BM60054AFV-C_技术文档

Datasheet

Gate Driver Providing Galvanic Isolation Series

Isolation voltage 2500Vrms

1ch Gate Driver Providing Galvanic Isolation

BM60054AFV-C

General Description

Key Specifications

The BM60054AFV-C is a gate driver with isolation voltage

2500Vrms, I/O delay time of 120ns, and a minimum input

pulse width of 90ns. Fault signal output function, ready

signal output function, under voltage lockout (UVLO)

function, thermal protection function, short current

protection (SCP) function, miller clamp function and

switching controller function, output state feedback

function are all built-in.

 Isolation Voltage:

 Maximum Gate Drive Voltage:

 I/O Delay Time:

2500Vrms

20V (Max)

120ns (Max)

90ns (Max)

 Minimum Input Pulse Width:

Package

SSOP-B28W

W(Typ) x D(Typ) x H(Max)

9.2 mm x 10.4 mm x 2.4 mm

Features

■

AEC-Q100 Qualified^{(Note 1)}

Fault Signal Output Function

Ready Signal Output Function

Under Voltage Lockout Function

Short Circuit Protection Function

Soft Turn-Off Function for Short Circuit Protection

(Adjustable Turn-Off time)

■

Thermal Protection Function

Active Miller Clamping

Switching Controller Function

Output State Feedback Function

UL1577 Recognized: File No. E356010

(Note 1) Grade 1

SSOP-B28W

Applications

 Automotive Inverter

 Automotive DC-DC Converter

 Industrial inverter System

 UPS System

Typical Application Circuit

Pin 1

Figure 1. Typical Application Circuit

○Product structure：Silicon integrated circuit ○This product has no designed protection against radioactive rays

.

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Contents

General Description ................................................................................................................................................................1

Features.................................................................................................................................................................................1

Applications............................................................................................................................................................................1

Key Specifications...................................................................................................................................................................1

Package...................................................................................................................................................................................1

Typical Application Circuit........................................................................................................................................................1

Contents.................................................................................................................................................................................2

Recommended Range of External Constants...........................................................................................................................3

Pin Configuration ....................................................................................................................................................................3

Pin Descriptions......................................................................................................................................................................3

Description of Functions and Examples of Constant Setting .....................................................................................................6

Absolute Maximum Ratings...................................................................................................................................................17

Thermal Resistance..............................................................................................................................................................18

Recommended Operating Conditions ....................................................................................................................................18

Insulation Related Characteristics..........................................................................................................................................18

Electrical Characteristics.......................................................................................................................................................19

UL1577 Ratings Table...........................................................................................................................................................21

Typical Performance Curves..................................................................................................................................................22

Figure 19. Main Power Supply Circuit Current vs Main Power Supply Voltage.........................................................................22

Figure 20. Output-side Circuit Current vs Output-side Positive Supply Voltage (MODE=H, V_EE2=0V, OUT1=L).........................22

Figure 21. Output-side Circuit Current vs Output-side Positive Supply Voltage (MODE=H, V_EE2=0V, OUT1=H).........................22

Figure 22. FET_G ON-resistance vs Temperature (Source /Sink)............................................................................................22

Figure 23. Oscillation Frequency vs RT Resistance................................................................................................................23

Figure 24. Soft-start Time vs Temperature..............................................................................................................................23

Figure 25. FB Pin Threshold Voltage vs Temperature .............................................................................................................23

Figure 26. COMP Pin Sink Current vs Temperature................................................................................................................23

Figure 27. COMP Pin Source Current vs Temperature............................................................................................................24

Figure 28. Over Current Detection Threshold vs Temperature.................................................................................................24

Figure 29. Logic Input Filtering Time vs Temperature (L pulse)................................................................................................24

Figure 30. Logic Input Filtering Time vs Temperature (H pulse)...............................................................................................24

Figure 31. ENA Input Filtering Time Figure vs Temperature ....................................................................................................25

Figure 32. MODE Input Voltage vs Temperature (V_CC2=14V)...................................................................................................25

Figure 33. OUT1H ON-resistance (Source) vs Temperature (I_OUT1H=-40mA)............................................................................25

Figure 34. OUT1L ON-resistance (Sink) vs Temperature (I_OUT1L=40mA)..................................................................................25

Figure 35. PROOUT ON-resistance vs Temperature (I_PROOUT=40mA)......................................................................................26

Figure 36. Turn ON time vs Temperature................................................................................................................................26

Figure 37. Turn OFF time vs Temperature..............................................................................................................................26

Figure 38. OUT2 ON-resistance vs Temperature (I_OUT2=40mA)...............................................................................................26

Figure 39. Short Current Detection Voltage vs Temperature....................................................................................................27

Figure 40. DESAT Leading Edge Blanking Time vs Temperature ............................................................................................27

Figure 41. Short Current Detection Filter Time vs Temperature.............................................................................................27

Figure 42. Short Current Detection Delay Time (PROOUT) vs Temperature ............................................................................27

Figure 43. SCPIN Pin Low Voltage vs Temperature................................................................................................................28

Figure 44. Output Delay Difference between PROOUT and FLT vs Temperature.....................................................................28

Figure 45. Thermal Detection Voltage vs Temperature............................................................................................................28

Selection of Components Externally Connected .....................................................................................................................29

I/O Equivalence Circuits........................................................................................................................................................30

Operational Notes.................................................................................................................................................................34

Ordering Information.............................................................................................................................................................36

Marking Diagram...................................................................................................................................................................36

Physical Dimension, Tape and Reel Information.....................................................................................................................37

Revision History....................................................................................................................................................................38

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Recommended Range of External Constants

Recommended Value

Pin Name

Symbol

Unit

Min

1.0

Typ

3.3

-

Max

10.0

-

VREG

VCC2

RT

C_VREG

C_VCC2

R_RT

µF

kΩ

0.33

24

68

150

Pin Configuration

(TOP VIEW)

VEE2

1

2

GND1

28

27 SENSE

26

PROOUT

VTSIN

SCPIN

NC

3

FET_G

4

25 VREG

24 V_BATT

23 COMP

22 FB

5

6

GND2

MODE

UVLOIN

VCC2

NC

7

8

21 RT

9

20 RDY

10

11

12

13

19

18

17

16

15

INB

INA

OUT1H

OUT1L

OUT2

ENA

FLT

14

GND1

VEE2

Figure 2. Pin Configuration

Pin Descriptions

Pin No.

