TB6562ANG_07 [TOSHIBA]
Dual Full-Bridge Driver IC for Stepping Motors; 双路全桥式驱动器IC步进电机
| 型号： | TB6562ANG_07 |
| 厂家： | 
TOSHIBA |
| 描述： | Dual Full-Bridge Driver IC for Stepping Motors |
| 文件： | 总19页 (文件大小：284K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB6562ANG/AFG
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB6562ANG/AFG
Dual Full-Bridge Driver IC for Stepping Motors
The TB6562ANG/AFG is a 2-phase bipolar stepping motor driver
that contains DMOS transistors in the output stage. The driver
achieves high efficiency through the use of low ON-resistance
DMOS transistors and PWM current control circuitry.
TB6562ANG
Features
2-phase / 1–2-phase / W 1–2-phase excitation
PWM current control
Power supply voltage: 40 V (max)
Output current: 1.5 A (max)
TB6562AFG
Low ON-resistance: 1.5 Ω (upper and lower transistors/typ.)
Power-saving function
Overcurrent protection: Ilim ＝ 2.5 A (typ.)
Thermal shutdown
Package: TB6562ANG; SDIP24-P-300-1.78
TB6562ANG; SSOP30-P-375-1.00
SSOP30-P-375-1.00
Weight:
TB6562ANG/AFG is lead-free (Pb-free) product.
The following conditions apply to solderability:
*Solderability
SDIP24-P-300-1.78: 1.62 g (typ.)
SSOP30-P-375-1.00: 0.63 g (typ.)
1. Use of Sn-37Pb solder bath
*solder bath temperature = 230˚C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245˚C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
This product has a MOS structure and is sensitive to electrostatic discharge. When handling the product,
ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive
mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable
levels.
Special care should be taken with the following pins, which are vulnerable to surge current.
Pins with low surge withstand capability:
TB6562ANG: pins 10, 15
TB6562AFG: pins 13, 18
1
2007-3-22
TB6562ANG/AFG
Block Diagram
Some functional blocks, circuits, or constants may be omitted or simplified in the block diagram for explanatory purposes.
< TB6562ANG >
GND
24
Vreg
2
SB
3
OSC
22
V
OUT2A
11
Vcc
7
OUT1A OUT2B
Vcc
18
OUT1B
17
GND
13
CC
23
8
14
OSC
5 V
Waveform squaring
circuit
Thermal
shutdown
Control logic
Decoder
1
4
5
6
21
20
19
9
10
16
15
12
GND
Phase A
X1A
X2A
Phase B
X1B
X2B
VrefA
RSA
VrefB
RSB
GND
< TB6562AFG >
GND
30
Vreg
SB
3
OSC
28
V
OUT2A
14
Vcc
10
OUT1A OUT2B
Vcc
21
OUT1B
20
GND
CC
2
29
11
17
16, 22, 23, 24
OSC
5 V
Waveform squaring
circuit
Thermal
shutdown
Control logic
Decoder
1
4
5
6
27
26
25
12
13
19
18
7, 8, 9, 15
GND
GND
Phase A
X1A
X2A
Phase B
X1B
X2B
VrefA
RSA
VrefB
RSB
2
2007-3-22
TB6562ANG/AFG
Pin Description
< TB6562ANG >
Symbol
Function Description
Pin No.
Remarks
1
2
3
4
5
6
7
8
9
GND
Vreg
Ground pin
5 V output pin
Standby pin
Connect a capacitor between this pin and the GND pin.
H: start, L: Standby, Built-in pull down resistance of 100kΩ(typ.)
Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.)
Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.)
Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.)
Vcc (opr) = 10 V to 34 V
SB
Phase A
X1A
Rotation direction control pin (Ch. A)
Input pin used to set output current level (Ch. A)
Input pin used to set output current level (Ch. A)
Power supply voltage input pin
X2A
Vcc
OUT1A
VrefA
RSA
Output pin 1 (Ch. A)
Connect to a motor coil pin.
Input pin for external reference voltage (Ch. A)
Output current detection resistor connection pin (Ch. A).
Output pin 2 (Ch. A)
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
OUT2A
GND
GND
OUT2B
RSB
Connect to a motor coil pin.
Connect to a motor coil pin.
Ground pin
Ground pin
Output pin 2 (Ch. B)
Output current detection resistor connection pin (Ch. B)
Input pin for external reference voltage (Ch. B)
Output pin 1 (Ch. B)
VrefB
OUT1B
Vcc
Connect to a motor coil pin.
