BV1HB045EFJ-C_技术文档

Datasheet

Automotive IPD Series

Built-in current sensing function

1ch High Side Switch

BV1HB045EFJ-C

General Description

Key Specifications

The BV1HB045EFJ-C is a 1ch high-side switch for

automotive application. It has a built-in overcurrent limit

function, thermal shutdown protection function, open

load detection function, low power output-OFF function.

It has a current sensing function of output load current.

◼

Power Supply Operating Range

ON-Resistance (Tj = 25 °C)

Overcurrent Limit

Standby Current (Tj = 25 °C)

Active Clamp Tolerance (Tj = 25 °C)

6 V to 28 V

45 mΩ (Typ)

21.0 A (Min)

0.5 µA (Max)

130 mJ

◼

Features

◼

Built-in current sensing function

Package

W (Typ) x D (Typ) x H (Max)

4.9 mm x 6.0 mm x 1.0 mm

Built-in Dual TSD ^{(Note 1)}

HTSOP-J8

AEC-Q100 Qualified ^{(Note 2)}

Built-in Overcurrent Protection Function (OCP)

Built-in thermal shutdown protection function (TSD)

Built-in open load detection function

Built-in Low-Voltage Output-OFF Function (UVLO)

Built-in diagnostic output

Low On-Resistance Single Nch MOSFET Switch

Monolithic power management IC with control unit

(CMOS) and power MOSFET mounted on a single

chip

(Note 1) Two type of built-in temperature protection:

Junction temperature, and ΔTj protection that detects sudden temperature rise

of the Power-MOS

(Note 2) Grade 1

Application

◼

Resistance load, inductance and capacitance load

Typical Application Circuit

VBB

C_VBB

IN

SEN

R_IN

OUT

R_SEN

MCU

BV1HB045EFJ-C

SENSE

RSENSE2

R_L

C_L

CSENSE

RSENSE1

GND

Figure 1. Application Circuit

○Product structure: Silicon integrated circuit ○This product has no designed protection against radioactive rays

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Contents

General Description......................................................................................................................................................................1

Features.........................................................................................................................................................................................1

Application ....................................................................................................................................................................................1

Key Specifications........................................................................................................................................................................1

Package .........................................................................................................................................................................................1

Typical Application Circuit...........................................................................................................................................................1

Contents ........................................................................................................................................................................................2

Pin Configuration..........................................................................................................................................................................3

Pin Description .............................................................................................................................................................................3

Block Diagram...............................................................................................................................................................................3

Definition .......................................................................................................................................................................................4

Absolute Maximum Ratings.........................................................................................................................................................5

Recommended Operating Conditions.........................................................................................................................................5

Thermal Resistance......................................................................................................................................................................6

Electrical Characteristics...........................................................................................................................................................10

Typical Performance Curves......................................................................................................................................................12

Measurement Circuit ..................................................................................................................................................................18

Timing Chart................................................................................................................................................................................20

Function Description..................................................................................................................................................................21

Application Circuit Diagram.......................................................................................................................................................28

I/O Equivalence Circuits.............................................................................................................................................................29

Operational Notes.......................................................................................................................................................................30

Ordering Information..................................................................................................................................................................32

Marking Diagram.........................................................................................................................................................................32

Physical Dimension and Packing Information .........................................................................................................................33

Revision History .........................................................................................................................................................................34

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Pin Configuration

(TOP VIEW)

1

8

GND

IN

OUT

7

6

5

2

3

4

OUT

SEN

SENSE

OUT

EXP-PAD = VBB

Figure 2. Pin Configuration

Pin Description

Pin No.

1

Pin Name

Function

GND

IN

Ground pin

Input pin. Pull-down resistor is connected internally.

Active High to turn on the switch.

Current Sense and Diagnostic Function Enable Terminal.

Current Sense output terminal.

