TB6568KQ [TOSHIBA]

Full-Bridge DC Motor Driver IC; 全桥直流马达驱动器IC
TB6568KQ
型号: TB6568KQ
厂家: TOSHIBA    TOSHIBA
描述:

Full-Bridge DC Motor Driver IC
全桥直流马达驱动器IC

驱动器
文件: 总15页 (文件大小:230K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TB6568KQ  
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic  
TB6568KQ  
Full-Bridge DC Motor Driver IC  
The TB6568KQ is a full-bridge DC motor driver IC employing  
the MOS process for output power transistors.  
The low ON-resistance MOS process and PWM control enables  
driving DC motors with high thermal efficiency.  
Four operating modes are selectable via IN1 and IN2: clockwise  
(CW), counterclockwise (CCW), Short Brake and Stop.  
Features  
Power supply voltage: 50 V (max)  
Output current: 3 A (max)  
Weight: 2.2 g (typ.)  
Output ON-resistance: 0.55 Ω (typ.)  
PWM control  
CW/CCW/Short Brake/Stop modes  
Overcurrent shutdown circuit (ISD)  
Overvoltage shutdown circuit (VSD)  
Thermal shutdown circuit (TSD)  
Undervoltage lockout circuit (UVLO)  
Dead time for preventing shoot-through current  
Note: The following conditions apply to solderability:  
About solderability, following conditions were confirmed  
(1) Use of Sn-37Pb solder Bath  
solder bath temperature: 230°C  
dipping time: 5 seconds  
the number of times: once  
use of R-type flux  
(2) Use of Sn-3.0Ag-0.5Cu solder Bath  
solder bath temperature: 245°C  
dipping time: 5 seconds  
the number of times: once  
use of R-type flux  
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TB6568KQ  
Block Diagram (application circuit example)  
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is  
required, especially at the mass production design stage.  
Toshiba does not grant any license to any industrial property rights by providing these examples of application  
circuits.  
VM  
5-V regulator  
UVLO  
VSD  
TSD  
ISD detection  
ISD detection  
OUT1  
OUT2  
IN1  
IN2  
Control  
Predriver  
Motor  
ISD detection  
ISD  
ISD detection  
GND  
Pin Functions  
Pin No.  
Pin Name  
Functional Description  
1
2
3
4
5
6
7
IN1  
IN2  
Control signal input pin 1  
Control signal input pin 2  
Output pin 1  
OUT1  
GND  
OUT2  
N.C.  
VM  
Ground pin  
Output pin 2  
No-connect  
Power supply voltage pin  
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TB6568KQ  
Absolute Maximum Ratings (Note) (Ta = 25°C)  
Characteristics  
Power supply voltage  
Symbol  
VM  
Rating  
Unit  
50  
V
V
Output voltage  
V
50  
O
Output current  
I
O
(peak)  
3
A
Input voltage  
V
0.3 to 5.5  
1.25 (Note 1)  
40 to 85  
55 to 150  
V
IN  
Power dissipation  
Operating temperature  
Storage temperature  
P
W
°C  
°C  
D
T
opr  
T
stg  
Note: The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even  
for a moment. Do not exceed any of these ratings.  
Exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by  
explosion or combustion.  
Please use the TB6568KQ within the specified operating ranges.  
Note 1: No heatsink  
Operating Ranges  
Characteristics  
Power supply voltage  
Symbol  
Rating  
Unit  
VM  
10 to 45  
Up to 100  
V
kHz  
A
opr  
PWM Frequency  
Output Current  
f
PWM  
I
O
(Ave.)  
Up to 1.5 (Note 2) (given as a guide)  
Note 2: Ta = 25°C, the TB6568KQ is mounted on the PCB (70 × 50 × 1.6 (mm), double-sided, Cu thickness: 50 μm,  
Cu dimension: 67%) with no heatsink.  
