FGY100T65SCDT [ONSEMI]

IGBT,场截止沟槽,短路额定值,650 V,100 A;
FGY100T65SCDT
型号: FGY100T65SCDT
厂家: ONSEMI    ONSEMI
描述:

IGBT,场截止沟槽,短路额定值,650 V,100 A

CD 双极性晶体管
文件: 总9页 (文件大小:423K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FGY100T65SCDT  
Field Stop Trench IGBT,  
Short Circuit Rated, 650V,  
100A  
General Description  
Using novel field stop IGBT technology, ON Semiconductor’s new  
series of field stop 3 generation IGBTs offer the optimum  
performance for solar, UPS, motor control, ESS and HVAC  
www.onsemi.com  
rd  
C
applications where low conduction and switching losses are essential.  
Features  
G
Maximum Junction Temperature: T = 175°C  
J
E
Positive Temperature Co-efficient for Easy Parallel Operating  
High Current Capability  
Low Saturation Voltage: V  
High Input Impedance  
Fast Switching  
= 1.5 V (Typ.) @ I = 100 A  
C
CE(sat)  
TO−247  
CASE 340CD  
Short Cirruit Rated 5 ms  
Tighten Parameter Distribution  
These Devices are Pb−Free and are RoHS Compliant  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 3 of  
Applications  
this data sheet.  
Solar, UPS, Motor Control, ESS, HVAC  
ABSOLUTE MAXIMUM RATINGS (at T = 25°C, Unless otherwise specified)  
C
Symbol  
Parameter  
Value  
650  
25  
Unit  
V
CES  
V
GES  
Collector to Emitter Voltage  
Gate to Emitter Voltage  
V
V
V
A
A
A
A
A
Transient Gate to Emitter Voltage  
30  
I
C
Collector Current @ T = 25°C  
200  
100  
300  
300  
C
Collector Current @ T = 100°C  
C
I
(Note 1)  
(Note 2)  
Clamped Inductive Load Current @ T = 25°C  
LM  
C
I
Pulsed Collector Current  
CM  
I
F
Diode Forward Current  
@ T = 25°C  
200  
100  
C
@ T = 100°C  
C
I
(Note 2)  
Pulsed Diode Maximum Forward Current  
300  
750  
A
FM  
P
D
Maximum Power Dissipation @ T = 25°C  
W
W
°C  
°C  
°C  
ms  
C
Maximum Power Dissipation @ T = 100°C  
375  
C
T
J
Operating Junction Temperature  
−55 to +175  
−55 to +175  
300  
T
stg  
Storage Temperature Range  
T
L
Maximum Lead Temp. for Soldering Purposes, 1/8from Case for 5 seconds  
T
(Note 3)  
Short circuit withstanding time @ T = 150°C  
5
SC  
C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. V = 400 V, V = 15 V, I = 375 A, R = 10 W, Inductive Load.  
CC  
GE  
C
G
2. Repetitive rating: Pulse width limited by max. junction temperature.  
3. Test condition: V = 15 V, V = 400 V.  
GE  
CC  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
October, 2017 − Rev. 2  
FGY100T65SCDT/D  
 
FGY100T65SCDT  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
0.2  
Unit  
R
R
(IGBT)  
(Diode)  
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
_C/W  
_C/W  
_C/W  
q
JC  
0.3  
q
JC  
R
40  
q
JA  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Collector to Emitter Breakdown  
Voltage  
V
I
= 0 V, I = 1 mA  
650  
V
CES  
GE  
C
DBV  
/
Temperature Coefficient of  
Breakdown Voltage  
= 1 mA, Reference to 25_C  
0.56  
V/_C  
CES  
C
DT  
J
CES  
GES  
I
Collector Cut-Off Current  
G−E Leakage Current  
V
V
= V  
= V  
, V = 0 V  
250  
400  
mA  
CE  
CES  
GE  
I
, V = 0 V  
nA  
GE  
GES  
CE  
ON CHARACTERISTICS  
V
G−E Threshold Voltage  
I
I
= 100 mA, V = V  
GE  
3.5  
5.3  
1.5  
6.9  
1.9  
V
V
V
GE(th)  
C
CE  
V
Collector to Emitter Saturation  
Voltage  
= 100 A, V = 15 V  
GE  
CE(sat)  
C
I
= 100 A, V = 15 V,  
GE  
1.97  
C
T
C
= 175_C  
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 30 V V = 0 V,  
6310  
384  
46  
pF  
pF  
pF  
ies  
CE  
,
GE  
f = 1 MHz  
C
Output Capacitance  
oes  
C
Reverse Transfer Capacitance  
res  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Rise Time  
V
R
= 400 V, I = 100 A,  
84  
147  
216  
133  
5.4  
3.8  
9.2  
80  
ns  
ns  
d(on)  
CC  
C
= 4.7 W, V = 15 V,  
G
GE  
t
r
Inductive Load, T = 25_C  
C
t
Turn-Off Delay Time  
Fall Time  
