BD9161FVM [ROHM]

Output 1.5A or Less High-efficiency Step-down Switching Regulator with Built-in Power MOSFET; 输出1.5A或更少的高效率降压开关稳压器具有内置功率MOSFET
BD9161FVM
型号: BD9161FVM
厂家: ROHM    ROHM
描述:

Output 1.5A or Less High-efficiency Step-down Switching Regulator with Built-in Power MOSFET
输出1.5A或更少的高效率降压开关稳压器具有内置功率MOSFET

稳压器 开关
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Single-chip Type with Built-in FET Switching Regulator Series  
Output 1.5A or Less High-efficiency  
Step-down Switching Regulator  
with Built-in Power MOSFET  
BD9161FVM  
No.09027EAT29  
Description  
ROHM’s high efficiency step-down switching regulator BD9161FVM is a power supply designed to produce 1.2volts  
(low voltage) from 3.3volts power supply line. Offers high efficiency with our original pulse skip control technology and  
synchronous rectifier. Employs a current mode control system to provide faster transient response to sudden change  
in load.  
Features  
1) Offers fast transient response with current mode PWM control system.  
2) Offers highly efficiency for all load range with synchronous rectifier (Nch/Pch FET)  
3) Incorporates 100% Duty function.  
4) Incorporates soft-start function.  
5) Incorporates thermal protection and ULVO functions.  
6) Incorporates short-current protection circuit with time delay function.  
7) Incorporates shutdown function Icc=0μA (Typ.)  
8) Employs small surface mount package MSOP8  
Use  
Power supply for HDD, DVS and for LSI of CPU, ASIC  
Absolute Maximum Rating (Ta=25)  
Parameter  
VCC voltage  
Symbol  
VCC  
Rating  
-0.3+7 *1  
-0.3+7 *1  
-0.3+7  
-0.3+7  
387.5*2  
Unit  
V
PVCC voltage  
PVCC  
EN  
V
EN Voltage  
V
SW, ITH Voltage  
Power Dissipation 1  
Power Dissipation 2  
Power Dissipation 3  
Power Dissipation 4  
SW,ITH  
Pd1  
V
mW  
mW  
Pd2  
587.4*3  
Topr  
-25+85  
-55+150  
+150  
Tstg  
EN voltage  
Tjmax  
*1 Pd should not be exceeded.  
*2 Derating in done 3.1mW/for temperatures above Ta=25℃.  
*3 Derating in done 4.7mW/for temperatures above Ta=25,Mounted on 70mm×70mm×1.6mm Glass Epoxy PCB.  
Operating Conditions (Ta=25)  
Limits  
Parameter  
Symbol  
Unit  
Min.  
2.5  
2.5  
0
Typ.  
Max.  
4.5  
VCC voltage  
VCC*4  
PVCC*4  
EN  
3.3  
V
V
V
V
A
PVCC voltage  
3.3  
4.5  
EN voltage  
-
-
-
VCC  
3.3  
Output Voltage Setting Range  
SW,ITH  
Isw*4  
1.0  
-
SW, ITH average output current  
0.6  
*4 Pd should not be exceeded.  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
1/13  
Technical Note  
BD9161FVM  
Electrical Characteristics  
(Ta=25, VCC=PVCC=3.3V, EN=VCC, unless otherwise specified.)  
Limits  
Typ.  
0
Parameter  
Symbol  
Unit  
Conditions  
Min.  
Max.  
10  
Standby current  
ISTB  
ICC  
-
-
μA  
μA  
V
EN=GND  
Bias current  
200  
GND  
VCC  
1
400  
0.8  
-
EN Low voltage  
VENL  
VENH  
IEN  
-
Standby mode  
Active mode  
VEN=3.3V  
EN High voltage  
2.0  
-
V
EN input current  
10  
μA  
MHz  
Oscillation frequency  
Pch FET ON resistance  
Nch FET ON resistance  
Output voltage  
FOSC  
RONP  
RONN  
VOUT  
ITHSI  
0.8  
-
1
1.2  
0.6  
0.68  
0.816  
-
0.35  
0.37  
0.8  
20  
PVCC=3.3V  
PVCC=3.3V  
-
0.784  
10  
10  
2.2  
2.22  
0.5  
1
V
ITH SInk current  
μA  
μA  
V
VOUT =H  
VOUT =L  
ITH Source Current  
UVLO threshold voltage  
UVLO hysteresis voltage  
Soft start time  
ITHSO  
VUVLO1  
VUVLO2  
TSS  
20  
-
2.3  
2.35  
1
2.4  
2.5  
2
VCC=HL  
VCC=LH  
V
ms  
ms  
V
Timer latch time  
TLATCH  
VSCP  
2
3
SCP/TSD operated  
Output Short circuit Threshold Voltage  
-
0.4  
0.56  
VOUT =HL  
Block Diagram, Application Circuit  
VCC  
EN  
3
VCC  
2.9 0.1  
8
7
VREF  
+6  
4
-4  
Max3.25(include.BURR)  
3.3V  
Input  
8
5
PVCC  
Current  
Comp.  