Power supply voltage input pin
Vcc (opr) = 10 V to 34 V
X2B
Input pin used to set output current level (Ch. B)
Input pin used to set output current level (Ch. B)
Rotation direction control pin (Ch. B)
External capacitor pin for triangular-wave oscillation
Power supply voltage input pin
Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.)
Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.)
Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.)
X1B
Phase B
OSC
V
V
= 10 V to 34 V
CC (opr)
CC
GND
Ground pin
<Top View>
TB6562ANG
TB6562AFG
GND
Vreg
GND
Vcc
1
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
GND
GND
Vcc
1
24
23
22
21
20
19
18
17
16
15
14
13
2
Vreg
SB
2
SB
OSC
Phase B
X1B
3
OSC
3
Phase A
X1A
4
Phase A
X1A
Phase B
X1B
4
5
X2A
X2B
6
5
GND
GND
GND
Vcc
GND
GND
GND
Vcc
7
X2A
X2B
6
8
Vcc
Vcc
7
9
OUT1A
VrefA
RSA
OUT1B
VrefB
RSB
8
10
11
12
13
14
15
OUT1A
VrefA
RSA
OUT1B
VrefB
RSB
9
10
11
12
OUT2A
GND
OUT2B
GND
OUT2A
GND
OUT2B
GND
3
2007-3-22
TB6562ANG/AFG
< TB6562AFG >
Pin No.
Symbol
Function Description
Remarks
1
GND
Vreg
Ground pin
2
3
5 V output pin
Connect a capacitor between this pin and the GND pin.
H: start, L: Standby, Built-in pull down resistance of
100kΩ(typ.)
SB
Standby pin
Apply a 0 V / 5 V signal, Built-in pull down resistance
of 100kΩ(typ.)
4
5
6
Phase A
X1A
Rotation direction control pin (Ch. A)
Apply a 0 V / 5 V signal, Built-in pull down resistance
of 100kΩ(typ.)
Input pin used to set output current level (Ch. A)
Input pin used to set output current level (Ch. A)
Apply a 0 V / 5 V signal, Built-in pull down resistance
of 100kΩ(typ.)
X2A
7
GND
GND
GND
Vcc
Ground pin
8
Ground pin
9
Ground pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Power supply voltage input pin
Output pin 1 (Ch. A)
Vcc (opr) = 10 V to 34 V
OUT1A
VrefA
RSA
Connect to a motor coil pin.
Reference voltage external set pin (Ch. A)
Resistance connect pin for detecting output current (Ch. A)
Output pin 2 (Ch. A)
OUT2A
GND
GND
OUT2B
RSB
Connect to a motor coil pin.
Connect to a motor coil pin.
Ground pin
Ground pin
Output pin 2 (Ch. B)
Output current detection resistor connection pin (Ch. B)
Input pin for external reference voltage (Ch. B)
Output pin 1 (Ch. B)
VrefB
OUT1B
Vcc
Connect to a motor coil pin.
Power supply voltage input pin
Ground pin
Vcc (opr) = 10 V to 34 V
GND
GND
GND
Ground pin
Ground pin
Apply a 0 V / 5 V signal, Built-in pull down resistance
of 100kΩ(typ.)
25
26
27
X2B
X1B
Input pin used to set output current level (Ch. B)
Input pin used to set output current level (Ch. B)
Rotation direction control pin (Ch. B)
Apply a 0 V / 5 V signal, Built-in pull down resistance
of 100kΩ(typ.)
Apply a 0 V / 5 V signal, Built-in pull down resistance
of 100kΩ(typ.)
Phase B
OSC
28
29
30
External capacitor pin for triangular-wave oscillation
Power supply voltage input pin
Ground pin
V
V
= 10 V to 34 V
CC (opr)
CC
GND
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2007-3-22
TB6562ANG/AFG
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Power supply voltage
Symbol
Rating
Unit
V
40
40
V
V
CC
Output voltage
Vo
1.5
Output current
I
A
O (Peak)
(Note 1)
Input voltage
Vin
−0.2 to 5.5
V
2.5
(Note 2)
Power dissipation
P
W
D
Operating temperature
Storage temperature
Junction temperature
T
−20 to 85
−55 to 150
150
°C
°C
°C
opr
T
stg
Tjmax
Note 1: Output current may be controlled by excitation mode, ambient temperature, or heatsink.
When designing a circuit, ensure that the maximum junction temperature, TjMAX = 150°C, is not exceeded
when the IC is used.