Switch output pin

2

3

SEN

SENSE

OUT

4

5

6

OUT

Switch output pin

7

8

OUT

Switch output pin

OUT

Switch output pin

EXP-PAD

VBB

Power input pin, switch input pin

Block Diagram

VBB

lnternal

supply

UVLO

Clamp

Charge

pump

IN

Gate Driver

Over current

detction

Control

Logic

Power

limitation

SEN

thermal

shut down

Open load

detection

SENSE

MUX

Current Sense

OUT

GND

Figure 3. Block Diagram

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Definition

IBB

VBB

VDS VBB

IOUT

OUT

IIN

IN

VOUT

ISENSE

ISEN

SEN

SENSE

VSENSE

GND

IGND

Figure 4. Voltage and Current Definition

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Absolute Maximum Ratings (Ta = 25 °C )

Parameter

Symbol

Rating

Unit

VBB - OUT Voltage

V_DS

V_BB

-0.3 to Internal clamp^{(Note 1)}

-0.3 to +40

V

Power Supply Voltage

Input Voltage

V_IN, V_SEN

V_SENSE

I_OUT

-0.3 to +7.0

Internal limit^{(Note 2)}

20

V

Diagnostic Output Voltage

Output Current

V

A

Diagnostic Output Current

Junction Temperature Width

Storage Temperature Range

Maximum Junction Temperature

I_SENSE

Tj

mA

°C

-40 to +150

-55 to +150

+150

Tstg

Tjmax

Active Clamp Energy (Single Pulse)

Tj_(START)= 25 °C, I_OUT= 2A^{(Note 3)(Note 4)}

E_{AS (25 °C)}

E_{AS (150 °C)}

V_BBLIM

130

70

mJ

V

Active Clamp Energy (Single Pulse)

Tj_(START)= 150 °C, I_OUT= 2 A^{(Note 3)(Note 4)}

Supply Voltage

28

for Short Circuit Detection ^{(Note 5)}

(Note 1) Internally limited by output clamp voltage.

(Note 2) Internally limited by fixed over current limit.

(Note 3) Maximum active clamp energy using single pulse of I_OUT(START)= 2 A and V_BB= 14 V.

(Note 4) Not 100% tested.

(Note 5) Maximum power supply voltage that can detect short circuit protection.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open

circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the

IC is operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Caution 3: When IC turns off with an inductive load, reverse energy is generated. This energy can be calculated by the following equation:

1

푉_퐵퐵

ꢁ

퐸_퐿

=

× ꢀ × 퐼_{푂푈푇 푆푇퐴푅푇}× ꢂ1 −

ꢃ

(

)

2

푉_퐵퐵− 푉_퐷푆

Where:

L is the inductance of the inductive load.

I_OUT(START)is the output current at the time of turning off.

The BV1HB045EFJ-C integrates the active clamp function to internally absorb the reverse energy E_Lwhich is generated when the inductive load

is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy E_Lis active

clamp energy E_AS(refer to Figure 5. Active Clump Energy vs Output Current) or under when inductive load is used.

1000

Tj_(start)= 25 ºC

100

Tj_(start)= 150 ºC

10

0.5

5.0

2.0

1.0

Output Current: I_OUT[A]

Figure 5. Active Clamp Energy vs Output Current

Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

Power Supply Voltage Operating Range

Operating Temperature

V_BB

Topr

f_IN

6

-40

-

14

-

28

+150

1

V

°C

Input Frequency

-

kHz

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Thermal Resistance ^{(Note 1)}

Parameter

Symbol

Typ

Unit

Condition

HTSOP-J8

(Note 2)

130.3

36.8

25.9

20

°C/W

1s

2s

Between Junction and Surroundings Temperature

(Note 3)

(Note 4)

(Note 2)

(Note 3)

(Note 4)

θ_JA

Thermal Resistance

2s2p

1s

Between Junction and the top center

of the outside surface of the component package

Thermal Characterization Parameter ^{(Note 5)}

Ψ_JT

8

2s

6

2s2p

(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HB045EFJ-C.

(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)

(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)

(Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)

(Top copper foil: ROHM recommended Footprint + wiring to measure/

Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,

copper (top & reverse side) 2 oz)

(Note 4) JESD51-5/-7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)

(Top copper foil: ROHM recommended Footprint + wiring to measure/

2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,

copper (top & reverse side/inner layers) 2 oz/1 oz)

(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

◼

PCB Layout 1 layer (1s)

Footprint

100 mm²

600 mm²

1200 mm²

Figure 6. PCB Layout 1 Layer (1s)

Dimension

Value

Board Finish Thickness

Board Dimension

1.57 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top Layer)

Copper Foil Area Dimension

0.070 mm (Cu: 2 oz)

Footprint/100 mm²/600 mm²/1200 mm²

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Thermal Resistance – continued

■

PCB Layout 2 layers (2s)

