TLC6983ZXLR [TI]
TLC6983 48x16 Common Cathode Matrix LED Display Driver with Ultra Low Power;
| 型号： | TLC6983ZXLR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TLC6983 48x16 Common Cathode Matrix LED Display Driver with Ultra Low Power |
| 文件： | 总12页 (文件大小：1179K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLC6983
SLVSFT9 – DECEMBER 2020
TLC6983 48x16 Common Cathode Matrix LED Display Driver with Ultra Low Power
– Upside and downside ghosting removal
– Low grayscale enhancement
1 Features
•
Separated VCC and VR/G/B power supply
– VCC voltage range: 2.5 V - 5.5 V
– VR/G/B voltage range: 2.5 V - 5.5 V
48 current source channels from 0.2 mA to 20 mA
– Channel-to-channel accuracy: ±0.5% (typ.),
±2% (max.); device-to-device accuracy: ±0.5%
(typ.), ±2% (max.)
– Low knee voltage: 0.26 V (max.) when IOUT = 5
mA
– 3-bits (8 steps) global brightness control
– 8-bits (256 steps) color brightness control
– Maximum 16-bits (65536 steps) PWM
grayscale control
16 scan line switches with 190-mΩ RDS(ON)
Ultra-low power consumption
– Independent VCC down to 2.5 V
– Lowest ICC down to 3.9 mA with 50-MHz GCLK
– Intelligent power saving mode
Built-in SRAM to support 1 - 32 multiplexing
– Single device with 16 multiplexing to support 32
× 16 LEDs or 16 × 16 RGB pixels
– Dual devices stackable with 32 multiplexing to
support 96 × 32 LEDs or 32 × 32 RGB pixels
High speed and low EMI Continuous Clock Series
Interface (CCSI)
– Only three wires: SCLK/SIN/SOUT
– External 25-MHz (max.) SCLK with dual-edge
transimission mechanism (internal 50 MHz)
– Internal frequency multiplier to support GCLK
range from 40 MHz - 160 MHz
– LED open/short/weak short detection and
removal
2 Applications
•
•
•
Narrow Pixel Pitch (NPP) LED display
Mini & micro-LED products
3 Description
With the pixel density getting higher in narrow pixel
pitch LED Display or Mini & Micro-LED products,
there are urgent demands for LED drivers to address
those critical challenges: ultra high integration to meet
the strict board space limitation, ultra low power to
minimize the system level power dissipation, new
interface to enable high data refresh rate with low
EMI impact, excellent display performance to serve
the growing needs of higher display quality.
•
•
The TLC6983 is a highly integrated common cathode
matrix LED display driver with 48 constant current
sources and 16 scanning FETs. A single TLC6983
is capable of driving 16 × 16 RGB LED pixels while
stacking two TLC6983s can drive 32 × 32 RGB LED
pixels. To achieve low power consumption, the device
supports separated power supplies for the red, green,
and blue LEDs by its common cathode structure.
Furthermore, the operation power of the TLC6983 is
significantly reduced by ultra-low operation voltage
range (Vcc down to 2.5 V) and ultra-low operation
current (Icc down to 3.9 mA).
•
•
Device Information
•
Optimized display performance
PART NUMBER
TLC6983
PACKAGE(1)
BODY SIZE (NOM)
VQFN (76)
BGA (96)
9 mm x 9 mm
6 mm x 6 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
VLEDR
VLEDG/B
VCC
VLEDR
VCC
VLEDG/B
VLEDR
VLEDG
VLEDB
VLEDR
VLEDG
VLEDB
VLEDR
VLEDG
VLEDB
VCC
GND
VCC
GND
VCC
GND
SOUT
SOUT
SCLK
SIN
LED
Driver
SCLK
SIN
SOUT
SCLK
SIN
SCLK
SIN
TLC6983
TLC6983
µC
µC
SCLK
SIN
SOUT
IREF
SOUT
IREF
IREF
...