*: The average output current shall be increased or decreased depending on usage conditions such as ambient  
temperature, a presence/absence of a heatsink and IC mounting method.  
Please use the average output current so that the junction temperature of 150°C (T ) and the absolute maximum  
j
output current rating of 3 A are not exceeded.  
**: Connecting the metal plate on the rear surface of the TB6568KQ to a heatsink allows for improvement of the  
power dissipation capability of the TB6568KQ. Please consider heat dissipation efficiency when designing the  
board layout.  
Moreover, this metal plate is electrically connected to the rear surface of the TB6568KQ; therefore, it must always  
be insulated or shorted to ground.  
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TB6568KQ  
Electrical Characteristics (unless otherwise specified, Ta = 25°C, VM = 24 V)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
mA  
I
I
I
Stop mode  
2
2.5  
2.5  
2.5  
8
8
CC1  
CC2  
CC3  
Power supply current  
CW/CCW mode  
Short Brake mode  
8
V
5.5  
0.8  
75  
5
INH  
Input voltage  
V
V
0
INL  
IN (HYS)  
Control circuit  
IN1 pin,  
Hysteresis voltage  
Input current  
V
1
0.4  
50  
IN2 pin  
I
V
V
= 5 V  
= 0 V  
INH  
IN  
IN  
μA  
I
INL  
PWM frequency  
f
Duty: 50 %  
100  
0.9  
2
kHz  
μs  
PWM  
PWM (TW)  
PWM minimum pulse width  
Output ON-resistance  
f
(value given as a guide)  
R
I
= 3 A  
O
2  
0.55  
Ω
ON (U + L)  
I
VM = 50 V, V  
= 0 V  
L (U)  
OUT  
Output leakage current  
Diode forward voltage  
μA  
I
VM = V  
= 50 V  
L (L)  
OUT  
V
I
I
= 3 A  
1.3  
1.3  
1.7  
1.7  
F (U)  
O
O
V
V
= −3 A  
F (L)  
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TB6568KQ  
Thermal Performance Characteristics  
Thermal Resistance  
P
Ta  
D
14  
12  
10  
8
(1) With a heatsink (10°C/W):  
Ta = 25°C, P = 7.8 W  
D
(2) No heatsink:  
Ta = 25°C, P = 1.25 W  
D
*: With an infinite heatsink:  
R
th (j-c)  
= 6°C/W  
(1)  
6
4
Pulse width  
t
(s)  
(2)  
2
0
0
25  
50  
75  
100  
125  
150  
Ambient temperature Ta (°C)  
I/O Equivalent Circuits  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory  
purposes.  
Pin No.  
I/O Signal  
I/O Internal Circuit  
10 kΩ  
(typ.)  
Digital input  
L: 0.8 V (max)  
H: 2 V (min)  
IN1 (IN2)  
IN1 (1)  
IN2 (2)  
VM  
5-V regulator  
OUT1 (3)  
OUT2 (5)  
GND (4)  
VM (7)  
OUT1 (OUT2)  
Operating supply voltage range  
VM = 10 to 45 V  
GND  
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TB6568KQ  
Functional Description  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory  
purposes.  
Timing charts may be simplified for explanatory purposes.  
1. I/O Function Table  
Input  
Output  
IN1  
H
IN2  
H
OUT1  
OUT2  
Mode  
L
L
L
H
L
Short Brake  
L
H
CW/CCW  
CCW/CW  
Stop  
H
L
H
L
L
OFF (Hi-Z)  
(caused by a release of TSD/ISD)  
2. Undervoltage Lockout Circuit (UVLO)  
The TB6568KQ incorporates an undervoltage lockout circuit. If the power supply voltage drops under 8 V  
(typ.), all the output transistors are turned off (Hi-Z).  
The UVLO circuit has a hysteresis of 0.7 V (typ.); thus the TB6568KQ recovers at 8.7 V (typ.).  
