NXH50C120L2C2ES1G [ONSEMI]

IGBT Module, CIB 1200 V, 50 A IGBT - DBC with enhanced thermal conductivity;
NXH50C120L2C2ES1G
型号: NXH50C120L2C2ES1G
厂家: ONSEMI    ONSEMI
描述:

IGBT Module, CIB 1200 V, 50 A IGBT - DBC with enhanced thermal conductivity

双极性晶体管
文件: 总12页 (文件大小:416K)
中文:  中文翻译
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TMPIM 50 A CIB/CI Module  
NXH50C120L2C2ESG,  
NXH50C120L2C2ES1G  
The NXH50C120L2C2ESG is a transfermolded power module  
with low thermal resistance substrate containing  
a converter-inverter-brake circuit consisting of six 50 A, 1600 V  
rectifiers, six 50 A, 1200 V IGBTs with inverse diodes, one 35 A,  
1200 V brake IGBT with brake diode and an NTC thermistor.  
The NXH50C120L2C2ES1G is a transfermolded power module  
with low thermal resistance substrate containing a converterinverter  
circuit consisting of six 50 A, 1600 V rectifiers, six 50 A, 1200 V  
IGBTs with inverse diodes, and an NTC thermistor.  
www.onsemi.com  
Features  
Low Thermal Resistance Substrate for Low Thermal Resistance  
Lower Package Height than Standard Case Modules  
6 mm Clearance distance between pin to heatsink  
Compact 73 mm × 40 mm × 8 mm Package  
Solderable Pins  
DIP26 67.8x40  
CASE 181AD  
Thermistor  
MARKING DIAGRAM  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
Typical Applications  
Industrial Motor Drives  
Servo Drives  
DBPLUS  
P
GUP  
U
GVP  
V
GWP  
W
R
S
T
B
GB  
GUN  
GVN  
GWN  
TH1  
TH2  
ORDERING INFORMATION  
DBMINUS  
NB  
NU  
NV  
NW  
Figure 1. NXH50C120L2C2ESG Schematic Diagram  
Device  
Package Shipping  
DBPLUS  
P
NXH50C120L2C2ESG  
DIP26  
(PbFree)  
6 Units /  
Tube  
NXH50C120L2C2ES1G  
GUP  
U
GVP  
V
GWP  
W
R
S
T
GUN  
GVN  
GWN  
TH1  
TH2  
DBMINUS  
NU  
NV  
NW  
Figure 2. NXH50C120L2C2ES1G Schematic Diagram  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
October, 2020 Rev. 1  
NXH50C120L2C2/D  
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
MAXIMUM RATINGS (Note 1)  
Rating  
Symbol  
Value  
Unit  
IGBT (INVERTER, BRAKE)  
Collector-emitter Voltage  
Gate-emitter Voltage  
V
1200  
20  
V
V
A
A
A
A
CES  
V
GE  
Inverter IGBT Continuous Collector Current @ T = 100°C (T  
= 175°C)  
I
C
50  
C
VJmax  
Inverter IGBT Pulsed Collector Current (T  
= 175°C)  
I
150  
35  
VJmax  
Cpulse  
Brake IGBT Continuous Collector Current @ T = 100°C (T  
= 175°C)  
I
C
C
VJmax  
Brake IGBT Pulsed Collector Current (T  
DIODE (INVERTER, BRAKE)  
= 175°C)  
I
105  
VJmax  
Cpulse  
