FGH40T70SHD-F155 [ONSEMI]

IGBT,700 V,40A,场截止沟槽;
FGH40T70SHD-F155
型号: FGH40T70SHD-F155
厂家: ONSEMI    ONSEMI
描述:

IGBT,700 V,40A,场截止沟槽

局域网 双极性晶体管 功率控制
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IGBT - Field Stop, Trench  
700 V, 40 A  
FGH40T70SHD  
Description  
Using novel field stop IGBT technology, ON Semiconductor’s new  
series of field stop 3rd generation IGBTs offer the optimum  
performance for Solar Inverter, UPS, Welder, Telecom, ESS and PFC  
applications where low conduction and switching losses are essential.  
www.onsemi.com  
C
Features  
Maximum Junction Temperature : T =175°C  
J
Positive Temperature Coefficient for Easy Parallel Operating  
High Current Capability  
G
Low Saturation Voltage: V  
=1.7 V(Typ.) @ I = 40 A  
C
CE(sat)  
E
E
100% of the Parts Tested for I (1)  
LM  
High Input Impedance  
C
G
Fast Switching  
Tighten Parameter Distribution  
These Devices are PbFree and are RoHS Compliant  
Applications  
Solar Inverter, UPS, Welder, Telecom, ESS, PFC  
TO2473LD  
CASE 340CH  
MARKING DIAGRAM  
$Y&Z&3&K  
FGH40T70SHD  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
FGH40T70SHD = Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
February, 2020 Rev. 3  
FGH40T70SHD/D  
FGH40T70SHD  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Description  
Symbol  
Rating  
Unit  
V
Collector to Emitter Voltage  
Gate to Emitter Voltage  
Transient Gate to Emitter Voltage  
Collector Current  
V
CES  
V
GES  
700  
20  
V
30  
V
T
T
T
= 25°C  
= 100°C  
= 25°C  
I
80  
40  
A
C
C
C
C
Collector Current  
A
Pulsed Collector Current  
Pulsed Collector Current  
Diode Forward Current  
Diode Forward Current  
I
(Note 1)  
(Note 2)  
120  
A
LM  
I
120  
A
CM  
T
T
= 25°C  
I
40  
A
C
F
= 100°C  
20  
A
C
Pulsed Diode Maximum Forward Current  
Maximum Power Dissipation  
I
(Note 2)  
120  
A
FM  
T
T
= 25°C  
P
D
268  
W
W
°C  
°C  
°C  
C
Maximum Power Dissipation  
= 100°C  
134  
C
Operating Junction Temperature  
Storage Temperature Range  
T
J
55 to +175  
55 to +175  
300  
T
stg  
Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds  
T
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. V = 400 V,V = 15 V, I = 120 A, R = 30 , Inductive Load  
CC  
GE  
C
G
2. Repetive rating: Pulse width limited by max. junction temperature.  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
R (IGBT)  
JC  
Typ  
Max  
0.56  
1.71  
40  
Unit  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
R
(Diode)  
JC  
R
JA  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Mark  
Package  
Packing Method  
Reel Size  
Tape Width  
Quantity  
FGH40T70SHDF155  
FGH40T70SHD  
TO2473  
(PbFree)  
Tube  
30  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector to Emitter Breakdown Voltage  
BV  
V
= 0 V, I = 250 A  
700  
V
CES  
GE  
C
Temperature Coefficient of Breakdown  
Voltage  
B
V
/T  
I = 1 mA, Reference to 25°C  
C
0.6  
V/°C  
CES  
J
Collector CutOff Current  
GE Leakage Current  
I
V
V
= V  
= V  
, V = 0 V  
250  
400  
A
CES  
CE  
CES  
GE  
I
, V = 0 V  
nA  
GES  
GE  
GES  
CE  
ON CHARACTERISTICs  
GE Threshold Voltage  
V
I
C
I
C
I
C
= 40 mA, V = V  
GE  
4.0  
5.5  
1.7  
7.5  
2.15  
V
V
V
GE(th)  
CE  
Collector to Emitter Saturation Voltage  
V
= 40 A, V = 15 V  
GE  
CE(sat)  
= 40 A, V = 15 V, T = 175°C  
2.37  
GE  
C
www.onsemi.com  
2
 
