CSPEMI307AG [ONSEMI]
4-Channel ESD/EMI Filter Array Plus 4-Channel ESD Array for USB; 4通道ESD / EMI滤波器阵列加4通道ESD阵列的USB![CSPEMI307AG](http://pdffile.icpdf.com/pdf1/p00146/img/icpdf/CSPEM_809021_icpdf.jpg)
型号: | CSPEMI307AG |
厂家: | ![]() |
描述: | 4-Channel ESD/EMI Filter Array Plus 4-Channel ESD Array for USB |
文件: | 总12页 (文件大小:372K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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4-Channel ESD/EMI Filter Array Plus
4-Channel ESD Array for USB
CSPEMI307A
Features
Product Description
•
Four channels of combined EMI/RFI filtering +
ESD protection
Four additional channels of ESD-only protection
EMI/ESD channels provide greater than 32dB
attenuation at 1GHz
The CSPEMI307A is a multichannel EMI/ESD array
offering a combination of four low-pass filter + ESD
•
•
channels to reduce EMI/RFI emissions on a data port
and four dedicated ESD-only channels intended
specifically for ESD protection on a USB port. Each
EMI/RFI channel integrates a high quality pi-style
filter (C-R-C) which provides greater than 30dB
attenuation in the 800-2700 MHz range. These pi-
style filters support bidirectional filtering, controlling
EMI both to and from a data port connector.
•
15kV ESD protection on all channels
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on all channels (HBM)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
15-bump, 2.960mm X 1.330mm footprint
Chip Scale Package (CSP)
Lead-free version available
•
•
•
•
The CSPEMI307A provides a high-level of ESD
protection on all eight channels for sensitive
electronic components that may be subjected to
electrostatic discharge (ESD). The input pins are
designed and characterized to safely dissipate ESD
Applications
•
EMI filtering and ESD protection for both data
and I/O ports
strikes of
15kV, exceeding the maximum
requirement of the IEC 61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than 30kV.
•
Outer 4 channels provide ESD protection for
USB lines and other I/O port applications
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
•
•
•
•
•
Notebooks
Desktop PCs
The CSPEMI307A is particularly well suited for
portable electronics (e.g., cellular telephones, PDAs,
notebook computers) because of its small package
footprint and low weight. The CSPEMI307A is
available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing.
©2010 SCILLC. All rights reserved.
May 2010 Rev. 2
Publication Order Number:
CSPEMI307A/D
CSPEMI307A
Electrical Schematic
Lead-free devices are specified by using a "+" character for the top side orientation mark.
Rev. 2 | Page 2 of 12 | www.onsemi.com
CSPEMI307A
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
A1
ESD_1
ESD Channel 1
A2
A3
FILTER+ESD_1
FILTER+ESD_2
FILTER+ESD_3
FILTER+ESD_4
ESD_2
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
ESD Channel 2
A4
A5
A6
B1-B3
C1
GND
Device Ground
ESD_3
ESD Channel 3
C2
FILTER+ESD_1
FILTER+ESD_2
FILTER+ESD_3
FILTER+ESD_4
ESD_4
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
ESD Channel 4
C3
C4
C5
C6
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
Ordering Part
Number1
Bumps
Package
Part Marking
Part Marking
15
CSP
CSPEMI307A
307A
CSPEMI307AG
307A
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a " " character for the top side orientation mark.
+
Rev. 2 | Page 3 of 12 | www.onsemi.com
CSPEMI307A
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
DC Power per Resistor
100
600
mW
mW
DC Package Power Rating
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
Rev. 2 | Page 4 of 12 | www.onsemi.com
CSPEMI307A
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
Ω
C
Capacitance
At 2.5V DC
24
30
36
pF
ppm/°C
ppm/°C
V
TCR
TCC
VDIODE
ILEAK
VSIG
Temperature Coefficient of Resistance
Temperature Coefficient of Capacitance
Diode Voltage (reverse bias)
Diode Leakage Current (reverse bias)
1200
-300
At 2.5V DC
IDIODE=10
µA
5.5
VDIODE=3.3V
ILOAD = 10mA
100
nA
Signal Voltage
Positive Clamp
Negative Clamp
5.6
-0.4
6.8
-0.8
9.0
-1.5
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2 and 4
30
15
kV
kV
b) Contact Discharge per IEC 61000-4-2
Level 4
VCL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2,3 and 4
+10
- 5
V
V
Negative Transients
fC
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 100
Ω
, C = 30pF
64
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin
A2, then clamping voltage is measured at Pin C2.
Note 4: Unused pins are left open.
Rev. 2 | Page 5 of 12 | www.onsemi.com
CSPEMI307A
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A2-C2 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
Rev. 2 | Page 6 of 12 | www.onsemi.com
CSPEMI307A
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2)
Figure 4. Insertion Loss VS. Frequency (A5-C5 to GND B2)
Rev. 2 | Page 7 of 12 | www.onsemi.com
CSPEMI307A
Performance Information
Typical Filter Performance (TA=25°C, 50 Ohm Environment)
Figure 5. Comparison of Filter Response Curves for CSPEMI307A VS. DC Bias
Rev. 2 | Page 8 of 12 | www.onsemi.com
CSPEMI307A
Performance Information (cont’d)
Figure 6. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
Figure 7. Resistance vs. Temperature
(normalized to resistance at 25°C)
Rev. 2 | Page 9 of 12 | www.onsemi.com
CSPEMI307A
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Round
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.290mm Round
Solder Mask Opening
Solder Stencil Thickness
0.125mm - 0.150mm
0.300mm Round
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
50/50 by volume
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50
+20
µ
m
m
Solder Ball Side Coplanarity
µ
Maximum Dwell Time Above Liquidous
60 seconds
260°C
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder MaskDefinedPad
0.240mmDIA.
Solder Stencil Opening
0.300mmDIA.
SolderMaskOpening
0.290mmDIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 10 of 12 | www.onsemi.com
CSPEMI307A
Mechanical Details
CSP Mechanical Specifications
The CSPEMI307A is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on the CSP, see the California Micro Devices CSP Package Information document.
PACKAGE DIMENSIONS
Custom CSP
15
Package
Bumps
Millimeters
Min Nom Max
Inches
Nom
Dim
Min
Max
2.915 2.960 3.005 0.1148 0.1165 0.1183
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.561 0.605 0.649 0.0221 0.0238 0.0256
0.355 0.380 0.405 0.0140 0.0150 0.0160
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
Package Dimensions for
CSPEMI307A Chip Scale Package
3500 pieces
# per tape and
reel
Controlling dimension: millimeters
Rev. 2 | Page 11 of 12 | www.onsemi.com
CSPEMI307A
CSP Tape and Reel Specifications
POCKET SIZE (mm) TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
PART NUMBER
CHIP SIZE (mm)
B0 X A0 X K0
P0
P1
CSPEMI307A
2.96 X 1.33 X 0.605
3.10 X 1.45 X 0.74
8mm
178mm (7")
3500
4mm 4mm
Figure 11. Tape and Reel Mechanical Data
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action
Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
ON Semiconductor Website: www.onsemi.com
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
N. American Technical Support: 800-282-9855
Toll Free USA/Canada
Order Literature: http://www.onsemi.com/orderlit
Europe, Middle East and Africa Technical
Support:
Phone: 421 33 790 2910
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
For additional information, please contact your local
Japan Customer Focus Center
Sales Representative
Email: orderlit@onsemi.com
Phone: 81-3-5773-3850
Rev. 2 | Page 12 of 12 | www.onsemi.com
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