NTMFSC0D9N04CL [ONSEMI]

Power MOSFET, 40V N Channel __A 0.9m Ohm in Dualcool56 package;
NTMFSC0D9N04CL
型号: NTMFSC0D9N04CL
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET, 40V N Channel __A 0.9m Ohm in Dualcool56 package

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel, DUAL COOL),  
DFN8 5x6  
V
R
MAX  
I MAX  
D
SSS  
SS(ON)  
0.85 mW @ 10 V  
1.3 mW @ 4.5 V  
40 V  
313 A  
40 V, 0.85 mW, 313 A  
NTMFSC0D9N04CL  
Features  
Advanced DualSided Cooled Packaging  
DFN8 5x6  
CASE 506EG  
Ultra Low R  
to Minimize Conduction Losses  
DS(on)  
MSL1 Robust Packaging Design  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
MARKING DIAGRAM  
Typical Applications  
3KAYWZ  
Orring FET/Load Switching  
Synchronous Rectifier  
DCDC Conversion  
MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)  
J
3K  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
W
Z
= Work Week  
= Assembly Lot Code  
GatetoSource Voltage  
V
20  
V
GS  
Continuous Drain  
Current R  
I
313  
A
D
q
JC  
Steady  
State  
(Note 2)  
NChannel MOSFET  
T
= 25°C  
C
Power Dissipation  
P
167  
W
A
D
R
(Note 2)  
q
JC  
S
S
S
1
8
D
D
D
Continuous Drain  
Current R  
I
49.5  
D
q
JA  
2
3
7
6
Steady  
State  
(Note 1, 2)  
T = 25°C  
A
Power Dissipation  
P
3.8  
W
D
R
(Note 1, 2)  
q
JA  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
900  
A
A
p
G
4
5
D
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
169  
706  
A
S
ORDERING INFORMATION  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 29 A)  
L(pk)  
Lead Temperature Soldering Reflow for Sol-  
dering Purposes (1/8from case for 10 s)  
T
L
300  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surfacemounted on FR4 board using 1 in pad size, 1 oz Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
February, 2023 Rev. 7  
NTMFSC0D9N04CL/D  
 
NTMFSC0D9N04CL  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Max  
0.9  
1.4  
39  
Unit  
JunctiontoCase (Bottom) – Steady State (Note 3)  
JunctiontoCase (Top) – Steady State (Note 3)  
JunctiontoAmbient – Steady State (Note 3)  
°C/W  
R
q
JC  
R
q
JC  
R
q
JA  
3. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular  
conditions noted.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain*to*Source Breakdown Voltage  
V
V
= 0 V, I = 250 mA  
40  
V
(BR)DSS  
GS  
D
Drain*to*Source Breakdown Voltage  
V
/ T  
I = 250 mA, ref to 25°C  
D
21.2  
mV/°C  
(BR)DSS  
J
Temperature Coefficient  
Zero Gate Voltage Drain Current  
I
V
GS  
= 0 V, V = 40 V  
T = 25°C  
J
10  
mA  
DSS  
DS  
T = 125°C  
100  
100  
J
Gate*to*Source Leakage Current  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage  
I
V
= 0 V, V = 20 V  
nA  
GSS  
DS  
GS  
V
V
GS  
= V , I = 250 mA  
1.2  
2.0  
V
GS(TH)  
DS  
D
/ T  
Negative Threshold Temperature  
Coefficient  
V
I
D
= 250 mA, ref to 25°C  
5.8  
mV/°C  
GS(TH)  
J
Drain*to*Source On Resistance  
R
V
= 10 V, I = 50 A  
0.65  
1
0.85  
1.3  
mW  
W
DS(on)  
GS  
D
V
GS  
= 4.5 V, I = 50 A  
D
GateResistance  
R
T = 25°C  
A
1.8  
G
CHARGES & CAPACITANCES  
Input Capacitance  
C
V
= 0 V, f = 1 MHz, V = 20 V  
8500  
3400  
110  
61  
pF  
ISS  
GS  
DS  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C
OSS  
RSS  
C
Q
Q
V
GS  
= 4.5 V, V = 20 V, I = 50 A  
nC  
G(TOT)  
G(TOT)  
DS  
D
Total Gate Charge  
V
GS  
= 10 V, V = 20 V, I = 50 A  
143  
27  
DS  
D
GatetoSource Charge  
GatetoDrain Charge  
Plateau Voltage  
Q
Q
GS  
GD  
GP  
19  
V
2.7  
V
SWITCHING CHARACTERISTICS (Note 4)  
Turn*On Delay Time  
t
t
V
= 4.5 V, V = 32 V,  
20.2  
94.6  
77.8  
111  
ns  
d(ON)  
GS  
D
DS  
I
= 50 A, R = 2.5 W  
G
Rise Time  
t
r
Turn*Off Delay Time  
Fall Time  
d(OFF)  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
V
GS  
= 0 V, I = 50 A  
T = 25°C  
0.75  
0.6  
92  
1.2  
V
SD  
S
J
T = 125°C  
J
Reverse Recovery Time  
t
V
GS  
= 0 V, dI /dt = 100 A/ms,  
ns  
RR  
S
I
= 50 A  
S
Reverse Recovery Charge  
Q
170  
nC  
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Switching characteristics are independent of operating junction temperatures.  
www.onsemi.com  
2
 