D 9 1  
Current  
Sense/  
Protect  
6
1
R
Q
Gm Amp.  
S
Lot No.  
Output  
SLOPE  
1
4
CLK  
+
6
+0.05  
1PIN MARK  
0.145  
OSC  
-0.03  
0.475  
VCC  
SW  
Driver  
Logic  
S
UVLO  
PGND  
Soft  
Start  
+0.05  
-0.04  
5
4
0.22  
TSD  
SCP  
GND  
0.08 S  
0.65  
1
2
ADJ  
ITH  
MSOP8 (Unit:mm)  
Fig.1 BD9161FVM Dimension  
Pin No. & function table  
Fig.2 BD9161FVM Block Diagram  
PIN function  
Pin No.  
Pin name  
ADJ  
1
2
3
4
5
6
7
8
Output voltage Feedback pin (Adjustable)  
GmAmp output pin/Connected phase compensation capacitor  
Enable pin (Active High)  
ITH  
EN  
GND  
PGND  
SW  
Ground  
Nch FET source pin  
Pch/Nch FET drain output pin  
Pch FET source pin  
PVCC  
VCC  
VCC power supply input pin  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
1/13  
Technical Note  
BD9161FVM  
Characteristics data(Reference data)  
3.0  
2.0  
1.0  
0.0  
3.0  
2.0  
1.0  
0.0  
3.0  
VOUT=2.5V】  
VOUT=2.5V】  
VOUT=2.5V】  
Ta=25℃  
Io=0A  
2.0  
1.0  
0.0  
VCC=3.3V  
Ta=25℃  
Io=0A  
VCC=3.3V  
Ta=25℃  
0
1
2
3
4
0
1
2
3
4
0
1
2
3
EN VOLTAGE:VEN[V]  
INPUT VOLTAGE:V [V]  
CC  
OUTPUT CURRENT:I  
[A]  
OUT  
Fig.4 Ven-Vout  
Fig.3 Vcc-Vout  
Fig.5 Iout-Vout  
1.20  
1.10  
1.00  
0.90  
0.80  
0.70  
0.60  
0.50  
0.40  
0.30  
0.20  
0.10  
0.00  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
2.55  
2.54  
2.53  
2.52  
2.51  
2.50  
2.49  
2.48  
2.47  
2.46  
2.45  
VOUT=2.5V】  
VCC=3.3V  
VCC=3.3V  
Io=0A  
VOUT=2.5V】  
VCC=3.3V  
Ta=25℃  
-25 -15 -5  
5
15 25 35 45 55 65 75 85  
-25 -15 -5  
5
15 25 35 45 55 65 75 85  
1
10  
100  
1000  
TEMPERATURE:Ta[  
]
TEMPERATURE:Ta[  
]
OUTPUT CURRENT:IOUT[mA]  
Fig.8 Ta - Fosc  
Fig. 6 Ta-VOUT  
Fig.7 Efficiency  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
1.2  
1.1  
1
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VCC=3.3V  
PMOS  
NMOS  
0.9  
VCC=3.3V  
0.8  
-25 -15 -5  
5
15 25 35 45 55 65 75 85  
-25 -15 -5  
5
15 25 35 45 55 65 75 85  
2.5  
3
3.5  
4
4.5  
TEMPERATURE:Ta[  
]
TEMPERATURE:Ta[  
]
INPUT VOLTAGE:VCC[V]  
Fig.9 Ta-VEN  
Fig.10 Ta-ICC  
Fig.11 Vcc-Fosc  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
2/13  
Technical Note  
BD9161FVM  
Characteristics data(Reference data) – Continued  
SLLMTM control  
VOUT=2.5V】  
VOUT=2.5V】  
PWM control  
VOUT=2.5V】  
VCC=PVCC  
=EN  
SW  
SW  
VOUT  
VOUT  
VOUT  
VCC=3.3V  
Ta=25℃  
Io=0A  
VCC=3.3V  
Ta=25℃  
VCC=3.3V  
Ta=25℃  
Fig.14 SW waveform Io=500mA  
Fig.12 Soft start waveform  
Fig.13 SW waveform Io=10mA  
100% Duty  
VOUT=2.5V】  
VOUT=2.5V】  
VOUT=2.5V】  
VOUT  
VOUT  
SW  
VOUT  
IOUT  
IOUT  
VCC=2.7V  
Ta=25℃  
VCC=3.3V  
Ta=25℃  
VCC=3.3V  
Ta=25℃  
Fig. 16 Transient response  
Io=250500mA(10μs)  
Fig.17 Transient response  
Io=500250mA(10μs)  
Fig. 15 SW waveform Io=600mA  
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2009.05 - Rev.A  
3/13  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD9161FVM  
Information on advantages  
