NCV84090DR2G [ONSEMI]
Self Protected Very Low Iq High Side Driver with Analog Current Sense;
| 型号： | NCV84090DR2G |
| 厂家： | 
ONSEMI |
| 描述： | Self Protected Very Low Iq High Side Driver with Analog Current Sense |
| 文件： | 总28页 (文件大小：547K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
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High Side Driver, Self
Protected, Very Low Iq,
with Analog Current Sense
8
1
SOIC−8
CASE 751
STYLE 11
NCV84090
The NCV84090 is a fully protected single channel high side driver
that can be used to switch a wide variety of loads, such as bulbs,
solenoids, and other actuators. The device incorporates advanced
protection features such as active inrush current management,
over−temperature shutdown with automatic restart and an overvoltage
active clamp. A dedicated Current Sense pin provides precision analog
current monitoring of the output as well as fault indication of short to
MARKING DIAGRAM
8
84090
AYWWG
G
1
84090 = Specific Device Code
V , short circuit to ground and ON and OFF state open load detection.
D
A
Y
WW
G
= Assembly Location
= Year
= Work Week
An active high Current Sense Enable pin allows all diagnostic and
current sense features to be enabled.
= Pb−Free Package
Features
(Note: Microdot may be in either location)
• Short Circuit Protection with Inrush Current Management
• CMOS (3 V / 5 V) Compatible Control Input
• Very Low Standby Current
PIN CONNECTIONS
• Very Low Current Sense Leakage
• Proportional Load Current Sense
• Current Sense Enable
1
VD
IN
CS_EN
GND
OUT
OUT
VD
• Off State Open Load Detection
CS
• Output Short to V Detection
D
(Top View)
• Overload and Short to Ground Indication
• Thermal Shutdown with Automatic Restart
• Undervoltage Shutdown
ORDERING INFORMATION
• Integrated Clamp for Inductive Switching
†
Device
NCV84090DR2G
Package
Shipping
• Loss of Ground and Loss of V Protection
D
SOIC−8
(Pb−Free)
2500 / Tape &
Reel
• ESD Protection
• Reverse Battery Protection with External Components
• AEC−Q100 Grade 1 Qualified and PPAP Capable
• This is a Pb−Free Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Typical Applications
• Switch a Variety of Resistive, Inductive and Capacitive Loads
• Can Replace Electromechanical Relays and Discrete Circuits
• Automotive / Industrial
FEATURE SUMMARY
Max Supply Voltage
V
V
41
4 to 28
90
V
V
D
Operating Voltage Range
D
R
(typical) T = 25°C
R
mW
A
DSon
J
ON
lim
Output Current Limit (typical)
I
24
OFF−state Supply Current (max)
I
0.5
mA
D(off)
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
December, 2021 − Rev. 0
NCV84090/D
NCV84090
Block Diagram & Pin Configuration
VD
Overvoltage
Protection
Undervoltage
Protection
IN
Output
Clamping
Regulated
Charge Pump
CS_
EN
Current Limit
Overtemperature
and
Power Protection
OFF State Open
Load Detection
Analog Fault
OUT
Control
Logic
CS
Current
Sense
GND
Figure 1. Block Diagram
Table 1. SO8 PACKAGE PIN DESCRIPTION
Pin #
Symbol
IN
Description
Logic Level Input
1
2
3
4
5
6
7
8
CS_EN
GND
CS
Current Sense Enable
Ground
Analog Current Sense Output
Supply Voltage
Output
V
D
OUT
OUT
Output
V
D
Supply Voltage
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2
NCV84090
ID
VDS
IIN
VD
IN
IOUT
OUT
ICS
CS
IDEN
VD
CS_EN
V
IN
VOUT
GND
VCS
VCS_EN
IGND
Figure 2. Voltage and Current Conventions
Table 2. Connection suggestions for unused and or unconnected pins
Connection
Floating
Input
Output
X
Current Sense
Current Sense Enable
X
X
Not Allowed
To Ground
Through 10 kΩ resistor
Not Allowed
Through 1 kΩ Resistor
Through 10 kΩ resistor
IN
CS_EN
GND
CS
1
2
8
7
VD
OUT
6
5
3
4
OUT
VD
Figure 3. Pin Configuration (top view)
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NCV84090
ELECTRICAL SPECIFICATIONS
Table 3. MAXIMUM RATINGS
Value
Min
−0.3
−
Max
41
Rating
Symbol
Unit
V
DC Supply Voltage
V
D
Max Transient Supply Voltage (Note 1)
Load Dump Suppresses
V
PEAK
45
V
Input Voltage
V
−10
−5
−
10
V
mA
mA
A
IN
Input Current
I
IN
5
−200
Reverse Ground Pin Current
Output Current (Note 2)
Reverse CS Current (Note 1)
CS Voltage
I
GND
I
−6
−
Internally Limited
−200
OUT
I
mA
V
CS
V
CS
V −41
D
V
D
CS_EN Voltage
V
−10
−5
10
5
V
CS_EN
CS_EN
CS_EN Current
I
mA
W
Power Dissipation Tc = 25°C (Note 6)
Electrostatic Discharge (Note 3)
P
tot
1.95
V
−
DC
ESD
(HBM Model 100 pF / 1500 W)
Input
4
4
4
4
4
kV
kV
kV
kV
kV
Current Sense
Current Sense Enable
Output
V
D
Charge Device Model
CDM−AEC−Q100−011
750
V
+Single Pulse Inductive Load Switching Energy
E
AS
−
81
mJ
(L = 5 mH, Vbat = 13.5 V; I = 4.8 A, T
= 150°C (Note 4)
L
Jstart
Operating Junction Temperature
Storage Temperature
T
−40
−55
+150
+150
°C
°C
J
T
storage
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class C (or A, B) according to ISO16750−1.