UVLO operation  
8.7 V (typ.)  
8.0 V (typ.)  
VM voltage  
UVLO operation  
H
UVLO internal signal  
L
H
OUT1, OUT2  
L
Normal operation  
OFF (Hi-Z)  
Normal operation  
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TB6568KQ  
3. Overvoltage Shutdown Circuit (VSD)  
The TB6568KQ incorporates an overvoltage shutdown circuit. When the power supply voltage exceeds 53 V  
(typ.), all the output transistors are turned off (Hi-Z).  
The VSD circuit has a hysteresis of 3 V (typ.); thus the TB6568KQ resumes the normal operation at 50 V  
(typ.).  
VSD operation  
53 V (typ.)  
50 V (typ.)  
VM voltage  
VSD operation  
H
VSD internal signal  
L
H
OUT1, OUT2  
L
Normal operation  
OFF (Hi-Z)  
Normal operation  
Note: The VSD circuit is activated if the absolute maximum voltage rating is violated. Note that the circuit is  
provided as an auxiliary only and does not necessarily provide the IC with a perfect protection from any  
kind of damages.  
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TB6568KQ  
4. Thermal Shutdown Circuit (TSD)  
The TB6568KQ incorporates a thermal shutdown circuit. If the junction temperature (T ) exceeds 170°C  
j
(typ.), all the output transistors are turned off (Hi-Z).  
The shutdown is released and the TB6568KQ resumes the normal operation when both the IN1 pin and IN2  
pin are driven Low.  
TSD = 170°C (typ.)  
TSD operation  
TSD operation  
170°C (typ.)  
Chip temperature:  
Junction temperature (T )  
j
H
TSD internal signal  
L
H
IN1, IN2  
More than 1 μs (typ.)  
L
H
OUT1, OUT2  
L
Normal operation  
OFF (Hi-Z)  
Normal operation  
Note: The TSD circuit is activated when the junction temperature (T ) violates the rating temperature of 150°C.  
j
Note that the circuit is provided as an auxiliary only and does not necessarily provide the IC with a perfect  
protection from any kind of damages.  
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TB6568KQ  
5. Overcurrent Shutdown Circuits (ISD)  
The TB6568KQ incorporates overcurrent shutdown (ISD) circuits monitoring the current that flows through  
each of all the four output power transistors.  
The threshold current ranges from 3 A to 6 A. If any of the ISDs detects an overcurrent for more than 5.1 μs  
(typ.), which is the predefined detection time, all the output transistors are turned off and enter High  
impedance state.  
The shutdown is released and the TB6568KQ resumes the normal operation when both the IN1 pin and IN2  
pin are driven Low.  
ISD operation  
Threshold  
Output current  
0
5.1 μs  
(typ.)  
H
ISD internal signal  
L
H
IN1, IN2  
More than 1 μs (typ.)  
L
OUT1, OUT2  
Normal operation  
OFF (Hi-Z)  
Normal operation  
Note: The ISD is activated if the absolute maximum current rating is violated. Note that the circuit is provided as  
an auxiliary only and does not necessarily provide the IC with a perfect protection from damages due to  
overcurrent caused by power fault, ground fault, load-short and the like.  
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TB6568KQ  
6. PWM Control  
Switching input through the IN1 and IN2 pins enables the PWM control of the motor driver.  
When the motor drive is controlled by the PWM input, the TB6568KQ repeats operating in Normal  
Operation mode and Short Brake mode alternately.  
For preventing the shoot-through current in the output circuit caused by the upper and lower power  
transistors being turned on simultaneously, the dead time is internally generated at the time the upper and  
lower power transistors switches between on and off.  
This eliminates the need of inserting Off time externally; thus the PWM control with synchronous  
rectification is enabled.  
Note that inserting Off time externally is not required on operation mode changes between CW and CCW,  
and CW (CCW) and Short Brake, again, because of the dead time generated internally.  
VM  
VM  
VM  
OUT1  
M
OUT1  
M
OUT1  
M
GND  
GND  
GND  
PWM ON  
t1  
PWM ON OFF  
t2 = 200 ns (typ.)  
