STD7N52DK3TRL [STMICROELECTRONICS]

6.2A, 620V, 1.15ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252, ROHS COMPLIANT, DPAK-3;
STD7N52DK3TRL
型号: STD7N52DK3TRL
厂家: ST    ST
描述:

6.2A, 620V, 1.15ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252, ROHS COMPLIANT, DPAK-3

晶体 晶体管 功率场效应晶体管 开关 脉冲
文件: 总16页 (文件大小:930K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STD7N52DK3  
STF7N52DK3, STP7N52DK3  
N-channel 525 V, 0.95 Ω, 6 A, DPAK, TO-220FP, TO-220  
SuperFREDmesh3™ Power MOSFET  
Features  
RDS(on)  
max.  
Order codes VDSS  
ID  
Pw  
3
1
STD7N52DK3  
6 A  
90 W  
25 W  
90 W  
DPAK  
STF7N52DK3 525 V < 1.15 Ω 6 A (1)  
STP7N52DK3  
6 A  
1. Limited by package  
100% avalanche tested  
3
3
2
Extremely high dv/dt capability  
Gate charge minimized  
1
2
TO-2201  
TO-220FP  
Very low intrinsic capacitance  
Improved diode reverse recovery  
characteristics  
Figure 1.  
Internal schematic diagram  
Zener-protected  
D(2)  
Application  
Switching applications  
G(1)  
Description  
These devices are N-channel  
SuperFREDmesh3™, a new Power MOSFET  
technology that is obtained via improvements  
applied to STMicroelectronics’ SuperMESH3™  
technology. The resulting product has an  
extremely low on resistance, superior dynamic  
performance, high avalanche capability and a fast  
body-drain recovery diode, making it especially  
suitable for the most demanding applications.  
S(3)  
AM01476v1  
Table 1.  
Device summary  
Order codes  
Marking  
Package  
Packaging  
STD7N52DK3  
STF7N52DK3  
STP7N52DK3  
7N52DK3  
7N52DK3  
7N52DK3  
DPAK  
TO-220FP  
TO-220  
Tape and reel  
Tube  
Tube  
October 2010  
Doc ID 16387 Rev 2  
1/16  
www.st.com  
16  
Contents  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Contents  
1
2
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
4
5
6
Test circuits  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2/16  
Doc ID 16387 Rev 2  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Electrical ratings  
1
Electrical ratings  
Table 2.  
Symbol  
Absolute maximum ratings  
Value  
DPAK  
Parameter  
Unit  
TO-220  
TO-220FP  
VDS  
VGS  
ID  
Drain-source voltage (VGS = 0)  
Gate- source voltage  
525  
30  
V
V
Drain current (continuous) at TC = 25 °C  
Drain current (continuous) at TC = 100 °C  
Drain current (pulsed)  
6
4
6 (1)  
4 (1)  
24 (1)  
25  
A
A
ID  
(2)  
IDM  
24  
90  
A
PTOT  
IAR  
Total dissipation at TC = 25 °C  
W
Avalanche current, repetitive or not-  
repetitive (pulse width limited by Tj max)  
3
A
mJ  
V
Single pulse avalanche energy  
EAS  
100  
2500  
(starting Tj = 25°C, ID = IAR, VDD = 50 V)  
Gate source ESD(HBM-C = 100 pF,  
VESD(G-S)  
R = 1.5 kΩ)  
dv/dt (3) Peak diode recovery voltage slope  
20  
V/ns  
A/µs  
di/dt  
Diode reverse recovery current slope  
400  
Insulation withstand voltage (RMS) from  
all three leads to external heat sink  
VISO  
2500  
V
(t = 1 s; TC = 25 °C)  
Tstg  
Tj  
Storage temperature  
-55 to 150  
150  
°C  
°C  
Max. operating junction temperature  
1. Limited by package  
2. Pulse width limited by safe operating area  
3.  
I
6 A, peak V < V  
DS (BR)DSS.  
SD  
Table 3.  
Symbol  
Thermal data  
Parameter  
Value  
DPAK  
Unit  
TO-220  
1.39  
TO-220FP  
Rthj-case Thermal resistance junction-case max  
5
°C/W  
°C/W  
°C/W  
(1)  
Rthj-pcb  
Thermal resistance junction-pcb max  
50  
Rthj-amb Thermal resistance junction-ambient max  
62.5  
300  
62.5  
300  
Maximum lead temperature for soldering  
purpose  
Tl  
°C  
1. When mounted on 1inch² FR-4 board, 2 oz Cu  
Doc ID 16387 Rev 2  
3/16  
Electrical characteristics  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
2
Electrical characteristics  
(TC = 25 °C unless otherwise specified)  
Table 4.  