2. Reverse Output current has to be limited by the load to stay within absolute maximum ratings and thermal performance.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2017)
Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes smaller than
2 x 2 mm due to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current
waveform characteristic defined in JEDEC JS−002−2018
4. Not subjected to production testing.
Table 4. THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max. Value
Units
Thermal Resistance
°C / W
Junction−to−Lead (Note 5)
Junction−to−Ambient (Note 5)
Junction−to−Ambient (Note 6)
R
R
R
27.3
50
64
thJL
thJA
thJA
2
5. 645 mm pad size, mounted on four−layer 2s2p PCB − FR4, 2 oz. Cu thickness for top layer and 1 oz. Cu thickness for inner layers (planes
not electrically connected)
2
6. 2 cm pad size, mounted on single−layer 2s0p PCB − FR4, 2 oz. Cu thickness (planes not electrically connected)
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NCV84090
ELECTRICAL CHARACTERISTICS (7 ≤ V ≤ 28 V; −40°C < T < 150°C unless otherwise specified)
D
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 5. POWER
Value
Min
4
Typ
−
Max
28
4
Rating
Symbol
Conditions
Unit
V
Operating Supply Voltage
Undervoltage Shutdown
V
D
V
−
3.5
0.4
V
UV
UV_hyst
Undervoltage Shutdown
Hysteresis
V
−
−
V
On Resistance
R
I
= 2.5 A, T = 25°C
−
−
−
−
90
−
−
mW
ON
OUT
J
I
= 2.5 A, T = 150°C
180
144
0.5
OUT
J
I
= 2.5 A, V = 4.5 V, T = 25°C
−
OUT
D
J
Supply Current (Note 7)
I
0.2
mA
mA
OFF−state: VD = 13 V,
= V = 0 V, T = 25°C
D
V
IN
OUT
J
−
−
−
−
0.2
−
0.5
3
OFF−state: VD = 13 V,
= V = 0 V, T = 85°C (Note 8)
V
IN
OUT
J
mA
OFF−state: VD = 13 V,
= V = 0 V, T = 125°C
V
IN
OUT
J
1.9
−
3.5
6
mA
mA
mA
ON−state: VD = 13 V,
= 5 V, I = 0 A
V
IN
OUT
On State Ground Current
Output Leakage Current
I
V
= 13 V, V
= 5 V
GND(ON)
D
CS_EN
OUT
V
IN
= 5 V, I
= 1 A
I
V
= V
= 0 V, V = 13 V, T = 25°C
−
−
−
−
0.5
3
L
IN
OUT
OUT
D
J
V
= V
= 0 V, V = 13 V, T = 125°C
IN
D
J
7. Includes PowerMOS leakage current.
8. Not Subject to production testing.
Table 6. LOGIC INPUTS (V = 13.5 V; −40°C ≤ T ≤ 150°C)
D
J
Value
Typ
−
Min
−
Max
0.9
−
Rating
Input Voltage − Low
Input Current − Low
Input Voltage − High
Input Current − High
Input Hysteresis Voltage
Input Clamp Voltage
Symbol
Conditions
Unit
V
V
in_low
I
V
V
= 0.9 V
= 2.1 V
= 1 mA
1
−
mA
V
in_low
in
V
2.1
−
−
−
in_high
in_high
I
−
10
−
mA
V
in
V
in_hyst
−
0.2
13
−13
−
V
in_cl
I
in
12
−14
−
14
−12
0.9
−
V
I
in
= −1 mA
CS_EN Voltage − Low
CS_EN Current − Low
CS_EN Voltage − High
CS_EN Current − High
CS_EN Hysteresis Voltage
CS_EN Clamp Voltage
V
_
V
mA
V
CSE low
I
_
V
V
= 0.9 V
= 2.1 V
= 1 mA
1
−
CSE low
CS_EN
CS_EN
CS_EN
V
_
2.1
−
−
−
CSE high
I
−
10
−
mA
V
CSE_high
V
_
−
0.2
13
−13
CSE Hys
V
_
I
12
−14
14
−12
V
CSE cl
I
= −1 mA
CS_EN
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NCV84090
Table 7. SWITCHING CHARACTERISTICS (Note 11) (V = 13. V, −40°C < T < 150°C)
D
J
Value
Typ
70
Min
Max
Rating
Symbol
Conditions
high to 20% Vout, V = 13 V,
Unit
Turn−On Delay Time
t
V
in
5
120
ms
d_on
D
R = 6.5 W, T = 25°C
L
J
Turn−Off Delay Time
Slew Rate On
t
V
low to 80% Vout, V = 13 V, R = 6.5 W,
5
0.1
0.1
−
40
0.27
0.35
0.15
0.15
−
100
0.7
ms
V / ms
V / ms
mJ
d_off
in
D
L
T = 25°C
J
dV /dt
out on
20% to 80% Vout, V = 13 V, R = 6.5 W,
D L
T = 25°C
J
Slew Rate Off
dV /dt
out off
80% to 20% Vout, V = 13 V, R = 6.5 W,
0.7
D
L
T = 25°C
J
Turn−On Switching Loss
(Note 9)
E
V
D
V
D
V
D
= 13 V, R = 6.5 W
0.22
0.22
50
on
off
L
Turn−Off Switching Loss
(Note 9)