Top Layer

Bottom Layer

Top Layer

Bottom Layer

Via

Isolation Clearance Diameter: ≥ 0.6 mm

Cross Section

Figure 7. PCB Layout 2 Layers (2s)

Dimension

Board Finish Thickness

Board Dimension

Value

1.60 mm ± 10 %

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top/Bottom Layers)

Thermal Vias Separation/Diameter

0.070 mm (Cu + Plating)

1.2 mm/0.3 mm

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Thermal Resistance – continued

■

PCB Layout 4 layers (2s2p)

TOP Layer

2nd/Bottom Layers

3rd Layer

Top Layer

2nd Layer

3rd Layer

Bottom Layer

Via

Isolation Clearance Diameter: ≥ 0.6 mm

Cross Section

Figure 8. PCB Layout 4 Layers (2s2p)

Dimension

Board Finish Thickness

Value

1.60 mm ± 10 %

Board Dimension

76.2 mm x 114.3 mm

FR4

Board Material

Copper Thickness (Top/Bottom Layers)

Copper Thickness (Inner Layers)

Thermal Vias Separation/Diameter

0.070 mm (Cu + Plating)

0.035 mm

1.2 mm/0.3 mm

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Thermal Resistance – continued

■ Transient Thermal Resistance (Single Pulse)

Figure 9. Transient Thermal Resistance

■

Thermal Resistance (θ_JAvs Copper foil area- 1s)

Figure 10. Thermal Resistance

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Electrical Characteristics (Unless otherwise specified V_BB= 6 V to 28 V, Tj = -40 °C to +150 °C)

Limit

Parameter

Power Supply

Symbol

Unit

Condition

Min

Typ

Max

V_BB= 14 V, V_IN= V_SEN= 0 V,

V_OUT= 0 V, Tj = 25 °C

-

0.5

10

µA

I_BBL1

V_BB= 14 V, V_IN= V_SEN= 0 V,

V_OUT= 0 V, Tj = 150 °C

Standby current

V_BB= 14 V, V_IN= 0 V,

V_SEN= 5 V,V_OUT= 0 V, Tj = 25 °C

1.0

mA

I_BBL2

V_BB= 14 V, V_IN= 0 V,

V_SEN= 5 V,V_OUT= 0 V, Tj = 150 °C

1.2

3

mA

V_BB= 14 V, V_IN= V_SEN= 5 V,

V_OUT= open

Operating Current

I_BBH

-

5

V_IN= 5 V, R_L= 10 kΩ

R_L： Output Load Resistor

UVLO Detection Voltage

UVLO Hysteresis Voltage

V_UVLO

-

5

V

V_UVHYS

0.9

Input (V_IN)

High Level Input Voltage

Low Level Input Voltage

V_INH

V_INL

2.1

-

V

0.9

Input Hysteresis Voltage

High Level Input Current

Low Level Input Current

V_{IN_HYS}

I_INH

-

0.4

50

-

V

150

+10

µA

V_IN= 5 V

V_IN= 0 V

I_INL

-10

Input (V_SEN

)

H-level input voltage

L-level input voltage

Input hysteresis

V_SENH

V_SENL

2.1

-

V

-

0.9

-

V_{SEN_HYS}

I_SENH

0.4

50

-

V

H-level input current

L-level input current

Power MOS Output

-

150

+10

µA

V_SEN= 5 V

V_SEN= 0 V

I_SENL

-10

R_ON1

R_ON2

R_ON3

I_OUTL1

-

45

-

60

90

75

0.5

mΩ

μA

V_BB= 8 V ~ 28 V, Tj = 25 °C

V_BB= 8 V ~ 28 V, Tj = 150 °C

V_BB= 6 V, Tj = 25 °C

Output ON Resistance

-

V_IN= 0 V, V_OUT= 0 V, Tj = 25 °C

Output Leak Current

Output Slew Rate

I_OUTL2

SR_ON

SR_OFF

-

10

1.0

μA

V_IN= 0 V, V_OUT= 0 V, Tj = 150 °C

V_BB= 14 V, R_L= 6.5 Ω

0.3

V/µs

V_BB= 14 V, R_L= 6.5 Ω

Output voltage drop limitation

at small load currents

V_DS(SL)

