FGHL40T65LQDT [ONSEMI]

IGBT - 650 V 40 A FS4 low Vce(sat) IGBT with full rated copack diode;
FGHL40T65LQDT
型号: FGHL40T65LQDT
厂家: ONSEMI    ONSEMI
描述:

IGBT - 650 V 40 A FS4 low Vce(sat) IGBT with full rated copack diode

双极性晶体管
文件: 总9页 (文件大小:206K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Field Stop Trench IGBT  
40 A, 650 V  
VCE(Sat) = 1.15 V  
40 A, 650 V  
FGHL40T65LQDT  
th  
C
Field stop 4 generation Low V  
IGBT technology and Full  
CE(Sat)  
current rated copak Diode technology.  
Features  
G
Maximum Junction Temperature: T = 175°C  
J
Positive Temperature Co−efficient for Easy Parallel Operating  
High Current Capability  
E
Low Saturation Voltage: V  
= 1.15 V (Typ.) @ I = 40 A  
C
CE(Sat)  
100% of the Parts are Tested for I (Note 2)  
LM  
Smooth and Optimized Switching  
Tight Parameter Distribution  
RoHS Compliant  
G
C
E
TO−247−3L  
CASE 340CX  
Typical Applications  
Solar Inverter  
UPS, ESS  
MARKING DIAGRAM  
PFC, Converters  
MAXIMUM RATINGS  
Rating  
Symbol Value  
Unit  
V
Collector−to−Emitter Voltage  
V
CES  
V
GES  
650  
&Y&Z&3&K  
FGHL  
40T65LQDT  
Gate−to−Emitter Voltage  
Transient Gate−to−Emitter Voltage  
20  
30  
V
Collector Current (Note 1)  
@ T = 25°C  
I
C
60  
40  
A
C
@ T = 100°C  
C
Pulsed Collector Current (Note 2)  
Pulsed Collector Current (Note 3)  
I
160  
160  
A
A
A
LM  
&Y  
&Z  
&3  
&K  
= onsemi Logo  
= Assembly Plant Code  
= 3−Digit Date Code  
I
CM  
Diode Forward Current  
@ T  
25°C  
100°C  
I
F
60  
40  
C =  
C =  
@ T  
= 2−Digit Lot Traceability Code  
FGHL40T65LQDT = Specific Device Code  
Pulsed Diode Maximum Forward Current  
I
160  
A
FM  
Maximum Power Dissipation @ T = 25°C  
P
D
273  
136  
W
C
@ T = 100°C  
C
ORDERING INFORMATION  
Operating Junction and Storage Temperature  
Range  
T ,  
−55 to  
+175  
°C  
°C  
J
Device  
Package  
Shipping  
T
STG  
FGHL40T65LQDT TO−247−3L 450 Units/Tube  
Maximum Lead Temp. for Soldering  
Purposes (1/8from case for 5 s)  
T
L
260  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limit by bond wire  
2. V = 400 V, V = 15 V, I = 160 A, Inductive Load, 100% tested  
CC  
GE  
C
3. Repetitive rating: pulse width limited by max. junction temperature  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
August, 2021 − Rev. 0  
FGHL40T65LQDT/D  
 
FGHL40T65LQDT  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Value  
0.55  
0.91  
40  
Unit  
°C/W  
°C/W  
°C/W  
Thermal resistance junction−to−case, for IGBT  
Thermal resistance junction−to−case, for Diode  
Thermal resistance junction−to−ambient  
R
q
JC  
R
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector to Emitter breakdown voltage  
V
V
= 0 V, I = 1 mA  
BV  
CES  
650  
V
GE  
C
Temperature Coefficient of Breakdown  
Voltage  
= 0 V, I = 1 mA  
0.6  
V/°C  
GE  
C
DBV  
CES  
DT  
J