E
= 13 V, R = 6.5 W
−
mJ
L
Differential Pulse Skew, (t
−
t
= 13 V, R = 6.5 W
−50
ms
OFF
skew
L
t
) see Figure 4
ON
9. Not subjected to production testing.
Table 8. OUTPUT DIODE CHARACTERISTICS
Value
Typ
−
Min
Max
Rating
Forward Voltage
Symbol
Conditions
Unit
V
F
I
= −1 A, V = V
−VD, T = 150°C
−
0.7
V
out
F
OUT
J
Table 9. PROTECTION FUNCTIONS (Note 10) (7 ≤ V ≤ 18 V, −40°C < T < 150°C)
D
J
Value
Typ
Min
Max
Rating
Symbol
Conditions
Unit
Temperature Shutdown
(Note 11)
T
SD
150
175
200
°C
Temperature Shutdown
Hysteresis (Note 11)
T
−
7
−
°C
SD_hyst
Reset Temperature (Note 11)
T
T
+1
T
+7
−
−
°C
°C
R
RS
RS
Thermal Reset of Status
(Note 11)
T
RS
135
−
Delta T Temperature Limit
(Note 11)
T
T = −40°C, V = 13 V
−
60
−
°C
DELTA
J
D
DC Output Current Limit
I
V
= 13 V
16
−
24
−
32
32
−
A
A
A
limH
D
4 V < V < 18 V
D
Short Circuit Current Limit dur-
ing Thermal Cycling (Note 11)
I
V
D
= 13 V
−
8
limTCycling
T
< Tj < T
R
TSD
Switch Off Output Clamp Voltage
Overvoltage Protection
V
I
= 0.5 A, V = 0 V, L = 20 mH
V
D
− 41
V
D
− 46
V − 52
D
V
V
out_clamp
out
in
V
OV
V
in
= 0 V, I = 20 mA
41
46
20
52
D
Output Voltage Drop Limitation
V
I
= 0.2 A, T = −40°C to 150°C
−
−
mV
DS_ON
out
J
10.To ensure long term reliability during overload or short circuit conditions, protection and related diagnostic signals must be used together
with a fitting hardware & software strategy. If the device operates under abnormal conditions, this hardware & software solution must limit
the duration and number of activation cycles.
11. Not subjected to production testing.
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NCV84090
Table 10. OPEN−LOAD DETECTION (7 ≤ V ≤ 18 V, −40°C < T < 150°C)
D
J
Value
Typ
−
Min
Max
Rating
Symbol
Conditions
Unit
Open−load Off State Detection
V
OL
V
in
= 0 V, V = 5 V
CS_EN
2
4
V
Threshold
Open−load Detection Delay at
Turn Off
t
100
350
850
ms
d_OL_off
Off State Output Current
I
V
= 0 V, V
= V
OL
−3
−
3
mA
ms
OLOFF1
in
OUT
Output rising edge to CS rising
edge during open load
t
V
= 4 V, V = 0 V
−
5
30
d_OL
OUT
in
V
CS
= 90% of V
CS_High
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NCV84090
Table 11. CURRENT SENSE CHARACTERISTICS (7 ≤ V ≤ 18 V, −40°C < T < 150°C)
D
J
Value
typ
−
min
435
400
−20
max
1250
1200
15
Rating
Current Sense Ratio
Current Sense Ratio
Symbol
Conditions
= 0.01 A, V = 0.5 V, V
Unit
K
I
= 5 V
= 5 V
0
1
out
CS
CS_EN
K
I
= 0.025 A, V = 0.5 V, V
800
−
out
CS
CS_EN
Current Sense Ratio Drift
(Note 13)
DK / K
I
= 0.025 A, V = 5 V
CS_EN
%
%
%
%
1
1
2
3
4
5
out
Current Sense Ratio
K
I
= 0.35 A, V = 4V, V = 5 V
CS_EN
450
750
1000
15
2
out
CS
Current Sense Ratio Drift
(Note 13)
DK / K
I
= 0.35 A, V = 5 V
CS_EN
−15
−
2
out
Current Sense Ratio
K
3
I
= 0.5 A, V = 4 V, V = 5 V
CS_EN
530
750
950
10
out
CS
Current Sense Ratio Drift
(Note 13)
DK / K
I
= 0.5 A, V = 5 V
CS_EN
−15
−
3
out
Current Sense Ratio
K
4
I
I
= 1 A, V = 4 V, V
CS_EN
= 5 V
= 5 V
625
750
835
10
out
out
CS
Current Sense Ratio Drift
(Note 13)
DK / K
I
= 1 A, V = 5 V
CS_EN
−10
−
4
out
Current Sense Ratio
K
5
= 3 A, V = 4 V, V
690
750
775
5
CS
CS_EN
Current Sense Ratio Drift
(Note 13)
DK / K
I
= 3 A, V = 5 V
CS_EN
−5
−
%
5
out
Current Sense Leakage Current
CS
I
= 0 A, V = 0 V
−
−
−
5
−
7
3
−
−
−
−
−
−
−
1
2
mA
Ilkg
out
CS
V
V
= 5 V, V = 0 V
CS_EN
IN
I
= 0 A, V = 0 V
CS
out
CS_EN
= 5 V, V = 5 V
IN
I
= 2 A, V = 0 V
−
0.5
7
out
CS
V
= 0 V, V = 5 V,
CS_EN
IN
CS Max Voltage
CS
V
= 7 V, V = 5 V, R = 15 kW,
OUT
−
V
V
Max
D
IN
CS
CS_EN
I
= 2 A, V
= 5 V
Current Sense Voltage in Fault