NTMFSC0D9N04CL  
TYPICAL CHARACTERISTICS  
180  
200  
180  
160  
140  
120  
100  
80  
10 V to 3.2 V  
160  
3.0 V  
140  
120  
2.8 V  
100  
80  
60  
40  
T = 25°C  
J
60  
40  
T = 125°C  
20  
0
J
20  
0
T = 55°C  
J
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5 4.0  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
0.0013  
0.0012  
0.0011  
0.0010  
0.0009  
0.0008  
0.0012  
0.0011  
T = 25°C  
J
V
= 4.5 V  
= 10 V  
GS  
0.0010  
0.0009  
0.0008  
0.0007  
0.0006  
T = 25°C  
D
J
I
= 50 A  
V
GS  
0.0007  
0.0006  
0.0005  
0.0004  
3
4
5
6
7
8
9
10  
10  
20  
30  
40  
50  
60  
V
GS  
, GATE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. GatetoSource  
Figure 4. OnResistance vs. Drain Current and  
Voltage  
Gate Voltage  
1.9  
1.7  
1.5  
1.3  
1.1  
1M  
100k  
10k  
1k  
V
I
= 10 V  
= 40 A  
GS  
D
T = 150°C  
J
T = 125°C  
J
T = 85°C  
J
100  
10  
0.9  
0.7  
50 25  
0
25  
50  
75 100 125 150 175  
5
10  
V
15  
20  
25  
30  
35  
40  
T , JUNCTION TEMPERATURE (°C)  
, DRAINTOSOURCE VOLTAGE (V)  
J
DS  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Voltage  
www.onsemi.com  
3
NTMFSC0D9N04CL  
TYPICAL CHARACTERISTICS  
11k  
10k  
9k  
10  
8
30  
25  
20  
Q
T
C
ISS  
8k  
C
OSS  
7k  
V
= 0 V  
GS  
6
4
T = 25°C  
6k  
J
15  
10  
f = 1 MHz  
5k  
Q
GD  
Q
GS  
4k  
V
= 20 V  
DS  
3k  
T = 25°C  
J
2
0
I
D
= 50 A  
2k  
5
0
1k  
0
C
RSS  
0
5
10  
15  
20  
25  
30  
35  
40  
0
20  
40  
60  
80  
100  
120  
140  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
G
Figure 7. Capacitance Variation  
Figure 8. GatetoSource and  
DraintoSource Voltage vs. Total Charge  
10,00  
100  
t
t
d(off)  
46  
41  
36  
31  
26  
21  
16  
11  
f
t
r
t
d(on)  
T = 125°C  
J
10  
1
V
V
I
= 4.5 V  
= 20 V  
= 50 A  
GS  
T = 150°C  
J
DD  
T = 25°C  
J
6
1
D
T = 55°C  
J
1
10  
R , GATE RESISTANCE (W)  
100  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
V
SD  
, SOURCETODRAIN VOLTAGE (V)  
G
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
1000  
100  
10  
1000  
100  
10 ms  
T
= 25°C  
J(initial)  
T
C
= 25°C  
Single Pulse  
10 V  
T
= 100°C  
0.5 ms  
1 ms  
10 ms  
J(initial)  
V
GS  
10  
1
1
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
0.1  
0.1  
1
10  
100  
1000  
1E04  
1E03  
TIME IN AVALANCHE (s)  
1E02  
V
DS  
, DRAINTOSOURCE VOLTAGE(V)  
Figure 11. Safe Operating Area  
Figure 12. IPEAK vs. Time in Avalanche  
www.onsemi.com  
4
NTMFSC0D9N04CL  
TYPICAL CHARACTERISTICS  
100  
10  
50% Duty Cycle  
20%  
10%  
5%  
2%  
1
1%  
0.1  
0.01  
0.001  
Single Pulse  
0.0001  
0.0000001 0.000001 0.00001 0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (sec)  
Figure 13. Thermal Characteristics RqJA(t) (5C/W)  
10  
1
50% Duty Cycle  
20%  
10%  
5%  
0.1  
2%  
1%  
0.01  
Single Pulse  
T
C
= 25°C  
0.001  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
PULSE TIME (sec)  
Figure 14. Thermal Characteristics RqJC(t) (5C/W)  
ORDERING INFORMATION  
Device  
Device Marking  
Package  
Shipping  
NTMFSC0D9N04CL  
3K  
DFN8 5x6  
(PbFree/Halogen Free)  
3000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
DUAL COOL is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States  
and/or other countries.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DFN8 5x6.15, 1.27P, DUAL COOL  
CASE 506EG  
ISSUE D  
DATE 25 AUG 2020  
GENERIC  
MARKING DIAGRAM*  
AYWWZZ  
XXXXXX  
XXXX = Specific Device Code  
*This information is generic. Please refer to  
A
Y
= Assembly Location  
= Year  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
WW = Work Week  
ZZ  
= Assembly Lot Code  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON84257G  
DFN8 5x6.15, 1.27P, DUAL COOL  
PAGE 1 OF 1  
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