Advantage 1Offers fast transient response with current mode control system.  
Conventional product (VOUT of which is 2.5 volts)  
BD9161FVM (Load response IO=250mA500mA)  
VOUT  
VOUT  
40mV  
98mV  
IOUT  
IOUT  
Voltage drop due to sudden change in load was reduced by about 50%.  
Fig.18 Comparison of transient response  
Advantage 2Offers high efficiency for all load range.  
For lighter load:  
Utilizes the current mode control mode called SLLMTM for lighter load, which reduces various dissipation such as  
switching dissipation (PSW), gate charge/discharge dissipation, ESR dissipation of output capacitor (PESR) and  
on-resistance dissipation (PRON) that may otherwise cause degradation in efficiency for lighter load.  
Achieves efficiency improvement for lighter load.  
100  
SLLMTM  
For heavier load:  
Utilizes the synchronous rectifying mode and the low on-resistance  
MOS FETs incorporated as power transistor.  
50  
inprovement by SLLMTM system  
PWM  
improvement by synchronous rectifier  
0
ON resistance of P-channel MOS FET: 0.35 (Typ.)  
ON resistance of N-channel MOS FET: 0.37 (Typ.)  
0.001  
0.01  
0.1  
1
Output current Io[A]  
Fig.19 Efficiency  
Achieves efficiency improvement for heavier load.  
Offers high efficiency for all load range with the improvements mentioned above.  
Advantage 3: ・Supplied in smaller package due to small-sized power MOS FET incorporated.  
Allows reduction in size of application products  
Output capacitor Co required for current mode control: 10 μF ceramic capacitor  
Inductance L required for the operating frequency of 1 MHz: 4.7 μH inductor  
Reduces a mounting area required.  
VCC  
15mm  
CIN  
Cin  
RITH  
L
DC/DC  
Convertor  
Controller  
L
VOUT  
10mm  
CITH  
RITH  
CITH  
Co  
CO  
Fig.20 Example application  
www.rohm.com  
2009.05 - Rev.A  
4/13  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD9161FVM  
Operation  
BD9161FVM is a synchronous rectifying step-down switching regulator that achieves faster transient response by  
employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for  
heavier load, while it utilizes SLLMTM (Simple Light Load Mode) operation for lighter load to improve efficiency.  
Current mode PWM control  
Synthesizes a PWM control signal with a inductor current feedback loop added to the voltage feedback.  
PWM (Pulse Width Modulation) control  
The oscillation frequency for PWM is 1 MHz. SET signal form OSC turns ON a P-channel MOS FET (while a  
N-channel MOS FET is turned OFF), and an inductor current IL increases. The current comparator (Current Comp)  
receives two signals, a current feedback control signal (SENSE: Voltage converted from IL) and a voltage feedback  
control signal (FB), and issues a RESET signal if both input signals are identical to each other, and turns OFF the  
P-channel MOS FET (while a N-channel MOS FET is turned ON) for the rest of the fixed period. The PWM control  
repeats this operation.  