1

Pin Name

Function

VEE2

PROOUT

VTSIN

SCPIN

NC

Output-side negative power supply pin

Soft turn-off pin/Gate voltage input pin

Temperature sensor voltage input pin

Short circuit current detection pin

Non-connection

2

3

4

5

6

GND2

MODE

UVLOIN

VCC2

NC

Output-side ground pin

7

Mode selection pin of output-side UVLO

Output-side UVLO setting input pin

Output-side positive power supply pin

Non-connection

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

OUT1H

OUT1L

OUT2

VEE2

GND1

FLT

Source side output pin

Sink side output pin

Miller Clamp pin

Output-side negative power supply pin

Input-side ground pin

Fault output pin

ENA

Input enabling signal input pin

Control input pin A

INA

INB

Control input pin B

RDY

Ready output pin

RT

Switching frequency setting pin for switching controller

Error amplifier inverting input pin for switching controller

Error amplifier output pin for switching controller

Main power supply pin

FB

COMP

V_BATT

VREG

FET_G

SENSE

GND1

Input-side internal power supply pin

MOS FET control pin for switching controller

Current detection pin for switching controller

Input-side ground pin

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Pin Descriptions – continued

1. V_BATT (Main power supply pin)

This is the main power supply pin. Connect a bypass capacitor between V_BATT and GND1 in order to suppress

voltage variations.

2. GND1 (Input-side ground pin)

The GND1 pin is a ground pin on the input side.

3. VCC2 (Output-side positive power supply pin)

The VCC2 pin is a positive power supply pin on the output side. To reduce voltage fluctuations due to OUT1H/L pin

output current and due to the driving current of the internal transformers, connect a bypass capacitor between VCC2

and GND2 pins.

4. VEE2 (Output-side negative power supply pin)

The VEE2 pin is a negative power supply pin on the output side. To suppress voltage fluctuations due to OUT1H/L pin

output current and due to the driving current of the internal transformers, connect a bypass capacitor between the VEE2

and the GND2 pins. Connect the VEE2 pin to the GND2 pin when no negative power supply is used.

5. GND2 (Output-side ground pin)

The GND2 pin is a ground pin on the output side. Connect the GND2 pin to the emitter/source of a power device.

6. INA, INB, ENA (Control Input pin)

The INA, INB, ENA are pins used to determine output logic.

ENA

L

H

INB

X

H

L

INA

X

L

H

OUT1H

Hi-Z

H

OUT1L

L

Hi-Z

7. FLT (Fault output pin)

The FLT pin is an open drain pin used to output a fault signal when short circuit protection function (SCP) or thermal

protection function is activated, and fault state (FLT=L output) is released in rising of ENA (L to H).

Status

FLT

Hi-Z

L

While in normal operation

When SCP or thermal protection is activated

8. RDY (Ready output pin)

The RDY pin is an open drain pin that outputs an internal abnormal state (V_BATT UVLO, VCC2 UVLO, output state

feedback). ‘output state feedback’ is a function to compare gate logic monitored by the PROOUT pin with input logic,

and outputs L when it does not match.

Status

RDY

Hi-Z

L

While in normal operation

V_BATT UVLO or VCC2 UVLO or Output state feedback (disaccord)

9. MODE (Mode selection pin of output-side UVLO)

The MODE pin is a pin which selects internal threshold or external setting threshold for output-side UVLO.

MODE

Output-side UVLO threshold voltage

Setting by external (Use UVLOIN pin)

L (=GND2)

H (=VCC2)

Fixed (=V_UVLO2L) (Connect UVLOIN pin to VCC2 pin)

10. UVLOIN (Output-side UVLO setting input pin)

The UVLOIN pin is a pin for deciding UVLO setting value of VCC2. The threshold value of UVLO can be set by

dividing the resistance voltage of VCC2. UVLOIN activates only at MODE pin=L. When MODE pin=H, connect

UVLOIN pin to VCC2 pin.

11. OUT1H, OUT1L (Output pin)

The OUT1H pin is a source side pin used to drive the gate of a power device, and the OUT1L pin is a sink side pin

used to drive the gate of a power device.

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Pin Descriptions – continued

12. OUT2 (Miller Clamp pin)

This is the miller clamp pin for preventing a rise of gate voltage due to miller current of output element connected to

OUT1H/L. It also functions as a pin for monitoring gate voltage for miller clamp. OUT2 pin voltage become less than

V_OUT2ON(typ 2.0V), miller clamp function operates. OUT2 should be connect to VEE2 when miller clamp function is

not used.

13. PROOUT (Soft turn-off pin/Gate voltage input pin)

This is a pin for soft turn-off of output pin when short circuit protection or thermal protection is in action. It also

functions as a pin for monitoring gate voltage for output state feedback function.

14. SCPIN (Short circuit current detection pin)

The SCPIN pin is a pin used to detect current for short circuit protection. When the SCPIN pin voltage exceeds

V_SCDET, SCP function will be activated. This may cause the IC to malfunction in an open state. To avoid such trouble,

short circuit the SCPIN pin to the GND2 pin when the short circuit protection is not used. In order to prevent the

wrong detection due to noise, the noise filter time t_SCPFILis set.

15. VTSIN (Temperature sensor voltage input pin)

The VTSIN pin is a temperature sensor voltage input pin, which can be used for thermal protection of an output

device. If VTSIN pin voltage becomes V_TSDETor less, the thermal protection function will be activated. IC may

malfunction in the open status, so be sure to supply the VTSIN more than V_TSDETif the thermal protection function is

not used. In order to prevent the wrong detection due to noise, the noise mask time t_TSFILis set. In addition, it can be

used also as compulsive shutdown pin other than a temperature sense by inputting a comparator output etc.