Condition (Note 12)
V
V
= 13 V, V = 0 V, R = 1 kW,
OUT
10
20
−
−
CS_fault
CS_fault
OUT_sat
D
IN
CS
CS_EN
V
= 4 V, V
= 5 V
Current Sense Current in Fault
Condition (Note 12)
I
V
= 13 V, V = 5 V, V = 0 V,
OUT
30
−
mA
A
D
CS
= 4 V, V
IN
= 5 V
V
CS_EN
Output Saturation Current
(Note 13)
I
V = 7 V, V = 4 V, V = 5 V,
D CS IN
T = 150°C, V
= 5 V
J
CS_EN
CS_EN High to CS High Delay
Time
t
V
= 5 V, V = 0 to 5 V,
CS_EN
−
100
25
250
250
100
ms
ms
ms
ms
ms
CS_High1
IN
IN
IN
IN
R
= 1 kW, R = 6.5 W
CS
L
CS_EN Low to CS Low Delay
Time
t
V
V
V
= 5 V, V
= 5 to 0 V,
5
CS_Low1
CS_High2
CS_EN
R
= 1 kW, R = 6.5 W
CS
L
V
High to CS High Delay
t
= 0 to 5 V, V
= 5 V,
100
50
−
in
CS_EN
Time
R
= 1 kW, R = 6.5 W
CS L
V
in
Low to CS Low Delay Time
t
= 5 to 0 V, V
= 5 V,
CS_Low2
CS_EN
R
= 1 kW, R = 6.5 W
CS
L
Delay Time I Rising Edge to
Dt
V
= 5 V, V
= 5 V
D
CS_High2
IN
CS_EN
Rising Edge of CS
R
= 1 kW, I = 90% of I Max
CS CS CS
12.The following fault conditions are: Overtemperature, Power Limitation, and OFF State Open−Load Detection.
13.Not subjected to production testing. For more information, refer to the AND9733−D Applications Note.
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NCV84090
Table 12. TRUTH TABLE
Conditions
Input
Output
CS (V
= 5V) (Note 14)
CS_EN
Normal Operation
L
H
L
H
0
I
= I
/K
CS
OUT NOMINAL
Overtemperature
Undervoltage
L
L
L
0
H
V
CS_High
L
H
L
L
0
0
Overload
H
H
H (no active current mgmt)
Cycling (active current mgmt)
I
= I
/K
CS_High
CS
OUT NOMINAL
V
Short circuit to Ground
OFF State Open Load
L
L
L
0
H
V
CS_High
L
H
V
CS_High
14.If V
is low, the Current Sense output is at a high impedance, its potential depends on leakage currents and external circuitry.
CS_EN
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NCV84090
WAVEFORMS AND GRAPHS
Resistive Switching Characteristics
VOUT
80%
80%
dVOUT/dt(off)
20%
dVOUT/dt(on)
20%
td(on)
td(off)
VIN
t(on)
t(off)
Figure 4. Switching Characteristics
Normal Operation
VIN
t
t
t
t
IOUT
tON
tOFF
tON
VCS_EN
ntCS_High2
tCS_High1
tCS_Low1
VCS
tCS_High2
Figure 5. Normal Operation with Current Sense Timing Characteristics
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NCV84090
VIN
DtCS_High2
t
IOUT
IOUTMAX
90% IOUTMAX
t
ICS
ICSMAX
90% ICSMAX
t
Figure 6. Delay Response from rising edge of IOUT and rising edge of CS (for CS_EN = 5V)
Off−State Open−Load Delay Timing
VIN
t
VOUT
VOL
t
VCS
VCS_FAULT
t
td_OL_off
Figure 7. OFF−State Open−Load Flag Delay Timing
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NCV84090
VIN
VOUT
VOL
IOUT
VCS
VCS_Fault
tCS_Low1
td_OL_off
VCS_EN
Figure 8. Off−State Open−Load with added external components
VD −VOUT
TJ = 150°C
TJ = 25°C
TJ = −40°C
VDS_ON
IOUT
VDS_ON/RDSON(T)
Figure 9. Voltage Drop Limitation for VDS_ON
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NCV84090
1400
1300
1200
1100
1000
900
A. Max, -40°C ≤ TJ ≤ 150°C
800
700
B. Typ, -40°C ≤ TJ ≤ 150°C
C. Min, -40°C ≤ TJ≤ 150°C
600
500
400
300
200
0
0.25
0.5
0.75
1
1.25
1.5
1.75
2
2.25
2.5
2.75
3
3.25
IOUT (A)
Figure 10. IOUT/ICS vs. IOUT
30
25
20
15
10
5
A. Max, -40°C ≤ TJ ≤ 150°C
0
-5
-10
-15
-20
-25
-30
B. Min, -40°C ≤ TJ ≤ 150°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
IOUT (A)
Figure 11. Current Sense Ratio Drift vs. Load Current
www.onsemi.com
13
NCV84090
VIN
IOUT
IlimH
IlimTCycling
VCS
VCS_fault
VCS_EN
Figure 12. Short to GND or Overload
VIN
t
t
IOUT
ILIMH
Overload
Current Limit during
thermal cycling
DC Output Current Limit
ILIMTCycling
TJ
TTSD
TR
TRS
nT
J
nT
J_RST
TJ_Start
t