Avoid using the IC in abnormal conditions that would cause the Tj to exceed 150°C, even though the heat
protection circuit of the IC will continue to operate in such conditions.
Note 2: When mounted on a board (50 mm × 50 mm × 1.6 mm, Cu area: 50%)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be
exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably
altered, in which case the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other
equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under
any operating condition.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in
this document.
Operating Range (Ta = –20 to 85°C)
Characteristic
Power supply voltage
Symbol
Rating
Unit
V
10 to 34
0 to 5
V
V
CC
Input voltage
Vin
Vref
Vref voltage
0.5 to 7.0
15 to 80
45 to 400
V
PWM frequency
fpwm
kHz
kHz
Triangular-wave oscillation frequency
f
osc
5
2007-3-22
TB6562ANG/AFG
Electrical Characteristics (V = 24 V, Ta = 25°C)
CC
Test
Circuit
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
XT1A = XT2A = H, XT1B = XT2B = H
I
⎯
6.5
10
CC1
Output = Open
Supply current
⎯
mA
XT1A = XT2A = L, XT1B = XT2B = L
I
I
⎯
7.0
12
CC2
CC3
Output = Open
Standby mode
⎯
2
2.0
⎯
4.0
5.5
0.8
V
⎯
⎯
INH
Input voltage
⎯
⎯
⎯
V
-0.2
⎯
INL
V
μA
V
Control circuit
(Note 1)
Input hysteresis
voltage
V
(Target spec.)
⎯
0.4
⎯
IN (HYS)
I
V
V
= 5 V
= 0 V
30
⎯
50
⎯
⎯
⎯
75
5
INH
IN
IN
Input current
Input voltage
I
INL
V
⎯
⎯
2.3
–0.2
5.5
0.8
INSH
⎯
⎯
⎯
V
INSL
Input hysteresis
voltage
Standby circuit
V
(Target spec.)
⎯
0.4
⎯
IN (HYS)
I
V
V
= 5 V
= 0 V
30
⎯
50
⎯
1.5
1.5
⎯
⎯
1.3
1.3
5
75
5
INSH
IN
IN
Input current
μA
Ω
I
INSL
I
I
= 0.2 A
= 1.5 A
⎯
2.0
2.0
10
O
O
Output ON-resistance
R
⎯
⎯
⎯
on (U + L)
⎯
I
V
V
= 40 V
= 40 V
⎯
L (U)
CC
CC
Output leakage current
Diode forward voltage
μA
V
I
⎯
10
L (L)
V
I
I
= 1.5 A
= 1.5 A
⎯
2.0
2.0
5.25
10
F (U)
O
O
V
⎯
F (L)
Internal reference voltage
Input current
V
⎯
⎯
1 mA
4.75
⎯
V
reg
Iref
Vref = 0.5 V
5
μA
X1 = X2 = L
Vref = 5 V
Vref (1/10)
Vref (1/15)
Vref (1/30)
⎯
⎯
⎯
0.5
0.45
0.28
0.12
0.55
0.38
0.22
Vref circuit
X1 = L, X2 = H
Vref = 5 V
Current limit
voltage
V
0.33
0.17
X1 = H, X2 = L
Vref ＝5 V
Triangular-wave oscillation
frequency
f
⎯
⎯
C = 4700 pF
88
110
160
132
kHz
°C
osc
Thermal shutdown circuit operating
temperature
(Target spec.)