16. RT (Switching frequency setting pin for switching controller)

The RT pin is a pin used to make setting of switching frequency of switching controller. The switching frequency is

determined by the resistance value connected between RT and GND1. The value of switching frequency is

determined by the value of the resistor R_RT.

F_SW1/(7.310^8 R_RT 2.210^4)



kHz



17. FB (Error amplifier inverting input pin for switching controller)

This is a voltage feedback pin of the switching controller. This pin combine with voltage monitoring at overvoltage

protection function and under voltage protection function for switching controller. When overvoltage or under voltage

protection is activated, switching controller will be at OFF state (FET_G pin outputs low). When the protection holding

time t_DCDCRLSis completed, the protection function will be released. Under voltage function is not activated during

soft-start.

18. COMP (Error amplifier output pin for switching controller)

This is the gain control pin of the switching controller. Connect a phase compensation capacitor and resistor.

19. VREG (Input-side internal power supply pin)

This is the input-side internal power supply pin. Be sure to connect a capacitor between VREG and GND1 even when

the switching controller is not used, in order to prevent oscillation and suppress voltage variation due to FET_G

output current and IC internal transformer drive current.

20. FET_G (MOS FET control pin for switching controller)

This is a MOSFET control pin for the switching controller transformer drive.

21. SENSE (Current detection pin for switching controller)

This is a pin connected to the resistor of the switching controller current feedback. This pin combines with current

monitoring at overcurrent restriction function for switching controller. When overcurrent restriction is activated,

switching controller will be at OFF state (FET_G pin outputs Low), and the overcurrent restriction function will be

released in the next switching period.

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Description of Functions and Examples of Constant Setting

1. Miller Clamp Function

When OUT1H/L=Hi-Z/L and OUT2 pin voltage<V_OUT2ON, internal MOS of OUT2 pin is turned ON and miller clamp

function operates. Miller clamp will be maintained until next turn on (OUT1H/L=H/Hi-Z).

During short circuit protection and thermal protection, the miller clamp function does not operate and the miller clamp

function is enabled after soft turn-off release time t_STOhas passed.

OUT2 pin

input voltage

IN

OUT2 output

L

less than V_OUT2ON

L

H

X

Hi-Z

VCC2

PREDRIVER

OUT1H/L

PROOUT

PREDRIVER

LOGIC

OUT2

GND2

VEE2

+

-

V_OUT2ON

Figure 3. Block Diagram of Miller Clamp Function

H

L

ENA

INA

H

L

V_TSDET

VTSIN

V_SCDET

Hi-Z

L

SCPIN

FLT

H

OUT1H/L

OUT2

Hi-Z

L

V_OUT2ON

t_PON

t_STO

Figure 4. Timing Chart of Miller Clamp Function

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Description of Functions and Examples of Constant Setting – continued

2. Under Voltage Lockout (UVLO)Function

The BM60054AFV-C incorporates the under voltage lockout (UVLO) function on V_BATT and VCC2. When the

power supply voltage drops to V_UVLOBATTL, V_UVLOINL(MODE=L), or V_UVLO2L(MODE=H), the OUT1H/L pin will output the

"Hi-Z/L" and the RDY pin will output the “L” signal. When the power supply voltage rises to V_UVLOBATTH

(=V_UVLOBATTL+V_UVLOBATTHYS), V_UVLOINH(=V_UVLOINL+V_UVLOINHYS) or V_UVLO2H(=V_UVLO2L+V_UVLO2HYS), these pins will be reset.

In addition, to prevent miss-triggers due to noise, mask time t_UVLOBATTFILand t_UVLO2FILare set on both voltage sides.

H

L

INA

V_UVLOBATTH

V_UVLOBATTL

V_BATT

Hi-Z

L

H

L

RDY

OUT1H/L

FET_G

H

Hi-Z

L

Figure 5. V_BATT UVLO Function Operation Timing Chart

H

L

INA

V_UVLOINH

V_UVLOINL

UVLOIN

(VCC2)

Hi-Z

L

RDY

H

Hi-Z

L

OUT1H/L

H

L

FET_G

Figure 6. VCC2 UVLO Function Operation Timing Chart (MODE=L)

H

L

INA

V_UVLO2H

V_UVLO2L

VCC2

Hi-Z

L

RDY

H

Hi-Z

OUT1H/L

L

H

L

FET_G

Figure 7. VCC2 UVLO Function Operation Timing Chart (MODE=H)

: Since the V_BATT to GND1 pin voltage is low and the output MOS does not turn ON,

the output pins become Hi-Z conditions.

: Since the VCC2 to VEE2 pin voltage is low and the output MOS does not turn ON,

the output pins become Hi-Z conditions.

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Description of Functions and Examples of Constant Setting – continued

3. Short Circuit Protection Function (SCP, DESAT)

When the SCPIN pin voltage exceeds V_SCDET, the SCP function will be activated. When the SCP function is activated,

the OUT1H/L pin voltage will be set to the “Hi-Z/Hi-Z” level and the PROOUT pin voltage will go to the “L” level first

(soft turn-off). Next, after t_STOhas passed, OUT1H/L pin become Hi-Z/L (PROOUT pin hold L).

When the rising edge is put in the ENA pin after ENA=L (>t_ENAFIL), the SCP function will be released.

When OUT1H/L=Hi-Z/L or Hi-Z/Hi-Z, MOSFET is built-in between SCPIN pin and GND2 pin turns ON to discharge

C_BLANKfor desaturation protection function. When OUT1H/L=H/Hi-Z, internal MOSFET connected to SCPIN pin turns

OFF. Collector/drain voltage V_DESATat which desaturation protection function operates and blank time t_{BLANKouternal}can

be set by the following formula.

