NVH4L075N065SC1 [ONSEMI]

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 57 mohm, 650 V, M2, TO247−4L;
NVH4L075N065SC1
型号: NVH4L075N065SC1
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 57 mohm, 650 V, M2, TO247−4L

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – 57 mohm, 650 V,  
M2, TO-247-4L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
650 V  
85 m@ 18 V  
38 A  
D
NVH4L075N065SC1  
Features  
G
Typ. R  
= 57 m@ V = 18 V  
GS  
= 75 m@ V = 15 V  
GS  
DS(on)  
S1: Kelvin Source  
S2: Power Source  
Typ. R  
DS(on)  
Ultra Low Gate Charge (Q  
= 61 nC)  
G(tot)  
S1 S2  
Low Output Capacitance (C = 107 pF)  
oss  
NCHANNEL MOSFET  
100% Avalanche Tested  
AECQ101 Qualified and PPAP Capable  
This Device is Halide Free and RoHS Compliant with exemption 7a,  
PbFree 2LI (on second level interconnection)  
Typical Applications  
D
Automotive On Board Charger  
Automotive DC-DC Converter for EV/HEV  
S2  
S1  
G
TO2474L  
CASE 340CJ  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
650  
Unit  
V
V
DSS  
MARKING DIAGRAM  
GatetoSource Voltage  
V
8/+22  
5/+18  
V
GS  
Recommended Operation Values  
of GatetoSource Voltage  
T
< 175°C  
= 25°C  
V
GSop  
V
C
Continuous Drain  
Current (Note 1)  
Steady  
State  
T
I
38  
148  
26  
A
W
A
H4L075  
065SC1  
AYWWZZ  
C
D
Power Dissipation  
(Note 1)  
P
D
Continuous Drain  
Current (Note 1)  
Steady  
State  
T
C
= 100°C  
I
D
H4L075065SC1 = Specific Device Code  
Power Dissipation  
(Note 1)  
P
74  
W
A
D
A
Y
= Assembly Location  
= Year  
Pulsed Drain Current  
(Note 2)  
T
C
= 25°C  
I
120  
DM  
WW = Work Week  
ZZ  
= Lot Traceability  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
ORDERING INFORMATION  
Source Current (Body Diode)  
I
29  
83  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Device  
NVH4L075N065SC1  
Package  
Shipping  
Energy (I  
= 12.9 A, L = 1 mH) (Note 3)  
L(pk)  
TO2474L  
30 Units /  
Tube  
Maximum Lead Temperature for Soldering  
(1/8from case for 5 s)  
T
260  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive rating, limited by max junction temperature.  
3. EAS of 83 mJ is based on starting T = 25°C; L = 1 mH, I = 12.9 A,  
J
AS  
V
DD  
= 50 V, V = 18 V.  
GS  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
May, 2022 Rev. 1  
NVH4L075N065SC1/D  
 
NVH4L075N065SC1  
Table 1. THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
JunctiontoCase Steady State (Note 1)  
JunctiontoAmbient Steady State (Note 1)  
Symbol  
Max  
1.01  
40  
Unit  
°C/W  
R
JC  
R
JA  
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
= 0 V, I = 1 mA  
650  
V
(BR)DSS  
GS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
I = 20 mA, referenced to 25°C  
D
0.15  
V/°C  
(BR)DSS  
J
Zero Gate Voltage Drain Current  
I
V
V
= 0 V,  
T = 25°C  
10  
1
A  
mA  
nA  
DSS  
GS  
DS  
J
= 650 V  
T = 175°C  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 2)  
Gate Threshold Voltage  
I
V
V
= +18/5 V, V = 0 V  
250  
GSS  
GS  
DS  
V
R
= V , I = 5 mA  
1.8  
5  
2.8  
4.3  
+18  
V
V
GS(TH)  
GS  
DS  
D
Recommended Gate Voltage  
DraintoSource On Resistance  
V
GOP  
V
GS  
V
GS  
V
GS  
V
DS  
= 15 V, I = 15 A, T = 25°C  
75  
57  
68  
9
mꢀ  
DS(on)  
D
J
= 18 V, I = 15 A, T = 25°C  
85  
D
J
= 18 V, I = 15 A, T = 175°C  
D
J
Forward Transconductance  
g
= 10 V, I = 15 A  
S
FS  
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
= 0 V, f = 1 MHz, V = 325 V  
1196  
107  
9
pF  
nC  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
C
RSS  
Reverse Transfer Capacitance  
Total Gate Charge  
Q
V
D
= 5/18 V, V = 520 V,  
61  
G(TOT)  
GS  
DS  
I
= 15 A  
GatetoSource Charge  
GatetoDrain Charge  
GateResistance  
Q
Q
19  
GS  
18  
GD  
R
f = 1 MHz  
5.8  
G
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
Rise Time  
t
V
D
= 5/18 V, V = 400 V,  
10  
12  
20  
7
ns  
d(ON)  
GS  
DS  
I
= 15 A, R = 2.2 ꢀ  
G
t
r
Inductive load  
TurnOff Delay Time  
t
d(OFF)  
Fall Time  
t
f
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
ON  
38  
16  
54  
J
E
OFF  
E
tot  
DRAINSOURCE DIODE CHARACTERISTICS  
Continuous DrainSource Diode Forward  
I
V
V
= 5 V, T = 25°C  
29  
120  
A
V
SD  
GS  
J
Current  
Pulsed DrainSource Diode Forward  
Current (Note 2)  
I
SDM  
Forward Diode Voltage  
V
= 5 V, I = 15 A, T = 25°C  
4.4  
SD  
GS  
SD  
J
www.onsemi.com  
2
 