FGH40T70SHD  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted) (continued)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
V
CE  
= 30 V, V = 0 V, f = 1 MHz  
2028  
75  
pF  
pF  
pF  
ies  
GE  
Output Capacitance  
C
oes  
Reverse Transfer Capacitance  
C
26  
res  
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
V
= 400 V, I = 40 A,  
22  
40  
ns  
ns  
ns  
ns  
J  
J  
J  
ns  
ns  
ns  
ns  
J  
J  
J  
nC  
nC  
nC  
d(on)  
CC  
G
C
R
= 6 ꢀ ꢄ V = 15 V,  
GE  
Rise Time  
t
r
Inductive Load, T = 25°C  
C
TurnOff Delay Time  
Fall Time  
t
66  
d(off)  
t
f
10  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
TurnOn Delay Time  
Rise Time  
E
on  
E
off  
1150  
271  
1421  
20  
E
ts  
t
t
V
= 400 V, I = 40 A,  
= 6 ꢀ ꢄ V = 15 V,  
GE  
d(on)  
CC C  
R
G
tr  
36  
Inductive Load, T = 175°C  
C
TurnOff Delay Time  
Fall Time  
68  
d(off)  
t
f
13  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
E
on  
E
off  
1760  
455  
2215  
69  
E
ts  
Q
V
= 400 V, I = 40 A, V = 15 V  
g
CE C GE  
Q
13  
ge  
gc  
Q
26  
ELECTRICAL CHARACTERISTICS OF THE DIODE (T = 25°C unless otherwise noted)  
J
Parametr  
Symbol  
Test Conditions  
Min  
Typ  
2.0  
1.73  
54  
Max  
2.5  
Unit  
Diode Forward Voltage  
V
FM  
I
= 20 A  
T
C
= 25°C  
= 175°C  
= 175°C  
= 25°C  
V
F
F
T
C
Reverse Recovery Energy  
E
rec  
I
= 20 A, dI / dt = 200 A/s  
T
C
J
F
Diode Reverse Recovery Time  
t
rr  
T
C
37  
ns  
T
= 175°C  
= 25°C  
C
235  
65  
C
Diode Reverse Recovery Charge  
Q
T
nC  
rr  
T
C
= 175°C  
944  
www.onsemi.com  
3
FGH40T70SHD  
TYPICAL PERFORMANCE CHARACTERISTICS  
120  
90  
60  
30  
0
120  
TC = 25oC  
20V  
15V  
12V  
20V  
15V  
12V  
10V  
TC = 175oC  
10V  
90  
60  
VGE = 8V  
VGE = 8V  
30  
0
1
2
3
4
5
0
0
1
2
3
4
5
CollectorEmitter Voltage, V [V]  
CollectorEmitter Voltage, V [V]  
CE  
CE  
Figure 2. Typical Output Characteristics  
Figure 1. Typical Output Characteristics  
120  
Common Emitter  
VGE = 15V  
Common Emitter  
VGE = 15V  
TC = 25oC  
TC = 175oC  
90  
60  
30  
0
3
80A  
40A  
2
IC = 20A  
1
100  
0
1
2
3
4
5
50  
0
50  
100  
150  
200  
CollectorEmitter Voltage, V [V]  
CE  
CollectorEmitter Case Temperature, T [°C]  
C
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Saturation Voltage vs. Case Temperature  
at Variant Current Level  
20  
20  
16  
12  
8
Common Emitter  
TC = 175oC  
Common Emitter  
TC = 25oC  
16  
12  
IC = 20A  
40A  
40A  
8
80A  
80A  
IC = 20A  
4
4
0
0
4
8
12  
16  
20  
4
8
12  
16  
20  
GateEmitter Voltage, V [V]  
GateEmitter Voltage, V [V]  
GE  
GE  
Figure 6. Saturation Voltage vs VGE  
Figure 5. Saturation Voltage vs VGE  
www.onsemi.com  
4
FGH40T70SHD  
TYPICAL PERFORMANCE CHARACTERISTICS  
10000  
1000  
100  
15  
Common Emitter  
TC = 25oC  
Cies  
12  
VCC = 200V  
400V  
300V  
9
Coes  
6
Common Emitter  
VGE = 0V, f = 1MHz  
TC = 25oC  
3
0
Cres  
10  
40  
60  
0
20  
80  
11  
0
30  
Gate Charge, Q [nC]  
CollectorEmitter Voltage, V [V]  
g
CE  
Figure 8. Gate Charge Characteristic  
Figure 7. Capacitance Characteristics  
100  
1000  
tr  
td(off)  
100  
10  
1
td(on)  
tf  
Common Emitter  
VCC = 400V, VGE = 15V  
IC = 40A  
TC = 25oC  
TC = 175oC  
Common Emitter  
VCC = 400V, VGE = 15V  
IC = 40A  
TC = 25oC  
TC = 175oC  
10  
5
40  
Gate Resistance, R []  
50  
20  
30  
0
10  
0
10  
20  
30  
40  
50  
G
Gate Resistance, R []  
G
Figure 10. TurnOff Characteristics vs.  
