10-FZ07BIA030SG-P894E38 [VINCOTECH]
High speed switching;Low EMI;Low turn-off losses;Low collector emitter saturation voltage;型号: | 10-FZ07BIA030SG-P894E38 |
厂家: | VINCOTECH |
描述: | High speed switching;Low EMI;Low turn-off losses;Low collector emitter saturation voltage |
文件: | 总33页 (文件大小:2940K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
flowSOL 0 BI (TL)
650 V / 30 A
Features
flow 0 12 mm housing
● Booster + H-Bridge
● Kelvin Emitter for improved switching performance
● Temperature sensor
Solder pin
Press-fit pin
Schematic
Target applications
● Power Supply
● Solar Inverters
Types
● 10-FZ07BIA030SG-P894E38
● 10-PZ07BIA030SG-P894E38Y
Maximum Ratings
T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
Condition
Value
Unit
H-Bridge Switch
VCES
IC
Collector-emitter voltage
650
30
V
A
Collector current
Tj = Tjmax
Ts = 80 °C
ICRM
Ptot
VGES
Repetitive peak collector current
Total power dissipation
Gate-emitter voltage
tp limited by Tjmax
Tj = Tjmax
90
A
Ts = 80 °C
70
W
V
±20
tSC
Tj ≤ 150 °C
VGE = 15 V
5
µs
V
Short circuit ratings
VCC
400
Tjmax
Maximum junction temperature
175
°C
Copyright Vincotech
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08 Jan. 2018 / Revision 1
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10-PZ07BIA030SG-P894E38Y
datasheet
Maximum Ratings
Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Condition
Value
Unit
H-Bridge Diode
VRRM
IF
Ptot
Tjmax
Peak Repetitive Reverse Voltage
650
15
V
A
Continuous (direct) forward current
Total power dissipation
Tj = Tjmax
Ts = 80 °C
14
W
°C
Maximum Junction Temperature
175
Boost Switch
VCES
IC
Collector-emitter voltage
650
30
V
A
Collector current
Tj = Tjmax
Ts = 80 °C
Ts = 80 °C
ICRM
Ptot
VGES
Repetitive peak collector current
Total power dissipation
Gate-emitter voltage
tp limited by Tjmax
Tj = Tjmax
90
A
70
W
V
±20
tSC
Tj ≤ 150 °C
VGE = 15 V
5
µs
V
Short circuit ratings
VCC
400
Tjmax
Maximum junction temperature
175
°C
Boost Diode
VRRM
IF
Ptot
Tjmax
Peak Repetitive Reverse Voltage
650
15
V
A
Continuous (direct) forward current
Total power dissipation
Tj = Tjmax
Ts = 80 °C
14
W
°C
Maximum Junction Temperature
175
Boost Sw. Protection Diode
VRRM
Peak repetitive reverse voltage
Continuous (direct) forward current
Repetitive peak forward current
Total power dissipation
650
10
V
A
IF
Tj = Tjmax
Ts = 80 °C
Ts = 80 °C
IFRM
Ptot
20
A
Tj = Tjmax
33
W
°C
Tjmax
Maximum junction temperature
175
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datasheet
Maximum Ratings
Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Condition
Value
Unit
ByPass Diode
VRRM
IF
IFSM
I2t
Ptot
Tjmax
Peak Repetitive Reverse Voltage
1600
35
V
A
Continuous (direct) forward current
Surge (non-repetitive) forward current
Surge current capability
Tj = Tjmax
Ts = 80 °C
Tj = 150 °C
Ts = 80 °C
270
370
56
A
50 Hz Single Half Sine Wave
tp = 10 ms
A2s
W
°C
Total power dissipation
Tj = Tjmax
Maximum Junction Temperature
150
Module Properties
Thermal Properties
Storage temperature
Tstg
Tjop
-40…+125
°C
°C
Operation temperature under switching condition
Isolation Properties
-40…(Tjmax - 25)
DC Test Voltage*
AC Voltage
tp = 2 s
6000
2500
V
Visol
Isolation voltage
tp = 1 min
V
Creepage distance