Collector to Emitter cut−off current  
Gate leakage current  
V
= 0 V, V = 650 V  
I
250  
400  
mA  
GE  
CE  
CES  
GES  
V
= 20 V, V = 0 V  
I
nA  
GE  
CE  
ON CHARACTERISTICS  
Gate to Emitter Threshold Voltage  
Collector to Emitter Saturation Voltage  
V
= V , I = 40 mA  
V
GE(th)  
3.0  
4.5  
6.0  
V
V
GE  
CE  
C
V
= 15 V, I = 40 A, T = 25°C  
= 15 V, I = 40 A, T = 175°C  
V
CE(sat)  
1.15  
1.22  
1.35  
GE  
C
J
V
GE  
C J  
DYNAMIC CHARACTERISTICS  
Input capacitance  
V
= 30 V, V = 0 V, f = 1 MHz  
C
8263  
93  
pF  
nC  
CE  
GE  
ies  
Output capacitance  
C
oes  
Reverse transfer capacitance  
Gate charge total  
C
41  
res  
V
CE  
= 400 V, I = 40 A, V = 15 V  
Q
414  
43  
C
GE  
g
Gate−to−emitter charge  
Gate−to−collector charge  
Q
Q
ge  
gc  
134  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turn−on delay time  
Rise time  
T = 25°C,  
CC  
t
24  
12  
ns  
J
d(on)  
V
= 400 V,  
= 20 A,  
= 4.7 W,  
t
r
I
C
R
V
G
GE  
Turn−off delay time  
Fall time  
t
336  
128  
0.31  
0.66  
0.97  
28  
d(off)  
= 15 V  
t
f
Turn−on switching loss  
Turn−off switching loss  
Total switching loss  
Turn−on delay time  
Rise time  
E
on  
E
off  
mJ  
ns  
E
ts  
T = 25°C,  
t
t
J
CC  
d(on)  
V
= 400 V,  
= 40 A,  
= 4.7 W,  
t
r
24  
I
R
C
G
Turn−off delay time  
Fall time  
328  
108  
0.75  
1.19  
1.94  
d(off)  
V
GE  
= 15 V  
t
f
Turn−on switching loss  
Turn−off switching loss  
Total switching loss  
E
on  
E
off  
mJ  
E
ts  
www.onsemi.com  
2
FGHL40T65LQDT  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turn−on delay time  
Rise time  
T = 175°C,  
CC  
t
24  
13  
ns  
J
d(on)  
V
= 400 V,  
= 20 A,  
= 4.7 W,  
t
r
I
C
R
V
G
GE  
Turn−off delay time  
Fall time  
t
364  
200  
0.62  
1.03  
1.64  
28  
d(off)  
= 15 V  
t
f
Turn−on switching loss  
Turn−off switching loss  
Total switching loss  
Turn−on delay time  
Rise time  
E
on  
E
off  
mJ  
ns  
E
ts  
T = 175°C,  
t
t
J
CC  
d(on)  
V
= 400 V,  
= 40 A,  
= 4.7 W,  
t
r
24  
I
C
R
G
Turn−off delay time  
Fall time  
360  
160  
1.16  
1.84  
3.00  
d(off)  
V
GE  
= 15 V  
t
f
Turn−on switching loss  
Turn−off switching loss  
Total switching loss  
DIODE CHARACTERISTICS  
E
on  
E
off  
mJ  
E
ts  
Diode Forward Voltage  
I = 40 A, T = 25°C  
V
1.7  
1.65  
55  
2.15  
V
F
J
FM  
rec  
I = 40 A, T = 175°C  
F
J
Reverse Recovery Energy  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
Reverse Recovery Energy  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
Reverse Recovery Energy  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
Reverse Recovery Energy  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
T = 25°C,  
E
mJ  
ns  
nC  
A
J
R
V
= 400 V,  
T
42  
rr  
I = 20 A,  
F
di /dt = 1000 A/ms  
F
Q
322  
16  
rr  
I
rr  
T = 25°C,  
E
116  
84  
mJ  
ns  
nC  