T
⎯
⎯
SD
Note 1: Phase, X1 and X2 pins
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2007-3-22
TB6562ANG/AFG
Truth Tables
< 2-phase excitation > (*) Io: OUT1 → OUT2; + current
OUT2 → OUT1; － current
Phase A
Phase B
Input
Input
X1A
Output
Output
Phase A
X2A
I (A)
O
Phase B
X1B
X2B
I (B)
O
H
L
L
L
L
L
L
L
L
L
100%
−100%
−100%
100%
H
H
L
L
L
L
L
L
L
L
L
100%
100%
L
−100%
−100%
H
L
< 1–2-phase excitation >
Phase A
Phase B
Input
Output
Input
Output
Phase A
X1A
X2A
L
I
(A)
Phase B
X1B
L
X2B
L
I (B)
O
O
H
X
L
L
H
L
L
L
H
L
L
100%
0%
H
H
H
X
L
100%
100%
100%
0%
H
L
L
L
−100%
−100%
−100%
0%
L
L
L
L
H
L
H
L
L
L
−100%
−100%
−100%
0%
X
H
H
H
L
L
L
L
100%
100%
L
L
L
L
X
H
H
< W 1–2-phase excitation >
Phase A
Phase B
Input
X1A
H
H
L
Output
Input
X1B
L
Output
Phase A
X2A
I
O
(A)
Phase B
X2B
I (B)
O
X
H
H
H
H
H
H
H
X
L
H
L
0%
L
L
L
L
−100%
−100%
−66.7%
−33.3%
0%
33.3%
66.7%
100%
L
H
L
L
L
H
L
L
L
H
H
H
L
L
L
100%
X
H
H
H
H
H
H
H
X
L
H
L
L
L
100%
33.3%
66.7%
100%
100%
100%
66.7%
33.3%
0%
H
L
L
33.3%
66.7%
0%
H
L
H
H
L
L
H
H
L
L
L
−33.3%
−66.7%
−100%
−100%
−100%
−66.7%
−33.3%
L
L
L
H
L
L
H
L
L
L
H
H
H
L
L
L
L
H
L
L
L
L
−33.3%
−66.7%
−100%
L
L
H
L
L
H
L
L
H
L
L
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2007-3-22
TB6562ANG/AFG
Timing Charts
Timing charts may be simplified for explanatory purposes.
< 2-phase excitation >
100％
I
I
(A)
(B)
O
O
−100％
100％
−100％
H
Phase A
L
H
L
X1A
X2A
H
L
H
L
Phase B
X1B
H
L
H
L
X2B
(*) Io: OUT1→OUT2; + current
OUT2→OUT1; － current
< 1–2-phase excitation >
100％
I
(A)
0%
O
−100％
100％
0%
I
(B)
O
−100％
H
Phase A
L
H
L
X1A
X2A
H
L
H
L
Phase B
X1B
H
L
H
L
X2B
(*) Io: OUT1→OUT2; + current
OUT2→OUT1; － current
8
2007-3-22
TB6562ANG/AFG
< W 1–2-phase excitation >
100％
66.7%
33.3%
I
(A)
0%
O
−33.3％
−66.7%
−100%
100％
66.7%
33.3%
0%
I
(B)
O
−33.3％
−66.7%
−100%
H
L
Phase A
H
L
X1A
X2A
H
L
H
L
Phase B
X1B
H
L
H
L
X2B
(*) Io: OUT1→OUT2; + current
OUT2→OUT1; － current
9
2007-3-22
TB6562ANG/AFG
PWM Current Control
The IC enters CW (CCW) mode and short brake mode alternately during PWM current control.
To prevent shoot-through current caused by simultaneous conduction of upper and lower transistors in the output
stage, a dead time is internally generated for 300 ns (target spec) when the upper and lower transistors are being
switched.
Therefore synchronous rectification for high efficiency in PWM current control can be achieved without an off-time
generated via an external input.
Even for toggling between CW and CCW modes, and CW (CCW) and short brake modes, no off-time is required due
to the internally generated dead time.
V
V
V
CC
CC
CC
M
OUT1
M
OUT1
M
OUT1
RS
RS
RS
PWM ON
t1
PWM ON → OFF
t2 = 300 ns (typ.)
PWM OFF
t3
V
V
CC
CC
OUT1
M
OUT1
M
RS
RS
PWM OFF → ON
t4 = 300 ns (typ.)
PWM ON
t5
10
2007-3-22
TB6562ANG/AFG
Constant current regulation
When V reaches the reference voltage (Vref), the IC enters discharge mode. After four clock signals are
RS
generated from the oscillator, the IC moves from discharge mode to charge mode.
Vref
V
RS
OSC
Internal
clock
Vref
V
RS
Charge
Discharge
Discharge
GND
11
2007-3-22
TB6562ANG/AFG
Transition from charge mode to discharge mode
If V > Vref after four clock signals in charge mode, the IC again enters discharge mode. After a further
RS
four clock signals in discharge mode, V
is compared with Vref. If V
< Vref, the IC operates in charge
RS
RS
mode until V
reaches Vref.
RS
OSC
Internal
clock
Vref
V
RS
Discharge
Discharge
Charge
Charge
GND
Transition from discharge mode to charge mode
Even when the reference voltage has risen, discharge mode lasts for four clock signals and is then toggled
to charge mode.
OSC
Internal
clock
Vref
V
RS
Charge
Discharge
Discharge
GND
Timing charts may be simplified for explanatory purposes.
