FGH25T120SMD-F155 [ONSEMI]

IGBT,1200V,25A,场截止沟槽;
FGH25T120SMD-F155
型号: FGH25T120SMD-F155
厂家: ONSEMI    ONSEMI
描述:

IGBT,1200V,25A,场截止沟槽

局域网 栅 双极性晶体管 功率控制
文件: 总9页 (文件大小:454K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IGBT - Field Stop, Trench  
1200 V, 25 A  
FGH25T120SMD  
Description  
Using innovative field stop trench IGBT technology,  
ON Semiconductor’s new series of field stop trench IGBTs offer  
the optimum performance for hard switching application such as solar  
inverter, UPS, welder and PFC applications.  
www.onsemi.com  
C
Features  
FS Trench Technology, Positive Temperature Coefficient  
High Speed Switching  
G
Low Saturation Voltage: V  
= 1.8 V @ I = 25 A  
C
CE(sat)  
100% of the Parts Tested for I (Note 1)  
E
LM  
High Input Impedance  
E
This Device is PbFree and is RoHS Compliant  
C
G
Applications  
Solar Inverter, Welder, UPS & PFC Applications  
COLLECTOR  
(FLANGE)  
TO2473LD  
CASE 340CH  
MARKING DIAGRAMS  
$Y&Z&3&K  
FGH25T120  
SMD  
$Y  
= ON Semiconductor Logo  
&Z  
&3  
&K  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
FGH25T120SMD  
= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
May, 2020 Rev. 4  
FGH25T120SMD/D  
FGH25T120SMD  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, unless otherwise specified)  
C
Parameter  
Collector to Emitter Voltage  
Symbol  
Ratings  
Unit  
V
V
CES  
V
GES  
1200  
Gate to Emitter Voltage  
25  
V
Transient Gate to Emitter Voltage  
30  
V
Collector Current  
T
T
T
= 25°C  
= 100°C  
= 25°C  
I
50  
25  
A
C
C
C
C
Collector Current  
A
Clamped Inductive Load Current (Note 1)  
Pulsed Collector Current (Note 2)  
Diode Continuous Forward Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
I
100  
A
LM  
I
100  
A
CM  
T
T
= 25°C  
I
50  
A
C
F
= 100°C  
25  
A
C
I
200  
A
FM  
T
T
= 25°C  
P
428  
W
W
°C  
°C  
°C  
C
D
= 100°C  
214  
C
T
55 to +175  
55 to +175  
300  
J
T
stg  
Maximum Lead Temp. for Soldering Purposes, 1/8” from Case for 5 Seconds  
T
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. V = 600 V, V = 15 V, I = 100 A, R = 23 , Inductive Load  
CC  
GE  
C
G
2. Limited by Tjmax  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Value  
0.35  
1.4  
Unit  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction to Case, Max. (IGBT)  
Thermal Resistance, Junction to Case, Max. (Diode)  
Thermal Resistance, Junction to Ambient, Max.  
R
JC  
R
JC  
R
40  
JA  
PACKAGE MARKING AND ORDERING INFORMATION  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FGH25T120SMD  
FGH25T120SMDF155  
TO2473LD  
30  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector to Emitter Breakdown Voltage  
BV  
V
GE  
V
CE  
V
GE  
= 0 V, I = 250 A  
1200  
V
CES  
C
Collector CutOff Current  
GE Leakage Current  
I
= V  
, V = 0 V  
250  
400  
A  
nA  
CES  
CES  
GES  
GE  
I
= V  
, V = 0 V  
CE  
GES  
ON CHARACTERISTICS  
GE Threshold Voltage  
V
I
C
I
C
I
C
= 25 mA, V = V  
GE  
4.9  
6.2  
1.8  
1.9  
7.5  
2.4  
V
V
V
GE(th)  
CE  
Collector to Emitter Saturation Voltage  
V
= 25 A, V = 15 V, T = 25°C  
GE C  
CE(sat)  
= 25 A, V = 15 V, T = 175°C  
GE  
C
www.onsemi.com  
2
 