min. 12,7
8,66 / 9,17
> 200
mm
mm
Clearance
Solder pin / Press-fit pin
Comparative Tracking Index
*100 % tested in production
CTI
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datasheet
Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VCE [V] IC [A]
VGE [V]
VGS [V]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
Min
Max
H-Bridge Switch
Static
VGE(th)
Gate-emitter threshold voltage
VGE = VCE
0,00043 25
25
4,2
5,1
5,6
V
V
1,48
1,92
2,22
2,30
2,32
VCEsat
Collector-emitter saturation voltage
15
30
125
150
ICES
IGES
rg
Collector-emitter cut-off current
Gate-emitter leakage current
Internal gate resistance
Input capacitance
0
650
0
25
25
1,6
µA
nA
Ω
20
300
none
1900
55
Cies
Cres
f = 1 Mhz
0
25
25
pF
Reverse transfer capacitance
Thermal
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
1,35
K/W
Dynamic
25
278
266
262
63
td(on)
125
150
25
Turn-on delay time
tr
Rise time
125
150
25
125
150
25
125
150
25
125
150
25
67
70
148
164
169
4
Rgoff = 16 Ω
Rgon = 16 Ω
ns
td(off)
Turn-off delay time
Fall time
±15
350
30
tf
7
8
1,12
1,60
1,77
0,232
0,343
0,382
Qr
FWD
Qr
FWD
Qr
FWD
= 0,5 μC
= 1,5 μC
= 1,9 μC
Eon
Turn-on energy (per pulse)
Turn-off energy (per pulse)
mWs
Eoff
125
150
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Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VCE [V] IC [A]
VGE [V]
VGS [V]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
Min
Max
H-Bridge Diode
Static
25
1,44
1,20
1,14
0
5
VF
Ir
Forward voltage
15
125
150
V
Reverse leakage current
650
25
µA
Thermal
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
1,95
K/W
Dynamic
25
9
IRRM
125
150
25
125
150
25
125
150
25
125
150
25
14
15
Peak recovery current
A
140
204
225
0,548
1,54
1,87
0,092
0,250
0,306
419
88
trr
Qr
Reverse recovery time
ns
di/dt = 484 A/μs
di/dt = 486 A/μs
di/dt = 392 A/μs
±15
350
30
Recovered charge
μC
Erec
Reverse recovered energy
Peak rate of fall of recovery current
mWs
A/µs
(dirf/dt)max
125
150
95
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Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VCE [V] IC [A]
VGE [V]
VGS [V]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
Min
Max
Boost Switch
Static
VGE(th)
Gate-emitter threshold voltage
VGE = VCE
0,00043 25
25
4,2
5,1
5,6
V
V
1,48
1,92
2,22
2,30
2,32
VCEsat
Collector-emitter saturation voltage
15
30
125
150
ICES
IGES
rg
Collector-emitter cut-off current
Gate-emitter leakage current
Internal gate resistance
Input capacitance
0
650
0
25
25
1,6
µA
nA
Ω
20
300
none
1900
55
Cies
Cres
f = 1 Mhz
0
25
25
pF
Reverse transfer capacitance
Thermal
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
1,35
K/W
Dynamic
25
93
81
78
td(on)
125
150
25
Turn-on delay time
56
tr
Rise time
125
150
25
125
150
25
125
150
25
125
150
25
61
64
370
400
405
12
Rgoff = 16 Ω
Rgon = 16 Ω
ns
td(off)
Turn-off delay time
Fall time
15/0
400
30
tf
10
9
1,26
1,85
2,01
0,488
0,624
0,632
Qr
FWD
Qr
FWD
Qr
FWD
= 0,7 μC
= 1,6 μC
= 1,9 μC
Eon
Turn-on energy (per pulse)
Turn-off energy (per pulse)
mWs
Eoff
125
150
Copyright Vincotech
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Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VCE [V] IC [A]
VGE [V]
VGS [V]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
