MASW-002100-11910G [TE]
HMIC™ Silicon PIN Diode Switches RoHs Compliant; HMIC ™硅PIN二极管开关符合RoHS
| 型号： | MASW-002100-11910G |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | HMIC™ Silicon PIN Diode Switches RoHs Compliant |
| 文件： | 总9页 (文件大小：339K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
Features
♦ Broad Bandwidth
♦ Specified from 50MHz to 20GHz
♦ Usable from 50MHz to 26.5GHz
♦ Lower Insertion Loss / Higher Isolation
than pHempt
MASW-001100-1190
♦ Rugged
♦ Fully Monolithic,
♦ Glass Encapsulated Construction
♦ Up to +33dBm C.W. Power Handling
Description
The MASW-001100-1190, MASW-002100-1191 and
MASW-003100-1192 are broadband monolithic
switches using series and shunt connected silicon
PIN diodes. They are designed for use as 2W, high
performance switches in applications up to
26.5GHz. They provide performance levels superior
to those realized by hybrid MIC designs
incorporating beamlead and PIN chip diodes that
require chip and wire assembly.
MASW-002100-1191
These switches are fabricated using M/A-COM’s
patented HMICTM (Heterolithic Microwave Integrated
Circuit) process, US Patent 5,268,310. This process
allows the incorporation of silicon pedestals that
form series and shunt diodes or vias by imbedding
them in low loss, low dispersion glass. By using
small spacing between elements, this combination
of silicon and glass gives HMIC devices low loss
and high isolation performance through low
millimeter frequencies.
Large bond pads facilitate the use of low inductance
ribbon leads, while gold backside metallization
allows for manual or automatic chip bonding via
80/20, AuSn solder or conductive Ag epoxy.
MASW-003100-1192
Parameter
Absolute Maximum
-65oC to +125oC
-65oC to +150oC
+175oC
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
RF C.W. Incident Power
Bias Current +25°C
| - 50V |
+33dBm C.W.
±20mA
Max operating Conditions for a Combination of
RF Power, D.C. Bias and Temperature:
+33dBm CW @ 15mA (per diode) @+85°C
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
MASW-001100-1190 (SPST)
Electrical Specifications @ TA = +25oC, 20mA Bias
Parameter
Frequency
6GHz
Minimum
Nominal
0.4
0.5
0.7
55
Maximum
Units
-
-
-
46
39
34
22
15
14
-
0.7
0.9
1.2
-
-
-
-
-
-
-
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
Insertion Loss
13GHz
20GHz
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
-
Isolation
47
42
31
33
27
20
Input Return Loss
Switching Speed1
Voltage Rating2
-
-
-
-
50
-
V
Signal Compression (500mW)
1GHz
0.2
dB
1.) Typical Switching Speed measured from 10 % to 90 % of
detected RF signal driven by TTL compatible drivers.
2.) Maximum reverse leakage current in either the shunt or
series PIN diodes shall be 10mA maximum at -50 volts.
MASW-002100-1191 (SPDT)
Electrical Specifications @ TA = +25oC, 20mA Bias
Parameter
Frequency
Minimum
Nominal
Maximum
Units
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
-
-
-
-
48
40
34
20
18
15
-
0.4
0.5
0.7
63
50
42
27
25
25
20
-
0.7
1.0
1.2
-
-
-
-
-
-
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
Insertion Loss
Isolation
Input Return Loss
Switching Speed1
Voltage Rating2
-
-
-
-
50
-
V
dB
Signal Compression (500mW)
1GHz
0.2
1.) Typical Switching Speed measured from 10 % to 90 % of
detected RF signal driven by TTL compatible drivers.
2.) Maximum reverse leakage current in either the shunt or
series PIN diodes shall be 10mA maximum at -50 volts.