...
...
...
...
...
16 RGBs
32 RGBs
TLC6983 with Single Device or Dual Devices Stackable Connection
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLC6983
SLVSFT9 – DECEMBER 2020
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Description (continued).................................................. 2
6 Device and Documentation Support..............................3
6.1 Receiving Notification of Documentation Updates......3
6.2 Support Resources..................................................... 3
6.3 Trademarks.................................................................3
6.4 Electrostatic Discharge Caution..................................3
6.5 Glossary......................................................................3
7 Mechanical, Packaging, and Orderable Information....4
4 Revision History
DATE
REVISION
NOTES
December 2020
*
Initial release.
5 Description (continued)
The TLC6983 implements a high speed dual-edge transmission interface to support high device count daisy-
chained and high refresh rate while minimizing electrical-magnetic interference (EMI). The device supports up
to 25-MHz SCLK (external) and up to 160-MHz GCLK (internal). Meanwhile, the device integrates enhanced
circuits and intelligent algorithms to solve the various display challenges in Narrow Pixel Pitch (NPP) LED
display applications and Mini / Micro-LED products: Dim at the fist scan line, Upper and downside ghosting,
Non-uniformity in low grayscale, Coupling, and Caterpillar caused by open or short LEDs, which make the
TLC6983 a perfect choice in such applications.
The TLC6983 also implements LED open/weak short/short detections and removals during operations and can
also report this information to the accompanying digital processor.
Copyright © 2021 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: TLC6983
TLC6983
SLVSFT9 – DECEMBER 2020
www.ti.com
6 Device and Documentation Support
6.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
6.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
6.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
6.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
6.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TLC6983
TLC6983
SLVSFT9 – DECEMBER 2020
www.ti.com
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: TLC6983
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTLC6983ZXLR
ACTIVE
NFBGA
ZXL
96
2500
Non-RoHS &
Non-Green
Call TI
Call TI
-40 to 85
TLC6983RRFR
TLC6983ZXLR
ACTIVE
VQFN
RRF
ZXL
76
96
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
TLC6983
TLC6983
PREVIEW
NFBGA
2500 RoHS & Green
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2021
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Apr-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLC6983RRFR
VQFN
RRF
76
2000
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Apr-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
VQFN RRF 76
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
TLC6983RRFR
2000
Pack Materials-Page 2
PACKAGE OUTLINE
RRF0076A
VQFN - 1 mm max height
S
C
A
L
E
1
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD
A
9.1
8.9
B
PIN 1 INDEX AREA
9.1
8.9
1.0
0.8
C
SEATING PLANE
0.08 C
0.05
0.00
2X 7.2
SYMM
EXPOSED
THERMAL PAD
(0.1) TYP
38
20
19
39
SYMM
77
2X 7.2
6.3 0.1
1
57
72X 0.4
0.25
0.15
76X
76
58
PIN 1 ID
0.1
C A B
0.6
0.4
76X
0.05
4224965/A 04/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RRF0076A
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(6.3)
SYMM
SEE SOLDER MASK
DETAIL
58
76
76X (0.7)
76X (0.2)
1
57
72X (0.4)
(1.1) TYP
(R0.05) TYP
(1.2) TYP
(0.6) TYP
SYMM
77
(8.7)
(
0.2) TYP
VIA
39
19
38
20
(0.6)
TYP
(1.2)
TYP
(1.1)
TYP
(8.7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4224965/A 04/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RRF0076A
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
25X ( 1)
(1.2) TYP
58
76
76X (0.7)
76X (0.2)
1
57
72X (0.4)
(R0.05) TYP
(1.2) TYP
SYMM
77
(8.7)
19
39
38
20
SYMM
(8.7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 10X
EXPOSED PAD 77
63% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4224965/A 04/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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PARTY INTELLECTUAL PROPERTY RIGHTS.
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Copyright © 2021, Texas Instruments Incorporated
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