SLLMTM (Simple Light Load Mode) control  
When the control mode is shifted from PWM for heavier load to the one for lighter load or vise versa, the switching  
pulse is designed to turn OFF with the device held operated in normal PWM control loop, which allows linear operation  
without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or  
vise versa.  
Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from Current  
Comp, it is so designed that the RESET signal is held issued if shifted to the light load mode, with which the switching  
is tuned OFF and the switching pulses are thinned out under control. Activating the switching intermittently reduces  
the switching dissipation and improves the efficiency.  
100% Duty control  
Max duty is 100%. (@ Pch MOS FET always ON) In usual PWM control, in case output voltage cannot keep (ex, drop  
of input voltage), oscillation frequency becomes lower and finally it becomes 100% duty. The output voltage is a value  
that depends only by on a voltage hang from the input voltage to Pch MOS FET, and can keep the output voltage even  
with the low input voltage.  
SENSE  
Current  
Comp  
VOUT  
RESET  
FB  
R
S
Q
IL  
Level  
Shift  
SET  
Driver  
Logic  
VOUT  
Gm Amp.  
SW  
Load  
OSC  
ITH  
Fig.21 Diagram of current mode PWM control  
PVCC  
SENSE  
PVCC  
Current  
Comp  
Current  
SENSE  
Comp  
FB  
FB  
SET  
SET  
GND  
GND  
GND  
GND  
RESET  
SW  
RESET  
GND  
SW  
GND  
IL  
IL(AVE)  
IL  
0A  
VOUT  
VOUT  
VOUT(AVE)  
VOUT(AVE)  
Not switching  
Fig.23 SLLMTM switching timing chart  
Fig.22 PWM switching timing chart  
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2009.05 - Rev.A  
5/13  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD9161FVM  
Description of operations  
Soft-start function  
EN terminal shifted to “High” activates a soft-starter to gradually establish the output voltage with the current limited  
during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current.  
Shutdown function  
With EN terminal shifted to “Low”, the device turns to Standby Mode, and all the function blocks including reference  
voltage circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 0μF (Typ.).  
UVLO function  
Detects whether the input voltage sufficient to secure the output voltage of this IC is supplied. And the hysteresis width  
of 50 mV (Typ.) is provided to prevent output chattering.  
Hysteresis 50mV  
VCC  
EN  
VOUT  
Tss  
Tss  
Tss  
Soft start  
Standby  
mode  
Standby  
mode  
Standby mode  
Operating mode  
Operating mode  
Operating mode  
Standby mode  
UVLO  
EN  
UVLO  
UVLO  
Fig.24 Soft start, Shutdown, UVLO timing chart  
Short-current protection circuit with time delay function  
Turns OFF the output to protect the IC from breakdown when the incorporated current limiter is activated continuously for  
the fixed time (TLATCH) or more. The output thus held tuned OFF may be recovered by restarting EN or by re-unlocking  
UVLO.  
EN  
Output OFF  
latch  
VOUT  
Limit  
IL  
1msec  
Standby  
mode  
Standby  
mode  
Operating mode  
Operating mode  
EN  
Timer latch  
EN  
Fig.25 Short-current protection circuit with time delay timing chart  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
6/13  
Technical Note  
BD9161FVM  
Switching regulator efficiency  
Efficiency ŋ may be expressed by the equation shown below:  
VOUT×IOUT  
POUT  
POUT  
η=  
×100[%]=  
×100[%]=  
×100[%]  
Vin×Iin  
Pin  
POUT+PDα  
Efficiency may be improved by reducing the switching regulator power dissipation factors PDα as follows:  
Dissipation factors:  
1) ON resistance dissipation of inductor and FETPD(I2R)  
2) Gate charge/discharge dissipationPD(Gate)  
3) Switching dissipationPD(SW)  
4) ESR dissipation of capacitorPD(ESR)  
5) Operating current dissipation of ICPD(IC)  
2
1)PD(I2R)=IOUT ×(RCOIL+RON) (RCOIL[]DC resistance of inductor, RON[]ON resistance of FET  
IOUT[A]Output current.)  
2)PD(Gate)=Cgs×f×V (Cgs[F]Gate capacitance of FET, f[H]Switching frequency, V[V]Gate driving voltage of FET)  
Vin2×CRSS×IOUT×f  
3)PD(SW)=  
(CRSS[F]Reverse transfer capacitance of FET, IDRIVE[A]Peak current of gate.)  