R3  R2

V_DESAT V_SCDET



V_F

V

 

D1

R3

R3  R2  R1

R3

V_CC2 V_SCDET



V

MIN

V

R2  R1

R3  R2  R1

R3

t_{BLANKouternal} 

 R3C_BLANK ln(1



^SCDET)  t_DESATleb

V_CC2

s

 

設定参考値

R2

V_DESAT

R1

R3

4.0V

4.5V

5.0V

5.5V

6.0V

6.5V

7.0V

7.5V

8.0V

8.5V

9.0V

9.5V

10.0V

15 kΩ

39kΩ

47kΩ

51kΩ

27kΩ

33kΩ

62kΩ

47kΩ

20kΩ

82kΩ

62kΩ

33kΩ

75kΩ

68kΩ

4.7kΩ

5.1kΩ

2.4kΩ

2.7kΩ

4.7kΩ

3.3kΩ

1.3kΩ

5.1kΩ

3.6kΩ

1.8kΩ

3.9kΩ

3.3kΩ

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Description of Functions and Examples of Constant Setting – continued

VCC2

OUT1H/L

PROOUT

LOGIC

FLT

SCPIN

FLT

+

SCPFIL

-

V_SCDET

GND2

VEE2

GND1

Figure 8. Block Diagram of Short Circuit Protection

VCC2

R1

OUT1H/L

PROOUT

LOGIC

FLT

D1

R2

R3

FLT

SCPIN

+

SCPFIL

-

V_SCDET

GND2

VEE2

GND1

Figure 9. Block Diagram of DESAT

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Description of Functions and Examples of Constant Setting – continued

H

L

IN

t_SCPFIL

t_SCPPRO

t_SCPFIL

t_SCPPRO

V_SCDET

SCPIN

H

OUT1H/L

Hi-Z

L

Hi-Z

L

Hi-Z

PROOUT

FLT

L

t_DESATleb

t_STO

H

L

ENA

>t_ENAFIL

Figure 10. SCP Operation Timing Chart

>t_ENAFIL

Start

OUT1H/L=Hi-Z/L, PROOUT=L

No

V_SCPIN>V_SCDET

Yes

No

ENA=L to H

Yes

Exceed filter time

Yes

FLT=Hi-Z

OUT1H/L=Hi-Z/Hi-Z, PROOUT=L, FLT=L

No

Exceed t_STO

Yes

IN=H

Yes

OUT1H/L=H/Hi-Z, PROOUT=Hi-Z

Figure 11. SCP Operation Status Transition Diagram

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Description of Functions and Examples of Constant Setting – continued

4. Thermal Protection Function

When the VTSIN pin voltage becomes V_TSDETor less, the thermal protection function will be activated. When the

thermal protection function is activated, the OUT1H/L pin voltage will be set to the “Hi-Z/Hi-Z” level and the PROOUT

pin voltage will go to the “L” level first (soft turn-off). Next, when the VTSIN pin voltage rises to the threshold value

and after t_STOhas passed, OUT1H/L pin become Hi-Z/L (PROOUT pin hold L).

When the rising edge is put in the ENA pin after ENA=L (>t_ENAFIL), the thermal protection function will be released.

VCC2

OUT1H/L

LOGIC

TSFIL

FLT

PROOUT

VTSIN

FLT

SENSOR

V_TSDET

GND2

VEE2

GND1

Figure 12. Block Diagram of thermal protection function

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Description of Functions and Examples of Constant Setting – continued

H

L

IN

t_TSFIL

VTSIN

V_TSDET

H

OUT1H/L

Hi-Z

L

Hi-Z

L

Hi-Z

PROOUT

FLT

L

t_STO

H

L

ENA

>t_ENAFIL

Figure 13. Thermal Protection Function Operation Timing Chart

START

OUT1H/L=Hi-Z/L, PROOUT=L

ENA=L to H

No

V_TSIN<V_TSDET

Yes

No

Exceed filter time

Yes

FLT=Hi-Z

OUT1H/L=Hi-Z/Hi-Z, PROOUT=L, FLT=L

No

V_TSIN>V_TSDET

IN=H

Yes

OUT1H/L=H/Hi-Z, PROOUT=Hi-Z

Exceed t_STO

Figure 14. Thermal Protection Function Operation Status Transition Diagram

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Description of Functions and Examples of Constant Setting – continued

5. Switching Controller

(a) Basic action

This IC has a built-in switching power supply controller which repeats ON/OFF synchronizing with internal clock

set by RT pin. When V_BATT voltage is supplied (V_BATT>V_UVLOBATTH(=V_UVLOBATTL+ V_UVLOBATTHYS)), FET_G pin

starts switching by soft-start. Output voltage is determined by the following equation by external resistance and

winding ratio “n” of fly back transformer (n= V_OUT2side winding number/V_OUT1side winding number)

V_{OUT 2}V_FB

(b) Max duty



R₁ R₂



/ R₂



n

V

 

When, for example, output load is large, and voltage level of SENSE pin does not reach current detection level,

output is forcibly turned OFF by Maximum ON Duty (D_ONMAX).

(c) Protection function

The switching controller has protection function as overvoltage protection (OVP), and under voltage protection

(UVP) monitoring the voltage of FB pin.

When the protection function is activated, switching controller will be OFF state (FET_G pin outputs Low). The

protection holding time (t_DCDCRLS) is completed, the protection function will be released. Under voltage function is

not activated during soft-start.

V_OUT1

RT

FB

OSC

V_FB

R1

R2

-

UVLO_BATT

+

OVP

UVP

COMP

V_BATT

VREG

V_OUT2

Max duty

VREG

Slope

COMP

V_FB

+

-

R

Q

FET_G

SENSE

GND1

S

OSC

OC

Soft start

Figure 15. Block Diagram of switching controller

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Description of Functions and Examples of Constant Setting – continued

(d)The pin handling when not using switching controller

When not using switching controller, do pin handling as follows.

Pin no.

21

22

23

24

25

26

27

Pin name

RT

Processing method

pull down in GND1 by 68kΩ

connect to VREG

connect to GND1

connect power supply

connect capacitor

open

FB

COMP

V_BATT

VREG

FET_G

SENSE

connect to VREG

RT

FB

OSC

V_FB

-

UVLO_BATT

+

OVP

UVP

COMP

V_BATT

Max duty

VREG

FET_G

SENSE

GND1

COMP

+

-

R

Q

S

OSC

V_FB

Slope

OC

Soft start

Figure 16. The pin handling when not using switching controller

6. Gate State Monitoring Function

When input logic and gate logic of output device monitored with PROOUT pin are compared, a logic L is output from

RDY pin when they disaccord. In order to prevent the detection error due to delay of input and output, OSFB filter

time t_OSFBFILis provided.

