MASW-001150-13160P [TE]
SURMOUNT PIN Diode Switch Element with Thermal Terminal; 众志成城的PIN二极管开关元件与热端子
| 型号： | MASW-001150-13160P |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | SURMOUNT PIN Diode Switch Element with Thermal Terminal |
| 文件： | 总9页 (文件大小：213K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
Features
V3
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Specified Bandwidth: 30MHz—2.5GHz
Useable to 3.0GHz
Low Loss <0.5dB
High isolation >40dB
High C.W. Incident Power, 50W at 500MHz
Unique Thermal Terminal for Series Diode
Surface Mount Device (No Wire Bonds)
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Protective Polymer Scratch Protection
RoHS Compliant
Description
This device is a PIN diode series-shunt switch
element with a unique integrated thermal terminal for
dissipating heat in the series diode created by the
DC and RF input power. The thermal terminal allows
for optimum heat dissipation by providing a direct
thermal path from the series diode to circuit thermal
ground while also being electrically isolated. The chip
is designed to provide a heat transfer conduit that
does not interfere with the PIN diode anode (input)
and cathode (output) electrical terminals, especially
with respect to RF performance. The silicon-glass
PIN diode chip is fabricated using M/A-COM
Technology Solutions patented HMIC™ process.
This device features silicon pedestals embedded in a
low loss, low dispersion glass. Selective backside
metallization is applied producing a surface mount
device. The topside is fully encapsulated with silicon
nitride and has an additional polymer layer to protect
against damage during handling and assembly.
Ordering Information 2
Part Number
Package
MASW-001150-13160W
MASW-001150-13160P
WAFFLE PACK
POCKET TAPE
2. Reference Application Note M513 for reel size information.
Absolute Maximum Ratings
Parameter
Absolute Maximum
Applications
Forward Current
100mA
- 180V
This PIN diode series-shunt switch element is
particularly advantageous in higher average power,
50W switch applications from 30MHZ – 3000GHz. In
addition, the backside RF, D.C., and thermal I/O
ports allow for direct solder re-flow attachments to
the micro-strip circuit for surface mount assembly. Of
particular interest, is the thermal terminal which
provides the power dissipating series diode a direct
connection to the circuit thermal ground for
unprecedented heat transfer. This thermal terminal is
electrically isolated from the other I/O ports. The chip
can be configured as either a reflective or an
absorptive switch.
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated RF & DC Power
RF C.W. Incident Power
Mounting Temperature
-55°C to +125°C
-55°C to +150°C
+175°C
500MHz, 4W
500MHz, 50W
+260°C for 30 seconds
Class 1A — HBM
Class M3 — MM
ESD
ESD
ESD
Class C3 — CDM
1
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
Electrical Specifications @ TAMB = +25°C
Symbol
Parameter
Conditions
Units
Typical
Maximum
CT Series
CT Series
CT Shunt
CT Shunt
RS Series
RS Series
Total Capacitance
Total Capacitance
Total Capacitance
Total Capacitance
Series Resistance
Series Resistance
-25V ,30MHz
pF
pF
pF
pF
Ω
0.52
0.37
0.54
0.39
1.13
1.25
—
—
—
—
—
—
-25V, 1800MHz
-25V, 30MHz
-25V, 1800MHz
20mA, 30MHz
20mA,1800MHz
Ω
RS Series
Series Resistance
50mA, 30MHz
0.93
—
Ω
RS Series
RS Shunt
RS Shunt
Series Resistance
Series Resistance
Series Resistance
50mA,1800MHz
10mA, 30MHz
1.07
1.00
0.99
—
—
—
Ω
Ω
Ω
V
10mA, 1800MHz
Forward Voltage
Forward Voltage
20mA
50mA
0.82
0.88
—
0.85
0.90
-10.0
—
V
V
F
V
µA
F
Reverse Leakage Current
Thermal Resistance Series
Minority Carrier Lifetime
-180V
I
R
Steady State
°C/W
µs
36.0
8.5
R
qJL
1
L
—
T
I
/I
-
F 10mA R 6mA
1. Measured from 50% of control voltage to 90% of output voltage
Parameter Units Port 1 Port 2
Conditions
Minimum Typical
Maximum
- 50mA
- 50mA
- 50mA
- 50mA
-25V
-25V
-25V
-25V
30MHz
—
—
—
36
0.07
0.30
0.60
39
0.10
0.45
0.80
—
Insertion Loss
Return Loss
dB
dB
1000MHZ
2500MHz
30MHz
- 50mA
- 50mA
+ 50mA
-25V
-25V
+25V
1000MHZ
2500MHz
30MHz
18
11
60
20
13
63
—
—
—
+ 50mA
+ 50mA
+25V
+25V
1000MHZ
2500MHz
40
29
42
33
—
—
Isolation
Input IP3
dB
-50mA / -25V
F1 = 500MHz
F2 = 505MHz
PIN = +40dBm(each
tone)