IDRIVE  
2
4)PD(ESR)=IRMS ×ESR (IRMS[A]Ripple current of capacitor, ESR[]Equivalent series resistance.)  
5)PD(IC)=Vin×ICC (ICC[A]Circuit current.)  
Consideration on permissible dissipation and heat generation  
As this IC functions with high efficiency without significant heat generation in most applications, no special consideration is  
needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input  
voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation  
must be carefully considered.  
For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered.  
Because the conduction losses are considered to play the leading role among other dissipation mentioned above including  
gate charge/discharge dissipation and switching dissipation.  
1000  
800  
2
Using an IC alone  
θj-a=322.6/W  
mounted on glass epoxy PCB  
θj-a=212.8/W  
P=IOUT ×(RON)  
RON=D×RONP+(1-D)×RONN  
DON duty (=VOUT/VCC)  
RONPON resistance of P-channel MOS FET  
RONNON resistance of N-channel MOS FET  
IOUTOutput current  
587.4mW  
387.5mW  
600  
400  
200  
0
0
25  
50  
75 85 100  
125  
150  
Ambient temperature:Ta []  
Fig.26 Thermal derating curve  
(MSOP8)  
If VCC=3.3V, VOUT=2.5V RONP=0.35, RONN=0.37ꢀ  
IOUT=0.6A, for example,  
D=VOUT/VCC=2.5/3.3=0.758  
RON=0.758×0.35+(1-0.758)×0.37  
=0.2653+0.08954  
=0.35484[]  
P=0.62×0.35484  
127.7[mV]  
As RONP is greater than RONN in this IC, the dissipation increases as the ON duty becomes greater. With the consideration  
on the dissipation as above, thermal design must be carried out with sufficient margin allowed.  
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2009.05 - Rev.A  
7/13  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD9161FVM  
Selection of components externally connected  
1. Selection of inductor (L)  
IL  
The inductance significantly depends on output ripple current.  
As seen in the equation (1), the ripple current decreases as the  
inductor and/or switching frequency increases.  
ΔIL  
VCC  
(VCC-VOUT)×VOUT  
[A]・・・(1)  
ΔIL=  
L×VCC×f  
IL  
Appropriate ripple current at output should be 2030% more or less  
of the maximum output current.  
VOUT  
ΔIL=0.25×IOUTmax. [A]・・・(2)  
L
Co  
(VCC-VOUT)×VOUT  
L=  
[H]・・・(3)  
ΔIL×VCC×f  
(ΔIL: Output ripple current, and f: Switching frequency)  
Fig.27 Output ripple current  
* Current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases  
efficiency. The inductor must be selected allowing sufficient margin with which the peak current may not exceed its  
current rating.  
If VCC=3.3V, VOUT=2.5V, f=1MHz, ΔIL=0.25×0.6A=0.15A  
(3.3-2.5)×2.5  
0.15×3.3×1M  
L≧  
4.04μ  
* Select the inductor of low resistance component (such as DCR and ACR) to minimize dissipation in the inductor for  
better efficiency.  
2. Selection of output capacitor (CO)  
VCC  
Output capacitor should be selected with the consideration on the stability region  
and the equivalent series resistance required to smooth ripple voltage.  
Output ripple voltage is determined by the equation (4):  
VOUT  
L
ΔVOUT=ΔIL×ESR [V]・・・(4)  
ESR  
Co  
(ΔIL: Output ripple current, ESR: Equivalent series resistance of output capacitor)  
*Rating of the capacitor should be determined allowing sufficient margin against  
output voltage. Less ESR allows reduction in output ripple voltage.  
Fig.28 Output capacitor  
Inappropriate capacitance may cause problem in startup. A 10μF to 100μF ceramic capacitor is recommended.  
3. Selection of input capacitor (Cin)  
Input capacitor to select must be a low ESR capacitor of the capacitance  
sufficient to cope with high ripple current to prevent high transient voltage. The  
ripple current IRMS is given by the equation (5):  
VCC  
Cin  
VOUT  
VOUT(VCC-VOUT)  
IRMS=IOUT×  
[A]・・・(5)  
L
VCC  
Co  
< Worst case > IRMS(max.)  