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Description of Functions and Examples of Constant Setting – continued

(7) I/O Condition Table

Input

Output

No.

Status

1

2

○

H

L

H

L

H

X

L

H

X

L

H

L

X

H

L

Hi-Z Hi-Z Hi-Z

Hi-Z Hi-Z

L

Hi-Z

L

SCP

L

3

UVLO

○

X

H

L

H

L

Hi-Z

L

Hi-Z Hi-Z Hi-Z

Hi-Z Hi-Z

Hi-Z Hi-Z Hi-Z

Hi-Z Hi-Z

UVLO_VBATT

UVLO_VCC2

4

○

L

5

UVLO

○

H

L

H

L

6

L

○

7

○

H

L

X

H

L

Hi-Z Hi-Z Hi-Z

L

Hi-Z

L

Thermal

protection

8

○

L

9

○

H

L

Hi-Z

H

L

Hi-Z Hi-Z Hi-Z

Disable

10

11

12

13

14

15

16

○

L

Hi-Z Hi-Z Hi-Z

○

H

L

H

L

INB active

○

L

○

H

L

H

L

Normal Operation

L Input

○

L

○

L

H

L

H

L

Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z

Hi-Z Hi-Z Hi-Z Hi-Z

Normal Operation

H Input

○

L

H

L

○ : > UVLO, X:Don't care

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Description of Functions and Examples of Constant Setting – continued

(8) Power Supply Startup/Shutdown Sequence

H

L

IN

V_UVLOBATTL

V_UVLOBATT

L

V_UVLOBATTL

V_BATT

VCC2

0V

V_UVLO2H

0V

(=V_UVLO2L+ V_UVLO2HYS

)

VEE2

H

OUT1H/L

Hi-Z

L

Hi-Z

OUT2

PROOUT

RDY

L

Hi-Z

L

Hi-Z

L

H

L

IN

V_BATT

VCC2

V_UVLOBATTH

(=V_UVLOBATTL+ V_UVLOBATTHYS

V_UVLOBATTL

V_UVLO2H

V_UVLOBATTH

0V

)

V_UVLO2L

0V

VEE2

H

OUT1H/L

OUT2

Hi-Z

L

Hi-Z

L

Hi-Z

PROOUT

RDY

L

Hi-Z

L

H

L

IN

V_BATT

VCC2

V_UVLOBATTL

V_UVLOBATTH

V_UVLO2L

0V

V_UVLO2H

0V

VEE2

H

OUT1H/L

OUT2

Hi-Z

L

Hi-Z

L

Hi-Z

PROOUT

RDY

L

Hi-Z

L

H

L

IN

V_BATT

VCC2

V_UVLOBATTH

0V

V_UVLO2L

0V

VEE2

H

OUT1H/L

OUT2

Hi-Z

L

Hi-Z

L

Hi-Z

PROOUT

RDY

L

Hi-Z

L

: Since the VCC2 to VEE2 pin voltage is low and the output MOS does not turn ON,

the output pins become Hi-Z conditions.

: Since the V_BATT to GND1 pin voltage is low and the RDY output MOS does not turn ON,

the output pins become Hi-Z conditions.

Figure 17. Power Supply Startup/Shutdown Sequence

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Absolute Maximum Ratings

Parameter

Symbol

V_BATT

V_CC2

Limit

Unit

V

-0.3 to +40.0^{(Note 2)}

-0.3 to +24.0^{(Note 3)}

-15.0 to +0.3^{(Note 3)}

Main Power Supply Voltage

Output-side Positive Supply Voltage

Output-side Negative Supply Voltage

V

V_EE2

V

Maximum Difference

V_MAX2

30.0

V

Between Output-Side Positive and NegativeVoltages

INA, INB, ENA Pin Input Voltage

MODE Pin Input Voltage

V_IN

V_MODE

V_SCPIN

V_VTS

-0.3 to +7.0^{(Note 2)}

V

-0.3 to +V_CC2+0.3 or +24.0^{(Note 3)}

SCPIN Pin Input Voltage

-0.3 to +V_CC2+0.3 or +24.0^{(Note 3)}

V

VTSIN Pin Input Voltage

-0.3 to +V_CC2+0.3 or +24.0^{(Note 3)}

V

UVLOIN Pin Input Voltage

V_UVLOIN

I_OUT1PEAK

-0.3 to +V_CC2+0.3 or +24.0^{(Note 3)}

V

OUT1H, OUT1L Pin Output Current (Peak 10μs)

OUT2 Pin Output Current (Peak 10μs)

PROOUT Pin Output Current (Peak 10μs)

FLT, RDY Pin Output Current

5.0^{(Note 4)}

2.5^{(Note 4)}

10

A

I_OUT2PEAK

A

I_PROOUTPEA

A

I_FLT

I_{FET_GPEAK}

Tstg

mA

A

FET_G Pin Output Current (Peak 1μs)

Storage Temperature Range

1

-55 to +150

°C

Junction Temperature

Tjmax

+150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 2) Relative to GND1

(Note 3) Relative to GND2

(Note 4) Should not exceed Tjmax=150C

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Thermal Resistance^{(Note 5)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 7)}

2s2p^{(Note 8)}

SSOP-B28W

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 6)}

θ_JA

112.9

34

64.4

23

°C/W

Ψ_JT

(Note 5) Based on JESD51-2A (Still-Air).

(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 7) Using a PCB board based on JESD51-3.