NVH4L075N065SC1  
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified) (continued)  
J
Parameter  
DRAINSOURCE DIODE CHARACTERISTICS  
Reverse Recovery Time  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
t
V
= 5/18 V, I = 15 A,  
16  
72  
7.4  
9
ns  
nC  
J  
A
RR  
GS  
S
SD  
dI /dt = 1000 A/s  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
Q
RR  
E
REC  
I
RRM  
Ta  
9
ns  
ns  
Discharge time  
Tb  
7
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
NVH4L075N065SC1  
TYPICAL CHARACTERISTICS  
5
60  
50  
40  
30  
20  
V
= 18 V  
15 V  
GS  
12 V  
4
V
GS  
= 12 V  
3
10 V  
9 V  
2
15 V  
18 V  
1
0
10  
0
8 V  
7 V  
0
10  
20  
30  
40  
50  
0
1
2
3
4
5
6
7
8
9
10  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
1.7  
300  
200  
I
V
= 15 A  
I
D
= 15 A  
D
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
= 18 V  
GS  
T = 25°C  
J
T = 150°C  
J
100  
0
0.8  
0.7  
75 50 25  
0
25 50 75 100 125 150 175 200  
8
10  
12  
14  
16  
18  
T , JUNCTION TEMPERATURE (°C)  
J
V
, GATETOSOURCE VOLTAGE (V)  
GS  
Figure 3. OnResistance Variation with  
Figure 4. OnResistance vs. GatetoSource  
Temperature  
Voltage  
100  
80  
70  
60  
50  
40  
30  
20  
V
DS  
= 10 V  
V
GS  
= 5 V  
T = 25°C  
J
T = 175°C  
J
T = 25°C  
J
10  
T = 175°C  
J
T = 55°C  
J
T = 55°C  
J
10  
0
1
2
3
4
5
6
7
8
4
6
8
10  
12  
14  
16  
18  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
www.onsemi.com  
4
NVH4L075N065SC1  
TYPICAL CHARACTERISTICS (continued)  
18  
15  
12  
9
10000  
V
DD  
= 390 V  
I
D
= 15 A  
C
iss  
V
DD  
= 520 V  
1000  
100  
V
DD  
= 650 V  
C
oss  
6
3
C
rss  
0
10  
1
f = 1 MHz  
= 0 V  
3  
6  
V
GS  
0
15  
30  
45  
60  
75  
0.1  
1
10  
100  
650  
175  
1
V
, DRAINTOSOURCE VOLTAGE (V)  
Q , GATE CHARGE (nC)  
DS  
g
Figure 7. GatetoSource Voltage vs. Total  
Figure 8. Capacitance vs. DraintoSource  
Charge  
Voltage  
100  
40  
30  
20  
V
GS  
= 18 V  
T = 25°C  
J
10  
10  
0
R
= 1.01°C/W  
JC  
1
25  
50  
75  
100  
125  
150  
0.001  
0.01  
0.1  
1
t
, TIME IN AVALANCHE (ms)  
T , CASE TEMPERATURE (°C)  
C
AV  
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
300  
100  
20000  
10000  
Single Pulse  
Single Pulse  
R
T
= 1.01°C/W  
R
T
= 1.01°C/W  
= 25°C  
JC  
= 25°C  
JC  
C
10 s  
C
10  
100 s  
1000  
100  
10 ms  
Limit  
1 ms  
1
R
DS(on)  
Thermal Limit  
Package Limit  
100 ms/DC  
100  
, DRAINTOSOURCE VOLTAGE (V)  
0.1  
0.00001 0.0001 0.001  
0.01  
0.1  
0.1  
1
10  
1000  
V
DS  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
www.onsemi.com  
5
NVH4L075N065SC1  
TYPICAL CHARACTERISTICS (continued)  
1
0.5 Duty Cycle  
0.2  
0.1  
0.1  
0.05  
Notes:  
= 1.01°C/W  
P
DM  
0.02  
R
JC  
Peak T = P  
Duty Cycle, D = t /t  
x Z (t) + T  
JC C  
J
DM  
0.01  
t
1
1
2
t
2
Single Pulse  
0.00001  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. JunctiontoCase Thermal Response  
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6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2474LD  
CASE 340CJ  
ISSUE A  
DATE 16 SEP 2019  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13852G  
TO2474LD  
PAGE 1 OF 1  
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