Figure 13. How TJ progresses during Short to GND or Overload
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14
NCV84090
VIN
IOUT
IlimH
Overload
INOMINAL
IlimTCycling
ICS
ICS_Fault
INOM/K
VCS_EN
Figure 14. Discontinuous Overload or Short to GND
Resistive short
Short from OUT
from OUT to VD
to VD
VOUT
VOL
IOUT
VCS
VCS_Fault
td_OL_off
td_OL_off
VCS_EN
Figure 15. Short Circuit from OUT to VD
www.onsemi.com
15
NCV84090
TYPICAL CHARACTERISTICS
7.5
7.0
6.5
6
5
4
3
2
V
IN
V
OUT
= 0 V
= 0 V
V
= 5.0 V
IN
6.0
5.5
5.0
4.5
4.0
3.5
3.0
T = 150°C
J
V
D
= 13 V
T = 125°C
J
T = 25°C
V
V
= 0.9 V
= 2.1 V
J
IN
1
0
T = −40°C
J
IN
2.5
2.0
−40 −20
0
5
10
15
20
(V)
25
30
35
0
20
40
60
80 100 120 140
V
D
TEMPERATURE (°C)
Figure 16. Output Leakage Current vs. VD
Figure 17. Input Current vs. Temperature
14.0
13.5
−11.5
−12.0
−12.5
−13.0
13.0
12.5
I
IN
= 1 mA
I
IN
= −1 mA
−13.5
−14.0
12.0
11.5
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 18. Input Clamp Voltage (Positive) vs.
Temperature
Figure 19. Input Clamp Voltage (Negative) vs.
Temperature
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.7
1.6
V
D
= 13 V
V
D
= 13 V
1.5
1.4
1.3
1.2
1.1
1.0
1.3
1.2
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 20. VIN Threshold High vs. Temperature
Figure 21. VIN Threshold Low vs. Temperature
www.onsemi.com
16
NCV84090
TYPICAL CHARACTERISTICS
0.40
0.35
0.30
0.25
0.20
0.15
0.10
160
V
I
= 13.5 V
= 2.5 A
D
140
120
100
80
OUT
60
40
20
0.05
0
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 22. Hysteresis Input Voltage vs.
Temperature
Figure 23. RON vs. Temperature
260
240
220
200
180
160
140
120
100
80
3.50
I
= 2.5 A
OUT
3.45
3.40
3.35
3.30
T = 150°C
J
T = 125°C
J
T = 25°C
J
3.25
3.20
T = −40°C
60
40
J
3
7
11
15
19
23
27
−40 −20
0
20
40
60
80 100 120 140
V
D
(V)
TEMPERATURE (°C)
Figure 24. RON vs. VD Voltage
Figure 25. Undervoltage Shutdown vs.
Temperature
0.7
0.6
0.5
0.4
0.3
0.2
0.7
0.6
0.5
0.4
V
R
= 13 V
V = 13 V
D
D
= 6.5 W
R
= 6.5 W
LOAD
LOAD
0.3
0.2
0.1
0
0.1
0
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 26. Slew Rate ON vs. Temperature
Figure 27. Slew Rate OFF vs. Temperature
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17
NCV84090
TYPICAL CHARACTERISTICS
28
27
26
25
24
23
22
21
20
19
2.2
V
= 13 V
D
V
= 13 V
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
D
18
17
16
1.3
1.2
−40 −20
−40 −20
0
20
40
60
80 100 120 140
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 28. Current Limit vs. Temperature
Figure 29. CS_EN Threshold High vs.
Temperature
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
14.0
13.5
13.0
12.5
12.0
V
= 13 V
D
I
= 1 mA
CS_EN
11.5
11.0
0.9
0.8
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 30. CS_EN Threshold Low vs.
Temperature
Figure 31. CS_EN Clamp Voltage (Positive) vs.
Temperature
−11.0
−11.5
−12.0
−12.5
−13.0
I
= −1 mA
CS_EN
−13.5
−14.0
−40 −20
0
20
40
60
80 100 120 140
TEMPERATURE (°C)
Figure 32. CS_EN Clamp Voltage (Negative)
vs. Temperature
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18
NCV84090
Table 13. ISO 7637−2: 2011(E) PULSE TEST RESULTS
Test Severity Levels
ISO 7637−2:2011
Test Pulse
III
IV
Delays and Impedance
2 ms, 10 W
# of Pulses or Test Time
Pulse / Burst Rep. Time
1
−112
55
−150
112
500 pulses
500 pulses
1 h
0.5 s
0.5 s
2a
3a
3b
0.05 ms, 2 W
−165
112
−220
150
0.1 ms, 50 W
100 ms
100 ms
0.1 ms, 50 W
1 h
Test Results
ISO 7637−2:2011
Test Pulse
III
IV
A
C
A
A
1
2a
3a
3b
Class
Functional Status
A
All functions of a device perform as designed during and after exposure to disturbance.