Min
Max
Boost Diode
Static
25
1,44
1,20
1,14
0
5
VF
Ir
Forward voltage
15
125
150
V
Reverse leakage current
650
25
µA
Thermal
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
1,95
K/W
Dynamic
25
10
15
15
IRRM
125
150
25
Peak recovery current
A
139
trr
Qr
Reverse recovery time
125
150
25
125
150
25
125
150
25
125
150
191
205
ns
di/dt = 449 A/μs
di/dt = 455 A/μs
di/dt = 413 A/μs
0,716
1,62
1,87
0,162
0,287
0,328
516
15/0
400
30
Recovered charge
μC
Erec
Reverse recovered energy
Peak rate of fall of recovery current
mWs
A/µs
(dirf/dt)max
80
113
Boost Sw. Protection Diode
Static
25
125
1,67
1,56
1,87
0,14
VF
IR
Forward voltage
Reverse leakage current
Thermal
10
V
650
25
µA
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
2,87
K/W
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Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VCE [V] IC [A]
VGE [V]
VGS [V]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
Min
Max
ByPass Diode
Static
25
0,8
1,17
1,13
1,6
Forward voltage
Reverse leakage current
Thermal
VF
Ir
35
V
125
25
50
1600
145
µA
1100
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
1,25
22
K/W
Thermistor
Rated resistance
R
ΔR/R
P
25
100
25
25
25
25
kΩ
%
Deviation of R100
Power dissipation
Power dissipation constant
B-value
R100 = 1486 Ω
-12
+14
200
2
mW
mW/K
K
B(25/50) Tol. ±3%
B(25/100) Tol. ±3%
3950
3998
B-value
K
Vincotech NTC Reference
B
Copyright Vincotech
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datasheet
H-Bridge Switch Characteristics
figure 1.
IGBT
figure 2.
IGBT
Typical output characteristics
Typical output characteristics
I C = f(VCE
)
I C = f(VCE)
VGE
:
I
I
I
I
I
I
I
I
tp
=
250
15
μs
V
25 °C
125 °C
150 °C
tp
=
250
150
7 V to 17 V in steps of 1 V
μs
VGE
=
Tj:
Tj =
°C
VGE from
figure 3.
IGBT
figure 4.
IGBT
Typical transfer characteristics
Transient thermal impedance as function of pulse duration
I C = f(VGE
)
Z th(j-s) = f(tp)
101
I
I
I
I
Z
Z
Z
Z
100
10-1
10-2
10-5
10-4
10-3
10-2
10-1
100
101
tp(s)
102
tp
=
100
10
μs
V
25 °C
125 °C
150 °C
D =
R th(j-s)
tp / T
VCE
=
Tj:
=
1,35
K/W
IGBT thermal model values
(K/W)
R
τ
(s)
1,08E-01
2,99E-01
6,53E-01
2,20E-01
6,40E-02
8,48E-03
9,29E-01
1,46E-01
4,83E-02
7,47E-03
8,48E-04
5,70E-04
Copyright Vincotech
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10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
H-Bridge Switch Characteristics
figure 5.
IGBT
Safe operating area
I C = f(VCE
)
I
I
I
I
D =
single pulse
Ts
=
80
ºC
VGE
=
±15
Tjmax
V
Tj =
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10-PZ07BIA030SG-P894E38Y
datasheet
H-Bridge Diode Characteristics
figure 1.
FWD
figure 2.
FWD
Typical forward characteristics
Transient thermal impedance as a function of pulse width
I F = f(VF)
Z th(j-s) = f(tp)
101
Z
Z
Z
Z
100
D = 0,5
0,2
10-1
0,1
0,05
0,02
0,01
0,005
0,000
10-2
10-4
=
10-3
10-2
10-1
100
101
102
D =
R th(j-s)
tp
=
250
μs
25 °C
125 °C
150 °C
tp / T
1,95
Tj:
K/W
FWD thermal model values
R (K/W)
τ
(s)
6,76E-02
1,40E-01
6,86E-01
5,59E-01
3,18E-01
1,83E-01
3,64E+00
5,05E-01
7,72E-02
2,36E-02
4,16E-03
1,00E-03
Copyright Vincotech
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datasheet
Boost Switch Characteristics
figure 1.