IOUT  
2
When VCC is twice the Vout, IRMS=  
Fig.29 Input capacitor  
If VCC=3.3V, VOUT=2.5V, and IOUTmax.=0.6A  
2.5(3.3-2.5)  
IRMS=0.6×  
=0.284[ARMS]  
5
A low ESR 10μF/10V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better  
efficiency.  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
8/13  
Technical Note  
BD9161FVM  
4. Determination of RITH, CITH that works as a phase compensator  
As the Current Mode Control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area  
due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high  
frequency area due to the output capacitor and its ESR. So, the phases are easily compensated by adding a zero to the  
power amplifier output with C and R as described below to cancel a pole at the power amplifier.  
fp(Min.)  
1
2π×RO×CO  
1
A
0
fp=  
fp(Max.)  
Gain  
[dB]  
fz(ESR)=  
fz(ESR)  
2π×ESR×CO  
IOUTMin.  
IOUTMax.  
Pole at power amplifier  
When the output current decreases, the load resistance Ro  
increases and the pole frequency lowers.  
0
Phase  
[deg]  
-90  
1
fp(Min.)=  
fp(Max.)=  
[Hz]with lighter load  
[Hz]with heavier load  
2π×ROMax.×CO  
Fig.30 Open loop gain characteristics  
1
2π×ROMin.×CO  
A
fz(Amp.)  
Zero at power amplifier  
Gain  
[dB]  
Increasing capacitance of the output capacitor lowers the pole  
frequency while the zero frequency does not change. (This  
is because when the capacitance is doubled, the capacitor  
ESR reduces to half.)  
0
0
Phase  
[deg]  
1
fz(Amp.)=  
-90  
2π×RITH.×CITH  
Fig.31 Error amp phase compensation characteristics  
Cin  
L
VCC  
VCC,PVCC  
EN  
SW  
VOUT  
RO  
VOUT  
VOUT  
ITH  
ESR  
CO  
GND,PGND  
RITH  
CITH  
Fig.32 Typical application  
Stable feedback loop may be achieved by canceling the pole fp (Min.) produced by the output capacitor and the load  
resistance with CR zero correction by the error amplifier.  
fz(Amp.)= fp(Min.)  
1
1
=
2π×RITH×CITH  
2π×ROMax.×CO  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
9/13  
Technical Note  
BD9161FVM  
5. Determination of output voltage  
The output voltage VOUT is determined by the equation (6):  
VOUT=(R2/R1+1)×VADJ・・・(6) VADJ: Voltage at ADJ terminal (0.8V Typ.)  
With R1 and R2 adjusted, the output voltage may be determined as required.  
(Adjustable output voltage range1.0V3.3V )  
L
6
1
Output  
SW  
Co  
R2  
R1  
ADJ  
Use 1 k100 kresistor for R1. If a resistor of the resistance higher than  
100 kis used, check the assembled set carefully for ripple voltage etc.  
Fig.33 Determination of output voltage  
BD9161FVM Cautions on PC Board layout  
ADJ  
ITH  
EN  
VCC  
PVCC  
SW  
1
2
3
4
8
7
6
5
RIN  
VCC  
RITH  
CIN  
L
EN  
VOUT  
CITH  
CO  
GND  
PGND  
GND  
Fig.34 Board layout  
For the sections drawn with heavy line, use thick conductor pattern as short as possible.  
Lay out the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor Co closer to the  
pin PGND.  
Lay out CITH and RITH between the pins ITH and GND as neat as possible with least necessary wiring.  