All functions of a device perform as designed during exposure. However, one or more of them can go beyond
specified tolerance. All functions return automatically to within normal limits after exposure is removed. Memo-
ry functions shall remain class A.
B
C
D
E
One or more functions of a device do not perform as designed during exposure but return automatically to
normal operation after exposure is removed.
One or more functions of a device do not perform as designed during exposure and do not return to normal
operation until exposure is removed and the device is reset by simple “operator/use” action.
One or more functions of a device do not perform as designed during and after exposure and cannot be re-
turned to proper operation without replacing the device.
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19
NCV84090
+5V
VD
RμC
RμC
RμC
ZCS
CS
IN
Output
Clamping
Dld
ZVD
Micro
Controller
VBAT
Control
Logic
CS_EN
ZBody
OUT
Cexternal
RCS
Z ESD
GND
ZL
RGND
Figure 33. Application Schematic
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20
NCV84090
Protection Features
In application, the device can be subject to stressful
conditions which are outside of normal operating range. To
prevent damage and destruction of the device from these
fault conditions, several protection functions are integrated
in device design. It is important to diagnose and remove any
fault condition that may exist since the protection functions
cannot prevent damage for continuous and repetitive faulty
operation.
OFF. In loss of ground state, the output stage is held OFF
independent of the state of the input. Input resistors are
recommended between the device and microcontroller.
Undervoltage Protection
The device has two under−voltage threshold levels,
V
D_MIN
and V . Switching function (ON/OFF) requires
UV
supply voltage to be at least V
. The device features a
D_MIN
lower supply threshold V , above which the output can
UV
remain in ON state. While all protection functions are
guaranteed when the switch is ON, diagnostic functions are
Loss of Ground Protection
When device or ECU ground connection is lost and load
is still connected to ground, the device will turn the output
operational only within nominal supply voltage range V
D.
VOUT
VUV
VD _ MIN
VD
Figure 34. Undervoltage Behavior
Overvoltage Protection:
The NCV84090 has two Zener diodes Z
which provide integrated overvoltage protection. Z
current flowing through Z and out of the CS pin into the
micro−controller I/O pin. With RGND, the GND pin voltage
CS
and Z
,
VD
CS
is elevated to V – V
when the supply voltage V rises
VD
D
ZVD
D
protects the logic block by clamping the voltage between
supply pin V and ground pin GND to V . Z limits
above V
. ESD diodes Z
pull up the voltage at logic
ZVD
ESD
pins IN, CS_EN close to the GND pin voltage V – V
External resistors R , and R
.
D
ZVD CS
D
ZVD
voltage at current sense pin CS to V – V . The output
are required to limit the
D
ZCS
IN
CS_EN
power MOSFET’s output clamping diodes provide
protection by clamping the voltage across the MOSFET
current flowing out of the logic pins into the
micro−controller I/O pins. During overvoltage exposure, the
device transitions into a self−protection state, with
automatic recovery after the supply voltage comes back to
the normal operating range. The specified parameters as
well as short circuit robustness and energy capability cannot
be guaranteed during overvoltage exposure.
(between V pin and OUT pin) to V
. During
CLAMP
D
overvoltage protection, current flowing through Z , Z
VD CS
and the output clamp must be limited. Load impedance Z
L
limits the current in the body diode Z . In order to limit
Body
the current in Z a resistor, R
the GND path. External resistors R and R
(150 Ω), is required in
VD
GND
limit the
CS
SENSE
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21
NCV84090
Reverse Battery Protection
Since this resistor can be used amongst multiple
High−Side devices, please take note the sum of the
maximum active GND currents (I ) for each
device when sizing the resistor. Please note that if the
microprocessor GND is not shared by the device GND, then
Solution 1: Resistor in the GND line only
(no parallel Diode)
The following calculations are true for any type of load.
In the case for no diode in parallel with R
calculations below explain how to size the resistor.
Consider the following parameters:
GND(On)max
, the
GND
R
GND
produces a shift of (I
× R
) in the input
GND(On)max
GND
thresholds and CS output values. If the calculated power
dissipation leads to too large of a resistor size or several
devices have to share the same resistor, please look at the
second solution for Reverse Battery Protection. Refer to
–I
Maximum = 200 mA for up to −V = 32 V.
GND
D
Where –I
is the DC reverse current through the GND
GND
pin and –V is the DC reverse battery voltage.
D
Figure 35 for selecting the proper R
.
GND
* VD
RGND
* IGND
+
(eq. 1)
Figure 35. Reverse Battery RGND Considerations
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22
NCV84090
Overload Protection
MOSFET will automatically be re−activated after a
minimum OFF time or when the junction temperature
returns to a safe level.
Current limitation as well as overtemperature shutdown
mechanisms are integrated into NCV84090 to provide
protection from overload conditions such as bulb inrush or
short to ground.
Output Clamping with Inductive Load Switch Off:
The output voltage V
drops below GND potential
OUT
Current Limitation
when switching off inductive loads. This is because the
inductance develops a negative voltage across the load in
response to a decaying current. The integrated clamp of the
device clamps the negative output voltage to a certain level
In case of overload, NCV84090 limits the current in the
output power MOSFET to a safe value. Due to high power
dissipation during current limitation, the device’s junction
temperature increases rapidly. In order to protect the device,
the output driver is shut down by one of the two
overtemperature protection mechanisms. The output current
limit is dependent on the device temperature, and will fold
back once the die reaches thermal shutdown. If the input
remains active during the shutdown, the output power
relative to the supply voltage V . During output clamping
BAT
with inductive load switch off, the energy stored in the
inductance rapidly dissipated in the device resulting in high
power dissipation. This is a stressful condition for the device
and the maximum energy allowed for a given load
inductance should not be exceeded in any application.