FGH25T120SMD  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted) (continued)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
V
CE  
= 30 V, V = 0 V, f = 1 MHz  
2800  
105  
60  
pF  
pF  
pF  
ies  
GE  
Output Capacitance  
C
oes  
Reverse Transfer Capacitance  
C
res  
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
V
= 600 V, I = 25 A,  
40  
45  
ns  
ns  
d(on)  
CC  
G
C
R
= 23 ꢀ ꢃ V = 15 V,  
GE  
Rise Time  
t
r
Inductive Load, T = 25°C  
C
TurnOff Delay Time  
Fall Time  
t
490  
12  
ns  
d(off)  
t
f
ns  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
TurnOn Delay Time  
Rise Time  
E
on  
E
off  
1.74  
0.56  
2.30  
40  
mJ  
mJ  
mJ  
ns  
E
ts  
t
t
V
= 600 V, I = 25 A,  
= 23 ꢀ ꢃ V = 15 V,  
GE  
d(on)  
CC C  
R
G
t
r
48  
ns  
Inductive Load, T = 175°C  
C
TurnOff Delay Time  
Fall Time  
520  
64  
ns  
d(off)  
t
f
ns  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
E
on  
E
off  
2.94  
1.09  
4.03  
225  
20  
mJ  
mJ  
mJ  
nC  
nC  
nC  
E
ts  
Q
V
= 600 V, I = 25 A, V = 15 V  
g
CE C GE  
Q
ge  
gc  
Q
128  
ELECTRICAL CHARACTERISTICS OF THE DIODE (T = 25°C unless otherwise noted)  
C
Parameter  
Diode Forward Voltage  
Symbol  
Test Conditions  
I = 25 A, T = 25°C  
Min  
Typ  
2.8  
Max  
3.7  
Unit  
V
V
FM  
F
C
I = 25 A, T = 175°C  
2.1  
V
F
C
Diode Reverse Recovery Time  
Diode Peak Reverse Recovery Current  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
t
V
= 600 V, I = 25 A,  
60  
ns  
A
rr  
R
F
di /dt = 200 A/s, T = 25°C  
F
C
I
rr  
6.6  
Q
197  
330  
325  
13  
nC  
J  
ns  
A
rr  
E
rec  
V
R
= 600 V, I = 25 A,  
F
dI /dt = 200 A/s, T = 175°C  
F
C
Diode Reverse Recovery Time  
Diode Peak Reverse Recovery Current  
Diode Reverse Recovery Charge  
t
rr  
rr  
I
Q
2113  
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGH25T120SMD  
TYPICAL PERFORMANCE CHARACTERISTICS  
100  
80  
60  
40  
20  
0
100  
T
= 175°C  
T
= 25°C  
C
C
15 V  
15 V  
80  
60  
40  
20 V  
20 V  
12 V  
12 V  
10 V  
10 V  
20  
0
V
= 8 V  
GE  
V
GE  
= 8 V  
0.0  
2.0  
4.0  
6.0  
8.0  
10.0  
0.0  
2.0  
4.0  
6.0  
8.0  
10.0  
V
CE  
, CollectorEmitter Voltage (V)  
V
CE  
, CollectorEmitter Voltage (V)  
Figure 2. Typical Output Characteristics  
Figure 1. Typical Output Characteristics  
100  
3.5  
Common Emitter  
Common Emitter  
GE  
V
= 15 V  
V
= 15 V  
GE  
T
T
= 25°C  
C
C
80  
60  
40  
20  
0
3.0  
2.5  
2.0  
1.5  
1.0  
= 175°C  
50 A  
25 A  
= 15 A  
I
C
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
25  
50  
75  
100 125  
150 175  
T
C,  
Case Temperature (°C)  
V
CE  
, CollectorEmitter Voltage (V)  
Figure 4. Saturation Voltage vs. Case  
Temperature at Variant Current Level  
Figure 3. Typical Saturation Voltage  
Characteristics  
20  
15  
10  
5
20  
16  
12  
8
Common Emitter  
C
Common Emitter  
C
T
= 25°C  
T
= 175°C  
25 A  
25 A  
50 A  
50 A  
I
C
= 15 A  
I
C
= 15 A  
4
0
0
16  
20  
4
8
12  
20  
4
8
12  
16  
V
GE  
, GateEmitter Voltage (V)  
V
GE  
, GateEmitter Voltage (V)  
Figure 6. Saturation Voltage vs VGE  
Figure 5. Saturation Voltage vs. VGE  
www.onsemi.com  
4
FGH25T120SMD  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
10000  
1000  
15  
Common Emitter  
T
= 25°C  
C
C
ies  
400 V  
= 200 V  
12  
9
600 V  
V
CC  
C
oes  
res  
6
100  
20  
Common Emitter  
= 0 V, f = 1 MHz  
C
3
C
V
GE  
T
= 25°C  
0
1
30  
0
10  
, CollectorEmitter Voltage (V)  
50  
100  
150  
200  
250  
V
CE  
Q , Gate Charge (nC)  
g
Figure 8. Gate Charge Characteristics  
Figure 7. Capacitance Characteristics  
300  
100  
10000  
1000  
Common Emitter  
V
CC  
= 600 V, V = 15 V  
GE  
t
d(off)  