MASW-003100-1192 (SP3T)
Electrical Specifications @ TA = +25oC, 20mA Bias
Parameter
Frequency
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
-
Minimum
Nominal
Maximum
Units
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
-
0.5
0.7
0.9
57
48
42
24
22
21
20
-
0.8
Insertion Loss
-
1.1
-
1.5
49
42
33
20
14
11
-
-
-
Isolation
-
-
Input Return Loss
-
-
Switching Speed1
Voltage Rating2
-
-
-
50
-
V
dB
Signal Compression (500mW)
1GHz
-
0.2
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
Typical Performance Curves at TA = +25°C, 20mA Bias Current
MASW-001100-1190
INSERTION LOSS vs. FREQUENCY
MASW-001100-1190
RETURN LOSS vs. FREQUENCY
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
-10
-15
-20
-25
-30
-35
Output Return Loss
Input Return Loss
0
5
10
15
20
25
30
0
5
10
15
20
25
30
FREQUENCY (GHz)
FREQUENCY (GHz)
MASW-002100-1191
INSERTION LOSS vs. FREQUENCY
MASW-002100-1191
RETURN LOSS vs. FREQUENCY
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
-10
-15
-20
-25
-30
-35
Output Return Loss
Input Return Loss
0
5
10
15
20
25
30
0
5
10
15
20
25
30
FREQUENCY (GHz)
FREQUENCY (GHz)
MASW-003100-1192
INSERTION LOSS vs. FREQUENCY
MASW-003100-1192
RETURN LOSS vs. FREQUENCY
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
-10
-15
-20
-25
-30
Output Return Loss
Input Return Loss
-1.1
-1.2
0
5
10
15
20
25
30
0
5
10
15
20
25
30
FREQUENCY (GHz)
FREQUENCY (GHz)
S-Parameters: S-Parameter data for these devices are available upon request.
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
Typical Performance Curves @ TA = +25°C, 20mA Bias Current
INPUT RETURN LOSS vs. BIAS CURRENT @ 10 GHz
MASW-001100-1190
ISOLATION vs. FREQUENCY
-22
-24
-26
-28
-30
-32
-34
-35
MAS W-003100
MAS W-002100
-40
-45
-50
-55
-60
-65
-70
-75
-80
M A S W- 0 0 110 0
0
5
10
15
20
25
30
CURRENT (mA)
35
40
45
50
55
OUTPUT RETURN LOSS vs. BIAS CURRENT@ 10 GHz
-21.5
0
5
10
15
20
25
30
FREQUENCY (GHz)
-22
-22.5
-23
MASW-002100-1191
ISOLATION vs. FREQUENCY
-23.5
-24
M A S W- 0 0 110 0
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
-24.5
-25
MASW-003100
MAS W-002100
-25.5
0
5
10
15
20
25
30
35
40
45
50
55
CURRENT (mA)
INSERTION LOSS vs. BIAS CURRENT @ 10 GHz
-0.35
-0.4
MASW-002100
MAS W-001100
-0.45
-0.5
0
5
10
15
20
25
30
FREQUENCY (GHz)
MAS W-003100
-0.55
-0.6
-0.65
-0.7
MASW-003100-1192
ISOLATION vs. FREQUENCY
0
5
10
15
20
25
30
35
40
45
50
55
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
CURRENT (mA)
ISOLATION vs. BIAS CURRENT @ 10 GHz
-46
-47
-48
-49
-50
-51
-52
-53
MAS W-001100
0
5
10
15
20
25
30
MAS W-002100
MAS W-003100
FREQUENCY (GHz)
-54
0
5
10
15
20
25
30
35
40
45
50
55
CURRENT (mA)
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
MASW-001100-1190 and Bias Connections1
J1 RF INPUT
Operation of the MASW Series Switches
Operation of the MASW series of PIN switches is achieved
by simultaneous application of negative DC current to the
low loss switching arm J1, J2, or J3, and positive DC
current to the remaining switching arms as shown in the
bias connection circuits. DC return is achieved via J1. The
control currents should be supplied by constant current
sources. The voltages at these points will not exceed
+1.5 volts (1.2V typical) at currents up to +20mA. In the low
loss state, the series diode must be forward biased and the
shunt diode reverse biased. In the isolated arm, the shunt
diode is forward biased and the series diode is reverse
biased.
