MASW006102_15 [TE]
HMIC Silicon PIN Diode Switch;
| 型号： | MASW006102_15 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | HMIC Silicon PIN Diode Switch |
| 文件： | 总7页 (文件大小：123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-006102-13610
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
V2
Features
♦
♦
♦
♦
♦
♦
♦
Broad Bandwidth 2 to 18 GHz
Usable up to 26 GHz
Integrated Bias Network
Low Insertion Loss / High Isolation
Rugged, Glass Encapsulated Construction
Fully Monolithic
RoHS Compliant
Description
The MASW-006102-13610 is a SP6T broadband
switch with integrated bias network utilizing M/A-COM
Technology Solutions HMICTM (Heterolithic Microwave
Integrated Circuit) process, US Patent 5,268,310. This
wafer fabrication process allows the incorporation of
silicon pedestals that form series and shunt diodes
and vias by imbedding them in low loss, low
dispersion glass. By using small spacing between
elements, plus the combination of silicon and glass
gives this HMIC device low loss and high isolation
performance with exceptional repeatability through low
millimeter frequencies. Large bond pads facilitate the
use of low inductance ribbons or 1 mil wire while full
backside gold metallization allows for die attachment
using 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders or
electrically conductive silver epoxy.
Yellow areas denote wire bond pads
Parameter
Absolute Maximum
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
RF Incident Power
-65oC to +125oC
-65oC to +150oC
+175oC
50V
+33dBm C.W.1
Applications
The MASW-006102-13160 is a high performance
switch which is suitable for use in multi-band ECM,
radar, and instrumentation control circuits where high
isolation to insertion loss ratios are required. With a
standard +5V/-5V, TTL controlled PIN diode driver,
80nS switching speeds can be achieved.
Bias Current +25°C
±20mA
Note:
1. Maximum operating conditions for
a
combination of RF power, D.C. bias and
operating temperature:
+33dBm CW @ 15mA (per diode) @+85°C
1
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MASW-006102-13610
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
V2
MASW-006102-13610 (SP6T)
Electrical Specifications @ TAMB = +25oC, 10mA Bias current
PARAMETER
FREQUENCY BAND
MIN
TYP
MAX
UNITS
6 GHZ
12 GHz
18 GHz
6 GHZ
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1.0
1.3
1.9
49
43
39
18
20
16
19
22
20
1.4
2.0
2.9
INSERTION
LOSS
43
35
30
ISOLATION
12 GHz
18 GHz
6 GHZ
INPUT RETURN
LOSS
12 GHz
18 GHz
6 GHZ
OUTPUT RETURN
LOSS
12 GHz
18 GHz
SWITCHING
SPEED
10 GHz
80
ns
Note:
1.Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC
output spiking network, R = 50 – 200Ω , C = 390 – 560pF.
Operation of the MASW-006102-13610
Operation of the MASW Series of PIN switches is achieved by the simultaneous application of negative DC
current to the low loss port and positive DC current to the remaining isolated switching ports per the Driver
Connections table below. The control currents should be supplied by constant current sources. For insertion
loss, -10mA bias results in approximately –2V, and for Isolation ,+10mA yields approximately +0.9V at the
respective bias nodes. The backside area of the die is the RF and DC return ground plane.
CONTROL LEVEL ( DC CURRENT )
CONDITION OF RF OUTPUT
B2
B3
B4
B5
B6
B7
J2-J1
J3-J1
J4-J1
J5-J1
J6-J1
J7-J1
Low
Loss
-10mA +10mA +10mA +10mA +10mA +10mA
Isolation Isolation Isolation Isolation Isolation
Low
Loss
+10mA -10mA +10mA +10mA +10mA +10mA Isolation
Isolation Isolation Isolation Isolation
Low
Loss
+10mA +10mA -10mA +10mA +10mA +10mA Isolation Isolation
Isolation Isolation Isolation
Low
Loss
+10mA +10mA +10mA -10mA +10mA +10mA Isolation Isolation Isolation
Isolation Isolation
Low
Loss
+10mA +10mA +10mA +10mA -10mA +10mA Isolation Isolation Isolation Isolation
Isolation
Low
Loss
+10mA +10mA +10mA +10mA +10mA -10mA Isolation Isolation Isolation Isolation Isolation
2
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is
• North America Tel: 800.366.2266 / Fax: 978.366.2266
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MASW-006102-13610
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
V2
MASW-006102-13610
TYPICAL INSERTION LOSS
0.00
-1.00
-2.00
J2
J3
J4
J5
J6
J7
-3.00
-4.00
-5.00
2.00
4.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
FREQUENCY ( GHz )
MASW-006102-13610
TYPICAL ISOLATION
0.00
-10.00
-20.00
-30.00
-40.00
-50.00
-60.00
-70.00
-80.00
J2
J3
J4
J5
J6
J7
2.00
4.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
FREQUENCY ( GHz )
3
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MASW-006102-13610
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
V2
MASW-0006102-13610
TYPICAL INPUT RETURN LOSS
0.00
-5.00
-10.00
-15.00
-20.00
-25.00
-30.00
J2
J3
J4
J5
J6
J7
2.00
4.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
FREQUENCY ( GHz )
MASW006102-13610
TYPICAL OUTPUT RETURN LOSS
0.00
-5.00
-10.00
-15.00
-20.00
-25.00
-30.00
J2
J3
J4
J5
J6
J7
2.00
4.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
FREQUENCY ( GHz )
4
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MASW-006102-13610
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
V2
MASW-006102-13610 Schematic
J1 ( Input Common Port )
DC Bias
J7
J6
J2
J5
J4
J3
5
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MASW-006102-13610
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
V2
MASW-006102-13610
Chip Outline Drawing1,2
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
B
C
D
E
F
G
H
.1325
.1225
.0595
.0345
.0245
.0115
.0305
.0275
.0395
.0295
.1335
.1235
.0605
.0355
.0255
.0125
.0315
.0285
.0405
.0305
3.3655
3.1115
1.5113
0.8763
0.6223
0.2921
0.7747
0.6985
1.0033
0.7493
3.3909
3.1369
1.5367
0.9017
0.6477
0.3175
0.8001
0.7239
1.0287
0.7747
I
J
RF Bond Pads (J1-J7)
DC Bond Pads (B2-B5)
Thickness
.016 X .005 REF.
.005 X .005 REF.
0.005 REF.
0.4064 X 0.127 REF.
.127 X .127 REF.
0.127 REF.
Notes:
1. Topside and backside metallization is gold , 2.5mm thick typical.
2. Yellow areas indicate wire bonding pads
6
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MASW-006102-13610
HMIC™ Silicon PIN Diode Switch
with Integrated Bias Network
V2
Wire/Ribbon and Die Attachment Recommendations
Cleanliness
These chips should be handled in a clean environment.
Wire Bonding
Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is
recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic
energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as
short and straight as possible.
Mounting
The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder
preform or conductive epoxy. Mounting surface must be clean and flat.
Eutectic Die Attachment
An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255oC and a
tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature should be 290oC. The chip
should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three
seconds should be required for attachment. Solders containing tin should not be used.
Epoxy Die Attachment
A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the
chip after placement. Cure epoxy per manufacturer’s schedule. (typically 125-150oC).
Ordering Information
Part Number
Package
MASW-006102-13610W
Waffle Pack
7
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
相关型号：
©2020 ICPDF网 联系我们和版权申明