IGBT
figure 2.
IGBT
Typical output characteristics
Typical output characteristics
I C = f(VCE
)
I C = f(VCE)
VGE
:
I
I
I
I
I
I
I
I
tp
=
250
15
μs
V
25 °C
125 °C
150 °C
tp
Tj
=
=
250
150
7 V to 17 V in steps of 1 V
μs
VGE
=
Tj:
°C
VGE from
figure 3.
IGBT
figure 4.
IGBT
Typical transfer characteristics
Transient thermal impedance as function of pulse duration
I C = f(VGE
)
Z th(j-s) = f(tp)
101
I
I
I
I
Z
Z
Z
Z
100
10-1
10-2
10-5
10-4
10-3
10-2
10-1
100
101
tp(s)
102
tp
=
100
10
μs
V
25 °C
125 °C
150 °C
D
=
tp
1,35
IGBT thermal model values
(K/W)
/ T
VCE
=
Tj:
R th(j-s)
=
K/W
R
τ
(s)
1,08E-01
2,99E-01
6,53E-01
2,20E-01
6,40E-02
8,48E-03
9,29E-01
1,46E-01
4,83E-02
7,47E-03
8,48E-04
5,70E-04
Copyright Vincotech
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datasheet
Boost Switch Characteristics
figure 5.
IGBT
Safe operating area
I C = f(VCE
)
I
I
I
I
D =
single pulse
Ts
=
80
ºC
VGE
=
±15
Tjmax
V
Tj =
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datasheet
Boost Diode Characteristics
figure 1.
FWD
figure 2.
FWD
Typical forward characteristics
Transient thermal impedance as a function of pulse width
I F = f(VF)
Z th(j-s) = f(tp)
101
Z
Z
Z
Z
100
D = 0,5
0,2
10-1
0,1
0,05
0,02
0,01
0,005
0,000
10-2
10-4
=
10-3
10-2
10-1
100
101
102
D =
R th(j-s)
tp
=
250
μs
25 °C
125 °C
150 °C
tp / T
1,95
Tj:
K/W
FWD thermal model values
R (K/W)
τ
(s)
6,76E-02
1,40E-01
6,86E-01
5,59E-01
3,18E-01
1,83E-01
3,64E+00
5,05E-01
7,72E-02
2,36E-02
4,16E-03
1,00E-03
Copyright Vincotech
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datasheet
Boost Sw. Protection Diode Characteristics
figure 1.
FWD
figure 2.
FWD
Typical forward characteristics
Transient thermal impedance as a function of pulse width
I F = f(VF)
Z th(j-s) = f(tp)
101
Z
Z
Z
Z
100
10-1
10-2
10-4
=
10-3
10-2
10-1
100
101
102
tp
=
250
μs
25 °C
125 °C
D =
R th(j-s)
tp / T
2,87
Tj:
K/W
FWD thermal model values
R (K/W)
τ
(s)
6,53E-02
1,48E-01
1,31E+00
7,32E-01
4,04E-01
2,11E-01
3,94E+00
4,48E-01
5,96E-02
1,36E-02
2,79E-03
5,37E-04
Copyright Vincotech
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datasheet
ByPass Diode Characteristics
figure 1.
Bypass diode
figure 2.