—
dBm
- 50mA
-25V
-66
—
50mA / -25V
500MHz /+35dBm
2
nd Harmonic
dBc
dBc
- 50mA
- 50mA
-25V
-25V
—
—
-46
-60
—
—
50mA / -25V
500MHz /+35dBm
3rd Harmonic
2
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
Typical RF Small Signal Performance
MASW-001150-13160
Insertion Loss, Isolation, Return Loss From 45-3000 MHz
Isolation_+5mA
Return loss_-50 mA
Insertion Loss_-50mA
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
0
-10
-20
-30
-40
-50
-60
-70
-80
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
3
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
Note:
The bias circuits provided in the schematic above assumes current sources are available. If only voltage
sources are available, a resistor will need to be added to the RF Input (J1) Bias Return Network. When using a
D.C. voltage of 25V, a 500Ω resistor must be used to draw 50mA of current into the switch.
4
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
Note:
The bias circuits provided in the schematic above assumes current sources are available. If only voltage
sources are available, a resistor will need to be added to the RF Input (J1) Bias Return Network. When using a
D.C. voltage of 25V, a 500Ω resistor must be used to draw 50mA of current into the switch.
5
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
RF , DC, and Thermal Circuit Footprint ( Topview )
22 +0/-2 mil
(4) PL
RF Output
Trace
Direction
RF Input
Trace
Direction
22 +0/-2 mil
(4) PL
RF Input
RF Output
20 ±1 mil
(4) PL
Thermal
Terminal
Shunt
Cathode
Return
Thermal
Circuit Vias
D.C Ground
or RF Trace
Direction
6
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
Chip Outline and Port Designations
Top View
Dimension
Inches
Millimeters
min.
max.
min.
max.
1.71
1.71
A
B
C
D
E
F
0.0665
0.0665
0.0045
0.0195
0.0195
0.0195
0.0195
0.0673
0.0673
0.0053
0.0205
0.0205
0.0205
0.0205
1.69
1.69
0.115
0.495
0.495
0.495
0.495
0.135
0.520
0.520
0.520
0.520
G
Ports
Function
RF Input
1
Thermal Terminal for Series Diode
(Electrically isolated from other ports)
2
3
4
Shunt Diode (Cathode Return)
RF Output / D.C. bias
Notes:
Backside Metal: 2.5μm thick Au
Hatched yellow areas are I/O ports (die solder pads)
Bottom View
Ordering Information
Part Number
Packaging
Waffle Tray
Pocket Tape
MASW-001150-13160W
MASW-001150-13160P
7
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
Component
C1, C2
Value
0.01μF
100pF
390nH
Case Size
0402
Manufacturer
Murata
C3, C4
L1, L2, L3, L4
0402
0603
Murata
Coilcraft
Ordering Information for Test Board
Part Number
MASW-001150-001SMB
8
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V3
Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard or soft substrates. The use of
60/40, Pb/Sn, 80/20, Au/Sn or any RoHS lead-free solder is recommended to achieve the lowest series
resistance and optimum heat sink. The thermal terminal is not electrically conductive and may be soldered directly
to any appropriate heat sink without affecting RF performance.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die
so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. All mounting pads should be heated simultaneously so that the solder under the pads flows at the same time.
Avoid soldering the pads one at a time as doing so would produce an un-equal heat flow and potentially create
thermal stress to the chip.
Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be
uniformly heated in a re-flow oven. Proper flow is easily determined looking down from the top since the HMIC
glass is transparent and the edges of the mounting pads can be visually inspected through the die after
attachment is complete. A typical soldering process profile and handling instructions are provided in Application
Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the MA-COM
Technology Solutions website at www.macomtech.com
Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the
average power is <1W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and
thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be
visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per
manufacturer’s recommended schedule.
9
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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