VIN
t
t
IOUT
VOUT
VBAT
t
VCLAMP
VBAT −VCLAMP
Figure 36. Inductive Load Switching
20
10
V
= 13.5 V
D
R = 0 W
L
T
Jstart
= 150°C, Single Pulse
1
1
10
100
L (mH)
Figure 37. Maximum Switch−Off Current vs. Load Inductance, VD = 13.5 V; RL = 0 W
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23
NCV84090
Inverse Current:
When the output voltage V
(I ), the current sense output current is reduced to a very
OL
rises above the supply
low value (I ). This mechanism helps to overcome a high
OUT
OL
voltage V , the output power MOSFET’s integral body
absolute tolerance of the current sense signal at very low
load current and to implement an accurate underload
detection threshold.
D
diode will be forward biased causing a current flow from the
OUT pin to the V pin. The device does not provide any
D
protection function such as current limitation or
overtemperature shutdown.
Open Load Detection in OFF State
Open load diagnosis in OFF state can be performed by
activating an external resistive pull−up path (R ) to V
Underload Detection in ON State
.
PU
BAT
An underload condition in ON state is indicated by
reducing the sense output current to a very minimal current.
In order to detect an underload condition, NCV84090
performs a real−time monitoring of the load current. In case
the output current falls below a specified threshold level
To calculate the pull−up resistance, external leakage
currents (designed pull−down resistance, humidity−induced
leakage etc) as well as the open load threshold voltage
V
have to be taken into account.
OL_OFF
VBAT
VD
VOL_OFF
IN
ZBody
RPU
ICS_FAULT
OUT
CS
GND
RGND
RPD
RLEAK
ZL
RCS
Figure 38. Open Load Detection in Off State
Current Sense in PWM Mode
a typical delay (tCS_High2) before the current sense
responds. Once this timing delay has passed, the rise time of
the current sense output (DtCS_High2) also needs to be
considered. When VIN switches from high to low a delay
time (tCS_Low1) needs to be considered. As long as these
timing delays are allowed, the current sense pin can be
operated in PWM mode.
When operating in PWM mode, the current sense
functionality can be used, but the timing of the input signal
and the response time of the current sense need to be
considered. When operating in PWM mode, the following
performance is to be expected. The CS_EN pin should be
left high to eliminate any unnecessary delay time to the
circuit. When VIN switches from low to high, there will be
www.onsemi.com
24
NCV84090
PACKAGE AND PCB THERMAL DATA
100
10
1
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
0.01
0.1
2
NCV84090, 8−SOIC, PCB Copper Area 645 mm ,
PCB:80x80x1.6 mm FR4, four−layer 2s2p
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t, PULSE TIME (s)
Figure 39. Junction−to−Ambient Transient Thermal Impedance (645 mm2 Cu Area)
100
10
1
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
0.01
2
NCV84090, 8−SOIC, PCB Copper Area 2 cm ,
PCB:80x80x1.6 mm FR4, four−layer 2s0p
0.1
Single Pulse
0.000001 0.00001
0.01
0.0001
0.001
0.01
0.1
1
10
100
1000
t, PULSE TIME (s)
Figure 40. Junction−to−Ambient Transient Thermal Impedance (2 cm2 Cu Area)
www.onsemi.com
25
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
8
1
DATE 16 FEB 2011
SCALE 1:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
Y
B
0.25 (0.010)
1
K
−Y−
MILLIMETERS
DIM MIN MAX
INCHES
G
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
1.27 BSC
0.050 BSC
−Z−
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
0.10 (0.004)
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
8
1
8
1
8
8
XXXXX
ALYWX
XXXXXX
AYWW
G
XXXXX
ALYWX
XXXXXX
AYWW
1.52
0.060
G
1
1
Discrete
Discrete
(Pb−Free)
IC
IC
(Pb−Free)
7.0
0.275
4.0
0.155
XXXXX = Specific Device Code
XXXXXX = Specific Device Code
A
L
= Assembly Location
= Wafer Lot
A
= Assembly Location
= Year
Y
Y
W
G
= Year
= Work Week
= Pb−Free Package
WW
G
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42564B
SOIC−8 NB
PAGE 1 OF 2
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are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−8 NB
CASE 751−07
ISSUE AK
DATE 16 FEB 2011
STYLE 1:
STYLE 2:
STYLE 3:
STYLE 4:
PIN 1. EMITTER
2. COLLECTOR
3. COLLECTOR
4. EMITTER
5. EMITTER
6. BASE
PIN 1. COLLECTOR, DIE, #1
2. COLLECTOR, #1
3. COLLECTOR, #2
4. COLLECTOR, #2
5. BASE, #2
PIN 1. DRAIN, DIE #1
2. DRAIN, #1
3. DRAIN, #2
4. DRAIN, #2
5. GATE, #2
PIN 1. ANODE
2. ANODE
3. ANODE
4. ANODE
5. ANODE
6. ANODE
7. ANODE
6. EMITTER, #2
7. BASE, #1
6. SOURCE, #2
7. GATE, #1
7. BASE
8. EMITTER
8. EMITTER, #1
8. SOURCE, #1
8. COMMON CATHODE
STYLE 5:
STYLE 6:
PIN 1. SOURCE
2. DRAIN
STYLE 7:
STYLE 8:
PIN 1. COLLECTOR, DIE #1
2. BASE, #1
PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. DRAIN
5. GATE
PIN 1. INPUT
2. EXTERNAL BYPASS
3. THIRD STAGE SOURCE
4. GROUND
5. DRAIN
6. GATE 3
7. SECOND STAGE Vd
8. FIRST STAGE Vd
3. DRAIN
3. BASE, #2
4. SOURCE
5. SOURCE
6. GATE
7. GATE
8. SOURCE
4. COLLECTOR, #2
5. COLLECTOR, #2
6. EMITTER, #2
7. EMITTER, #1
8. COLLECTOR, #1
6. GATE
7. SOURCE
8. SOURCE
STYLE 9:
STYLE 10:
PIN 1. GROUND
2. BIAS 1
STYLE 11:
PIN 1. SOURCE 1
2. GATE 1
STYLE 12:
PIN 1. EMITTER, COMMON
2. COLLECTOR, DIE #1
3. COLLECTOR, DIE #2
4. EMITTER, COMMON
5. EMITTER, COMMON
6. BASE, DIE #2
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
3. OUTPUT
4. GROUND
5. GROUND
6. BIAS 2
7. INPUT
8. GROUND
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
7. BASE, DIE #1
8. EMITTER, COMMON
STYLE 13:
PIN 1. N.C.