Bypass diode
Typical forward characteristics
Transient thermal impedance as a function of pulse width
I F = f(VF)
Z th(j-s) = f(tp)
101
Z
Z
Z
Z
100
D = 0,5
10-1
0,2
0,1
0,05
0,02
0,01
0,005
0,000
10-2
10-4
10-3
10-2
10-1
100
101
D =
R th(j-s)
tp
=
250
μs
25 °C
125 °C
tp / T
T j:
=
1,25
K/W
Diode thermal model values
R (K/W)
τ
(s)
8,00E-02
1,56E-01
6,95E-01
2,23E-01
9,97E-02
5,22E+00
4,18E-01
8,82E-02
3,07E-02
5,99E-03
NTC Characteristics
Typical Thermistor resistance values
figure 1.
Thermistor
Typical NTC characteristic
as a function of temperature
R = f(T)
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datasheet
H-Bridge Switching Characteristics
figure 1.
IGBT
figure 2.
IGBT
Typical switching energy losses as a function of collector current
Typical switching energy losses as a function of gate resistor
E = f(R g)
E = f(I C
)
E
E
E
E
E E
E E
25 °C
25 °C
125 °C
150 °C
With an inductive load at
With an inductive load at
:
125 °C
150 °C
350
±15
30
V
V
A
VCE
VGE
=
=
=
=
350
±15
16
V
V
Ω
Ω
T
j
VCE
VGE
I C
=
=
=
Tj:
R gon
R goff
16
figure 3.
FWD
figure 4.
FWD
Typical reverse recovered energy loss as a function of collector current
Typical reverse recovered energy loss as a function of gate resistor
Erec = f(I c)
Erec = f(R g)
E
E
E
E
E
E
E
E
25 °C
125 °C
150 °C
25 °C
125 °C
150 °C
With an inductive load at
With an inductive load at
350
±15
16
V
V
Ω
Tj:
VCE
VGE
I C
=
=
=
350
±15
30
V
V
A
:
Tj
VCE
VGE
=
=
=
R gon
Copyright Vincotech
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H-Bridge Switching Characteristics
figure 5.
IGBT
figure 6.
IGBT
Typical switching times as a function of collector current
Typical switching times as a function of gate resistor
t = f(I C)
t = f(R g)
t
t
t
t
t
t
t
t
With an inductive load at
With an inductive load at
Tj =
150
350
±15
16
°C
V
Tj =
150
350
±15
30
°C
V
VCE
=
=
=
=
VCE
=
=
=
V
V
VGE
R gon
R goff
VGE
I C
Ω
Ω
A
16
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery time as a function of collector current
Typical reverse recovery time as a function of IGBT turn on gate resistor
t rr = f(I C
)
trr = f(R gon
)
t
t
t
t
t
t
t
t
350
At
VCE
=
350
±15
16
V
V
Ω
25 °C
125 °C
150 °C
At
VCE
=
V
V
A
25 °C
125 °C
150 °C
:
Tj
±15
30
:
Tj
VGE
R gon
=
=
VGE
I C
=
=
Copyright Vincotech
18
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
H-Bridge Switching Characteristics
figure 9.
FWD
figure 10.
FWD
Typical recovered charge as a function of collector current
Typical recovered charge as a function of IGBT turn on gate resistor
Q r = f(I C
)
Q r = f(R gon)
Q
Q
Q
Q
Q
Q
Q
Q
350
25 °C
350
V
V
Ω
V
V
A
25 °C
125 °C
150 °C
At
VCE
VGE
R gon
=
At
VCE
VGE
I C
=
±15
16
:
Tj
125 °C
150 °C
=
±15
30
:
Tj
=
=
=
figure 11.
FWD
figure 12.
FWD
Typical peak reverse recovery current current as a function of collector current
Typical peak reverse recovery current as a function of IGBT turn on gate resistor
I RM = f(I C
)
I RM = f(R gon
)
I
I
I I
I I
I
I
350
25 °C
At
VCE
=
V
V
Ω
At
VCE
=
350
±15
30
V
V
A
25 °C
125 °C
150 °C
±15
16
:
Tj
125 °C
150 °C
:
Tj
VGE
=
=
VGE
I C
=
R gon
=
Copyright Vincotech
19
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
H-Bridge Switching Characteristics
figure 13.
