BD6382EFV_12_技术文档

Stepping Motor Driver Series

Low Voltage

Stepping Motor Drivers

BD6382EFV

No.12009EAT02

●Description

This series can drive the bipolar stepping motor used for paper feed carriages. It is a low power consumption bipolar PWM

constant current-drive driver. It is suitable for the mobile devices of a battery drive by power save function. It contributes

also to reduction of mounting area by ultra-thin and high heat-radiation (exposed metal type) HTSSOP package.

●Feature

1)

Low ON resistance DMOS output

2)

3)

4)

PWM constant current control (self oscillation)

Built-in spike noise cancel function (external noise filter is unnecessary)

Power save function

5)

Built-in logic input pull-down resistor

6)

Power-on reset function

7)

Thermal shutdown circuit (TSD)

8)

Over current protection circuit (OCP)

9)

Under voltage lock out circuit (UVLO)

10)

11)

12)

13)

Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)

Electrostatic discharge: 4kV (HBM specification)

Adjacent pins short protection

Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package

●Application

Mini printer, Handy printer, Monitoring camera, WEB camera, Scanner, Toy, and Robot etc.

●Absolute maximum ratings(Ta=25℃)

Item

Symbol

V_CC

Ratings

Unit

V

Supply voltage VCC

Supply voltage VM

-0.2～+7.0

-0.2～+15.0

V_M

V

1

1.1^※

W

Power dissipation

Pd

2

4.0^※

W

Input voltage for control pin

RNF maximum voltage

V_IN

V_RNF

I_OUT

T_opr

-0.2～(V_CC+0.3)

V

0.5

V

3

Maximum output current

Operating temperature range

Storage temperature range

Junction temperature

0.8^※

A/ch

℃

-40～+85

-55～+150

150

T_stg

T_jmax

※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃.

※2 4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.

※3 Do not exceed Pd, ASO and Tjmax=150℃.

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2012.02 - Rev.A

1/8

Technical Note

BD6382EFV

●Operating conditions (Ta=-25～+75℃)

Item

Symbol

V_CC

Ratings

3.0～5.5

4.0～13.5

0～V_CC

Unit

V

Supply voltage VCC

Supply voltage VM

V_M

V

Input voltage for control pin

V_IN

V

4

Output current (DC)

I_OUT

0.5^※

A/ch

※4 Do not exceed Pd, ASO

●Electrical characteristics

Applicable to BD6382EFV(Unless otherwise specified Ta=25℃, VCC=3.3V, VM=6.0V)

Limit

Item

Symbol

Unit

Conditions

Min.

Typ.

Max.

Whole

VCC current at standby

VCC current

I_CCST

I_CC

I_VMST

I_VM

-

0

1.6

0

10

3.0

10

μA PS=L

mA PS=H, VLIMX=0.5V

μA PS=L

VM current at standby

VM current

0.08

0.50

mA PS=H, VLIMX=0.5V

Control input (PS, IN1A, IN1B, IN2A, IN2B)

H level input voltage

L level input voltage

H level input current

L level input current

V_INH

2.0

0

-

3.3

0.8

60

-

V

V_INL

I_INH

I_INL

V

15

-10

30

0

μA V_IN=3V

μA V_IN=0V

Output (OUT1A, OUT1B, OUT2A, OUT2B)

I

_OUT=±0.3A, V_M=6V

Output ON resistance

R_ON

-

1.2

-

1.5

10

Ω

Sum of upper and lower

Output leak current

Current control

I_LEAK

μA

RNFX input current

SENSEX input current

VLIMX input current

VLIMX input voltage range

Comparator offset voltage

Noise cancel time

I_RNF

I_SENSE

I_VLIM

V_VLIM

V_OFS

t_n

-40

-2.0

0

-20

-0.1

-

μA RNFX=0V

μA SENSEX=0V

μA VLIMX=0V

V

-

0.5

10

1.2

1.03

-10

0.3

0.97

-

mV

0.7

1.00

μs R=39kΩ, C=1000pF

VREF voltage

V_VREF

V

I_VREF=0~1mA

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2012.02 - Rev.A

2/8

Technical Note

BD6382EFV

●Terminal function･Block diagram･Application circuit diagram

1) BD6382EFV

No.

Pin name

Function

Ground terminal

Pin name

RNF2

Function

No.