-

10

25

mV

I_OUT= 50 mA

Propagation Delay when ON

Propagation Delay when OFF

Output Clamp Voltage

t_OUTON

t_OUTOFF

V_DSCLP

-

90

40

50

140

100

55

µs

V

V_BB= 14 V, R_L= 6.5 Ω

V_IN= 0 V, I_OUT= 10 mA

45

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Electrical Characteristics (Unless otherwise specified V_BB= 6V to 28V, T_j= -40°C to 150°C)

Limit

Parameter

Symbol

Unit

Condition

Min

Typ

Max

Current sensing unit

Current Sense Ratio 1

Current Sense Ratio 2

Current Sense Ratio 3

Current Sense Ratio 4

Current Sense Ratio 5

Current Sense Ratio 6

K_ILISderating

K₁

K₂

-50%

-30%

-20%

-10%

-7%

-5%

-

1500

1450

-

+50%

+30%

+20%

+10%

+7%

+5%

0.5

-

V_IN= V_SEN= 5 V, I_OUT= 50mA

V_IN= V_SEN= 5 V, I_OUT= 0.25 A

V_IN= V_SEN= 5 V, I_OUT= 0.5 A

V_IN= V_SEN= 5 V, I_OUT= 1 A

V_IN= V_SEN= 5 V, I_OUT= 2 A

V_IN= V_SEN= 5 V, I_OUT= 4 A

K₄vs K₅

K₃

-

K₄

K₅

-

K₆

-

ΔK_ILIS

I_SENSEL

%

SENSE terminal leakage current

-

µA V_SEN= 0 V, V_SENSE= 0 V

Output voltage of SENSE terminal in

abnormal condition

V_SENSEH

t_INON

4.0

5.5

130

40

10

-

6.5

300

100

50

V

V_BB= 8 V to 28 V, R_{SENSE =}1 kΩ

V_BB= 14 V, R_L= 6.5 Ω, Tj = 25 °C

R_SENSE= 1 kΩ, I_OUT= 1 A to 2 A

Diagnostic output delay time

when input (IN) is ON

-

µs

Diagnostic output delay time

when input (IN) is off

t_INOFF

Diagnostic output delay time

when input (SEN) is ON

t_SENON

Diagnostic output delay time

when input (SEN) is off

t_SENOFF

t_SENON(CL)

50

SENSE Settling Time after Load

Change

20

Protection Circuit

Overcurrent Limit Value

Open Load Detection Voltage

I_LIMH

V_OLD

I_OLD

21

30

40

A

V

V_DS= 5 V

V_BB-3.0

V_BB-2.0

V_BB-1.0

V_BB= 8 V to 28 V

Open Load Detection Source

Current

-

10

30

µA V_IN= 0 V, V_OUT= 5 V

Open Load Detection

Diagnostic Output Mask Time

t_OLD

100

250

400

µs

V_BB= 14 V, V_IN= 5 to 0 V

Thermal Shutdown ^{(Note 1)}

T_TSD

T_TSDHYS

T_DTJ

150

175

15

200

°C

K

Thermal Shutdown Hysteresis ^{(Note 1)}

-

∆Tj Protection Temperature ^{(Note 1)}

90

K

(Note 1) Not 100% tested.

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Typical Performance Curves

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

0.5

0.4

0.3

0.2

0.1

0

10

8

6

4

2

0

10

20

30

40

-50

0

50

100

150

Power Supply Voltage: V_BB[V]

Junction Temperature: T_J[ºC]

Figure 11. Standby Current vs Power Supply Voltage

Figure 12. Standby Current vs Junction Temperature

2.5

2

1.6

1.4

1.2

1

1.5

1

0.5

0

0.8

0.6

0

5

10 15 20 25 30 35 40

Power Supply Voltage: V_BB[V]

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 13. Standby Current vs Power Supply Voltage

Figure 14. Standby Current vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

6

5

4

3

2

1

0

6

5

4

3

2

1

0

5

10

15

20

25

30

35

40

-50

0

50

100

150

Power Supply Voltage: V_BB[V]

Junction Temperature: Tj [ºC]

Figure 15. Circuit Current vs Power Supply Voltage

Figure 16. Circuit Current vs Junction Temperature

6

5

4

3

2

1

0

2.2

V_INH, V_SENH

2

1.8

1.6

1.4

1.2

1

0.8

0.6

V_INL, V_SENL

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 17. UVLO Detection Voltage vs Junction Temperature

Figure 18. Input Voltage vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

100

90

80

70

60

50

40

30

20

10

0

90

80

70

60

50

40

30

20

10

0

5

10 15 20 25 30 35 40

Power Supply Voltage: V_BB[V]