Figure 9. TurnOn Characteristics vs.  
Gate Resistance  
Gate Resistance  
100  
5000  
1000  
tr  
Eon  
td(on)  
Eoff  
Common Emitter  
VCC = 400V, VGE = 15V  
Common Emitter  
IC = 40A  
TC = 25oC  
TC = 175oC  
VGE = 15V, RG = 6 ꢀ  
TC = 25oC  
TC = 175oC  
10  
5
100  
20  
40  
60  
80  
0
10  
20  
30  
40  
50  
Collector Current, I [A]  
Gate Resistance, R []  
C
G
Figure 12. TurnOn Characteristics vs.  
Figure 11. Switching Loss vs.  
Gate Resistance  
Collector Current  
www.onsemi.com  
5
FGH40T70SHD  
TYPICAL PERFORMANCE CHARACTERISTICS  
10000  
500  
100  
Common Emitter  
VGE = 15V, RG = 6 ꢀ  
TC = 25oC  
TC = 175oC  
Eon  
td(off)  
1000  
tf  
10  
Common Emitter  
VGE = 15V, RG = 6ꢀ  
Eoff  
TC = 25oC  
TC = 175oC  
100  
20  
1
20  
40  
60  
80  
40  
60  
80  
Collector Current, I [A]  
C
Collector Current, I [A]  
C
Figure 14. Switching Loss vs.  
Collector Current  
Figure 13. TurnOff Characteristics vs.  
Collector Current  
250  
200  
150  
100  
50  
300  
Square Wave  
TJ <= 175oC, D = 0.5, VCE = 400V  
VGE = 15/0V, RG = 6ꢀ  
100  
10  
1
10s  
TC = 25oC  
100s  
1ms  
10 ms  
TC = 75oC  
DC  
*Notes:  
TC = 100oC  
1. TC = 25oC  
2. TJ = 175oC  
3. Single Pulse  
0
1k  
0.1  
10k  
100k  
1M  
1
10  
100  
1000  
CollectorEmitter Voltage, V [V]  
Switching Frequency, f[Hz]  
CE  
Figure 16. SOA Characteristics  
Figure 15. Load Current vs. Frequency  
10  
8
80  
TC = 25oC  
C = 175o  
di/dt = 200A/s  
T
C −−−  
TC = 25oC  
TC = 175oC  
6
4
2
0
di/dt = 100A/s  
di/dt = 200A/s  
10  
TC = 75oC  
TC = 25oC  
C = 75oC  
di/dt = 100A/ s  
T
TC = 175oC  
1
30  
40  
10  
20  
0
0
1
2
3
4
5
Forward Current, I [A]  
F
Forward Voltage, V [V]  
F
Figure 18. Reverse Recovery Current  
Figure 17. Forward Characteristics  
www.onsemi.com  
6
FGH40T70SHD  
TYPICAL PERFORMANCE CHARACTERISTICS  
350  
280  
210  
140  
70  
1200  
TC = 25oC  
TC = 25oC  
C = 175o  
C
TC = 175oC −−−  
T
−−−  
900  
600  
di/dt = 100A/  
di/dt = 200A/s  
s  
di/dt = 200A/s  
di/dt = 100A/s  
300  
0
0
0
40  
40  
10  
20  
30  
10  
20  
30  
0
Forward Current, I  
Forward Current, IF [A]  
F [A]  
Figure 19. Reverse Recovery Time  
Figure 20. Stored Charge  
0.6  
0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
PDM  
t1  
t2  
Duty Factor, D = t1/t2  
single pulse  
0.01  
= Pdm x Zthjc + T  
Peak T  
C
j
0.005  
105  
104  
103  
102  
101 100  
Rectangular Pulse Duration [sec]  
Figure 21. Transient Thermal Impedance of IGBT  
2
1
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.1  
PDM  
t1  
t2  
Duty Factor, D = t1/t2  
single pulse  
= Pdm x Zthjc + T  
101 100  
Peak T  
C
j
0.01  
105  
104  
103  
102  
Rectangular Pulse Duration [sec]  
Figure 22. Transient Thermal Impedance of Diode  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CH  
ISSUE A  
DATE 09 OCT 2019  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXX  
AYWWG  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13853G  
TO2473LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
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, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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