(Note 8) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

70μm

Recommended Operating Conditions

Parameter

Symbol

Min

4

Typ

12

15

-

Max

Unit

V

Main Power Supply Voltage^{(Note 9)}

V_BATT

V_CC2

V_EE2

32

20

0

Output-side Positive Supply Voltage^{(Note 10)}

Output-side Negative Supply Voltage^{(Note 10)}

10

-12

V

Maximum Difference

V_MAX2

10

-

28

V

Between Output-Side Positive and Negative Voltages

Switching Frequency for Switching Controller

Operating Temperature Range

f_SWR

Topr

100

-40

-

500

kHz

°C

+25

+125

(Note 9) Relative to GND1

(Note 10) Relative to GND2

Insulation Related Characteristics

Parameter

Symbol

R_S

Characteristic

Unit

Ω

Insulation Resistance (V_IO=500V)

Insulation Withstand Voltage/1min

Insulation Test Voltage/1sec

>10⁹

2500

3000

V_ISO

Vrms

V_ISO

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Electrical Characteristics

(Unless otherwise specified Ta=-40°C to +125°C, V_BATT=4V to 32V, V_CC2=UVLO to 20V, V_EE2=-12V to 0V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

General

Main Power Supply

1.0

0.7

0.8

1.6

1.3

1.4

2.2

1.9

2.0

I_BATT1

I_BATT2

I_BATT3

mA

V_BATT=4V

Circuit Current 1

Main Power Supply

V_BATT=12V

V_BATT=32V

Circuit Current 2

Main Power Supply

Circuit Current 3

0.8

0.4

0.9

0.5

1.5

1.1

1.6

1.2

2.2

1.8

2.3

1.9

Output-side Circuit Current 1

Output-side Circuit Current 2

Output-side Circuit Current 3

Output-side Circuit Current 4

I_CC21

I_CC22

I_CC23

I_CC24

mA

V_CC2=14V, OUT1=L

V_CC2=14V, OUT1=H

V_CC2=18V, OUT1=L

V_CC2=18V, OUT1=H

V_CC2=16V, V_EE2=-8V,

OUT1=L

1.0

0.6

1.6

1.3

2.4

2.0

Output-side Circuit Current 5

I_CC25

I_CC26

mA

V_CC2=16V, V_EE2=-8V,

OUT1=H

Output-side Circuit Current 6

Switching Power Supply Controller

FET_G Output Voltage H1

4.2V<V_BATT≤32V

I_{FET_G}=0A(open)

V_BATT≤4.2V

V_FETGH1

V_FETGH2

3.8

-

4.0

4.2

V

FET_G Output Voltage H2

V_BATT-0.2

V_BATT

I_{FET_G}=0A(open)

I_{FET_G}=-10mA

I_{FET_G}=10mA

RT=68kΩ

FET_G Output Voltage L

FET_G ON-resistance (Source)

FET_G ON-resistance (Sink)

Oscillation Frequency

V_FETGL

R_ONGH

0

3

-

6

0.3

12

V

Ω

R_ONGL

0.3

182

-

0.6

200

-

1.3

222

50

Ω

f_SW

kHz

ms

V

Soft-start Time

t_SS

FB Pin Threshold Voltage

FB Pin Input Current

V_FB

1.47

-0.8

-160

40

1.50

0

1.53

+0.8

-40

160

3.60

0.13

-

I_FB

µA

V

COMP Pin Sink Current

COMP Pin Source Current

V_BATT UVLO ON Voltage

V_BATT UVLO Hysteresis

V_BATT UVLO Filtering Time

Maximum ON DUTY

I_COMPSINK

I_COMPSOURCE

V_UVLOBATTL

V_UVLOBATTHYS

t_UVLOBATTFIL

D_ONMAX

V_OVTH

-80

80

3.20

0.07

-

3.40

0.1

2

V

μs

%

-

48

-

Over Voltage Detection Threshold

1.60

1.65

1.70

V

Under Voltage Detection

Threshold

V_UVTH

1.23

1.30

1.37

V

Over Current Detection Threshold

Protection Holding Time

V_OCTH

0.17

20

0.20

40

0.23

60

V

t_DCDCRLS

ms

Logic

Logic High Level Input Voltage

Logic Low Level Input Voltage

Logic Pull-Down Resistance

Minimum Input Pulse Width

ENA Input Filtering Time

MODE Low Level Input Voltage

MODE High Level Input Voltage

V_INH

V_INL

2.0

-

5.5

0.8

V

INA, INB, ENA

INA, INB

0

R_IND

25

50

-

100

kΩ

ns

µs

V

t_INFIL

-

90

t_ENAFIL

V_MODEL

V_MODEH

-

0

0.5

-

0.8

ENA

0.3xV_CC2

V_CC2

Relative to GND2

0.7xV_CC2

-

V

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Electrical Characteristics – continued

(Unless otherwise specified Ta=-40°C to +125°C, V_BATT=4V to 32V, V_CC2=UVLO to 20V, V_EE2=-12V to 0V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Output

I_OUT1H=-40mA

I_OUT1L=40mA

OUT1H ON-resistance (Source)

OUT1L ON-resistance (Sink)

R_ONH

R_ONL

0.50

0.25

0.85

0.45

1.45

0.80

Ω

V_CC2=15V

Guaranteed by design

I_PROOUT=40mA

3.0

4.5

-

OUT1 Maximum Current

PROOUT ON-resistance

I_OUT1MAX

A

0.45

40

0.85

80

1.55

120

R_ONPRO

t_PONA

t_PONB

t_POFFA

t_POFFB

t_PDISTA

t_PDISTB

t_RISE

Ω

ns

Ω

INA=PWM, INB=L

Turn ON Time

40

80

INA=H, INB=PWM

INA=PWM, INB=L

INA=H, INB=PWM

t_POFFA– t_PONA

35

-25

-

75

115

+15

-

Turn OFF Time

-5

Propagation Distortion

-5

t_POFFB– t_PONB

Rise Time

50

10nF between OUT1-VEE2

Guaranteed by design

I_OUT2=40mA

Fall Time

t_FALL

-

50

-

0.25

0.45

0.80

OUT2 ON-resistance

R_ON2

OUT2 ON Threshold Voltage

Common Mode Transient Immunity

Protection Functions

Output-side UVLO ON

Threshold Voltage (UVLOIN)

Output-side UVLO Threshold

Hysteresis (UVLOIN)