Peak Repetitive Reverse Voltage  
V
1200  
50  
V
A
A
RRM  
Inverter Diode Continuous Forward Current @ T = 80°C (Tv  
Inverter Diode Repetitive Peak Forward Current (T  
= 17°C)  
I
F
c
Jmax  
= 175°C)  
I
150  
94  
VJmax  
FRM  
2
2
2
Inverter Diode I t value (60 Hz single halfsine wave)  
I t  
A t  
Brake Diode Continuous Forward Current @ Tc = 80°C (T  
= 175°C)  
I
35  
A
A
VJmax  
F
Brake Diode Repetitive Peak Forward Current (T  
= 175°C)  
I
105  
46  
VJmax  
FRM  
2
2
Brake Diode I2t value (60 Hz single halfsine wave)  
RECTIFIER DIODE  
I t  
A t  
Peak Repetitive Reverse Voltage  
V
1600  
50  
V
A
A
RRM  
Continuous Forward Current @ T = 80°C (T  
= 150°C)  
I
F
C
VJmax  
Repetitive Peak Forward Current (T  
= 150°C)  
I
150  
VJmax  
FRM  
2
o
2
2
I t value (60 Hz single halfsine wave) @ 25 C  
I t  
1126  
510  
A t  
o
(60 Hz single halfsine wave) @ 150 C  
o
o
Surge current (10ms sin180 ) @ 25 C  
MODULE THERMAL PROPERTIES  
Storage Temperature Range  
INSULATION PROPERTIES  
Isolation Test Voltage, t = 1 s, 50 Hz  
Internal Isolation  
IFSM  
520  
A
T
40 to 125  
°C  
stg  
V
3000  
HPS  
6.0  
V
RMS  
is  
Creepage Distance  
mm  
mm  
Clearance Distance  
6.0  
Comperative Tracking Index  
CTI  
>400  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe  
Operating parameters.  
www.onsemi.com  
2
 
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
INVERTER IGBT CHARACTERISTICS  
Collector-emitter Cutoff Current  
Collector-emitter Saturation Voltage  
V
V
V
V
V
= 0 V, V = 1200 V  
I
CES  
1.8  
250  
2.4  
mA  
GE  
GE  
GE  
GE  
GE  
CE  
= 15 V, I = 50 A, T = 25°C  
V
V
V
C
J
CE(sat)  
= 15 V, I = 50 A, T = 150°C  
2
C
J
Gate-emitter Threshold Voltage  
Gate Leakage Current  
Turn-on Delay Time  
= V , I = 6 mA  
4.8  
6
6.8  
400  
V
CE  
C
GE(TH)  
= 20 V, V = 0 V  
I
nA  
ns  
CE  
GES  
T = 25°C  
t
144  
104  
380  
52  
J
d(on)  
V
V
= 600 V, I = 50 A  
CE  
GE  
C
Rise Time  
t
r
=
15 V, R = 15 W  
G
Turn-off Delay Time  
t
d(off)  
Fall Time  
t
f
Turn-on Switching Loss per Pulse  
Turn-off Switching Loss per Pulse  
Turn-on Delay Time  
E
5870  
1700  
136  
112  
432  
184  
9530  
3800  
11897  
416  
240  
558  
mJ  
on  
off  
E
T = 150°C  
t
t
ns  
J
V
V
d(on)  
= 600 V, I = 50 A  
CE  
GE  
C
Rise Time  
t
r
=
15 V, R = 15 W  
G
Turn-off Delay Time  
d(off)  
Fall Time  
t
f
Turn-on Switching Loss per Pulse  
Turn-off Switching Loss per Pulse  
Input Capacitance  
E
on  
E
off  
mJ  
V