1

GND

PS

Connection terminal of resistor for

output current detection

13

2

3

4

Power save terminal

VLIM1

SENSE1

Output current limit setting terminal

Input terminal of current limit comp.

14

15

16

17

18

19

OUT2B

OUT2A

VM2

H bridge output terminal

Power supply terminal for motor

Non connection

Connection terminal of CR for setting

PWM frequency

5

CR1

NC

6

7

IN1A

IN1B

Logic input terminal

IN2B

IN2A

Logic input terminal

8

NC

Non connection

Connection terminal of CR for setting

PWM frequency

20

CR2

9

VM1

Power supply terminal for motor

H bridge output terminal

10

11

OUT1A

OUT1B

21

22

23

24

SENSE2

VLIM2

VREF

VCC

Input terminal of current limit comp.

Output current limit setting terminal

Reference voltage output terminal

Power supply terminal

Connection terminal of resistor for

output current detection

12

RNF1

You can devide the

reference voltage by

external resistor, and use

it for output current limit

setting.

Bypass capacitor.

Setting range is

4.7uF～47uF(electrolytic)

0.01uF～0.1uF(multilayer ceramic etc.)

Refer to P.6

Refer to P.7

4.7uF

0.1uF

VCC

24

VREF

VLIM1

VREF

23

3

Resistor for current. detecting.

Setting range is

0.1Ω～1.0Ω

Current Limit Comp.

Predriver

Set the PWM frequency.

Setting range is

C:470pF～4700pF

R:10kΩ～100kΩ

Refer to P.7

VM1

9

Refer to P.7

OUT1A

10

11

OUT1B

RNF1

12

0.3Ω

CR1

CR

5

2

1000pF

39kΩ

Timer

4

SENSE1

PS

UVLO

47uF

0.1uF

IN1A

IN1B

6

7

Logic

TSD

Set the PWM frequency.

Setting range is

C:470pF～4700pF

R:10kΩ～100kΩ

Refer to P.7

IN2A

IN2B

OCP

19

18

Bypass capacitor.

Setting range is

10uF～470uF(electrolytic)

0.01uF～0.1uF

(multilayer ceramic etc.)

Refer to P.6

VM2

16

CR2

CR

20

22

OUT2A

15

14

1000pF

39kΩ

Timer

Predriver

OUT2B

RNF2

13

0.3Ω

VLIM2

21

Resistor for current. detecting.

Current Limit Comp.

SENSE2

Setting range is

0.1Ω～1.0Ω

Refer to P.7

1

GND

Fig.1 Block diagram & Application circuit diagram of BD6382EFV

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2012.02 - Rev.A

3/8

Technical Note

BD6382EFV

●Points to notice for terminal description

○PS／Power save terminal

PS can make circuit standby state and make motor output OPEN. Please be careful because there is a delay of 40μ

s(max.) before it is returned from standby state to normal state and the motor output becomes ACTIVE at PS=L→H.

If you don't use power save mode, you may short PS terminal to VCC.

PS

State

Standby state (RESET)

ACTIVE

L

H

○IN1A,IN1B,IN2A,IN2B／Logic input terminal

These pins decide output state.

Input

Output

OUT1A

OUT2A

IN1A

IN2A

IN1B

IN2B

OUT1B

OUT2B

PS

L

X

L

X

L

OPEN

Standby state (RESET)

Standby

H

OPEN

H

L

H

L

H

L

Forward

H

Reverse

H

Brake

X: H or L

●Protection Circuits

○Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above

175℃ (typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (typ.), it

automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added

externally, heat overdrive can lead to destruction.

○Over current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are

shorted each other or VCC-output or motor output-GND is shorted. This circuit latches the motor output to OPEN

condition when the regulated threshold current flows for 4μs (typ.). It returns with VCC power reactivation or a reset of

the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular

situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets

should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues

and the return by power reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly

and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being

long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values

may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output

current rating and under the OCP detection current flows, the IC can heat up to over Tjmax=150℃ and can deteriorate,

so current which exceeds the output rating should not be applied.

○Under voltage lock out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the VCC terminal goes under 1.95V (typ.), the motor output is set to OPEN.

This switching voltage has a 0.25V (typ.) hysteresis to prevent false operation by noise etc. Please be aware that this

circuit does not operate during power save mode.