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 20. Output ON Resistance vs Power Supply Voltage

Figure 19. Input Current vs Junction Temperature

90

80

70

60

50

40

30

20

10

0

10

8

6

4

2

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 22. Output Leak Current vs Junction Temperature

Figure 21. Output ON Resistance vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

1

0.8

0.6

160

140

120

100

80

t_OUTON

SR_OFF

0.4

60

t_OUTOFF

SR_ON

40

0.2

20

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 23. Output Slew Rate vs Junction Temperature

Figure 24. Output Propagation Delay Time

vs Junction Temperature

55

53

51

49

47

45

43

41

16

14

12

10

8

6

4

2

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 26. Output Clamp Voltage vs

Junction Temperature

Figure 25. Output Voltage Drop at Low Load

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

0.5

0.4

0.3

0.2

0.1

0

7

6

5

4

3

2

1

0

-50

0

50

100

150

0

10

20

30

40

Junction Temperature: Tj [ºC]

Power Supply Voltage: V_BB[V]

Figure 27. Diagnostic Output Leak Current

vs Junction Temperature

Figure 28. Diagnostic Output High Voltage

vs Power Supply Voltage

7

6.5

6

350

300

250

200

150

100

50

5.5

5

4.5

4

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 30. Open Load Detection Diagnostic Output Mask

Time vs Junction Temperature

Figure 29. Diagnostic Output High Voltage

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

20

16

12

8

200

160

t_INON

120

t_SENOFF

80

t_SENON

40

4

t_INOFF

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 31. IN - SENSE Propagation Delay Time

vs Junction Temperature

Figure 32. SEN - SENSE Propagation Delay Time

vs Junction Temperature

40

35

30

25

20

15

10

5

10

8

6

4

2

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature: Tj [ºC]

Figure 34. Over Current Limitation

vs Junction Temperature

Figure 33. SENSE Settling Time after Load Change

vs Junction Temperature

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Measurement Circuit

V_BB

VBB

IN

OUT

IN

OUT

V_IN

SEN

SENSE

SEN

SENSE

GND

V_SEN

Figure 35. Standby Current

Low-Level Input (V_IN) Current

Figure 36. Operating Current

Low-Level Input (V_SEN) Current

Output Leak Current

Diagnostic Output Leak Current

V_BB

VBB

IN

OUT

IN

OUT

1 kΩ

V_IN

SEN

SENSE

V_IN

SEN

SENSE

V_SEN

GND

Figure 37. UVLO Detection Voltage

UVLO Hysteresis Voltage

High Level Input Voltage

Low Level Input Voltage

Input Hysteresis Voltage

High Level Input Current

Thermal Shutdown

Figure 38. Output ON Resistance

Output Clamp Voltage

Thermal Shutdown Hysteresis

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Measurement Circuit - continued

V_BB

VBB

IN

VBB

IN

OUT

6.5 Ω

Monitor

V_IN

Monitor

SEN

SENSE

V_IN

SEN

SENSE

Monitor

V_SEN

GND

1 kΩ

1k Ω

Figure 39. Output ON Slew Rate

Output OFF Slew Rate

Figure 40. SENSE Settling Time

after Load Change

Output ON Propagation Delay Time

Output OFF Propagation Delay Time

Diagnostic Output ON Propagation Delay Time

Diagnostic Output OFF Propagation Delay Time

V_BB

VBB

IN

OUT

V_OUT

SEN

SENSE

V_SEN

１ｋΩ

GND

Figure 41. Open Load Detection Voltage

Open Load Detection Sink Current

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Timing Chart

VBB

V_INH

IN

V_INL

V_SENH

SEN

V_SENL

SR_ON

SR_OFF

80%

70%

OUT

30%

20%

t_OUTON

t_OUTOFF

SENSE

t_SENON

t_SENOFF

t_INON

t_INOFF

IOUT

t_SENON(CL)

Figure 42. Timing Chart

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Function Description

1. Protection Function

Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output

Mode

Conditions

IN

SEN

SENSE

OUT

Standby

-

Low

High

Low

High

Low

High

-

Low

I_SENSE= I_OUT/ K

V_SENSEH

Low

High

-

Operating

-

Detect V_OUT> V_BB- 2.0 V (Typ)

Release V_OUT< V_BB- 2.5 V (Typ)