PWM OFF  
t3  
VM  
VM  
OUT1  
M
OUT1  
M
GND  
GND  
PWM OFF ON  
t4 = 500 ns (typ.)  
PWM ON  
t5  
VM  
t5  
Output voltage  
waveform  
(OUT1)  
t1  
t3  
GND  
t4  
t2  
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TB6568KQ  
7. Output Circuits  
The switching characteristics of the output transistors provided to the OUT1 pin and OUT2 pin are as  
follows:  
Characteristic  
Value  
Unit  
ns  
t
t
650 (typ.)  
450 (typ.)  
90 (typ.)  
pLH  
pHL  
t
r
t
130 (typ.)  
f
PWM input  
(IN1, IN2)  
t
pLH  
t
pHL  
90%  
50%  
90%  
50%  
Output voltage  
(OUT1, OUT2)  
10%  
10%  
t
t
r
f
11  
2009-08-11  
TB6568KQ  
Package Dimensions  
Weight: 2.2 g (typ.)  
12  
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TB6568KQ  
Notes on Contents  
1. Block Diagrams  
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for  
explanatory purposes.  
2. Equivalent Circuits  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory  
purposes.  
3. Timing Charts  
Timing charts may be simplified for explanatory purposes.  
4. Application Circuits  
The application circuits shown in this document are provided for reference purposes only. Thorough  
evaluation is required, especially at the mass production design stage.  
Toshiba does not grant any license to any industrial property rights by providing these examples of  
application circuits.  
5. Test Circuits  
Components in the test circuits are used only to obtain and confirm the device characteristics. These  
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the  
application equipment.  
IC Usage Considerations  
Notes on Handling of ICs  
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be  
exceeded, even for a moment. Do not exceed any of these ratings.  
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result  
injury by explosion or combustion.  
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case  
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed  
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise  
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can  
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,  
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.  
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the  
design to prevent device malfunction or breakdown caused by the current resulting from the inrush  
current at power ON or the negative current resulting from the back electromotive force at power OFF.  
IC breakdown may cause injury, smoke or ignition.  
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,  
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,  
smoke or ignition.  
(4) Do not insert devices in the wrong orientation or incorrectly.  
Make sure that the positive and negative terminals of power supplies are connected properly.  
Otherwise, the current or power consumption may exceed the absolute maximum rating, and  
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result  
injury by explosion or combustion.  
In addition, do not use any device that is applied the current with inserting in the wrong orientation or  
incorrectly even just one time.  
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TB6568KQ  
Points to Remember on Handling of ICs  
(1) Over Current Protection Circuit  
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs  
under all circumstances. If the Over current protection circuits operate against the over current, clear  
the over current status immediately.  
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings  
can cause the over current protection circuit to not operate properly or IC breakdown before operation.  
In addition, depending on the method of use and usage conditions, if over current continues to flow for  
a long time after operation, the IC may generate heat resulting in breakdown.  
(2) Thermal Shutdown Circuit  
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal  
shutdown circuits operate against the over temperature, clear the heat generation status immediately.  
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings  
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.  
(3) Heat Radiation Design  
In using an IC with large current flow such as power amp, regulator or driver, please design the device  
so that heat is appropriately radiated, not to exceed the specified junction temperature (T ) at any time  
j
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation  
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,  
please design the device taking into considerate the effect of IC heat radiation with peripheral  
components.  
(4) Back-EMF  
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow  
back to the motor’s power supply due to the effect of back-EMF. If the current sink capability  
of the power supply is small, the device’s motor power supply and output pins might be  
exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of  
back-EMF into consideration in system design.  
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TB6568KQ  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also  
refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the  
specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA  
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are  
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the  
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any  
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other  
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO  
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public  
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the  
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,  
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology  
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign  
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software  
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
15  
2009-08-11  

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