ns  
d(off)  
t
f
ns  
E
on  
E
off  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
mJ  
mJ  
mJ  
ns  
E
ts  
t
t
V
= 400 V, I = 100 A,  
= 4.7 W, V = 15 V,  
GE  
d(on)  
CC C  
R
G
t
r
160  
244  
166  
9.7  
5.2  
14.9  
157  
43  
ns  
Inductive Load, T = 175_C  
C
Turn-Off Delay Time  
Fall Time  
ns  
d(off)  
t
f
ns  
E
on  
E
off  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
mJ  
mJ  
mJ  
nC  
nC  
nC  
E
ts  
Q
V
CE  
V
GE  
= 400 V, I = 100 A,  
g
C
= 15 V  
Q
ge  
gc  
Q
46  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
FGY100T65SCDT  
ELECTRICAL CHARACTERISTICS OF THE DIODE (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
V
FM  
Diode Forward Voltage  
I = 100 A  
V
F
T
C
T
C
= 25_C  
1.68  
1.45  
2.1  
= 175_C  
E
rec  
Reverse Recovery Energy  
I = 100 A, dI /dt = 200 A/ms,  
96  
mJ  
F
F
T
C
= 175_C  
t
Diode Reverse Recovery Time  
I = 100 A, dI /dt = 200 A/ms  
ns  
rr  
F
F
62  
251  
T
T
= 25_C  
C
C
= 175_C  
Q
Diode Reverse Recovery Charge  
I = 100 A, dI /dt = 200 A/ms  
nC  
rr  
F
F
164  
2736  
T
T
= 25_C  
C
C
= 175_C  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
PACKAGE MARKING AND ORDERING INFORMATION  
Pare Number  
Top Mark  
Package  
Packing Method  
Reel Size  
Tape Width  
Quantity  
FGY100T65SCDT  
FGY100T65SCDT  
TO−247H03  
Tube  
30  
www.onsemi.com  
3
FGY100T65SCDT  
TYPICAL PERFORMANCE CHARACTERISTICS  
300  
250  
200  
150  
100  
50  
300  
TC = 25oC  
TC = 175oC  
20V  
15V  
12V  
20V  
15V  
250  
200  
150  
100  
50  
12V  
10V  
10V  
VGE = 8V  
VGE = 8V  
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Collector−Emitter Voltage, VCE [V]  
Collector−Emitter Voltage, VCE [V]  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
300  
4
Common Emitter  
VGE = 15V  
Common Emitter  
VGE = 15V  
250  
200  
150  
100  
50  
TC = 25oC  
TC = 175oC  
3
200A  
2
100A  
IC = 50A  
0
1
−100  
−50  
0
50  
100  
150  
200  
0
1
2
3
4
5
Collector−Emitter Case Temperature, TC [oC]  
Collector−Emitter Voltage, VCE [V]  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Saturation Voltage vs. Case  
Temperature at Variant Current Level  
20  
20  
16  
12  
8
Common Emitter  
TC = 175oC  
Common Emitter  
TC = 25oC  
16  
12  
100A  
100A  
8
200A  
IC = 50A  
200A  
IC = 50A  
4
0
4
0
4
8
12  
16  
20  
4
8
12  
16  
20  
Gate−Emitter Voltage, VGE [V]  
Gate−Emitter Voltage, VGE [V]  
Figure 5. Saturation Voltage vs. VGE  
Figure 6. Saturation Voltage vs. VGE  
www.onsemi.com  
4
FGY100T65SCDT  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
10000  
1000  
100  
15  
Common Emitter  
TC = 25oC  
Cies  
Coes  
Cres  
12  
9
400V  
VCC = 200V  
300V  
6
Common Emitter  
VGE = 0V, f = 1MHz  
3
TC = 25oC  
10  
0
1
10  
Collector−Emitter Voltage, VCE [V]  
0
40  
80  
120  
160  
200  
30  
Gate Charge, Qg [nC]  
Figure 7. Capacitance Characteristics  
Figure 8. Gate Charge Characteristics  
1000  
1000  
Common Emitter  
VCC = 400V, VGE = 15V  
IC = 100A  
TC = 25oC  
TC = 175oC  
td(off)  
tr  
tf  
Common Emitter  
VCC = 400V, VGE = 15V  
IC = 100A  
TC = 25oC  
TC = 175oC  
100  
50  
100  
td(on)  
0
10  
20  
30  
40  
50  
0
10  
Gate Resistance, RG [ ]  
W
20  
30  
40  
50  
Gate Resistance, RG  
[
]
W
Figure 9. Turn-on Characteristics vs. Gate  
Resistance  
Figure 10. Turn-off Characteristics vs. Gate  
Resistance  
1000  
30  
Eon  
tr  
10  
100  
Common Emitter  
VCC = 400V, VGE = 15V  
td(on)  
Eoff  
Common Emitter  
IC = 100A  
TC = 25oC  
TC = 175oC  
VGE = 15V, RG = 4.7W  
TC = 25oC  
TC = 175oC  
10  
1
0
10  
20  
30  
40  
50  
0
50  
100  
150  
200  
Gate Resistance, RG  
[
]
W
Collector Current, IC [A]  
Figure 11. Switching Loss vs. Gate  
Resistance  
Figure 12. Turn-on Characteristics vs.  
