STPS1L20M [STMICROELECTRONICS]

LOW DROP POWER SCHOTTKY RECTIFIER; 电力低压降肖特基整流器
STPS1L20M
型号: STPS1L20M
厂家: ST    ST
描述:

LOW DROP POWER SCHOTTKY RECTIFIER
电力低压降肖特基整流器

文件: 总6页 (文件大小:64K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STPS1L20M  
®
LOW DROP POWER SCHOTTKY RECTIFIER  
Table 1: Main Product Characteristics  
IF(AV)  
VRRM  
1 A  
20 V  
A
Tj (max)  
VF(max)  
150°C  
0.37 V  
C
FEATURES AND BENEFITS  
STmite  
(DO216-AA)  
Very small conduction losses  
Negligible switching losses  
Extremely fast switching  
Low forward voltage drop for higher efficiency  
and extented battery life  
Low thermal resistance  
Avalanche capability specified  
Table 2: Order Code  
Part Number  
Marking  
STPS1L20M  
1L2  
DESCRIPTION  
Single Schottky rectifier suited for switch mode  
power supplies and high frequency DC to DC  
converters.  
Packaged in STmite, this device is intended for  
use in low voltage, high frequency inverters, free  
wheeling and polarity protection applications. Due  
to the small size of the package this device fits  
battery powered equipment (cellular, notebook,  
PDA’s, printers) as well chargers and PCMCIA  
cards.  
Table 3: Absolute Ratings (limiting values)  
Symbol  
VRRM  
Parameter  
Repetitive peak reverse voltage  
Value  
Unit  
V
20  
IF(RMS)  
IF(AV)  
IFSM  
PARM  
Tstg  
RMS forward voltage  
2
1
A
Tc = 140°C δ = 0.5  
10 ms sinusoidal  
Average forward current  
A
Surge non repetitive forward current  
Repetitive peak avalanche power  
Storage temperature range  
50  
A
tp = 1µs Tj = 25°C  
1400  
-65 to + 150  
150  
W
°C  
°C  
V/µs  
Tj  
Maximum operating junction temperature *  
Critical rate of rise of reverse voltage (rated VR, Tj = 25°C)  
dV/dt  
10000  
dPtot  
dTj  
1
* : --------------- > ------------------------- thermal runaway condition for a diode on its own heatsink  
Rth(j a)  
September 2004  
REV. 3  
1/6  
STPS1L20M  
Table 4: Thermal Resistance  
Symbol  
Parameter  
Value  
20  
Unit  
°C/W  
°C/W  
Rth(j-c)  
Rth(j-l)  
*
Junction to case  
*
Junction to ambient  
250  
* Mounted with minimum recommended pad size, PC board FR4.  
Table 5: Static Electrical Characteristics  
Symbol  
Parameter  
Tests conditions  
Min.  
Typ  
0.015 0.075  
0.9 4.5  
0.005 0.035  
0.45 2.5  
0.003 0.025  
Max.  
Unit  
Tj = 25°C  
VR = VRRM  
VR = 10V  
Tj = 85°C  
Tj = 25°C  
Tj = 85°C  
Tj = 25°C  
Tj = 85°C  
Tj = 25°C  
Tj = 85°C  
Tj = 25°C  
Tj = 85°C  
IR *  
Reverse leakage current  
mA  
VR = 5V  
0.3  
1.6  
0.38  
0.32  
0.46  
0.42  
0.43  
0.37  
0.53  
0.49  
IF = 1A  
IF = 3A  
VF *  
Forward voltage drop  
V
Pulse test:  
* tp = 380 µs, δ < 2%  
2
To evaluate the conduction losses use the following equation: P = 0.34 x I  
+ 0.07 I  
F(AV)  
F (RMS)  
Figure 1: Conduction losses versus average  
current  
Figure 2: Average forward current versus  
ambient temperature (δ = 0.5)  
P
(W)  
F(AV)  
I
(A)  
F(AV)  
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Rth(j-a)=Rth(j-c)  
δ = 0.2  
δ = 0.5  
δ = 0.1  
δ = 0.05  
δ = 1  
Rth(j-a)=270°C/W  
T
I
(A)  
T
(°C)  
amb  
F(AV)  
tp  
=tp/T  
δ
0
25  
50  
75  
100  
125  
150  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5 0.6  
0.7  
0.8  
0.9  
1.0  
1.1  
1.2  
2/6  
STPS1L20M  
Figure 3: Normalized avalanche power  
derating versus pulse duration  
Figure 4: Normalized avalanche power  
