FGH30N120FTDTU [FAIRCHILD]

Field stop trench technology; 场站的沟槽技术
FGH30N120FTDTU
型号: FGH30N120FTDTU
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Field stop trench technology
场站的沟槽技术

晶体 晶体管 功率控制 双极性晶体管 栅 局域网
文件: 总9页 (文件大小:588K)
中文:  中文翻译
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November 2008  
FGH30N120FTD  
tm  
1200V, 30A Trench IGBT  
Features  
General Description  
Field stop trench technology  
Using advanced field stop trench technology, Fairchild’s 1200V  
trench IGBTs offer superior conduction and switching perfor-  
mances, and easy parallel operation with exceptional avalanche  
ruggedness. This device is designed for soft switching applica-  
tions.  
High speed switching  
Low saturation voltage: VCE(sat) = 1.6V @ IC = 30A  
High input impedance  
RoHS compliant  
Applications  
Induction heating and Microwave oven  
Soft switching applications  
E
C
C
G
G
COLLECTOR  
(FLANGE)  
E
Absolute Maximum Ratings  
Symbol  
Description  
Ratings  
1200  
± 25  
60  
Units  
VCES  
VGES  
Collector to Emitter Voltage  
Gate to Emitter Voltage  
Collector Current  
V
V
A
A
A
@ TC = 25oC  
@ TC = 100oC  
IC  
Collector Current  
30  
@ TC = 25oC  
ICM (1)  
IF  
Pulsed Collector Current  
90  
@ TC = 100oC  
@ TC = 25oC  
@ TC = 100oC  
30  
A
Diode Continuous Forward Current  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
339  
W
W
oC  
oC  
PD  
132  
TJ  
-55 to +150  
-55 to +150  
Tstg  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
oC  
TL  
300  
Notes:  
1: Repetitive rating: Pulse width limited by max. junction temperature  
Thermal Characteristics  
Symbol  
RθJC(IGBT)  
RθJC(Diode)  
RθJA  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Typ.  
Max.  
0.38  
1.2  
Units  
oC/W  
oC/W  
oC/W  
-
-
-
40  
©2008 Fairchild Semiconductor Corporation  
FGH30N120FTD Rev. A  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FGH30N120FTD  
FGH30N120FTDTU  
TO-247  
-
-
30  
Electrical Characteristics of the IGBT  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BVCES  
ICES  
Collector to Emitter Breakdown Voltage VGE = 0V, IC = 250µA  
1200  
-
-
-
-
1
V
Collector Cut-Off Current  
G-E Leakage Current  
VCE = VCES, VGE = 0V  
VGE = VGES, VCE = 0V  
-
-
mA  
nA  
IGES  
±250  
On Characteristics  
VGE(th)  
G-E Threshold Voltage  
IC = 30mA, VCE = VGE  
IC = 30A, VGE = 15V  
IC = 30A, VGE = 15V,  
3.5  
-
6
7.5  
2
V
V
1.6  
VCE(sat)  
Collector to Emitter Saturation Voltage  
-
2.0  
-
V
T
C = 125oC  
Dynamic Characteristics  
Cies  
Coes  
Cres  
Input Capacitance  
-
-
-
5140  
150  
95  
-
-
-
pF  
pF  
pF  
V
CE = 30V VGE = 0V,  
,
Output Capacitance  
f = 1MHz  
Reverse Transfer Capacitance  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
31  
101  
198  
259  
0.54  
1.16  
1.70  
40  
-
ns  
ns  
Rise Time  
-
Turn-Off Delay Time  
Fall Time  
-
ns  
VCC = 600V, IC = 30A,  
R
G = 10, VGE = 15V,  
-
ns  
Resistive Load, TC = 25oC  
Eon  
Eoff  
Ets  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
-
mJ  
mJ  
mJ  
ns  
1.51  
-
-
-
-
-
-
-
-
-
-
-
td(on)  
tr  
td(off)  
tf  
127  
211  
364  
0.74  
1.63  
2.37  
208  
41  
ns  
Turn-Off Delay Time  
Fall Time  
ns  
VCC = 600V, IC = 30A,  
G = 10, VGE = 15V,  
Resistive Load, TC = 125oC  
R
ns  
Eon  
Eoff  
Ets  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
mJ  
mJ  
mJ  
nC  
nC  
nC  
Qg  
V
V
CE = 600V, IC = 30A,  
GE = 15V  
Qge  
Qgc  
97  
2
www.fairchildsemi.com  
FGH30N120FTD Rev. A  
Electrical Characteristics of the Diode  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
1.3  
Max Units  
T
T
T
C = 25oC  
C = 125oC  
C = 25oC  
-
-
-
-
-
-
-
-
1.7  
VFM  
Diode Forward Voltage  
IF = 30A  
V
1.3  
-
730  
775  
43  
-
trr  
Diode Reverse Recovery Time  
ns  
TC = 125oC  
C = 25oC  
TC = 125oC  
-
IF =30A,  
di/dt = 200A/µs  
T
-
Irr  
Diode Peak Reverse Recovery Current  
Diode Reverse Recovery Charge  
A
47  
-
T
T
C = 25oC  
C = 125oC  
5.9  
-
Qrr  
µC  
18.2  
-
3
www.fairchildsemi.com  
FGH30N120FTD Rev. A  
Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
180  
180  
TC = 25oC  
20V  
TC = 125oC  
20V  
150  
150  
15V  
17V  
17V  
15V  
120  
90  
60  
30  
0
120  
12V  
90  
60  
30  
0
12V  
10V  
10V  
9V  
9V  
VGE = 8V  
VGE = 8V  
0
2
4
6
8
0
2
4
6
8