I
C
= 25 A  
T
C
T
C
= 25°C  
= 175°C  
100  
10  
t
r
t
f
Common Emitter  
= 600 V, V = 15 V  
V
t
CC  
GE  
d(on)  
I
T
T
= 25 A  
C
1
= 25°C  
= 175°C  
C
C
0.1  
10  
0
14  
28  
42  
56  
70  
0
14  
28  
42  
56  
70  
R , Gate Resistance ()  
G
R , Gate Resistance ()  
G
Figure 10. TurnOff Characteristics  
Figure 9. TurnOn Characteristics  
vs. Gate Resistance  
vs. Gate Resistance  
100  
10  
1
300  
100  
Common Emitter  
Common Emitter  
V
T
= 15 V, R = 23 ꢀ  
= 25°C  
V
I
= 600 V, V = 15 V  
= 25 A  
GE  
G
CC  
GE  
C
C
T
C
= 175°C  
T
C
T
C
= 25°C  
= 175°C  
t
r
E
on  
t
d(on)  
E
off  
10  
0.1  
0
10  
20  
30  
40  
50  
0
14  
28  
42  
56  
70  
I , Collector Current (A)  
C
R , Gate Resistance ()  
G
Figure 12. TurnOn Characteristics  
Figure 11. Switching Loss vs. Gate  
Resistance  
vs. Collector Current  
www.onsemi.com  
5
FGH25T120SMD  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
1000  
100  
100  
Common Emitter  
V
GE  
= 15 V, R = 23 ꢀ  
G
t
d(off)  
T
C
T
C
= 25°C  
= 175°C  
10  
1
E
on  
t
f
10  
1
Common Emitter  
= 15 V, R = 23  
V
E
GE  
= 25°C  
= 175°C  
G
off  
T
C
T
C
0.1  
0
10  
20  
30  
40  
50  
50  
0
10  
20  
30  
40  
I
C,  
Collector Current (A)  
I , Collector Current (A)  
C
Figure 14. Switching Loss vs. Collector  
Current  
Figure 13. TurnOff Characteristics  
vs. Collector Current  
200  
150  
100  
50  
500  
100  
V
= 600 V  
CE  
I MAX(Pulse)  
C
Load Current : Peak of Square Wave  
10 s  
100 s  
Duty Cycle: 50%  
T
C
= 100°C  
10  
1
Power Dissipation =167 W  
1 ms  
I MAX(Continuous)  
C
10 ms  
DC Operation  
Single Nonrepetitive  
Pulse T = 25°C  
C
0.1 Curves must be derated  
linearly with increase  
in temperature.  
T
C
= 100°C  
0
0.01  
1k  
10k  
100k  
1M  
1
10  
100  
1000  
f, Switching Frequency (Hz)  
V
CE  
, CollectorEmitter Voltage (V)  
Figure 15. Load Current vs. Frequency  
Figure 16. SOA Characteristics  
100  
10  
1
16  
T
C
T
C
= 25°C  
= 175°C  
14  
12  
T
= 175°C  
C
di/dt = 200 A/s  
10  
8
6
4
2
di/dt = 100 A/s  
di/dt = 200 A/s  
T
C
= 25°C  
di/dt = 100 A/s  
5
50  
0
1
2
3
4
0
10  
20  
30  
40  
I , Forward Current (A)  
F
V , Forward Voltage (V)  
F
Figure 18. Reverse Recovery Current  
Figure 17. Forward Characteristics  
www.onsemi.com  
6
FGH25T120SMD  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
600  
500  
400  
300  
200  
100  
0
3000  
T
C
T
C
= 25°C  
T
C
T
C
= 25°C  
= 175°C  
= 175°C  
2500  
2000  
1500  
1000  
di/dt = 200 A/s  
di/dt = 100 A/s  
di/dt = 200 A/s  
di/dt = 100 A/s  
di/dt = 100 A/s  
di/dt = 200 A/s  
500  
0
di/dt = 100 A/s  
di/dt = 200 A/s  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
I , Forward Current (A)  
F
I , Forward Current (A)  
F
Figure 20. Stored Charge  
Figure 19. Reverse Recovery Time  
0.5  
0.5  
0.1  
0.3  
0.1  
0.05  
0.02  
0.01 0.01  
P
DM  
Single Pulse  
t
1
t
2
Duty Factor, D = t1/t2  
Peak T = Pdm x Zjc + T  
j
C
1E3  
1E5  
1E4  
1E3  
0.01  
0.1  
1
Rectangular Pulse Duration (sec)  
Figure 21. Transient Thermal Impedance of IGBT  
2
1
0.5  
0.3  
0.1  
0.1  
0.05  
P
DM  
0.02  
0.01  
t
1
t
2
Single Pulse  
Duty Factor, D = t1/t2  
Peak T = Pdm x Zjc + T  
0.01  
j
C
0.005  
5  
2  
1  
0
4  
3  
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration (sec)  
Figure 22. Transient Thermal Impedance of Diode  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CH  
ISSUE A  
DATE 09 OCT 2019  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXX  
AYWWG  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13853G  
TO2473LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
www.onsemi.com/support/sales  