Detect V_BB≤ 5.0 V (Max)

Release V_BB≥ 5.9 V (Max)

Detect Tj > 175 °C (Typ)

Release Tj < 150 °C (Typ)

Detect ΔTj > 90°C (Typ)

Release ΔTj < 30 °C (Typ)

Detect I_OUT＞ I_LIMH

Release I_OUT＞ I_LIMH

Open Load Detect

(OLD)

Hi-Z

-

Low Power

Output-OFF

(UVLO)

-

Low

High

Low

High

Low

High

-

High

V_SENSEH

Thermal

Shutdown (TSD)

I_SENSE= I_OUT/ K

V_SENSEH

I_SENSE= I_OUT/ K

V_SENSEH

ΔTj

Protection ^{(Note 2)}

Over Current

Protection (OCP)

I_SENSE= I_OUT/ K

(Note1) Thermal shutdown is automatically restored to normal operation.

(Note2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit.

This IC incorporates the above-mentioned protection-detection function, and outputs an abnormal condition at the SENSE

terminal.Connect a resistor between the SENSE-GND and determine the abnormal condition based on the voltage level.

It is self-rest and operation becomes normal when each protection releases after detecting.

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Function Description - continued

2. Current sensing function

2.1 SENSE current

VBB

Protect

SEN

IOUT

OUT

SENSE

MUX

I

SENSE

RSENSE

VSENSEH

Figure 43. Current Sense Block Diagram

The SENSE terminal of the IC can feed back the current flowing through the IC.

The SENSE voltage varies linearly according to the load current IOUT during normal operation.

The V_SENSEtheoretical equations are shown below.

푉

푆ꢄ푁푆ꢄ

= ꢅ_{푆ꢄ푁푆ꢄ}× 퐼_{푆ꢄ푁푆ꢄ}

퐼

ꢈꢉꢊ

ꢇ

퐼_{ꢆ퐸ꢇꢆ퐸}

＝

ꢅ_{푆ꢄ푁푆ꢄ}× 퐼_푂푈푇

1450 (푡푦푝)

푉

푆ꢄ푁푆ꢄ

＝

ꢇ

Where:

V_SENSE: SENSE terminal voltages

R_SENSE: SENSE resistor

I_OUT: Load current

N: Output mirror value

BV1HB045EFJ-C is recommended to use 1 kΩ as the pull-down resistor at SENSE pin.

When R_SENSEis 1 kΩ, and I_OUTis 2 A, the above formula is summarized as follows.

ꢋꢌꢌꢌ× ꢁ

푉

푆ꢄ푁푆ꢄ

＝

= 1.379 [푉]

ꢋꢍꢎꢌ

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Function Description - continued

2.2 Variation of Outputs Voltage of SENSE terminals

Diagnostic output current of I_SENSEincreases linearly with I_OUToutput current. Figure 44 shows the the variation of current

sense ratio. The accuracy of the sense current depends on temperature and load current. To achieve high accuracy

requirement, a calibration on the application is possible. To avoid multiple calibration points at different load and

temperature conditions, BV1HB045EFJ-C allows limited derating of the kILIS value, at a given point (I_O= 1 A, Tj = 25 °C).

An external RC filter between SENSE pin and microcontroller ADC input pin is recommended to reduce signal ripple

and oscillations.

2300

Typical Sense Ratio

min/max Sense Ratio

2100

1900

1700

1500

1300

1100

900

700

0

0.5

1

1.5

2

2.5

3

3.5

4

Output Load Current: I_OUT[A]

Figure 44. Current Sense Ratio vs Output Load Current

2.3 Outputs of SENSE terminals

VBB

Is(FAULT)

Is(Current Sense)

SEN

FAULT

SENSE

Figure 45. SENSE output-block diagram

The SENSE terminal serves as both the current sense output and the flag signal when an error is detected.

When SEN = High, a current approximately 1/1450 of the output current is output to the SENSE terminal.

When overcurrent detection, overheat detection, or load open detection are activated,

The FAULT signals of the Figure 45 output the V_SENSEHvoltage generated internally from the SENSE terminal.

When monitoring the V_SENSEH, operate within the recommended operating conditions.

Refer to Table 1 for more information on SENSE outputs.

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Function Description - continued

3. Overcurrent Protection

This IC has a built-in overcurrent protection function. When overcurrent flows in the output, the output current is

limited to 30A (Typ) and self-diagnostic output (SENSE) becomes V_SENSEH

.