Symbol  
On /off states  
Parameter  
Test conditions  
ID = 1 mA, VGS = 0  
DS = Max rating  
Min.  
Typ.  
Max. Unit  
Drain-source  
breakdown voltage  
V(BR)DSS  
525  
V
Zero gate voltage  
V
1
µA  
µA  
IDSS  
drain current (VGS = 0) VDS = Max rating, TC=125 °C  
50  
Gate-body leakage  
IGSS  
VGS  
=
20 V  
10  
µA  
V
current (VDS = 0)  
VGS(th)  
RDS(on)  
Gate threshold voltage VDS = VGS, ID = 50 µA  
Static drain-source on  
3
3.75  
0.95  
4.5  
VGS = 10 V, ID = 3 A  
1.15  
Ω
resistance  
Table 5.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
Input capacitance  
Output capacitance  
Ciss  
Coss  
Crss  
870  
70  
pF  
V
V
DS = 50 V, f = 1 MHz,  
GS = 0  
-
-
-
pF  
pF  
Reverse transfer  
capacitance  
13  
Equivalent  
capacitance time  
related  
(1)  
Co(tr)  
-
53  
pF  
VDS = 0 to 525 V, VGS = 0  
f = 1 MHz open drain  
Equivalent  
capacitance energy  
related  
(2)  
Co(er)  
-
-
74  
-
-
pF  
Intrinsic gate  
resistance  
RG  
3.5  
Ω
Qg  
Qgs  
Qgd  
Total gate charge  
Gate-source charge  
Gate-drain charge  
VDD = 420 V, ID = 6 A,  
VGS = 10 V  
33  
5
nC  
nC  
nC  
-
-
(see Figure 20)  
19  
1.  
2.  
C
time related is defined as a constant equivalent capacitance giving the same charging time as C  
oss eq. oss  
when V increases from 0 to 80% V  
DS  
DSS  
C
C
energy related is defined as a constant equivalent capacitance giving the same stored energy as  
oss eq.  
oss  
when V increases from 0 to 80% V  
DSS  
DS  
4/16  
Doc ID 16387 Rev 2  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Electrical characteristics  
Min. Typ. Max Unit  
Table 6.  
Symbol  
Switching times  
Parameter  
Test conditions  
td(on)  
tr  
td(off)  
tf  
Turn-on delay time  
Rise time  
12  
12  
37  
19  
ns  
ns  
ns  
ns  
VDD = 260 V, ID = 3 A,  
RG = 4.7 Ω, VGS = 10 V  
-
-
Turn-off-delay time  
Fall time  
(see Figure 19)  
Table 7.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
ISD  
Source-drain current  
6
A
A
-
-
(1)  
ISDM  
Source-drain current (pulsed)  
24  
(2)  
VSD  
Forward on voltage  
ISD = 6 A, VGS = 0  
1.5  
V
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
110  
440  
8
ns  
nC  
A
I
SD = 6 A, di/dt = 100 A/µs  
Qrr  
-
-
V
DD = 60 V (see Figure 24)  
IRRM  
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
ISD = 6 A, di/dt = 100 A/µs  
DD = 60 V, Tj = 150 °C  
(see Figure 24)  
140  
680  
10  
ns  
nC  
A
Qrr  
V
IRRM  
1. Pulse width limited by safe operating area  
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%  
Table 8.  
Symbol  
Gate-source Zener diode  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
30  
Gate-source breakdown  
voltage  
BVGSO  
Igs= 1 mA (open drain)  
-
V
The built-in back-to-back Zener diodes have specifically been designed to enhance not only  
the device’s ESD capability, but also to make them safely absorb possible voltage transients  
that may occasionally be applied from gate to source. In this respect the Zener voltage is  
appropriate to achieve an efficient and cost-effective intervention to protect the device’s  
integrity. These integrated Zener diodes thus avoid the usage of external components.  
Doc ID 16387 Rev 2  
5/16  
Electrical characteristics  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
2.1  
Electrical characteristics (curves)  
Figure 2.  
Safe operating area for DPAK  
Figure 3.  
Thermal impedance for DPAK  
Thermal impedance for TO-220FP  
Thermal impedance for TO-220  
AM07185v1  
I
D
(A)  
10µs  
10  
100µs  
1
1ms  
10ms  
Tj=150°C  
Tc=25°C  
Single pulse  
0.1  
10  
VDS(V)  
0.1  
1
100  
Figure 4.  