FWD
figure 14.
FWD
Typical rate of fall of forward and reverse recovery current as a function of collector current
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor
di F/dt, di rr/dt = f(I C
)
di F/dt, di rr/dt = f(R gon
)
diF/dt
diF
/
dt
t
t
t
t
t
t
t
t
di
rr/dt
i
i
i
i
dir r
/dt
i
i
i
i
At
VCE
=
350
±15
16
V
V
Ω
25 °C
125 °C
150 °C
At
VCE
VGE
I C
=
350
±15
30
V
V
A
25 °C
:
Tj
:
Tj
125 °C
150 °C
VGE
=
=
=
R gon
=
figure 15.
IGBT
Reverse bias safe operating area
I C = f(VCE
)
I
I
I
I
IC MAX
I
I
I
I
I
I
I
I
V
V
V
V
At
Tj
=
=
=
175
°C
16
16
Ω
Ω
R gon
R goff
Copyright Vincotech
20
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
H-Bridge Switching Definitions
General conditions
=
=
=
125 °C
16 Ω
T j
R gon
R goff
16 Ω
figure 1.
IGBT
figure 2.
IGBT
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)
tdoff
IC
VCE
VGE
tEoff
VGE
IC
VCE
tEon
VGE (0%) =
-15
V
VGE (0%) =
-15
V
VGE (100%) =
VC (100%) =
I C (100%) =
15
V
VGE (100%) =
VC (100%) =
I C (100%) =
15
V
350
30
V
350
30
V
A
A
0,164
0,229
μs
μs
0,266
0,572
μs
μs
t doff
t Eoff
=
=
tdon
tEon
=
=
figure 3.
IGBT
figure 4.
IGBT
Turn-off Switching Waveforms & definition of tf
Turn-on Switching Waveforms & definition of tr
IC
VCE
IC
VCE
tr
tf
350
30
V
350
30
V
VC (100%) =
I C (100%) =
t f =
VC (100%) =
I C (100%) =
A
A
0,007
μs
0,067
μs
tr
=
Copyright Vincotech
21
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
H-Bridge Switching Characteristics
figure 5.
IGBT
figure 6.
IGBT
Turn-off Switching Waveforms & definition of tEoff
Turn-on Switching Waveforms & definition of tEon
Eoff
Eon
Pon
Poff
tEoff
tEon
P off (100%) =
Eoff (100%) =
10,43
0,34
0,23
kW
mJ
μs
P on (100%) =
Eon (100%) =
10,43
1,60
0,57
kW
mJ
μs
t Eoff
=
tEon =
figure 7.
FWD
Turn-off Switching Waveforms & definition of trr
IF
VF
fitted
VF (100%) =
I F (100%) =
I RRM (100%) =
350
30
V
A
-14
0,204
A
μs
t rr
=
Copyright Vincotech
22
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
H-Bridge Switching Characteristics
figure 8.
FWD
figure 9.
FWD
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)
Turn-on Switching Waveforms & definition of tErec (tErec= integrating time for Erec)
IF
Qr
Erec
tErec
Prec
30
A
10,43
0,25
0,41
kW
I F (100%) =
Q r (100%) =
P rec (100%) =
Erec (100%) =
1,54
0,41
μC
μs
mJ
μs
t Qr
=
tErec =
Copyright Vincotech
23
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Boost Switching Characteristics
figure 1.
IGBT
figure 2.
IGBT
Typical switching energy losses as a function of collector current
Typical switching energy losses as a function of gate resistor
E = f(R g)
E = f(I C
)
E
E
E
E
E
E
E
E
25 °C
25 °C
125 °C
150 °C
With an inductive load at
With an inductive load at
:
125 °C
150 °C
400
15/0
30
V
V
A
VCE
VGE
=
=
=
=
400
15/0
16
V
V
Ω
Ω
T
j
VCE
VGE
I C
=
=
=
Tj:
R gon
R goff
16
figure 3.