= 20 V, V = 0 V, f = 100  
C
pF  
CE  
GE  
ies  
oes  
kHz  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C
C
res  
V
CE  
V
GE  
= 600 V, I = 50 A,  
= 0 V 15 V  
Q
g
nC  
C
Temperature under switching conditions  
Thermal Resistance Chip-to-Case  
INVERSE DIODE CHARACTERISTICS  
Diode Forward Voltage  
Tvj op  
40  
150  
°C  
R
0.26  
°C/W  
thJC  
I = 50 A, T = 25°C  
V
F
1.9  
1.7  
2.7  
V
F
J
I = 50 A, T = 150°C  
F
J
Reverse Recovery Charge  
T = 25°C  
Q
2.58  
20  
mC  
A
J
V
V
rr  
= 600 V, I = 50 A  
CE  
GE  
C
Peak Reverse Recovery Current  
Reverse Recovery Energy  
I
I
RRM  
=
15 V, R = 15 W  
G
E
rr  
640  
8.0  
mJ  
Reverse Recovery Charge  
T = 150°C  
Q
rr  
RRM  
mC  
A
J
V
V
= 600 V, I = 50 A  
CE  
GE  
C
Peak Reverse Recovery Current  
Reverse Recovery Energy  
32.5  
2300  
=
15 V, R = 15 W  
G
E
rr  
mJ  
Temperature under switching conditions  
Thermal Resistance Chip-to-Case  
Tvj op  
40  
150  
°C  
R
0.42  
°C/W  
thJC  
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3
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified) (continued)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
RECTIFIER DIODE CHARACTERISTICS  
Diode Forward Voltage  
I = 50 A, T = 25°C  
V
F
1.2  
1.1  
1.6  
V
F
J
I = 50 A, T = 150°C  
F
J
Temperature under switching conditions  
Thermal Resistance Chip-to-Case  
BRAKE IGBT CHARACTERISTICS  
Collector-emitter Cutoff Current  
Tvj op  
40  
150  
°C  
R
0.33  
°C/W  
thJC  
V
V
V
V
V
= 0 V, V = 1200 V  
I
1.8  
250  
2.4  
mA  
GE  
GE  
GE  
GE  
GE  
CE  
CES  
Collector-emitter Saturation Voltage  
= 15 V, I = 35 A, T = 25°C  
V
V
V
C
J
CE(sat)  
= 15 V, I = 35 A, T = 125°C  
1.9  
C
J
Gate-emitter Threshold Voltage  
= V , I = 4.25 mA  
4.8  
6
6.8  
400  
V
CE  
C
GE(TH)  
Gate Leakage Current  
= 20 V, V = 0 V  
I
nA  
ns  
CE  
GES  
Turnon Delay Time  
T
J
= 25°C  
t
104  
64  
d(on)  
V
CE  
V
GE  
= 600 V, I = 35 A  
C
Rise Time  
t
r
=
15 V, R = 15 W  
G
Turnoff Delay Time  
Fall Time  
t
277  
53  
d(off)  
t
f
Turnon Switching Loss per Pulse  
Turn off Switching Loss per Pulse  
Turnon Delay Time  
Rise Time  
E
E
2900  
1200  
168  
72  
mJ  
on  
off  
T
V
V
= 150°C  
t
t
ns  
J
d(on)  
= 600 V, I = 35 A  
CE  
GE  
C
t
r
=
15 V, R = 15 W  
G
Turnoff Delay Time  
Fall Time  
320  
165  
4030  
2200  
8333  
298  
175  
360  
d(off)  
t
f
Turnon Switching Loss per Pulse  
Turn off Switching Loss per Pulse  
Input Capacitance  
E
on  
E
off  
mJ  
V
= 20 V. V = 0 V.  