Safe operating area for TO-220FP  
Figure 5.  
AM07186v1  
I
D
(A)  
10  
10µs  
100µs  
1
1ms  
10ms  
0.1  
Tj=150°C  
Tc=25°C  
Single pulse  
0.01  
10  
VDS(V)  
0.1  
1
100  
Figure 6.  
Safe operating area for TO-220  
Figure 7.  
AM07187v1  
I
D
(A)  
10  
10µs  
100µs  
1ms  
1
10ms  
Tj=150°C  
Tc=25°C  
Single pulse  
0.1  
10  
VDS(V)  
0.1  
1
100  
6/16  
Doc ID 16387 Rev 2  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Electrical characteristics  
Figure 8.  
Output characteristics  
Figure 9.  
Transfer characteristics  
AM07188v1  
AM07189v1  
I
D
(A)  
I
D
(A)  
14  
12  
10  
V
DS=20V  
14  
12  
10  
VGS=10V  
7V  
8
6
4
8
6
4
6V  
2
0
2
0
5V  
25  
5
1
20  
V
DS(V)  
4
5
7
8
9
VGS(V)  
0
10  
15  
0
2
3
6
Figure 10. Gate charge vs gate-source voltage Figure 11. Static drain-source on resistance  
AM07190v1  
AM07191v1  
V
(V)  
GS  
450  
400  
350  
300  
R
DS(on) (Ω)  
VGS  
1.06  
V
GS=10V  
V
DD=420V  
=6A  
12  
ID  
VDS  
1.04  
1.02  
1.00  
0.98  
0.96  
0.94  
0.92  
10  
8
250  
200  
6
150  
100  
50  
4
2
0
0.90  
0
0.88  
5
6
0
2
3
4
1
10  
30  
Qg  
(nC)  
ID(A)  
0
20  
Figure 12. Capacitance variations  
Figure 13. Output capacitance stored energy  
AM07192v1  
AM07193v1  
C
(pF)  
Eoss  
(µJ)  
4.0  
3.5  
3.0  
1000  
Ciss  
2.5  
2.0  
1.5  
1.0  
100  
10  
1
Coss  
Crss  
0.5  
0
0
0.1  
100  
200  
400  
500  
1
10  
V
DS(V)  
100  
300  
VDS(V)  
Doc ID 16387 Rev 2  
7/16  
Electrical characteristics  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Figure 14. Normalized gate threshold voltage Figure 15. Normalized on resistance vs  
vs temperature temperature  
AM07194v1  
AM07195v1  
V
GS(th)  
R
DS(on)  
(norm)  
(norm)  
1.10  
1.00  
0.90  
2.5  
2.0  
1.5  
1.0  
0.80  
0.5  
0.0  
0.70  
-75  
-75  
-25  
25  
75  
T
J(°C)  
-25  
25  
75  
TJ(°C)  
125  
125  
Figure 16. Source-drain diode forward  
characteristics  
Figure 17. Normalized BVDSS vs temperature  
AM07198v1  
AM07196v1  
V
SD  
BVDSS  
(V)  
(norm)  
1.0  
TJ=-50°C  
1.10  
0.9  
1.05  
1.00  
0.8  
TJ=25°C  
0.7  
0.6  
TJ=150°C  
0.95  
0.90  
0.5  
0.4  
0
-75  
10  
20  
30  
40  
50 ISD(A)  
-25  
25  
75  
TJ(°C)  
125  
Figure 18. Maximum avalanche energy vs  
starting Tj  
AM07197v1  
E
AS  
(mJ)  
ID=3 A  
V
DD=50 V  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
120  
140 T  
20  
40  
60  
80 100  
J(°C)  
8/16  
Doc ID 16387 Rev 2  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Test circuits  
3
Test circuits  
Figure 19. Switching times test circuit for  
resistive load  
Figure 20. Gate charge test circuit  
VDD  
12V  
47kΩ  
1kΩ  
100nF  
2200  
3.3  
μF  
RL  
μF  
IG=CONST  
VDD  
100Ω  
Vi=20V=VGMAX  
D.U.T.  
VG  
VD  
RG  
VGS  
2200  
μF  
D.U.T.  
2.7kΩ  
47kΩ  
PW  
1kΩ  
PW  
AM01468v1  
AM01469v1  
Figure 21. Test circuit for inductive load  
switching and diode recovery times  
Figure 22. Unclamped inductive load test  
circuit  
L
A
A
A
B
D
FAST  
DIODE  
L=100μH  
VD  
G
2200  
μF  
D.U.T.  
