NVHL040N60S5F [ONSEMI]
Power MOSFET, N-Channel, SUPERFET® V, FAST, 600 V, 59 A, 40 mΩ, TO-247;
| 型号： | NVHL040N60S5F |
| 厂家： | 
ONSEMI |
| 描述： | Power MOSFET, N-Channel, SUPERFET® V, FAST, 600 V, 59 A, 40 mΩ, TO-247 |
| 文件： | 总9页 (文件大小：348K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
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MOSFET - Power, Single
N-Channel, SUPERFET) V,
FRFET), TO247-3L
600 V, 40 mW, 59 A
V
R
MAX
I MAX
D
DSS
DS(ON)
600 V
40 mW @ 10 V
59 A
D
NVHL040N60S5F
G
Description
The SUPERFET V MOSFET FRFET series has optimized body
diode performance characteristics. This can allow for the removal of
components in the application and improve application performance
and reliability, particularly when soft switching topologies are used.
S
POWER MOSFET
Features
• 650 V @ T = 150°C / Typ. R
= 32 mW
J
DS(on)
• 100% Avalanche Tested
• Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
Applications
G
D
S
• Electric Vehicle On Board Chargers
• EV Main Battery DC/DC Converters
TO−247 Long Leads
CASE 340CX
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
600
30
Unit
V
V
DSS
V
GSS
MARKING DIAGRAM
Gate−to−Source Voltage
DC
V
AC (f > 1 Hz)
30
Continuous Drain Current
T
= 25°C
= 100°C
= 25°C
= 25°C
= 25°C
I
59
A
C
D
T
C
37
V040N
60S5F
AYWWZZ
Power Dissipation
T
C
T
C
T
C
P
347
209
209
W
A
D
Pulsed Drain Current (Note 1)
I
DM
Pulsed Source Current
(Body Diode) (Note 1)
I
A
SM
Operating Junction and Storage Temperature T , T
−55 to
+150
°C
J
STG
Range
V040N60S5F = Specific Device Code
A
YWW
ZZ
= Assembly Location
= Date Code (Year & Week)
= Assembly Lot
Source Current (Body Diode)
I
59
A
S
Single Pulse Avalanche
Energy
I = 8.3 A,
G
E
AS
574
mJ
L
R
= 25 W
Avalanche Current
I
8.3
3.47
120
70
A
AS
Repetitive Avalanche Energy (Note 1)
MOSFET dv/dt
E
mJ
AR
ORDERING INFORMATION
dv/dt
V/ns
Device
NVHL040N60S5F
Package
Shipping
Peak Diode Recovery dv/dt (Note 2)
TO−247
30 Units / Tube
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 seconds)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Repetitive rating: pulse−width limited by maximum junction temperature.
2. I ≤ 29.5 A, di/dt ≤ 200 A/ms, V ≤ 400 V, starting T = 25°C.
SD
DD
J
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
May, 2022 − Rev. 1
NVHL040N60S5F/D
NVHL040N60S5F
THERMAL CHARACTERISTICS
Parameter
Symbol
Value
0.36
40
Unit
Thermal Resistance, Junction−to−Case, Max.
Thermal Resistance, Junction−to−Ambient, Max.
R
°C/W
q
JC
R
q
JA
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
J
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V
V
I
= 0 V, I = 1 mA, T = 25_C
600
−
−
−
V
(BR)DSS
GS
D
J
Drain−to−Source Breakdown Voltage
Temperature Coefficient
DV
/
= 10 mA, Referenced to 25_C
−
630
mV/_C
(BR)DSS
D
DT
J
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
ON CHARACTERISTICS
I
V
GS
= 0 V, V = 600 V, T = 25_C
−
−
−
−
10
mA
DSS
GSS
DS
J
I
V
=
30 V, V = 0 V
100
nA
GS
DS
Drain−to−Source On Resistance
Gate Threshold Voltage
R
V
V
= 10 V, I = 29.5 A, T = 25_C
−
3.2
−
32
−
40
4.8
−
mW
V
DS(on)
GS
D
J
V
= V , I = 7.2 mA, T = 25_C
GS(th)
GS
DS
D
J
Forward Trans−conductance
g
FS
V
DS
= 20 V, I = 29.5 A
59.5
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
V
= 400 V, V = 0 V, f = 250 kHz
−
−
−
6318
98.9
1478
−
−
−
pF
ISS
DS
GS
Output Capacitance
C
OSS
Time Related Output Capacitance
C
I = Constant, V = 0 V to 400 V,
D DS
OSS(tr.)
V
GS
= 0 V
Energy Related Output Capacitance
Total Gate Charge
C
V
= 0 V to 400 V, V = 0 V
−
−
−
−
−
170
115
35.9
32.7
4.5
−
−
−
−
−
OSS(er.)
