BTA16B [STMICROELECTRONICS]

STANDARD TRIACS; 标准双向可控硅
BTA16B
型号: BTA16B
厂家: ST    ST
描述:

STANDARD TRIACS
标准双向可控硅

可控硅 三端双向交流开关
文件: 总5页 (文件大小:70K)
中文:  中文翻译
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BTA16 B  
BTB16 B  
STANDARD TRIACS  
FEATURES  
.
HIGH SURGE CURRENT CAPABILITY  
COMMUTATION : (dV/dt)c > 10V/µs  
BTA Family :  
.
.
INSULATINGVOLTAGE = 2500V  
(UL RECOGNIZED : E81734)  
(RMS)  
DESCRIPTION  
A1  
A2  
The BTA/BTB16 B triac family are high perform-  
ance glass passivated PNPN devices.  
G
These parts are suitables for general purpose ap-  
plications where high surge current capability is re-  
quired. Application such as phase control and  
static switching on inductive or resistive load.  
TO220AB  
(Plastic)  
ABSOLUTE RATINGS (limiting values)  
Symbol  
Parameter  
Value  
Unit  
I
RMS on-state current  
(360° conduction angle)  
BTA  
BTB  
Tc = 80 °C  
Tc = 90 °C  
tp = 8.3 ms  
tp = 10 ms  
tp = 10 ms  
16  
A
T(RMS)  
I
Non repetitive surge peak on-state current  
( Tj initial = 25°C )  
170  
160  
128  
10  
A
TSM  
2
I t  
2
2
A s  
I t value  
dI/dt  
Critical rate of rise of on-state current  
Repetitive  
F = 50 Hz  
A/µs  
Gate supply : I = 500mA di /dt = 1A/µs  
G
G
Non  
50  
Repetitive  
Tstg  
Tj  
Storage and operating junction temperature range  
- 40 to + 150  
- 40 to + 125  
°C  
°C  
Tl  
Maximum lead temperature for soldering during 10 s at 4.5 mm  
from case  
260  
°C  
Symbol  
Parameter  
BTA / BTB16-... B  
Unit  
400  
600  
700  
800  
V
V
Repetitive peak off-state voltage  
Tj = 125 °C  
400  
600  
700  
800  
V
DRM  
RRM  
1/5  
March 1995  
BTA16 B / BTB16 B  
THERMAL RESISTANCES  
Symbol  
Parameter  
Value  
60  
Unit  
°C/W  
°C/W  
Rth (j-a)  
Junction to ambient  
Rth (j-c) DC Junction to case for DC  
BTA  
BTB  
BTA  
BTB  
2.9  
2.3  
Rth (j-c) AC Junction to case for 360° conduction angle  
2.2  
°C/W  
( F= 50 Hz)  
1.75  
GATE CHARACTERISTICS (maximum values)  
P
= 1W  
P
GM  
= 10W (tp = 20 µs)  
I
= 4A (tp = 20 µs)  
V = 16V (tp = 20 µs).  
GM  
G (AV)  
GM  
ELECTRICAL CHARACTERISTICS  
Symbol  
Test Conditions  
Quadrant  
Suffix  
B
Unit  
I
V =12V (DC) R =33Ω  
Tj=25°C  
I-II-III  
IV  
MAX  
MAX  
MAX  
MIN  
50  
mA  
GT  
D
L
100  
1.5  
0.2  
2
V
V =12V (DC) R =33Ω  
Tj=25°C  
Tj=125°C  
Tj=25°C  
I-II-III-IV  
I-II-III-IV  
I-II-III-IV  
V
V
GT  
D
L
V
V =V  
R =3.3kΩ  
L
GD  
D
DRM  
DRM  
tgt  
V =V  
I
G
= 500mA  
TYP  
µs  
D
dI /dt = 3A/µs  
G
I
I
=1.2 I  
G GT  
Tj=25°C  
I-III-IV  
II  
TYP  
40  
70  
mA  
L
I
*
I = 500mA gate open  
Tj=25°C  
Tj=25°C  
Tj=25°C  
Tj=125°C  
Tj=125°C  
MAX  
MAX  
MAX  
MAX  
MIN  
50  
mA  
V
H
T
V
*
I
= 22.5A tp= 380µs  
TM  
1.6  
0.01  
2
TM  
I
I
V
V
Rated  
Rated  
mA  
DRM  
RRM  
DRM  
RRM  
dV/dt *  
Linear slope up to V =67%V  
D
gate open  
250  
V/µs  
V/µs  
DRM  
(dV/dt)c * (dI/dt)c = 7A/ms  
Tj=125°C  
MIN  
10  
* For either polarity of electrode A voltage with reference to electrode A .  
2
1
2/5  
BTA16 B / BTB16 B  
Fig.1 : Maximum RMS power dissipation versus RMS  
on-state current (F=50Hz).  
(Curves are cut off by (dI/dt)c limitation)  
Fig.2  
:
Correlation between maximum RMS power  
dissipation and maximum allowable temperatures (T  
and T  
contact (BTA).  
amb  
) for different thermal resistances heatsink +  
case  
Fig.3  
:
Correlation between maximum RMS power  
amb  
) for different thermal resistances heatsink +  
Fig.4 : RMS on-state current versus case temperature.  
dissipation and maximum allowable temperatures (T  
and T  
case  
contact (BTB).  
Fig.5 : Relative variation of thermal impedance versus  
Fig.6 : Relative variation of gate trigger current and  
pulse duration.  
holding current versus junction temperature.  
Zth/Rth  
1
Zth(j-c)  
0.1  
Zth(j-a)  
tp(s)  
1E+2 5E+2  
0.01  
1E-3  
1E-2  
1E-1  
1E+0  
1E+1  
3/5  
BTA16 B / BTB16 B  
Fig.7 : Non Repetitive surge peak on-state current  
versus number of cycles.  
Fig.8 : Non repetitive surge peak on-state current for a  
sinusoidal pulse with width 10ms, and  
corresponding value of I t.  
:
t
2
Fig.9 : On-state characteristics (maximum values).  
4/5  
BTA16 B / BTB16 B  
PACKAGE MECHANICAL DATA  
TO220AB Plastic  
REF.  
DIMENSIONS  
Millimeters  
Inches  
Min.  
Min.  
10.20  
14.23  
12.70  
5.85  
Max.  
10.50  
15.87  
14.70  
6.85  
4.50  
3.00  
4.82  
4.00  
1.39  
0.65  
2.70  
5.58  
1.20  
0.96  
Max.  
0.413  
0.625  
0.579  
0.270  
0.178  
0.119  
0.190  
0.158  
0.055  
0.026  
0.107  
0.22  
H
A
J
G
A
B
C
D
F
0.401  
0.560  
0.500  
0.230  
I
D
B
C
G
H
I
2.54  
4.48  
3.55  
1.15  
0.35  
2.10  
4.58  
0.80  
0.64  
0.100  
0.176  
0.140  
0.045  
0.013  
0.082  
0.18  
F
O
L
J
P
L
M
N
O
P
M
N
=
=
0.031  
0.025  
0.048  
0.038  
Cooling method : C  
Marking : type number  
Weight : 2.3 g  
Recommended torque value : 0.8 m.N.  
Maximum torque value : 1 m.N.  
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability  
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may  
result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.  
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all  
information previously supplied.  
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems  
without express written approval of SGS-THOMSON Microelectronics.  
1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.  
SGS-THOMSON Microelectronics GROUP OF COMPANIES  
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Nether-  
lands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.  
5/5  

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