B
3.3  
μF  
VDD  
S
3.3  
μF  
1000  
μF  
B
VDD  
25  
Ω
ID  
D
G
RG  
S
Vi  
D.U.T.  
Pw  
AM01470v1  
AM01471v1  
Figure 23. Unclamped inductive waveform  
Figure 24. Switching time waveform  
ton  
tdon  
toff  
tdoff  
V(BR)DSS  
tr  
tf  
VD  
90%  
10%  
90%  
IDM  
10%  
VDS  
ID  
0
0
VDD  
VDD  
90%  
VGS  
10%  
AM01472v1  
AM01473v1  
Doc ID 16387 Rev 2  
9/16  
Package mechanical data  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®  
specifications, grade definitions and product status are available at: www.st.com. ECOPACK  
is an ST trademark.  
10/16  
Doc ID 16387 Rev 2  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Package mechanical data  
Table 9.  
Dim.  
TO-220FP mechanical data  
mm  
Min.  
Typ.  
Max.  
A
B
4.4  
2.5  
4.6  
2.7  
D
2.5  
2.75  
0.7  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
1
F1  
F2  
G
1.70  
1.70  
5.2  
G1  
H
2.7  
10  
10.4  
L2  
L3  
L4  
L5  
L6  
L7  
Dia  
16  
28.6  
9.8  
2.9  
15.9  
9
30.6  
10.6  
3.6  
16.4  
9.3  
3
3.2  
Figure 25. TO-220FP drawing  
L7  
E
A
B
D
Dia  
L5  
L6  
F2  
F1  
F
G
H
G1  
L4  
L2  
L3  
7012510_Rev_K  
Doc ID 16387 Rev 2  
11/16  
Package mechanical data  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
TO-220 type A mechanical data  
mm  
Typ  
Dim  
Min  
Max  
A
b
4.40  
0.61  
1.14  
0.48  
15.25  
4.60  
0.88  
1.70  
0.70  
15.75  
b1  
c
D
D1  
E
1.27  
10  
10.40  
2.70  
5.15  
1.32  
6.60  
2.72  
14  
e
2.40  
4.95  
1.23  
6.20  
2.40  
13  
e1  
F
H1  
J1  
L
L1  
L20  
L30  
P  
Q
3.50  
3.93  
16.40  
28.90  
3.75  
3.85  
2.95  
2.65  
0015988_Rev_S  
12/16  
Doc ID 16387 Rev 2  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Package mechanical data  
TO-252 (DPAK) mechanical data  
mm.  
typ  
DIM.  
min.  
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
max.  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
A
A1  
A2  
b
b4  
c
c2  
D
D1  
E
5.10  
6.40  
6.60  
E1  
e
4.70  
2.28  
e1  
H
4.40  
9.35  
1
4.60  
10.10  
L
L1  
L2  
L4  
R
2.80  
0.80  
0.60  
0 o  
1
0.20  
8 o  
V2  
0068772_G  
Doc ID 16387 Rev 2  
13/16  
Package mechanical data  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
5
Package mechanical data  
DPAK FOOTPRINT  
All dimensions are in millimeters  
TAPE AND REEL SHIPMENT  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
16.4  
50  
0.059  
13.2 0.504 0.520  
0.795  
18.4 0.645 0.724  
1.968  
22.4  
0.881  
BASE QTY  
BULK QTY  
2500  
TAPE MECHANICAL DATA  
2500  
mm  
MIN. MAX. MIN. MAX.  
6.8 0.267 0.275  
10.4 10.6 0.409 0.417  
12.1 0.476  
inch  
DIM.  
A0  
B0  
B1  
D
7
1.5  
1.5  
1.6 0.059 0.063  
0.059  
D1  
E
1.65 1.85 0.065 0.073  
7.4 7.6 0.291 0.299  
2.55 2.75 0.100 0.108  
F
K0  
P0  
P1  
P2  
R
3.9  
7.9  
1.9  
40  
4.1 0.153 0.161  
8.1 0.311 0.319  
2.1 0.075 0.082  
1.574  
W
15.7  
16.3 0.618 0.641  
14/16  
Doc ID 16387 Rev 2  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Revision history  
6
Revision history  
Table 10. Document revision history  
Date  
Revision  
Changes  
09-Oct-2009  
20-Oct-2010  
1
2
First release  
Document status promoted from preliminary data to datasheet  
Doc ID 16387 Rev 2  
15/16  
STD7N52DK3, STF7N52DK3, STP7N52DK3  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
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