2. SOURCE
3. SOURCE
4. GATE
STYLE 14:
PIN 1. N−SOURCE
2. N−GATE
STYLE 15:
PIN 1. ANODE 1
2. ANODE 1
STYLE 16:
PIN 1. EMITTER, DIE #1
2. BASE, DIE #1
3. P−SOURCE
4. P−GATE
5. P−DRAIN
6. P−DRAIN
7. N−DRAIN
8. N−DRAIN
3. ANODE 1
4. ANODE 1
5. CATHODE, COMMON
6. CATHODE, COMMON
7. CATHODE, COMMON
8. CATHODE, COMMON
3. EMITTER, DIE #2
4. BASE, DIE #2
5. COLLECTOR, DIE #2
6. COLLECTOR, DIE #2
7. COLLECTOR, DIE #1
8. COLLECTOR, DIE #1
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 17:
PIN 1. VCC
2. V2OUT
3. V1OUT
4. TXE
STYLE 18:
STYLE 19:
PIN 1. SOURCE 1
2. GATE 1
STYLE 20:
PIN 1. ANODE
2. ANODE
3. SOURCE
4. GATE
PIN 1. SOURCE (N)
2. GATE (N)
3. SOURCE (P)
4. GATE (P)
5. DRAIN
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. MIRROR 2
7. DRAIN 1
8. MIRROR 1
5. RXE
6. VEE
7. GND
8. ACC
5. DRAIN
6. DRAIN
7. CATHODE
8. CATHODE
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 21:
STYLE 22:
STYLE 23:
STYLE 24:
PIN 1. CATHODE 1
2. CATHODE 2
3. CATHODE 3
4. CATHODE 4
5. CATHODE 5
6. COMMON ANODE
7. COMMON ANODE
8. CATHODE 6
PIN 1. I/O LINE 1
PIN 1. LINE 1 IN
PIN 1. BASE
2. COMMON CATHODE/VCC
3. COMMON CATHODE/VCC
4. I/O LINE 3
5. COMMON ANODE/GND
6. I/O LINE 4
7. I/O LINE 5
8. COMMON ANODE/GND
2. COMMON ANODE/GND
3. COMMON ANODE/GND
4. LINE 2 IN
2. EMITTER
3. COLLECTOR/ANODE
4. COLLECTOR/ANODE
5. CATHODE
6. CATHODE
7. COLLECTOR/ANODE
8. COLLECTOR/ANODE
5. LINE 2 OUT
6. COMMON ANODE/GND
7. COMMON ANODE/GND
8. LINE 1 OUT
STYLE 25:
PIN 1. VIN
2. N/C
STYLE 26:
PIN 1. GND
2. dv/dt
STYLE 27:
PIN 1. ILIMIT
2. OVLO
STYLE 28:
PIN 1. SW_TO_GND
2. DASIC_OFF
3. DASIC_SW_DET
4. GND
3. REXT
4. GND
5. IOUT
6. IOUT
7. IOUT
8. IOUT
3. ENABLE
4. ILIMIT
5. SOURCE
6. SOURCE
7. SOURCE
8. VCC
3. UVLO
4. INPUT+
5. SOURCE
6. SOURCE
7. SOURCE
8. DRAIN
5. V_MON
6. VBULK
7. VBULK
8. VIN
STYLE 30:
PIN 1. DRAIN 1
2. DRAIN 1
STYLE 29:
PIN 1. BASE, DIE #1
2. EMITTER, #1
3. BASE, #2
3. GATE 2
4. SOURCE 2
5. SOURCE 1/DRAIN 2
6. SOURCE 1/DRAIN 2
7. SOURCE 1/DRAIN 2
8. GATE 1
4. EMITTER, #2
5. COLLECTOR, #2
6. COLLECTOR, #2
7. COLLECTOR, #1
8. COLLECTOR, #1
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42564B
SOIC−8 NB
PAGE 2 OF 2
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