20pF
20nH
J2 BIAS
20pF
100Ω
20nH
20pF
J2
RF OUTPUT
20pF
Switch
Chip
Driver Connections
MASW-001100-1190
MASW-002100-1191 and Bias Connections1
Control Level
(DC Current) at
J2
Condition of
RF Output
J1-J2
J1 RF INPUT
20pF
-20mA
Low Loss
Isolation
J2 BIAS
J3 BIAS
20nH
+20mA
100Ω
20nH
MASW-002100-1191
20pF
20pF
20pF
20nH
20pF
J3
RF OUTPUT
Control Level
Condition of
RF Output
Condition of
(DC Current) at
J2
RF OUTPUT
RF Output
20pF
Switch
Chip
J2
J3
J1-J2
J1-J3
-20mA
+20mA
+20mA
-20mA
Low Loss
Isolation
Isolation
Low Loss
MASW-003100-1192 and Bias Connections1
J1 RF INPUT
MASW-003100-1192
Control Level
20pF
Cond. of
RF Output RF Output
Cond. of Cond. of RF
(DC Current) at
Output
J4 BIAS
J2 BIAS
20nH
J2
J3
J4
J1-J2
J1-J3
J1-J4
20pF
100Ω
-20mA
+20mA
+20mA
-20mA
+20mA
+20mA
-20mA
Low Loss
Isolation
Isolation
Isolation
Low Loss
Isolation
Isolation
Isolation
Low Loss
20pF
20nH
20pF
20nH
20pF
J4
RF OUTPUT
+20mA +20mA
J2
RF OUTPUT
20pF
Handling Considerations
J3 BIAS
20nH
Cleanliness: These chips should be handled in a clean
environment.
Electro-Static Sensitivity: The MASW series PIN switches
are ESD, Class 1A sensitive (HBM). The proper ESD
handling procedures should be used.
20pF
20pF
J3
RF OUTPUT
Notes:
1. RLC values are for an operation frequency of 2-18GHz and
bias current of ± 20mA per diode.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is
recommended. A heat stage temperature of approximately 200oC and a force of 18 to 22 grams should be
used. Ultrasonic energy should be adjusted to the minimum required to achieve a good bond. RF bond wires
should be kept as short as possible.
Mounting
The HMIC switches have TiPtAu back metal. They can be die mounted with a gold-tin eutectic solder preform
or conductive epoxy. Mounting surface must be clean and flat.
Eutectic Die Attachment: An 80/20 gold-tin eutectic solder preform is recommended with a work surface
temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature
should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than
20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not
be used.
Epoxy Die Attachment: Surface of assembly should be preheated to 125-150oC. A minimum amount of
epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the chip after placement.
Cure epoxy per manufacturer’s schedule.
,
Chip Outline Drawing1 2
DIM
INCHES
MM
MIN. MAX. MIN. MAX.
A
B
C
D
E
F
0.014 0.018 0.35
0.025 0.029 0.64
0.45
0.74
0.008 REF
0.20 REF
0.004 0.006 0.10
0.15
0.004 REF
0.003 REF
0.003 REF
0.020 REF
0.10 REF
0.08 REF
G
H
0.08 REF
0.52 REF
Notes:
1. Topside and backside surface metallization is gold, 2.5μm thick typical.
2. Yellow areas indicate wire bonding pads.
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
Chip Outline Drawing1,2
MASW-002100-1191
DIM
INCHES
MM
MIN.
0.029
0.004
MAX.
0.033
0.006
MIN.
MAX.
0.83
0.15
A
B
C
D
E
F
0.73
0.10
0.004 REF
0.10 REF
0.13 REF
0.23 REF
0.58 REF
0.17 REF
0.10 REF
0.005 REF
0.009 REF
0.023 REF
0.007 REF
0.004 REF
G
H
Notes:
1. Topside and backside surface metallization is gold , 2.5μm thick typical.
2. Yellow areas indicate wire bonding pads
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
Chip Outline Drawing 1, 2
MASW-003100-1192
DIM
INCHES
MM
MIN.
0.046
0.036
MAX.
0.050
0.040
MIN.
MAX.
1.26
1.02
A
B
C
D
E
F
1.16
0.92
0.019 REF
0.48 REF
0.36 REF
0.10 REF
0.13 REF
0.014 REF
0.004 REF
0.005 REF
G
H
J
0.004
0.006
0.10
0.15
0.005 REF
0.004 REF
0.12 REF
0.10 REF
Notes:
1. Topside and backside surface metallization is gold , 2.5μm thick typical.
2. Yellow areas indicate wire bonding pads
8
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
RoHs Compliant
Rev. V6
Ordering Information
Part Number
Package
MASW-001100-11900W
MASW-001100-11900G
MASW-002100-11910W
MASW-002100-11910G
MASW-003100-11920W
MASW-003100-11920G
Waffle Pack
Gel Pack
Waffle Pack
Gel Pack
Waffle Pack
Gel Pack
9
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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