4. Thermal Shutdown

4.1 Thermal Shutdown Protection

This IC has a built-in thermal shutdown protection function. When the IC chip temperature exceeds175 °C (Typ),

the output is turned OFF and self-diagnostic output (SENSE) becomes V_SENSEH. When the temperature goes

below 150 °C (Typ), output will self-reset and operation becomes normal.

4.2 ΔTj Protection

This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (T_DTJ

)

between the POWER-MOS unit (T_POWER-MOS) and the control unit (T_AMB) in the IC is 90 °C (Typ) or more. ΔTj

protection also has a built-in hysteresis (T_DTJHYS) that returns the output to normal state when the temperature

difference becomes 30 °C (Typ) or less.

Figure 46 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND

fault.

IN

I_LIMH

IOUT

TTSD

T_TSDHYS

T_POWER-MOS

T_AMB

⊿Tj

T_DTJHYS

ΔTj Protection Operation

TSD Operation

VSENSEH

SENSE

Figure 46. Thermal Shutdown Protection Timing Chart

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Function Description - continued

5. Open Load Detection

VBB

SOLD

ROLD

IN

VOLD

Internal

supply

SEN

OUT

SW1

RL

logic

SENSE

OUT

R₁

R

PD

RSENSE

Figure 47. Open Load Detection Block Diagram

Open load can be detected by connecting an external resistance R_OLDbetween power supply VBB and OUT.

When output load is disconnected during IN is low, diagnostic output of the SENSE pin is turned to high to indicate

abnormality. To reduce the standby current of the system, an open load resistance switch S_OLDis recommended.

When the SW1 is OFF, voltage of the OUT does not fall to GND level. Because, when the IN pin is low, the

voltage of the OUT pin does not become under or equal to the Output ON Detection Voltage. To pull down the

OUT pin, insert the pulled down resistance R_PDis recommended. The resistance R_PDis 4.3 kΩ or less for outflow

current from the OUT.

5.1 When the OUT is pulled down by the load (Normal function)

The value of external resistance R_OLDis decided based on used minimum power supply voltage (V_BB), internal

resistance R₁and open detection voltage V_OLD.External resistance R_PDis unnecessary.

The equation for calculating the R_OLDvalue is shown below.

ꢏ

× 푅

ꢑ(푀푖푛)

ꢐꢐ

ꢅ_푂퐿퐷

<

− ꢅ_{ꢋ(ꢕꢖꢗ)}[Ω]

ꢏ

ꢒꢓꢔ(Max)

The above formula is summarized as follows.

ꢏ

ꢐꢐ

ꢅ_푂퐿퐷

<

× 300 × 10^ꢙ− 300 × 10^ꢙ[Ω]

ꢏ

ꢘ ꢋ.ꢌ

ꢐꢐ

R_OLDvalue is fell below the above calculated result.

5.2 If the SW is OFF, the output is no longer pulled down by the load

The value of external resistance R_OLDis decided based on used minimum power supply voltage (V_BB), external

resistance R_PDand open detection voltage V_OLD

.

The equation for calculating the R_OLDvalue is shown below.

푅

× 푅

+ 푅

ꢏ

ꢑ(푀ꢚꢛ)

푃ꢔ

ꢐꢐ

ꢅ_푂퐿퐷< ꢂ_ꢏ

− 1ꢃ ×

)

[Ω]

(

푃ꢔ

ꢒꢓꢔ Max

When R_PDis 4.3 kΩ, the above formula is summarized as follows.

ꢏ

ꢐꢐ

ꢅ_푂퐿퐷< ꢜ_{ꢏ ꢘ ꢋ.ꢌ}− 1ꢝ × 4.24 × 10^ꢙ[Ω]

ꢐꢐ

R_OLDvalue is fell below the above calculated result

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Function Description - continued

5.3 SENSE output mask time at output falling

This IC diagnoses open load detection after the mask tine (t_OLD: 250 µs) inside the IC, when the IN voltage falls

from High to Low,

Normal state

Open Load state

IN

SEN

VOLD

OUT

V_SENSEH

SENSE

t_OLD: 250 µs (typ)

Figure 48. SENSE Output-Mask Timing Chart

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Function Description - continued

6. Other Detection

6.1 GND open protection

VBB

Clamp

IN

Internal

supply

SEN

Control

logic

OUT

SENSE

GND

Figure 49. GND Open Detection Block Diagram

When GND of the IC is open, the output is switched OFF regardless of the input voltage.