DS
GS
Q
V
= 400 V, I = 29.5 A, V = 10 V
nC
G(tot)
DD
D
GS
Gate−to−Source Charge
Gate−to−Drain Charge
Gate Resistance
Q
GS
Q
GD
R
f = 1 MHz
W
G
SWITCHING CHARACTERISTICS
Turn-On Delay Time
Rise Time
t
V
= 0/10 V, V = 400 V,
−
−
−
−
49.6
85.9
110
2.5
−
−
−
−
ns
d(on)
GS
D
DD
I
= 29.5 A, R = 2.2 W
G
t
r
Turn-Off Delay Time
Fall Time
t
d(off)
t
f
SOURCE-TO−DRAIN DIODE CHARACTERISTICS
Forward Diode Voltage
Reverse Recovery Time
Reverse Recovery Charge
V
V
GS
= 0 V, I = 29.5 A, T = 25_C
−
−
−
−
1.2
−
V
SD
RR
SD
J
t
V
= 0 V, I = 29.5 A,
140
917
ns
nC
GS
SD
dI/dt = 100 A/ms, V = 400 V
DD
Q
−
RR
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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2
NVHL040N60S5F
TYPICAL CHARACTERISTICS
120
100
80
60
40
20
0
1000
T
VDS=20V
J=25°C
100
10
1
VGS=4.5V
GS=5V
GS=5.5V
GS=6V
V
V
V
T
J=−55°C
VGS=7V
T
J=25°C
VGS=10V
T
J=150°C
0
5
10
15
20
3
0
0
4
5
6
7
V
, DRAIN−TO−SOURCE VOLTAGE (V)
V
, GATE−TO−SOURCE VOLTAGE (V)
DS
GS
Figure 1. On−Region Characteristics
Figure 2. Transfer Characteristics
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
1000
100
10
T
VGS=0V
J=25°C
1
T
J=150°C
VGS=10V
VGS=20V
T
J=25°C
T
J=−55°C
0.1
0
20
40
60
80
100
120
0.2
0.4
0.6
0.8
1
1.2
I , DRAIN CURRENT (A)
V
, DIODE FORWARD VOLTAGE (V)
D
SD
Figure 3. On−Resistance Variation vs. Drain
Figure 4. Diode Forward Voltage vs. Source
Current
Current and Gate Voltage
5
10
10
8
VGS=0V
ID=29.5A
T
J=25°C
f=250KHz
4
10
3
10
6
2
10
4
1
10
2
0
10
CISS
COSS
CRSS
VDD=120V
V
DD=360V
V
DD=400V
−1
10
0
0
100
200
300
400
500
600
20
40
60
80
100
120
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Q , TOTAL GATE CHARGE (nC)
G
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
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3
NVHL040N60S5F
TYPICAL CHARACTERISTICS
1.2
1.15
1.1
3
VGS=0V
ID=10mA
ID=29.5A
VGS=10V
2.5
2
1.5
1
1.05
1
0.95
0.9
0.5
0.85
0.8
0
−75 −50 −25
0
25
50
75 100 125 150 175
−75 −50 −25
0
25
50
75 100 125 150 175
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Breakdown Voltage Variation vs.
Temperature
Figure 8. On−Resistance Variation vs.
Temperature
60
50
40
30
20
10
0
1000
100
10
10 ms
100 ms
1 ms
Operation in this Area
is Limited by R
10 ms
DS(on)
1
T
C
= 25°C
DC
T = 150°C
J
Single Pulse
0.1
25
50
75
100
125
150
1
10
100
1000
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
T , CASE TEMPERATURE (°C)
C
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current vs. Case
Temperature
25
20
15
10
5
VGS=0V
T
J=25°C
f=250KHz
EOSS
500
0
0
100
200
300
400
600
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 11. EOSS vs. Drain−to−Source Voltage
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4
NVHL040N60S5F
TYPICAL CHARACTERISTICS
1
D = 0.5
D = 0.2
0.1
D = 0.1
D = 0.05
D = 0.02
D = 0.01
Notes:
(t) = 0.36°C/W Max
0.01
Z
q
JC
Single Pulse
0.00001
Duty Cycle, D = t /t
1
2
T
JM
= P
x Z (t) + T
q
DM JC C
0.001
0.0001
0.001
0.01
0.1
1
t, RECTANGULAR PULSE DURATION (s)
Figure 12. Transient Thermal Impedance
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5
NVHL040N60S5F
V
GS
R
Q
g
L
V
DD
Q
Q
gs
gd
V
GS
DUT
I
G
= Const.
Charge
Figure 13. Gate Charge Test Circuit & Waveform
R
L
V
DS
GS
90%
90%
10%
90%
V
DS
V
DD
V
GS
R
G
10%
V
DUT
V
GS
t
r
t
f
t
t
d(off)
d(on)
t
on
t
off
Figure 14. Resistive Switching Test Circuit & Waveforms
L
2
1
2
EAS
+
@ LIAS
V
DS
BV
DSS
I
D
I
AS
R
G
V
DD
I (t)
D
DUT
V
DD
V
GS
V
DS
(t)
t
p
Time
t
p
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms
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6
NVHL040N60S5F
+
DUT
V
SD
−
I
SD
L
Driver
R
G
Same Type
as DUT
V
DD
V
GS
− dv/dt controlled by R
G
− I controlled by pulse period
SD
Gate Pulse Width
D +
Gate Pulse Period
V
GS
10 V
(Driver)
I
, Body Diode Forward Current
FM
I
di/dt
SD
(DUT)
I
RM
Body Diode Reverse Current
Body Diode Recovery dv/dt
V
DS
V
DD
V
SD
(DUT)
Body Diode
Forward Voltage Drop
Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms
SUPERFET and FRFET are a registered trademarks of Semiconductor Components Industries, LLC or its subsidiaries in the United States and/or other
countries.
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7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−247−3LD
CASE 340CX
ISSUE A
DATE 06 JUL 2020
GENERIC
MARKING DIAGRAM*
XXXXX = Specific Device Code
A
Y
= Assembly Location
= Year
WW
G
= Work Week
= Pb−Free Package
XXXXXXXXX
AYWWG
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON93302G
TO−247−3LD
PAGE 1 OF 1
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