C
pF  
CE  
GE  
ies  
oes  
f = 100 kHz  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C
C
res  
V
V
= 600 V, I = 35 A,  
= 0V ~ +15 V  
Q
g
nC  
CE  
GE  
C
Temperature under switching conditions  
Thermal Resistance Chip-to-Case  
BRAKE DIODE CHARACTERISTICS  
Brake Diode Reverse Leakage Current  
Diode Forward Voltage  
Tvj op  
40  
150  
°C  
R
0.42  
°C/W  
thJC  
VR = 1200 V  
I = 35 A, T = 25°C  
IR  
2.2  
2
200  
2.7  
mA  
V
F
V
F
J
I = 35 A, T = 150°C  
F
J
Reverse Recovery Time  
T
V
V
= 25°C  
t
224  
1.51  
18  
ns  
°C  
A
J
rr  
= 600 V, I = 35 A  
CE  
GE  
C
Reverse Recovery Charge  
Q
rr  
=
15 V, R = 15 W  
G
Peak Reverse Recovery Current  
Reverse Recovery Energy  
I
I
RRM  
E
410  
532  
5,36  
30  
mJ  
rr  
Reverse Recovery Time  
T = 150°C  
t
rr  
ns  
J
V
V
= 600 V, I = 35 A  
CE  
GE  
C
Reverse Recovery Charge  
Q
rr  
RRM  
°C  
A
=
15 V, R = 15 W  
G
Peak Reverse Recovery Current  
Reverse Recovery Energy  
E
1983  
mJ  
rr  
Temperature under switching conditions  
Thermal Resistance Chip-to-Case  
Tvj op  
40  
150  
°C  
°C/W  
R
0.65  
thJC  
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4
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified) (continued)  
J
Parameter  
THERMISTOR CHARACTERISTICS  
Nominal Resistance  
Nominal Resistance  
Deviation of R25  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
T = 25°C  
R
5
493.3  
5
kW  
W
25  
T = 100°C  
R
100  
DR/R  
5  
%
Power Dissipation  
P
D
20  
mW  
mW/K  
K
Power Dissipation Constant  
B-value  
1.4  
B(25/50), tolerance 2%  
B(25/100), tolerance 2%  
3375  
3433  
B-value  
K
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
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5
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
TYPICAL CHARACTERISTICS INVERTER IGBT & INVERSE DIODE  
150  
120  
90  
60  
30  
0
150  
25°C  
150°C  
120  
V
= 20 V  
GE  
V
= 20 V  
GE  
90  
60  
30  
0
V
= 11 V  
GE  
V
= 11 V  
GE  
0
0.5  
1
1.5  
2
2.5  
3.5  
4
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
V
, COLLECTOR EMITTER VOLTAGE (V)  
V
CE  
, COLLECTOR EMITTER VOLTAGE (V)  
CE  
Figure 3. Inverter IGBT Typical Output  
Figure 4. Inverter IGBT Typical Output  
Characteristic (255C)  
Characteristic (1505C)  
150  
120  
90  
60  
30  
0
150  
120  
90  
60  
30  
0
150°C  
25°C  
150°C  
25°C  
0
2
4
6
8
10  
12  
14  
0
0.5  
1
1.5  
2
2.5  
3
V
, GateEmitter Voltage (V)  
V , Forward Voltage (V)  
F
GE  
Figure 5. Inverter IGBT Typical Transfer  
Characteristic  
Figure 6. Inverter Diode Typical Forward  
Characteristic  
30  
25  
20  
15  
10  
10  
25°C  
25°C  
V
V
= 600 V  
= 15 V/15 V  
= 15 W  
9
8
7
6
5
4
3
2
1
0
V
V
= 600 V  
= 15 V/15 V  
= 15 W  
CE  
CE  
150°C  
150°C  
GE  
GE  
R
R
G
G
5
0
0
5
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100  
Ic (A)  
0
5
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100  
Ic (A)  
Figure 7. Inverter IGBT Typical Turn On Loss vs IC  
Figure 8. Inverter IGBT Typical Turn Off Loss vs IC  
www.onsemi.com  
6
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
TYPICAL CHARACTERISTICS INVERTER IGBT & INVERSE DIODE  
3.5  
35  
25°C  
V
V
= 600 V  
= 15 V/15 V  
= 15 W  
125°C  
150°C  
V
V
I
= 600 V  
CE  
CE  
GE  
3
2.5  
2
30  
25  
20  
15  
10  
5
150°C  
= 15 V/15 V  
GE  
R
= 50 A  
G
C
1.5  
1
0.5  
0
0
0
5
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100  