A
J
R
rec  
V
= 400 V,  
T
rr  
I = 40 A,  
F
di /dt = 1000 A/ms  
F
Q
648  
16  
rr  
I
rr  
T = 175°C,  
E
320  
98  
mJ  
ns  
nC  
A
J
rec  
V
R
= 400 V,  
T
rr  
I = 20 A,  
F
di /dt = 1000 A/ms  
F
Q
1262  
26  
rr  
I
rr  
T = 175°C,  
E
464  
126  
1652  
26  
mJ  
ns  
nC  
A
J
rec  
V
R
= 400 V,  
T
rr  
I = 40 A,  
F
di /dt = 1000 A/ms  
F
Q
rr  
I
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGHL40T65LQDT  
TYPICAL CHARACTERISTICS  
160  
120  
80  
40  
0
160  
120  
20V  
15V  
12V  
10V  
20V  
15V  
12V  
10V  
V
= 8 V  
V
= 8 V  
GE  
GE  
80  
40  
0
0
0.5  
1
1.5  
2
0
0
1
0.5  
1
1.5  
2
2.5  
3
10  
30  
V
, Collector−Emitter Voltage (V)  
V
, Collector−Emitter Voltage (V)  
CE  
CE  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
(TJ = 255C)  
(TJ = 1755C)  
160  
120  
80  
40  
0
80  
60  
40  
20  
0
Common Emitter  
Common Emitter  
V
J
J
= 15 V  
V
J
J
= 20 V  
T = 25°C  
T = 175°C  
GE  
CE  
T = 25°C  
T = 175°C  
0
0.5  
1
1.5  
2
2.5  
3
2
4
6
8
V
, Collector−Emitter Voltage (V)  
V
GE  
, Gate−Emitter Voltage (V)  
CE  
Figure 4. Typical Transfer Characteristics  
Figure 3. Typical Saturation Voltage Characteristics  
2.0  
Common Emitter  
V
GE  
= 15 V  
10000  
1000  
100  
C
ies  
1.5  
1.0  
0.5  
80 A  
40 A  
C
oes  
I
C
= 20 A  
50  
C
Common Emitter  
= 0 V, f = 1 MHz  
res  
V
GE  
10  
−100  
−50  
0
100  
150  
200  
10  
, Collector−Emitter Voltage (V)  
T , Junction Temperature (°C)  
V
CE  
J
Figure 6. Capacitance Characteristics  
Figure 5. Saturation Voltage vs. Junction Temperature  
www.onsemi.com  
4
FGHL40T65LQDT  
TYPICAL CHARACTERISTICS (continued)  
15  
12  
9
Common Emitter  
= 40 A  
I
C
100  
V
= 200 V  
CC  
300 V  
10 ms  
DC  
400 V  
100 ms  
1ms  
10ms  
10  
1
6
*Notes:  
3
1. T = 25°C  
J
2. T = 175°C  
J
3. Single Pulse  
0
0.1  
0
100  
200  
300  
400  
500  
1
10  
100  
1000  
Q , Gate Charge (nC)  
g
V
CE  
, Collector−Emitter Voltage (V)  
Figure 7. Gate Charge Characteristics  
Figure 8. SOA Characteristics  
10000  
1000  
100  
Common Emitter  
= 400 V, V = 15 V  
V
CC  
GE  
I
C
= 40 A  
T = 25°C  
t
J
d(off)  
t
T = 175°C  
d(on)  
J
100  
Common Emitter  
t
f
t
r
V
CC  
= 400 V, V = 15 V, I = 40 A  
GE C  
T = 25°C  
J
T = 175°C  
J
10  
10  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
R , Gate Resistance (W)  
g
R , Gate Resistance (W)  
g
Figure 9. Turn−On Characteristics vs. Gate  
Resistance  
Figure 10. Turn−Off Characteristics vs. Gate  
Resistance  
1000  
100  
10  
Common Emitter  
V
CC  
= 400 V, V = 15 V  
GE  
R
= 4.7 W  
t
G
f
100  
10  
1
T = 25°C  
J
t
r
T = 175°C  
J
t
d(on)  
t
d(off)  
Common Emitter  
V
R
J
J
= 400 V, V = 15 V  
= 4.7 W  
T = 25°C  
T = 175°C  
CC  
GE  
G
0
20  
40  
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
120  
