BD60910GU [ROHM]
Silicon Monolithic Integrated Circuit; 硅单片集成电路型号: | BD60910GU |
厂家: | ROHM |
描述: | Silicon Monolithic Integrated Circuit |
文件: | 总5页 (文件大小:140K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
1/4
Structure
Silicon Monolithic Integrated Circuit
Product Name
Compound LED Driver for cellular phone
Type
BD60910GU
Features
Boost DC/DC for LED back lighting
Constant current driver for LED back lighting
Auto Luminous Control (ALC)
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
VMAX1
VMAX2
VMAX3
Pd
Limits
7
Unit
V
Pins
except for VLED, VOUT, SW
VLED
Maximum voltage 1
Maximum voltage 2
15
V
Maximum voltage 3
32.6
V
VOUT, SW
1250
mW
oC
oC
Power Dissipation
Topr
-40 ~ +85
-55 ~ +150
Operating Temperature Range
Storage Temperature Range
Tstg
note)Power dissipation deleting is 10mW/ oC, when it’s used in over 25 oC.
(It’s deleting is on the board that is ROHM’s standard)
Dissipation by LSI should not exceed tolerance level.of Pd.
●Operating conditions(VBAT≧VIO, Ta=-40~85℃)
Parameter
VBAT input voltage
VIO pin voltage
Symbol
VBAT
VIO
Limits
Unit
V
2.7~5.5
1.65~3.3
V
* Radiation-proof is not designed.
REV. A
2/4
● Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V)
Parameter
【Circuit Current】
Symbol
Min.
Typ.
Max.
Unit
Condition
VBAT Circuit current 1
VBAT Circuit current 2
IBAT1
IBAT2
0.1
0.5
1.0
3.0
μA
μA
RESETB=0V, VIO=0V
RESETB=0V, VIO=1.8V
LED=ON, ILED=15mA setting
Vo=24V
VBAT Circuit current 3
IBAT3
-
-
2.5
5.0
mA
Only ALC block ON
ADCYC=0.52s setting
Except sensor current
VBAT Circuit current 4
IBAT4
0.4
1.0
mA
【LED Driver】
LED current Step (Setup)
LED current Step (At slope)
LED Maximum current
LED current accuracy
【DC/DC】
ILEDSTP1
ILEDSTP2
IMAXWLED
IWLED
128
256
25.6
15
Step
Step
mA
-
-
-7%
+7%
mA
ILED=15mA setting
VLED pin feedback voltage
Over current protection
Vfb
-
-
0.3
-
-
V
OCP
650
mA
Oscillator frequency
Over Voltage Protection
detect voltage
fosc
0.8
1.0
31
27
24
21
18
-
1.2
MHz
V
OVP1
OVP2
OVP3
OVP4
OVP5
Mduty
30
32
-
-
V
-
-
V
-
-
-
V
-
V
Maximum Duty
92.5
-
%
VOUT open protection
【I2C input (SDA, SCL)】
OVO
-
0.7
1.4
V
0.25 ×
VIO
LOW level input voltage
HIGH level input voltage
VIL
VIH
-0.3
-
-
-
V
V
V
0.75 ×
VIO
VBAT
+0.3
Hysteresis of
0.05 ×
VIO
Vhys
-
Schmitt trigger input
LOW level output voltage
(SDA) at 3mA sink current
Input current
VOL
lin
0
-
-
0.3
3
V
-3
μA
Input voltage = 0.1×VIO~0.9×VIO
Input voltage = 0.1×VIO~0.9×VIO
【RESETB】
0.25 ×
VIO
LOW level input voltage
HIGH level input voltage
VIL
-0.3
-
V
0.75 ×
VIO
-3
VBAT
+0.3
3
VIH
Iin
-
-
V
Input current
μA
【ALC】
2.850
2.470
-
3.0
2.6
-
3.150
2.730
30
V
V
Io=200μA < Initial value >
Io=200μA
SBIAS Output voltage
SBIAS Output current
SSENS Input range
VoS
IoS
mA
Vo=3.0V
VoS x
255/256
1.5
VISS
0
-
-
V
SBIAS Discharge resister at OFF
ADC resolution
ROFFS
ADRES
ADINL
1.0
8
kΩ
bit
ADC non-linearity error
ADC differential
-3
-1
1
-
+3
+1
-
LSB
ADDNL
-
-
LSB
non-linearity error
SSENS Input impedance
RSSENS
MΩ
REV. A
3/4
● Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V)
【WPWMIN】
L level input voltage
VILA
-0.3
1.4
-
-
0.3
VBAT
+0.3
10
V
H level input voltage
VIHA
-
V
Input current
IinA
3.6
-
μA
μs
Vin=1.8V
PWM input
PWpwm
50
-
minimum High pulse width
【GC1, GC2】
L level output voltage
VOLS
VOHS
-
-
-
0.2
-
V
V
IOL=1mA
IOH=1mA
VoS
-0.2
H level output voltage
●Outside size figure
D60910
LOT No.