derating versus junction temperature  
P
(t )  
p
(1µs)  
ARM  
P
ARM  
(t )  
p
(25°C)  
ARM  
P
ARM  
P
1
1.2  
1
0.1  
0.8  
0.6  
0.4  
0.2  
0.01  
T (°C)  
j
t (µs)  
p
0.001  
0
25  
50  
75  
100  
125  
150  
0.01  
0.1  
1
10  
100  
1000  
Figure 5: Non repetitive surge peak forward  
current versus overload duration (maximum  
values)  
Figure 6: Relative variation of thermal  
impedance junction to ambient versus pulse  
duration  
I (A)  
M
Z
/R  
th(j-c) th(j-c)  
25  
20  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
15  
δ = 0.5  
TC=25°C  
TC=75°C  
10  
δ = 0.2  
T
TC=125°C  
5
IM  
δ = 0.1  
Single pulse  
t
t(s)  
δ=0.5  
t (s)  
p
tp  
1.E-01  
=tp/T  
δ
0
1.E-04  
1.E-03  
1.E-02  
1.E-03  
1.E-02  
1.E-01  
1.E+00  
Figure 7: Reverse leakage current versus  
reverse voltage applied (typical values)  
Figure 8: Reverse leakage current versus  
junction temperature (typical values)  
I (mA)  
R
I (mA)  
R
1.E+02  
1.E+01  
1.E+00  
1.E-01  
1.E-02  
1.E-03  
1.E+02  
1.E+01  
1.E+00  
1.E-01  
1.E-02  
1.E-03  
Tj=150°C  
Tj=125°C  
VR=20V  
Tj=100°C  
Tj=75°C  
Tj=50°C  
Tj=25°C  
V (V)  
R
T (°C)  
j
0
2
4
6
8
10  
12  
14  
16  
18  
20  
0
25  
50  
75  
100  
125  
150  
3/6  
STPS1L20M  
Figure 9: Junction capacitance versus reverse  
voltage applied (typical values)  
Figure 10: Forward voltage drop versus  
forward current  
I (A)  
FM  
C(pF)  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1000  
F=1MHz  
VOSC=30mVRMS  
Tj=25°C  
Tj=85°C  
(maximum values)  
Tj=85°C  
(typical values)  
100  
Tj=25°C  
(maximum values)  
V (V)  
FM  
V (V)  
R
10  
1
10  
100  
0.00  
0.05  
0.10  
0.15  
0.20  
0.25  
0.30  
0.35  
0.40  
0.45  
0.50  
Figure 11: Thermal resistance junction to  
ambient versus copper surface under tab  
(epoxy printed board FR4, Cu = 35µm, typical  
values)  
R
(°C/W)  
th(j-a)  
250  
200  
150  
100  
50  
S(mm²)  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
4/6  
STPS1L20M  
Inches  
Figure 12: STmite Package Mechanical Data  
DIMENSIONS  
Millimeters  
REF.  
Min. Typ. Max. Min. Typ. Max.  
L3  
D
A
0.85 1.00 1.15 0.033 0.039 0.045  
A1 -0.05  
0.05 -0.002  
0.65 0.016  
1.00 0.027  
0.25 0.004  
0.002  
0.025  
0.039  
0.010  
b2  
b
b
b2  
c
0.40  
0.70  
0.10  
H
D
1.75 1.90 2.05 0.069 0.007 0.081  
1.75 1.90 2.05 0.069 0.007 0.081  
3.60 3.75 3.90 0.142 0.148 0.154  
0.50 0.63 0.80 0.020 0.025 0.031  
1.20 1.35 1.50 0.047 0.053 0.059  
L2  
E
L
R
E
H
C
A
L
A1  
0° to 6°  
L2  
L3  
R1  
0.50  
ref  
0.019  
ref  
R
0.07  
0.07  
0.003  
0.003  
R1  
Figure 13: Foot Print Dimensions (in millimeters)  
1.82  
1.38  
0.75  
2.03 1.10  
0.50  
0.71  
Table 6: Ordering Information  
Ordering type  
STPS1L20M  
Marking  
Package  
STmite  
Weight  
15.5 mg  
Base qty  
12000  
Delivery mode  
Tape & reel  
1L2  
Table 7: Revision History  
Date  
Revision  
Description of Changes  
Jul-2003  
2A  
Last update.  
STmite package dimensions reference A1 change: from  
blank (min) to -0.05mm and from 0.10 (max) to 0.05mm.  
13-Sep-2004  
3
5/6  
STPS1L20M  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics.  
All other names are the property of their respective owners  
© 2004 STMicroelectronics - All rights reserved  
STMicroelectronics group of companies  
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
www.st.com  
6/6  

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