FWD
figure 4.
FWD
Typical reverse recovered energy loss as a function of collector current
Typical reverse recovered energy loss as a function of gate resistor
Erec = f(I c)
Erec = f(R g)
E
E
E
E
E
E
E
E
25 °C
125 °C
150 °C
25 °C
125 °C
150 °C
With an inductive load at
With an inductive load at
400
15/0
16
V
V
Ω
Tj:
VCE
VGE
I C
=
=
=
400
15/0
30
V
V
A
:
Tj
VCE
VGE
=
=
=
R gon
Copyright Vincotech
24
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Boost Switching Characteristics
figure 5.
IGBT
figure 6.
IGBT
Typical switching times as a function of collector current
Typical switching times as a function of gate resistor
t = f(I C)
t = f(R g)
t
t
t
t
t
t
t
t
With an inductive load at
With an inductive load at
Tj =
150
400
15/0
16
°C
V
Tj =
150
400
15/0
30
°C
V
VCE
=
=
=
=
VCE
=
=
=
V
V
VGE
R gon
R goff
VGE
I C
Ω
Ω
A
16
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery time as a function of collector current
Typical reverse recovery time as a function of IGBT turn on gate resistor
t rr = f(I C
)
trr = f(R gon
)
t
t
t
t
t
t
t
t
400
A
t
VCE
=
400
15/0
16
V
V
Ω
25 °C
125 °C
150 °C
At
VCE
=
V
V
A
25 °C
125 °C
150 °C
:
Tj
15/0
30
:
Tj
VGE
R gon
=
=
VGE
I C
=
=
Copyright Vincotech
25
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Boost Switching Characteristics
figure 9.
FWD
figure 10.
FWD
Typical recovered charge as a function of collector current
Typical recovered charge as a function of IGBT turn on gate resistor
Q r = f(I C
)
Q r = f(R gon)
Q
Q
Q
Q
Q
Q
Q
Q
400
25 °C
400
V
V
Ω
V
V
A
25 °C
125 °C
150 °C
At
VCE
VGE
R gon
=
At
VCE
VGE
I C
=
15/0
16
:
Tj
125 °C
150 °C
=
15/0
30
:
Tj
=
=
=
figure 11.
FWD
figure 12.
FWD
Typical peak reverse recovery current current as a function of collector current
Typical peak reverse recovery current as a function of IGBT turn on gate resistor
I RM = f(I C
)
I RM = f(R gon
)
I
I
I I
I I
I
I
400
25 °C
A
t
VCE
=
V
V
Ω
At
VCE
=
400
15/0
30
V
V
A
25 °C
125 °C
150 °C
15/0
16
:
Tj
125 °C
150 °C
:
Tj
VGE
=
=
VGE
I C
=
R gon
=
Copyright Vincotech
26
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Boost Switching Characteristics
figure 13.
FWD
figure 14.
FWD
Typical rate of fall of forward and reverse recovery current as a function of collector current
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor
di F/dt, di rr/dt = f(I C
)
di F/dt, di rr/dt = f(R gon
)
diF/dt
diF
/
dt
t
t
t
t
t
t
t
t
di
rr/dt
i
i
i
i
dir r
/dt
i
i
i
i
At
VCE
=
400
V
V
Ω
25 °C
125 °C
150 °C
At
VCE
VGE
I C
=
400
V
V
A
25 °C
15/0
16
:
Tj
15/0
30
:
Tj
125 °C
150 °C
VGE
=
=
=
R gon
=
figure 15.
IGBT
Reverse bias safe operating area
I C = f(VCE
)
I
I
I
I
IC MAX
I
I
I
I
I
I
I
I
V
V
V
V
At
Tj
=
=
=
175
°C
Ω
16
16
R gon
R goff
Ω
Copyright Vincotech
27
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Boost Switching Definitions
General conditions
=
=
=
125 °C
16 Ω
T j
R gon
R goff
16 Ω
figure 1.
