPEMI307A  
ELECTRICAL OPERATING CHARACTERISTICS1  
SYMBOL PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
R
Resistance  
80  
100  
120  
C
Capacitance  
At 2.5V DC  
24  
30  
36  
pF  
ppm/°C  
ppm/°C  
V
TCR  
TCC  
VDIODE  
ILEAK  
VSIG  
Temperature Coefficient of Resistance  
Temperature Coefficient of Capacitance  
Diode Voltage (reverse bias)  
Diode Leakage Current (reverse bias)  
1200  
-300  
At 2.5V DC  
IDIODE=10  
µA  
5.5  
VDIODE=3.3V  
ILOAD = 10mA  
100  
nA  
Signal Voltage  
Positive Clamp  
Negative Clamp  
5.6  
-0.4  
6.8  
-0.8  
9.0  
-1.5  
V
V
VESD  
In-system ESD Withstand Voltage  
a) Human Body Model, MIL-STD-883,  
Method 3015  
Notes 2 and 4  
30  
15  
kV  
kV  
b) Contact Discharge per IEC 61000-4-2  
Level 4  
VCL  
Clamping Voltage during ESD Discharge  
MIL-STD-883 (Method 3015), 8kV  
Positive Transients  
Notes 2,3 and 4  
+10  
- 5  
V
V
Negative Transients  
fC  
Cut-off frequency  
ZSOURCE = 50, ZLOAD = 50Ω  
R = 100  
, C = 30pF  
64  
MHz  
Note 1: TA=25°C unless otherwise specified.  
Note 2: ESD applied to input and output pins with respect to GND, one at a time.  
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin  
A2, then clamping voltage is measured at Pin C2.  
Note 4: Unused pins are left open.  
Rev. 2 | Page 5 of 12 | www.onsemi.com  
CSPEMI307A  
Performance Information  
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)  
Figure 1. Insertion Loss VS. Frequency (A2-C2 to GND B2)  
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)  
Rev. 2 | Page 6 of 12 | www.onsemi.com  
CSPEMI307A  
Performance Information  
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)  
Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2)  
Figure 4. Insertion Loss VS. Frequency (A5-C5 to GND B2)  
Rev. 2 | Page 7 of 12 | www.onsemi.com  
CSPEMI307A  
Performance Information  
Typical Filter Performance (TA=25°C, 50 Ohm Environment)  
Figure 5. Comparison of Filter Response Curves for CSPEMI307A VS. DC Bias  
Rev. 2 | Page 8 of 12 | www.onsemi.com  
CSPEMI307A  
Performance Information (cont’d)  
Figure 6. Filter Capacitance vs. Input Voltage over Temperature  
(normalized to capacitance at 2.5VDC and 25°C)  
Figure 7. Resistance vs. Temperature  
(normalized to resistance at 25°C)  
Rev. 2 | Page 9 of 12 | www.onsemi.com  
CSPEMI307A  
Application Information  
PARAMETER  
VALUE  
Pad Size on PCB  
0.240mm  
Round  
Pad Shape  
Pad Definition  
Non-Solder Mask defined pads  
0.290mm Round  
Solder Mask Opening  
Solder Stencil Thickness  
0.125mm - 0.150mm  
0.300mm Round  
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)  
Solder Flux Ratio  
Solder Paste Type  
50/50 by volume  
No Clean  
Pad Protective Finish  
OSP (Entek Cu Plus 106A)  
Tolerance — Edge To Corner Ball  
+50  
+20  
µ
m
m
Solder Ball Side Coplanarity  
µ
Maximum Dwell Time Above Liquidous  
60 seconds  
260°C  
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder  
Paste  
Non-Solder MaskDefinedPad  
0.240mmDIA.  
Solder Stencil Opening  
0.300mmDIA.  
SolderMaskOpening  
0.290mmDIA.  
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration  
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile  
Rev. 2 | Page 10 of 12 | www.onsemi.com  
CSPEMI307A  
Mechanical Details  
CSP Mechanical Specifications  
The CSPEMI307A is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For  
complete information on the CSP, see the California Micro Devices CSP Package Information document.  
PACKAGE DIMENSIONS  
Custom CSP  
15  
Package  
Bumps  
Millimeters  
Min Nom Max  
Inches  
Nom  
Dim  
Min  
Max  
2.915 2.960 3.005 0.1148 0.1165 0.1183  
1.285 1.330 1.375 0.0506 0.0524 0.0541  
0.495 0.500 0.505 0.0195 0.0197 0.0199  
0.245 0.250 0.255 0.0096 0.0098 0.0100  
0.430 0.435 0.440 0.0169 0.0171 0.0173  
0.430 0.435 0.440 0.0169 0.0171 0.0173  
0.180 0.230 0.280 0.0071 0.0091 0.0110  
0.180 0.230 0.280 0.0071 0.0091 0.0110  
0.561 0.605 0.649 0.0221 0.0238 0.0256  
0.355 0.380 0.405 0.0140 0.0150 0.0160  
A1  
A2  
B1  
B2  
B3  
B4  
C1  
C2  
D1  
D2  
0.30 DIA.  
63/37 Sn/Pb (Eutectic) or  
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)  
SOLDER BUMPS  
Package Dimensions for  
CSPEMI307A Chip Scale Package  
3500 pieces  
# per tape and  
reel  
Controlling dimension: millimeters  
Rev. 2 | Page 11 of 12 | www.onsemi.com  
CSPEMI307A  
CSP Tape and Reel Specifications  
POCKET SIZE (mm) TAPE WIDTH  
W
REEL  
DIAMETER  
QTY PER  
REEL  
PART NUMBER  
CHIP SIZE (mm)  
B0 X A0 X K0  
P0  
P1  
CSPEMI307A  
2.96 X 1.33 X 0.605  
3.10 X 1.45 X 0.74  
8mm  
178mm (7")  
3500  
4mm 4mm  
Figure 11. Tape and Reel Mechanical Data  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any  
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising  
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”  
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating  
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the  
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to  
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or  
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors  
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such  
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action  
Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.   
   
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Rev. 2 | Page 12 of 12 | www.onsemi.com  

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