If (A)  
0
20  
40  
60  
80  
Rg (W)  
100  
120  
140  
160  
Figure 9. Inverter Diode Typical Reverse Recovery  
Energy vs IC  
Figure 10. Inverter IGBT Typical Turn On Loss vs  
RG  
6
2.5  
2
125°C  
150°C  
V
V
= 600 V  
CE  
GE  
5
4
3
2
1
0
= 15 V/15 V  
I
C
= 50 A  
1.5  
1
125°C  
150°C  
V
V
I
= 600 V  
CE  
GE  
= 15 V/15 V  
0.5  
0
= 50 A  
C
0
20  
40  
60  
80  
100  
120  
140  
160  
0
20  
40  
60  
80  
100  
120  
140  
160  
Rg (W)  
Rg (W)  
Figure 11. Inverter IGBT Typical Turn Off Loss vs  
RG  
Figure 12. Inverter Diode Typical Reverse  
Recovery Energy vs RG  
18  
15  
12  
9
V
V
= 600 V  
= 15 V  
CE  
GE  
I
C
= 50 V  
6
3
0
0
50  
100 150 200 250 300 350 400 450 500 550 600  
Charge (nC)  
Figure 13. Inverter IGBT Gate Voltage vs Gate  
Charge  
www.onsemi.com  
7
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
TYPICAL CHARACTERISTICS INVERTER IGBT & INVERSE DIODE  
1
50%  
0.1  
20%  
10%  
5%  
0.01  
0.001  
2%  
1%  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
pulse on time [s]  
Figure 14. Inverter IGBT Junctiontocase Transient Thermal Impedance  
1
50%  
20%  
10%  
0.1  
5%  
2%  
1%  
0.01  
0.001  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
pulse on time [s]  
Figure 15. Inverter Diode Junctiontocase Transient Thermal Impedance  
www.onsemi.com  
8
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
TYPICAL CHARACTERISTICS BRAKE IGBT & BRAKE DIODE  
105  
90  
75  
60  
45  
30  
15  
0
105  
150°C  
90  
25°C  
75  
V
= 20 V  
GE  
V
= 20 V  
60  
45  
30  
15  
0
GE  
V
= 11 V  
GE  
V
= 11 V  
GE  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
V
, COLLECTOR EMITTER VOLTAGE (V)  
V
CE  
, COLLECTOR EMITTER VOLTAGE (V)  
CE  
Figure 16. Brake IGBT Typical Output  
Figure 17. Brake IGBT Typical Output  
Characteristic (255C)  
Characteristic (1505C)  
105  
90  
75  
60  
45  
30  
15  
0
105  
90  
75  
60  
45  
30  
15  
0
150°C  
25°C  
150°C  
25°C  
0
2
4
6
8
10  
12  
14  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
V , Forward Voltage (V)  
F
V
, GateEmitter Voltage (V)  
GE  
Figure 18. Brake IGBT Typical Transfer  
Characteristic  
Figure 19. Brake Diode Typical Forward  
Characteristic  
18  
V
V
= 600 V  
= 15 V  
CE  
GE  
15  
12  
9
I
C
= 35 A  
6
3
0
0
50  
100  
150  
200  
250  
300  
350  
Charge (nC)  
Figure 20. Brake IGBT Gate Voltage vs Gate  
Charge  
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9
NXH50C120L2C2ESG, NXH50C120L2C2ES1G  
TYPICAL CHARACTERISTICS RECTIFIER  
105  
90  
75  
60  
45  
150°C  
25°C  
30  
15  
0
0
0.5  
1.0  
V , Forward Voltage (V)  
1.5  
2.0  
F
Figure 21. Rectifier Typical Forward Characteristic  
1
50%  
20%  
10%  
0.1  
5%  
2%  
0.01  
1%  
Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
pulse on time [s]  
Figure 22. Rectifier JunctiontoCase Transient Thermal Impedance  
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10  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DIP26 67.8x40  
CASE 181AD  
ISSUE B  
DATE 05 AUG 2021  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXXXXXXXXXX  
ZZZATYWW  
XXX = Specific Device Code  
ZZZ = Assembly Lot Code  
AT = Assembly & Test Location  
Y
= Year  
WW = Work Week  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON09519H  
DIP26 67.8x40  
PAGE 1 OF 1  
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