I , Collector Current (A)  
C
I , Collector Current (A)  
C
Figure 12. Turn−Off Characteristics vs. Collector  
Current  
Figure 11. Turn−On Characteristics vs. Collector  
Current  
www.onsemi.com  
5
FGHL40T65LQDT  
TYPICAL CHARACTERISTICS (continued)  
10  
Common Emitter  
V
CC  
= 400 V, V = 15 V  
GE  
R
= 4.7 W  
G
E
E
off  
10  
1
T = 25°C  
J
T = 175°C  
J
E
off  
1
on  
E
on  
Common Emitter  
= 400 V, V = 15 V  
V
CC  
GE  
I
C
= 40 A  
T = 25°C  
J
T = 175°C  
J
0.1  
0.1  
0
10  
20  
30  
40  
50  
0
20  
40  
60  
80  
100  
120  
R , Gate Resistance (W)  
g
I , Collector Current (A)  
C
Figure 13. Switching Loss vs. Gate Resistance  
Figure 14. Switching Loss vs. Collector Current  
160  
120  
80  
40  
0
30  
25  
20  
15  
10  
5
Common Emitter  
T = 25°C  
J
T = 175°C  
J
V
= 400 V  
R
I = 40 A  
F
T = 25°C  
J
T = 175°C  
J
0
400  
0
1
2
3
4
5
600  
800  
1000  
V , Forward Voltage (V)  
F
di /dt, Diode Current Slop (A/ms)  
F
Figure 15. Forward Characteristics  
Figure 16. Reverse Recovery Current  
2500  
2000  
1500  
1000  
500  
250  
200  
150  
100  
50  
V
= 400 V  
R
I = 40 A  
F
T = 25°C  
J
T = 175°C  
J
V
= 400 V  
R
I = 40 A  
F
T = 25°C  
J
T = 175°C  
J
0
400  
0
600  
800  
1000  
400  
600  
800  
1000  
di /dt, Diode Current Slop (A/ms)  
F
di /dt, Diode Current Slop (A/ms)  
F
Figure 18. Stored Charge  
Figure 17. Reverse Recovery Time  
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6
FGHL40T65LQDT  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
1
P
DM  
0.5  
t
1
t
2
0.1  
0.2  
0.1  
Duty Factor, D = t /t  
1
q
2
Peak T = P x Z + T  
j
dm  
jc  
c
R
R2  
1
0.05  
0.02  
0.01  
0.01  
C = t / R  
2
C = t / R  
1
2
2
1
1
i:  
1
2
3
4
5
6
ri[K/W]: 0.0128  
0.0903  
0.0833  
0.1235  
0.1016  
0.0248  
t[s]:  
9.495E−6 1.020E−4 4.824E−4 2.810E−3 7.520E−3 2.975E−2  
Single Pulse  
−6  
0.001  
−5  
−4  
−3  
−2  
−1  
0
1
10  
10  
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration (s)  
Figure 19. Transient Thermal Impedance of IGBT  
1
0.1  
0.5  
0.2  
P
DM  
t
1
t
2
Duty Factor, D = t /t  
0.1  
1
2
Peak T = P x Z + T  
q
j
dm  
jc  
c
0.05  
R
R2  
1
0.02  
0.01  
0.01  
C = t / R  
C = t / R  
Single Pulse  
2
2
2
1
1
1
i:  
1
2
3
4
5
6
ri[K/W]: 0.0234  
0.0513  
0.2291  
0.2074  
0.2291  
0.0715  
t[s]:  
2.351E−6 1.597E−5 4.097E−4 1.708E−3 1.055E−2 3.657E−2  
0.001  
−5  
−4  
−6  
−3  
−2  
−1  
0
1
10  
10  
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration (s)  
Figure 20. Transient Thermal Impedance of Diode  
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7
FGHL40T65LQDT  
PACKAGE DIMENSIONS  
TO−247−3LD  
CASE 340CX  
ISSUE A  
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8
FGHL40T65LQDT  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
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