Collector Current  
www.onsemi.com  
5
FGY100T65SCDT  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
1000  
100  
Common Emitter  
Common Emitter  
VGE = 15V, RG = 4.7 W  
VGE = 15V, RG = 4.7 W  
TC = 25oC  
TC = 175oC  
TC = 25oC  
TC = 175oC  
Eon  
tf  
10  
td(off)  
Eoff  
100  
50  
1
0.5  
0
50  
100  
150  
200  
0
50  
100  
150  
200  
Collector Current, IC [A]  
Collector Current, IC [A]  
Figure 13. Turn-off Characteristics vs.  
Collector Current  
Figure 14. Switching Loss vs. Collector  
Current  
450  
360  
270  
180  
90  
500  
Square Wave  
TJ <= 175oC, D = 0.5, VCE = 400V  
DC  
ms  
10  
100  
10  
1
VGE = 15/0V, RG = 4.7  
W
ms  
100  
TC = 25oC  
1ms  
10 ms  
TC = 75oC  
TC = 100oC  
*Notes:  
1. TC = 25oC  
2. TJ = 175oC  
3. Single Pulse  
0
0.1  
1k  
10k  
100k  
1M  
1
10  
100  
1000  
Collector−Emitter Voltage, VCE [V]  
Switching Frequency, f [Hz]  
Figure 15. Load Current vs. Frequency  
Figure 16. SOA Characteristics  
300  
100  
30  
25  
20  
15  
10  
5
TC = 25oC  
T
C = 175oC −−−  
ms  
di/dt = 200 A/  
TC = 175oC  
TC = 25oC  
ms  
ms  
di/dt = 100 A/  
di/dt = 200 A/  
10  
T
T
C = 25oC  
C = 175oC  
di/dt = 100 A/  
80  
ms  
1
0
0
1
2
3
0
40  
120  
160  
Forward Voltage, V F [V]  
Forward Current, IF [A]  
Figure 17. Forward Characteristics  
Figure 18. Reverse Recovery Current  
www.onsemi.com  
6
FGY100T65SCDT  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
400  
320  
240  
160  
80  
3500  
TC = 25oC  
C = 175oC ---  
TC = 25oC  
C = 175oC −−−  
T
T
2800  
2100  
1400  
700  
0
di/dt = 100 A/ms  
ms  
di/dt = 200 A/  
ms  
di/dt = 200 A/  
ms  
di/dt = 100 A/  
0
0
40  
80  
120  
160  
0
40  
80  
120  
160  
Forward Current, IF [A]  
Forward Current, IF [A]  
Figure 19. Reverse Recovery Time  
Figure 20. Stored Charge  
0.4  
0.5  
0.2  
0.1  
0.1  
PDM  
0.05  
t1  
0.02  
0.01  
t2  
0.01  
Duty Factor, D = t1/t2  
Peak Tj = Pdm x Zthjc + TC  
single pulse  
0.003  
10−5  
10−4  
10−3  
10−2  
10−1  
100  
Rectangular Pulse Duration [sec]  
Figure 21. Transient Thermal Impedance of IGBT  
0.4  
0.1  
0.5  
0.2  
0.1  
PDM  
0.05  
t1  
0.02  
t2  
0.01  
Duty Factor, D = t1/t2  
Peak Tj = Pdm x Zthjc + TC  
single pulse  
0.01  
10−5  
10−4  
10−3  
10−2  
10−1  
100  
Rectangular Pulse Duration [sec]  
Figure 22. Transient Thermal Impedance of Diode  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO−247−3LD  
CASE 340CD  
ISSUE A  
DATE 18 SEP 2018  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXX  
AYWWG  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
= Pb−Free Package  
G
*This information is generic. Please refer to  
device data sheet for actual part marking.  
Pb−Free indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13857G  
TO−247−3LD  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
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