VCSP85H3(24pin) (unit:mm)
REV. A
4/4
● Block Diagram
●Pin List
PIN
A2
PIN NAME
PIN
B1
PIN NAME
VBAT1
WPWMIN
VIO
D5
D1
C1
E2
A3
E3
D4
C5
D3
C2
D2
VBAT2
VIO
E4
C3
A4
B4
B5
B3
C4
A1
A5
E5
E1
SW
OCP
RESETB
SCL
VOUT
VLED
SBIAS
SSENS
GC1
GC2
T1
I2C interface
DC/DC
Level
Shift
OVP
SDA
GND1
GND2
LEDGND
GNDP
Digital
Control
Feed Back
WPWMIN
VLED
External PWM
LEDGND
SBIAS
SSENS
SGND
GND1
GND2
GNDPS
TSD
Sensor
I/F
ALC
SGND
VREF
IREF
GC2
GC1
RESETB
T2
SDA
SCL
T3
T4
● Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making
impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed,
consideration should be given to take physical safety measures including the use of fuses, etc.
(2) Power supply and ground line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by common
impedance of layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for small signal and
ground pattern for large current included the external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount
a capacitor between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(3) Ground voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no pins are at
a potential lower than the ground voltage including an actual electric transient.
(4) Short circuit between pins and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs.
Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin and the power supply or the ground pin, the
ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference
with circuit operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle the input pins, such
as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the
input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input pins a voltage lower
than the power supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due
to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown
circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming
its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.
(10) About the pin for the test, the un-use pin
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a function manual and an
application notebook. And, as for the pin that doesn't specially have an explanation, ask our company person in charge.
(11) Rush Current
Rush current may flow in instant in the internal logic unfixed state by the power supply injection order and delay. Therefore, be careful of power
supply coupling capacity, a power supply and the width of grand pattern wiring, and leading about.
(12) DC/DC converter
Please select the low DCR inductors to decrease power loss for DC/DC converter.
REV. A
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
R0039
A
相关型号:
BD60910GU-E2
White backlight LED Drivers for Small to Medium LCD Panels (Switching Regulator Type)
ROHM
BD60910GU_11
White backlight LED Drivers for Small to Medium LCD Panels (Switching Regulator Type)
ROHM
BD6092GU-E2
Analog Circuit, 1 Func, PBGA24, 2.80 X 2.80 MM, 0.50 MM PITCH, ROHS COMPLIANT, VCSP85H2-24
ROHM
BD60A00NUX
White Backlight LED Drivers for Small to Medium LCD Panels (Switching Regulator Type)
ROHM
BD60A00NUX-TR
White Backlight LED Drivers for Small to Medium LCD Panels (Switching Regulator Type)
ROHM
©2020 ICPDF网 联系我们和版权申明