Internal oscillation frequency (fosc)
The internal oscillation frequency is approximated by the formula below:
ｆosc = 1 / (0.523 × (Cosc × 3700 ＋ Cosc × 600)).
12
2007-3-22
TB6562ANG/AFG
Reference Voltage Generator
The current value at 100% is determined by applying voltage at the Vref pin.
The value can be calculated as follows:
I (100％) = Vref × 1/10 × 1/RS[A] (X1 = X2 = L)
O
V
CC
Control
circuit
X1
X2
OUT2
OUT1
M
Decoder
I
O
1/10
1/15
1/30
Vref
RS
I
O
Thermal Shutdown Circuit (TSD)
The IC incorporates a thermal shutdown circuit. When the junction temperature (T ) reaches 160°C (typ.), the output
j
transistors are turned off.
After 50 μs (typ.), the output transistors are turned on automatically.
The IC has 40°C temperature hysteresis.
TSD = 160°C (target spec)
ΔTSD = 40°C (target spec)
Overcurrent Protection Circuit (ISD)
The IC incorporates an overcurrent protection circuit to detect voltage flowing through the output transistors. The
overcurrent threshold is 2.5 A (typ.).
Currents flowing through the eight output transistors are monitored individually. If overcurrent is detected in at least
one of the transistors, all transistors are turned off.
The IC incorporates a timer to count the 50 μs (typ.) for which the transistors are off. After the 50 μs, the transistors are
turned on automatically. If an overcurrent occurs again, the same operation is repeated. To prevent false detection due to
glitches, the circuit turns off the transistors only when current exceeding the overcurrent threshold flows for 10 μs or
longer.
I
LIM
Output current
0
50 μs
50 μs
(typ.)
(typ.)
10 μs
10 μs
(typ.)
(typ.)
Not detected
The target specification for the overcurrent limiter value (overcurrent threshold) is 2.5 A (typ.), and varies in a range
from approximately 1.5 A to 3.5 A.
These protection functions are intended only as a temporary means of preventing output short circuits or other
abnormal conditions and are not guaranteed to prevent damage to the IC.
If the guaranteed operating ranges of this product are exceeded, these protection features may not operate and some
output short circuits may result in the IC being damaged.
The overcurrent protection feature is intended to protect the IC from temporary short circuits only.
Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should be
configured so that any overcurrent condition will be eliminated as soon as possible.
13
2007-3-22
TB6562ANG/AFG
Application Circuit
The application circuit below is for reference only and requires thorough evaluation at the mass production design stage.
In furnishing this example of an application circuit, Toshiba does not grant the use of any industrial property rights.
(Note 2)
(Note 4)
(Note 1)
5 V
2
28
10
21
29
Vreg
OSC
VCC Vcc Vcc
V
DD
PORT1
PORT2
PORT3
PORT4
SB
OUT1A
OUT2A
RSA
3
4
11
14
13
Stepping
motor
Phase A
XA1
5
XA2
6
TB6562ANG/AFG
Phase B
XB1
27
26
25
PORT5
PORT6
OUT1B
OUT2B
RSB
20
17
18
PORT7
PORT8
XB2
PORT9
VrefA VrefB
12 19
GND
GND
1, 7, 8, 9, 15, 16, 22, 23 24, 30
DAC output signal
Note 1: A power supply capacitor should be connected between V
the IC.
and RSA (RSB), and as close as possible to
CC
Note 2: C2 and C3 should be connected as close as possible to S-GND.
Note 3: In powering on, set the IC as follows:
SB = Low (standby mode)
or
XA1 = XA2 = XB1 = XB2 = High (current value = 0%)
Note 4: When the Vref is being changed, a DAC output can be connected directly to the Vref pin.
Note 5: The V
pins (pin 10, pin 21, pin 29) should be shorted externally.
CC
Note 6: Connect the capacitor C4 to the Vref to reduce the switching noise.
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Package Dimensions
Weight: 1.62 g (typ.)
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Weight: 0.63 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,
are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
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TB6562ANG/AFG
Points to remember on handling of ICs
(1) Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect
ICs under all circumstances. If the Over current protection circuits operate against the over current,
clear the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before
operation. In addition, depending on the method of use and usage conditions, if over current
continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ)
at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid
this problem, take the effect of back-EMF into consideration in system design.
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TB6562ANG/AFG
RESTRICTIONS ON PRODUCT USE
070122EBA_R6
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties. 070122_C
• Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances.
Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws
and regulations. 060819_AF
• The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E
19
2007-3-22
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