V_OUT2ON

CM

1.8

2

-

2.2

-

V

Relative to V_EE2

100

kV/μs Guaranteed by design

MODE=L

V_UVLOINL

0.85

0.90

0.95

V

0.10×

V_UVLOINL

10.9

0.8

0.11×

V_UVLOINL

11.5

0.12×

V_UVLOINL

12.1

V_UVLOINHYS

MODE=H

Output-side UVLO ON Voltage

Output-side UVLO Hysteresis

Output-side UVLO Filtering Time

DESAT Leading Edge

V_UVLO2L

V_UVLO2HYS

t_UVLO2FIL

V

1.2

1.6

6

12

22

µs

t_DESATleb

0.14

0.20

0.26

µs

Guaranteed by design

Relative to GND2

Blanking Time

Short Current Detection Voltage

Short Current Detection Filtering Time

Short Current Detection

V_SCDET

t_SCPFIL

V

0.47

0.12

0.50

0.2

0.53

0.28

µs

t_SCPPRO

V_SCPINL

t_PROFLT

0.26

-

0.38

0.1

0.50

0.22

0.7

µs

V

Delay Time (PROOUT)

SCPIN Pin Low Voltage

Output Delay Difference

between PROOUT and FLT

Thermal Detection Voltage

Thermal Detection Filtering Time

Soft Turn Off Release Time

FLT Output Low Voltage

Gate State H Detection

Threshold Voltage

I_SCPIN=1mA

0.1

0.4

µs

V_TSDET

t_TSFIL

t_STO

1.62

4

1.72

10

1.82

30

V

µs

V

Relative to GND2

30

-

110

0.40

V_FLTL

0.18

I_FLT=5mA

V_OSFBH

V_OSFBL

4.5

4.0

5.0

4.5

5.5

5.0

V

Relative to GND2

Gate State L Detection

Threshold Voltage

Relative to GND2

I_RDY=5mA

OSFB Output Filtering Time

RDY Output Low Voltage

t_OSFBFIL

V_RDYL

4.0

-

6.2

8.4

µs

V

0.18

0.40

50%

90%

t_PON

INA

t_POFF

90%

50%

10%

OUT1H/L

10%

t_FALL

t_RISE

Figure 18. INA to OUT1H/L Timing Chart

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BM60054AFV-C

UL1577 Ratings Table

Following values are described in UL Report.

Parameter

Side 1 (Input Side) Circuit Current

Side 2 (Output Side) Circuit Current

Side 1 (Input Side) Consumption Power

Side 2 (Output Side) Consumption Power

Isolation Voltage

Value

1.3

Unit

mA

Conditions

V_BATT=12V, OUT1H/L=L

1.6

V_CC2=16V, V_EE2=-8V, OUT1H/L=L

V_BATT=12V, OUT1H/L=L

15.6

38.4

2500

125

150

5.5

mW

Vrms

°C

V_CC2=16V, V_EE2=-8V, OUT1H/L=L

Maximum Operating (Ambient) Temperature

Maximum Junction Temperature

Maximum Storage Temperature

Maximum Data Transmission Rate

°C

MHz

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Typical Performance Curves

2.2

2

2.2

2

+25°C

+125°C

1.8

1.6

1.4

1.2

1

1.8

1.6

1.4

1.2

1

+125°C

+25°C

-40°C

0.8

0.6

0.4

0.8

10

12

14

16

18

20

4

11

18

25

32

Output-side Positive SupplyVoltage : V_CC2[V]

Main Power SupplyVoltage : V_BATT[V]

Figure 20. Output-side Circuit Current vs

Output-side Positive Supply Voltage

(MODE=H, V_EE2=0V, OUT1=L)

Figure 19. Main Power Supply Circuit Current

vs Main Power Supply Voltage

12

2.2

2

Source

9

6

3

0

1.8

1.6

1.4

1.2

1

+125°C

+25°C

0.8

0.6

0.4

Sink

-40°C

10

15

20

-40

0

40

80

120

Output-side Positive SupplyVoltage : V_CC2[V]

Temperature : Ta [°C]

Figure 21. Output-side Circuit Current vs

Output-side Positive Supply Voltage

(MODE=H, V_EE2=0V, OUT1=H)

Figure 22. FET_G ON-resistance vs

Temperature (Source /Sink)

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Typical Performance Curves – continued

50

40

30

20

10

0

480

430

380

330

280

230

180

130

80

20

40

60

80 100 120 140

-40

0

40

80

120

RT Resistance : R_RT[kΩ]

Temperature : Ta [°C]

Figure 24. Soft-start Time vs

Temperature

Figure 23. Oscillation Frequency vs

RT Resistance

1.53

1.52

1.51

1.5

-40

-60

-80

-100

-120

-140

-160

1.49

1.48

1.47

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 25. FB Pin Threshold Voltage vs

Temperature

Figure 26. COMP Pin Sink Current vs

Temperature

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BM60054AFV-C

Typical Performance Curves – continued

160

0.23

0.21

0.19

0.17

140

120

100

80

60

40

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 27. COMP Pin Source Current vs Temperature

Figure 28. Over Current Detection Threshold vs Temperature

90

60

30

0

90

60

30

0

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 29. Logic Input Filtering Time vs

Temperature (L pulse)

Figure 30. Logic Input Filtering Time vs

Temperature (H pulse)

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Typical Performance Curves – continued

0.8

9

8.8

8.6

8.4

8.2

8

V_MODEH

0.6

0.4

0.2

0

7.8

7.6

7.4

7.2

7

V_MODEL

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 31. ENA Input Filtering Time Figure vs

Temperature

Figure 32. MODE Input Voltage vs Temperature

(V_CC2=14V)

0.8

0.75

0.7

1.4

1.3

1.2

1.1

1

0.65

0.6

0.55

0.5

0.9

0.8

0.7

0.6

0.5

0.45

0.4

0.35

0.3

0.25

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 33. OUT1H ON-resistance (Source) vs

Temperature (I_OUT1H=-40mA)

Figure 34. OUT1L ON-resistance (Sink) vs

Temperature (I_OUT1L=40mA)

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BM60054AFV-C

Typical Performance Curves – continued

120

100

80

1.45

1.25

1.05

0.85

0.65

0.45

t_PONB

t_PONA

60

40

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 35. PROOUT ON-resistance vs

Temperature (I_PROOUT=40mA)