Collector-Emitter Voltage, VCE [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Transfer Characteristics  
120  
120  
Common Emitter  
VCE = 20V  
TC = 25oC  
Common Emitter  
VGE = 15V  
TC = 25oC  
TC = 125oC  
100  
100  
TC = 125oC  
80  
80  
60  
40  
20  
0
60  
40  
20  
0
0
2
4
6
0
5
10  
15  
Collector-Emitter Voltage, VCE [V]  
Gate-Emitter Voltage,VGE [V]  
Figure 5. Saturation Voltage vs. Case  
Figure 6. Saturation Voltage vs. V  
GE  
Temperature at Variant Current Level  
3.0  
2.5  
2.0  
1.5  
1.0  
20  
Common Emitter  
VGE = 15V  
Common Emitter  
TC = 25oC  
16  
12  
8
60A  
30A  
60A  
4
IC = 10A  
30A  
IC = 15A  
0
25  
50  
75  
100  
125  
0
4
8
12  
16  
20  
Collector-EmitterCase Temperature, TC [oC]  
Gate-Emitter Voltage, VGE [V]  
4
www.fairchildsemi.com  
FGH30N120FTD Rev. A  
Typical Performance Characteristics  
Figure 7. Saturation Voltage vs. V  
Figure 8. Capacitance Characteristics  
GE  
20  
8000  
Common Emitter  
TC = 125oC  
Common Emitter  
VGE = 0V, f = 1MHz  
TC = 25oC  
Cies  
16  
12  
8
6000  
4000  
2000  
0
Coes  
60A  
12  
4
30A  
Cres  
IC = 15A  
0
0
4
8
16  
20  
1
10  
30  
Gate-Emitter Voltage, VGE [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 9. Gate charge Characteristics  
Figure 10. SOA Characteristics  
15  
200  
100  
Common Emitter  
TC = 25oC  
10µs  
12  
100µs  
1ms  
600V  
VCC = 200V  
10  
400V  
10 ms  
9
DC  
1
0.1  
6
3
0
*Notes:  
1. TC = 25oC  
2. TJ = 150oC  
3. Single Pulse  
0.01  
0
50  
100  
150  
200  
250  
1
10  
100  
1000 3000  
Gate Charge, Qg [nC]  
Collector-Emitter Voltage, VCE [V]  
Figure 11. Turn-on Characteristics vs.  
Figure 12. Turn-off Characteristics vs.  
Gate Resistance  
Gate Resistance  
500  
2000  
1000  
td(off)  
100  
tr  
tf  
Common Emitter  
Common Emitter  
VCC = 600V, VGE = 15V  
VCC = 600V, VGE = 15V  
td(on)  
IC = 30A  
IC = 30A  
100  
50  
TC = 25oC  
TC = 125oC  
TC = 25oC  
TC = 125oC  
10  
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
Gate Resistance, RG []  
Gate Resistance, RG []  
5
www.fairchildsemi.com  
FGH30N120FTD Rev. A  
Typical Performance Characteristics  
Figure 13. Turn-on Characteristics vs.  
Figure 14. Turn-off Characteristics vs.  
Collector Current  
Collector Current  
1000  
1200  
Common Emitter  
VGE = 15V, RG = 10  
Common Emitter  
VGE = 15V, RG = 10  
1000  
TC = 25oC  
TC = 25oC  
TC = 125oC  
TC = 125oC  
tr  
tf  
100  
td(on)  
10  
td(off)  
100  
10  
10  
20  
30  
40  
50  
20  
30  
40  
50  
Collector Current, IC [A]  
Collector Current, IC [A]  
Figure 15. Switching Loss vs. Gate Resistance  
Figure 16. Switching Loss vs. Collector Current  
10  
10  
Common Emitter  
VGE = 15V, RG = 10  
TC = 25oC  
TC = 125oC  
Eoff  
Eoff  
1
1
Eon  
Common Emitter  
VCC = 600V, VGE = 15V  
Eon  
IC = 30A  
TC = 25oC  
TC = 125oC  
0.1  
10  
0.1  
20  
30  
40  
50  
0
20  
40  
60  
80  
100  
Collector Current, IC [A]  
Gate Resistance, RG []  
Figure 17. Turn off Switching SOA Characteristics Figure 18. Forward Characteristics  
100  
100  
10  
TJ = 125oC  
10  
TJ = 25oC  
1
TC = 25oC  
Safe Operating Area  
VGE = 15V, TC = 125oC  
TC = 125oC  
0.1  
0.0  
1
0.5  
1.0  
1.5  
2000  
1000  
1
10  
100  
Forward Voltage, VF [V]  
Collector-Emitter Voltage, VCE [V]  
6
www.fairchildsemi.com  
FGH30N120FTD Rev. A  
Typical Performance Characteristics  
Figure 19. Reverse Current  
Figure 20. Stored Charge  
20  
50  
18  
16  
200A/µs  
40  
200A/µs  
14  
di/dt = 100A/µs  
12  
10  
8
30  
di/dt = 100A/µs  
6
10  
20  
10  
20  
30  
40  
20  
30  
40  
Forward Current, IF [A]  
Forward Current, IF [A]  
Figure 21. Reverse Recovery Time  
1000  
di/dt = 100A/µs  
800  
200A/µs  
600  
400  
10  
20  
30  
40  
Forward Current, IF [A]  
Figure 22. Transient Thermal Impedance of IGBT  
PDM  
t1  
t2  
7
www.fairchildsemi.com  
FGH30N120FTD Rev. A  
Mechanical Dimensions  
TO-247AB (FKS PKG CODE 001)  
Dimensions in Millimeters  
www.fairchildsemi.com  
8
FGH30N120FTD Rev. A  
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PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
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First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I36  
www.fairchildsemi.com  
FGH30N120FTD Rev. A  
9

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