Recommended component lists with above applications  
Symbol  
Part  
Value  
Manufacturer  
TDK  
Series  
VLF5014AT-4R7M1R1  
CMD6D11B  
L
Coil  
4.7μH  
Sumida  
ROHM  
Kyocera  
Kyocera  
murata  
murata  
murata  
murata  
murata  
ROHM  
ROHM  
ROHM  
ROHM  
ROHM  
RIN  
CIN  
CO  
Resistance  
10ꢀ  
10μF  
10μF  
MCR03 Series  
CM316X5R106K10A  
CM316X5R106K10A  
GRM18 Series  
GRM18 Series  
GRM18 Series  
GRM18 Series  
GRM18 Series  
MCR03 Series  
MCR03 Series  
MCR03 Series  
MCR03 Series  
MCR03 Series  
Ceramic capacitor  
Ceramic capacitor  
Ceramic capacitor  
VOUT=1.0V  
820pF  
560pF  
470pF  
470pF  
330pF  
6.8kꢀ  
8.2kꢀ  
12kꢀ  
VOUT=1.2V  
VOUT=1.5V  
VOUT=1.8V  
VOUT=2.5V  
VOUT=1.0V  
VOUT=1.2V  
VOUT=1.5V  
VOUT=1.8V  
VOUT=2.5V  
CITH  
RITH  
Resistance  
12kꢀ  
15kꢀ  
* The parts list presented above is an example of recommended parts. Although the parts are sound, actual circuit characteristics should be checked on your  
application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when employing the  
depicted circuit with other circuit constants modified. Both static and transient characteristics should be considered in establishing these margins. When  
switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC pins, and a schottky barrier  
diode established between the SW and PGND pins.  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
10/13  
Technical Note  
BD9161FVM  
I/O equivalence circuit  
PVCC  
PVCC  
PVCC  
SW pin  
EN pin  
10kΩ  
EN  
SW  
ITH pin  
ADJ pin  
VCC  
10kΩ  
ADJ  
ITH  
Fig.36 I/O equivalence circuit  
www.rohm.com  
2009.05 - Rev.A  
11/13  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD9161FVM  
Cautions on use  
1. Absolute Maximum Ratings  
While utmost care is taken to quality control of this product, any application that may exceed some of the absolute  
maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken,  
short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed the  
absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses.  
2. Electrical potential at GND  
GND must be designed to have the lowest electrical potential In any operating conditions.  
3. Short-circuiting between terminals, and mismounting  
When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may  
result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output  
and power supply or GND may also cause breakdown.  
4.Operation in Strong electromagnetic field  
Be noted that using the IC in the strong electromagnetic radiation can cause operation failures.  
5. Thermal shutdown protection circuit  
Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to  
protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not  
be used thereafter for any operation originally intended.  
6. Inspection with the IC set to a pc board  
If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the  
capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper  
grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the  
inspection process, be sure to turn OFF the power supply before it is connected and removed.  
7. Input to IC terminals  
This is a monolithic IC with P+ isolation between P-substrate and each element as illustrated below. This P-layer and  
the N-layer of each element form a P-N junction, and various parasitic element are formed.  
If a resistor is joined to a transistor terminal as shown in Fig 37:  
P-N junction works as a parasitic diode if the following relationship is satisfied; GND>Terminal A (at resistor side), or  
GND>Terminal B (at transistor side); and  
if GND>Terminal B (at NPN transistor side),  
a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode.  
The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits,  
and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such  
manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in  
activation of parasitic elements.  
Resistor  
Transistor (NPN)  
B
Pin A  
Pin B  
Pin B  
C
E
Pin A  
B
C
E
N
N
N
P+  
P+  
P+  
P+  
N
P
P
Parasitic  
element  
N
N
Parasitic  
element  
P substrate  
P substrate  
GND  
GND  
GND  
GND  
Parasitic element  
Parasitic element  
Other adjacent elements  
Fig.37 Simplified structure of monorisic IC  
8. Ground wiring pattern  
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND  
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that  
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the  
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
12/13  
Technical Note  
BD9161FVM  
Ordering part number  
B D  
9
1
6
1
F
V
M - T  
R
Part No.  
Package  
Packaging and forming specification  
TR: Embossed tape and reel  
(MSOP8)  
Part No.  
FVM:MSOP8  
MSOP8  
<Tape and Reel information>  
2.9 0.1  
(MAX 3.25 include BURR)  
Tape  
Embossed carrier tape  
3000pcs  
+
6°  
4°  
Quantity  
4°  
8
7
6
5
TR  
Direction  
of feed  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1
2
3
4
1PIN MARK  
1pin  
+0.05  
0.145  
–0.03  
0.475  
S
+0.05  
0.22  
–0.04  
0.08  
S
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
0.65  
Reel  
(Unit : mm)  
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© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
13/13  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
system which requires an extremely high level of reliability the failure or malfunction of which  
may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,  
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of  
any of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may  
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to  
obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
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© 2009 ROHM Co., Ltd. All rights reserved.  
R0039  
A

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