○False operation prevention function in no power supply (Ghost Supply Prevention)

If a logic control signal is input when there is no power supplied to this IC, there is a function which prevents the false

operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to

the VCC, to this IC or to another IC’s power supply. Therefore, there is no chance of malfunction of the circuit even

when voltage is supplied to the logic control input terminal while there is no power supply.

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2012.02 - Rev.A

4/8

Technical Note

BD6382EFV

●Power dissipation

○HTSSOP-B24 Package

HTSSOP-B24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also,

the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing

power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is

a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is

recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this

product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat

dissipation efficiency.

Measurement machine：TH156（Kuwano Electric）

Measurement condition：ROHM board

Board size：70*70*1.6mm³

(With through holes on the board)

4.0W

4

3

4.0

3.0

The exposed metal of the backside is connected to the board with

solder.

Board①：1-layer board(Copper foil on the back 0mm²)

Board②：2-layer board(Copper foil on the back 15*15mm²)

Board③：2-layer board(Copper foil on the back 70*70mm²)

Board④：4-layer board(Copper foil on the back 70*70mm²)

2.8W

Board①：θ_ja=113.6℃/W

Board②：θ_ja=73.5℃/W

Board③：θ_ja=44.6℃/W

Board④：θ_ja=31.3℃/W

2.0

1.7W

1.1W

2

1

1.0

0

100

125

Ambient Temperature : Ta[℃]

Fig.2 HTSSOP-B24 Derating curve

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2012.02 - Rev.A

5/8

Technical Note

BD6382EFV

●Usage Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If

any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply

lines. An external direction diode can be added.

(3) Power supply Lines

Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,

separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals

to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the

circuit, not that capacitance characteristic values are reduced at low temperatures.

(4) GND Potential

The potential of GND pin must be minimum potential in all operating conditions.

(5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

Users should be aware that BD6382EFV have been designed to expose their frames at the back of the package, and

should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a dissipation pattern

should be taken as possible, not only on the front of the baseboard but also on the back surface.

(6) Inter-pin shorts and mounting errors

When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper

attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be

caused by foreign matter entering between outputs or an output and the power supply or GND.

(7) Operation in a strong electric field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

(8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(9) Thermal shutdown circuit

The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher,

coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal

operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect

peripheral equipment.

TSD ON Temperature [℃] (typ.)

Hysteresis Temperature [℃] (typ.)

175

25

(10) Inspection of the application board

During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility

that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a

measure again electrostatic discharge, it should be earthed during the assembly process and special care should be

taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power

supply should first be turned off and then removed before the inspection.

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2012.02 - Rev.A

6/8

Technical Note

BD6382EFV

(11) Input terminal of IC

This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.

This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.

For example, when the resistance and transistor are connected to the terminal as shown in figure 3,

○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),

the P-N junction operates as a parasitic diode.

○Also, when GND＞(Terminal B) at the transistor (NPN)

The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned

parasitic diode.

Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The

operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.

Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage

that is lower than the GND (P substrate) to the input terminal.

Resistor

Transistor (NPN)

Pin A

Pin B

B

C

Pin A

E

C

E

B

N

P⁺

N

P

N

Parasitic

element

P substrate

Parasitic

element

P substrate

GND

Parasitic element

Other adjacent elements

Fig.3 Pattern Diagram of Parasitic Element

(12) Ground Wiring Patterns

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern potential of any external components, either.

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2012.02 - Rev.A

7/8

Technical Note

BD6382EFV

●Ordering part number

E F

V

B D 6 3 8 2

-

E 2

パッケージ

EFV=HTSSOP-B24

包装、フォーミング仕様

形名

E2: リール状エンボステーピング

HTSSOP-B24

7.8 0.1

(MAX 8.15 include BURR)

Tape

Embossed carrier tape (with dry pack)

+

6°

−4°

(5.0)

4°

Quantity

2000pcs

24

13

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

12

1PIN MARK

0.325

+0.05

0.17

-

0.03

S

0.65

0.08

S

+0.05

Direction of feed

1pin

M

0.24

0.08

-

0.04

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

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2012.02 - Rev.A

8/8

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

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R1120

A


型号：	BD6382EFV_12
厂家：	ROHM
描述：	Low Voltage Stepping Motor Drivers 低电压步进电机驱动器驱动器电机
文件：	总9页 (文件大小：253K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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