However, self-diagnostic output (SENSE) is not flagged. When an inductive load is connected,

the active clamp operates when the GND pin is open

6.2 MCU I/O Protection

VBB

Internal

supply

Clamp

IN

SEN

Control

logic

OUT

MCU

SENSE

GND

Figure 50. MCU I/O Protection

Negative surge voltage to the input, battery loss, and GND negative voltage may cause damage to the MCU I/O pin.

To prevent these problems, a limiting resistor can be inserted between the input terminal and the MCU.

4.7 kΩ to 10 kΩ is recommended as the insert resistor.

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Application Circuit Diagram

VBB

CVBB

IN

SEN

R_IN

ROLD

OUT

R_SEN

MCU

BV1HB045EFJ-C

SENSE

RSENSE2

R_L

C_L

C_SENSE

R_SENSE1

GND

D1

RGND

Figure 51. Application Circuit Diagram

Symbol

R_IN

Value

Purpose

4.7 kΩ

1 kΩ

Limit resistance for negative surge

R_SEN

R_SENSE1

R_SENSE2

C_SENSE

R_GND

D_GND

C_VBB

Insert the pull-dpwn resistor for using diagnostic function

For Noise suppression filter

10 kΩ

100 pF

For Noise suppression filter

100 Ω, 1 kΩ

Current limit resistance for reverse battery connection

Protection Diode of BV1HB045EFJ-C for reverse battery connection

For battery line voltage spike filter

-

10 µF

2 kΩ

1000 pF

-

R_OLD

C_L

Resistor for open load detection

Filter for radiation noise from outside

Output Load Resistor

R_L

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I/O Equivalence Circuits

IN, SEN

SENSE

VBB

10 kΩ

IN

SEN

SENSE

100 kΩ

OUT

VBB

OUT

10 kΩ

500 kΩ

Resistance values shown in the diagrams above are typical values

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So, unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

10. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

11. Thermal Shutdown Function (TSD)

This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should

always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued

period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins.

When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under

no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC

from heat damage.

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Operational Notes – continued

12. Over Current Protection Function

This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This

protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC

should not be used in applications characterized by continuous operation or transitioning of the protection function.

13. Active Clamp Operation

The IC integrates the active clamp function to internally absorb the reverse energy E_Lwhich is generated when the

inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a

load so that the reverse energy E_Lis active clamp energy (refer to Figure 5. Active Clamp Energy vs Output Current)

or under when inductive load is used.

14. Open Power Supply Pin

When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of

input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same

potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ).

15. Open GND Pin

When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an

inductive load is connected, the active clamp operates when the GND pin is open.

16. OUT Pin Voltage

Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition.

Otherwise malfunction or other problems can occur.

17. Same Pin Connection

Connect all VBB pins, GND pins, OUT pins to same line respectively.

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Ordering Information

B V 1 H B 0 4 5 E F J

-

CE 2

V1: 1ch

H: High side switch

Package

EFJ: HTSOP-J8

Product Rank

C: Automotive product

Packaging and Forming Specification

E2: Embossed tape and reel

Marking Diagram

HTSOP-J8 (TOP VIEW)

Part Number Marking

LOT Number

1

H B 0 4 5

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

HTSOP-J8

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Revision History

Date

Revision

Changes

03.Mar.2022

001

002

New Release

P.5 Absolute Maximum Ratings

Figure 5 - Change the graph of E_AS

P.6 Thermal Resistance

Figure 6 - Change the size of PCB layout.

P.10 Electrical Characteristics

.

09.Feb.2023

Change the condition of I_SENHand I_SENL

.

P.28 Application Circuit Diagram

Change the recommended value of R_GND

.

P.31 Operational Notes

14. Open Power Supply Pin

Change the value of output clamp voltage.

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BV1HB045EFJ-C
厂家：	ROHM
描述：	BV1HB045EFJ-C是一款车载用单通道高边开关。内置输出异常模式接地故障检测功能（过电流限制功能）、过热保护功能、负载开路检测功能、低电压时输出OFF功能，还具有检测到异常时的诊断信息输出功能。另外，还配有针对输出电流的电流检测功能。开关
文件：	总37页 (文件大小：1745K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BV1HB045EFJ-C [ROHM]

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