相关型号:

FGH25T120SMD_F155

Insulated Gate Bipolar Transistor, 50A I(C), 1200V V(BR)CES, N-Channel, TO-247AB, ROHS COMPLIANT, TO-247G03, 3 PIN
FAIRCHILD

FGH30N120FTD

Field stop trench technology
FAIRCHILD

FGH30N120FTDTU

Field stop trench technology
FAIRCHILD

FGH30N60LSD

Low saturation voltage: VCE(sat) =1.1V @ IC = 30A
FAIRCHILD

FGH30N60LSDTU

Low saturation voltage: VCE(sat) =1.1V @ IC = 30A
FAIRCHILD

FGH30N60LSDTU

IGBT,600 V,30A,PT
ONSEMI

FGH30N6S2

600V, SMPS II Series N-Channel IGBT
FAIRCHILD

FGH30N6S2D

600V, SMPS II Series N-Channel IGBT with Anti-Parallel StealthTM Diode
FAIRCHILD

FGH30N6S2_01

600V, SMPS II Series N-Channel IGBT
FAIRCHILD

FGH30S130P

Shorted AnodeTM IGBT
FAIRCHILD

FGH30S130P

IGBT,1300V,30A,短路阳极
ONSEMI

FGH30S150P

IGBT,1500v,30A,阳极短路
ONSEMI