Figure 36. Turn ON time vs Temperature

0.8

0.6

0.4

0.2

115

95

t_POFFB

75

t_POFFA

55

35

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 37. Turn OFF time vs Temperature

Figure 38. OUT2 ON-resistance vs

Temperature (I_OUT2=40mA)

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Typical Performance Curves – continued

0.53

0.52

0.51

0.5

0.26

0.24

0.22

0.2

0.49

0.48

0.47

0.18

0.16

0.14

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 40. DESAT Leading Edge

Blanking Time vs Temperature

Figure 39. Short Current Detection Voltage vs

Temperature

0.5

0.44

0.38

0.32

0.26

0.28

0.24

0.2

0.16

0.12

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 41. Short Current Detection

Filter Time vs Temperature

Figure 42. Short Current Detection Delay

Time (PROOUT) vs Temperature

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Typical Performance Curves – continued

0.7

0.5

0.3

0.1

0.2

0.15

0.1

0.05

0

-40

0

40

80

120

-40

0

40

80

120

Temperature : Ta [°C]

Figure 44. Output Delay Difference

between PROOUT and FLT vs

Temperature

Figure 43. SCPIN Pin Low Voltage vs

Temperature

1.82

1.77

1.72

1.67

1.62

-40

0

40

80

120

Temperature : Ta [°C]

Figure 45. Thermal Detection Voltage vs

Temperature

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Recommended

ROHM

MCR100JZH

LTR50UZP

Selection of Components Externally Connected

Recommended

ROHM

MCR03EZP

Recommended

ROHM

MCR03EZP

Recommended

SUMIDA

CEER117

Recommended

ROHM

Recommended

ROHM

Recommended

ROHM

Recommended

ROHM

MCR100JZH

LTR50UZP

RB168M150DD

LTR18EZP

RSR025N05

Figure 46. Recommended External Parts

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I/O Equivalence Circuits

Pin Name

Pin No.

Input Output Equivalent Circuit Diagram

Pin Function

VCC2

PROOUT

2

PROOUT

Soft turn-off pin/Gate voltage input pin

VEE2

VCC2

VTSIN

3

VTSIN

GND2

Temperature sensor voltage input pin

VCC2

SCPIN

Short circuit current detection pin

MODE

4

SCPIN

GND2

VCC2

MODE

7

Mode selection pin of output-side UVLO

GND2

VEE2

VCC2

UVLOIN

8

Output-side UVLO setting input pin

GND2

VEE2

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I/O Equivalence Circuits – continued

Pin Name

Pin No.

Input Output Equivalent Circuit Diagram

Pin Function

VCC2

OUT1H

11

Source side output pin

OUT1H

OUT1L

12

VEE2

VCC2

OUT2

Sink side output pin

OUT2

13

Output pin for Miller Clamp

VEE2

FLT

RDY

16

Fault output pin

RDY

20

GND1

Ready output pin

VREG

ENA

17

Input enabling signal input pin

GND1

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I/O Equivalence Circuits – continued

Name

Pin No.

Input Output Equivalent Circuit Diagram

Function

VREG

INA

18

Control input pin A

GND1

VREG

INB

19

Control input pin B

GND1

V_BATT

RT

21

RT

Switching frequency setting pin for

switching controller

GND1

Internal power

supply

V_BATT

FB

22

FB

Error amplifier inverting input pin for

switching controller

GND1

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I/O Equivalence Circuits – continued

Name

Pin No.

Input Output Equivalent Circuit Diagram

Function

Internal power

V_BATT

supply

COMP

GND1

23

Error amplifier output pin for switching

controller

VREG

V_BATT

VREG

Internal power

supply

25

26

Input-side internal power supply pin

FET_G

MOS FET control pin for switching

controller

GND1

Internal power

supply

V_BATT

SENSE

27

SENSE

GND1

Current detection pin for switching

controller

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital

and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.

Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the

capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground

caused by large currents. Also ensure that the ground traces of external components do not cause variations on the

ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions.

The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of

connections.

7. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the

IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be

turned off completely before connecting or removing it from the test setup during the inspection process. To prevent

damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

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Operational Notes – continued

9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin

shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional

solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply

or ground line.

11. Regarding the Input Pin of the IC

This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N

junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or

transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 47. Example of IC structure

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature

and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the

Area of Safe Operation (ASO).

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BM60054AFV-C

Ordering Information

A

F

V

B M 6

0

5

4

-

C E 2

Package

FV:

Rank

C:Automotive

Part Number

SSOP-B28W

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

SSOP-B28W (TOP VIEW)

Part Number Marking

LOT Number

B M6 0 05 4A

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

SSOP-B28W

(Max 9.55 (include.BURR))

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Revision History

Date

Revision

001

Changes

26.Feb.2018

New Release

P1 Features : add UL1577 Recognized

P17 Absolute Maximum Ratings : delete condition Ta=25°C

P19 Change spec of Output-side Circuit Current 5

P20 Change spec of Thermal Detection Voltage

P21 Adding UL1577 Rating Table

19.Mar.2018

23.Apr.2018

13.Sep.2019

002

003

004

P28 Update Figure 45

P18 Misprint correction of Thermal Resistance

P6 Miller Clamp Function add comment, Figure 4. change Timing chart

P10 Figure 10. change Timing chart

P15 I/O Condition Table change No.8

P30 I/O Equivalence Circuits change PROOUT,VTSIN

P31 I/O Equivalence Circuits change OUT2,ENA

P32 I/O Equivalence Circuits change RT

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BM60054AFV-C
厂家：	ROHM
描述：	这是一款内置隔离元件的栅极驱动器，绝缘电压为2500Vrms，输入输出延迟时间为120ns，最小输入脉冲宽度为90ns。内置故障信号输出功能、Ready信号输出功能、低电压故障防止功能（UVLO）、热保护功能、DESAT保护功能、米勒钳位功能、开关控制器和门极状态监控功能。此产品不在网络代理商出售。请联系我们的销售人员进行咨询。开关栅极驱动控制器监控脉冲驱动器
文件：	总41页 (文件大小：1942K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM60054AFV-C [ROHM]

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