IGBT
figure 2.
IGBT
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)
tdoff
IC
VCE
VGE
tEoff
IC
VGE
VCE
tEon
VGE (0%) =
0
V
VGE (0%) =
0
V
VGE (100%) =
VC (100%) =
I C (100%) =
15
V
VGE (100%) =
VC (100%) =
I C (100%) =
15
V
400
30
V
400
30
V
A
A
0,400
0,471
μs
μs
0,081
0,387
μs
μs
t doff
t Eoff
=
=
tdon
tEon
=
=
figure 3.
IGBT
figure 4.
IGBT
Turn-off Switching Waveforms & definition of tf
Turn-on Switching Waveforms & definition of tr
IC
IC
VCE
VCE
tr
tf
400
400
30
V
V
VC (100%) =
I C (100%) =
t f =
VC (100%) =
I C (100%) =
A
30
A
0,010
μs
0,061
μs
tr
=
Copyright Vincotech
28
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Boost Switching Characteristics
figure 5.
IGBT
figure 6.
IGBT
Turn-off Switching Waveforms & definition of tEoff
Turn-on Switching Waveforms & definition of tEon
Eoff
Eon
Pon
Poff
tEoff
tEon
P off (100%) =
Eoff (100%) =
11,92
0,62
0,47
kW
mJ
μs
P on (100%) =
Eon (100%) =
11,92
1,85
0,39
kW
mJ
μs
t Eoff
=
tEon =
figure 7.
FWD
Turn-off Switching Waveforms & definition of trr
IF
VF
fitted
VF (100%) =
I F (100%) =
I RRM (100%) =
400
30
V
A
-15
0,191
A
μs
t rr
=
Copyright Vincotech
29
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Boost Switching Characteristics
figure 8.
FWD
figure 9.
FWD
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)
Turn-on Switching Waveforms & definition of tErec (tErec= integrating time for Erec)
Erec
IF
Qr
tErec
Prec
30
A
11,92
0,29
0,39
kW
I F (100%) =
Q r (100%) =
P rec (100%) =
Erec (100%) =
1,62
0,39
μC
μs
mJ
μs
t Qr
=
tErec =
Copyright Vincotech
30
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Ordering Code & Marking
Version
without thermal paste 12 mm housing with solder pins
without thermal paste 12 mm housing with press-fit pins
with thermal paste 12 mm housing with solder pins
with thermal paste 12 mm housing with press-fit pins
Ordering Code
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
10-FZ07BIA030SG-P894E38-/3/
10-PZ07BIA030SG-P894E38Y-/3/
Name
Date code
WWYY
Serial
UL & VIN
UL VIN
Lot
Serial
NN-NNNNNNNNNNNNNN
TTTTTTVV WWYY UL
VIN LLLLL SSSS
Text
NN-NNNNNNNNNNNNNN-TTTTTTVV
LLLLL
SSSS
Type&Ver
Lot number
Date code
WWYY
Datamatrix
TTTTTTTVV
LLLLL
SSSS
Outline
Pin table
Pin
1
X
Y
Function
G4
28,7
25,9
23,1
17,6
12,1
9,3
2,8
0
0
2
0
S4
-INV
+INV
G3
3
0
4
0
5
0
0
6
S3
7
0
G5
8
0
S5
9
0
5,05
10,55
-DC
+DC
10
0
11
12
13
0
0
9,3
16,15
22,6
22,6
Sol
Boost
S1
14
15
16
17
18
19
20
21
22
23
12,1
17,6
23,1
25,9
28,7
33,6
33,6
33,6
33,6
22,6
22,6
22,6
22,6
22,6
20,05
14,55
8,05
2,55
G1
+INV
-INV
S2
G2
L1
R1
R2
L2
Not assembled
Copyright Vincotech
31
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Pinout
Identification
ID
Component
IGBT
Voltage
650 V
Current
Function
Comment
T1 , T2 , T3 , T4
D1 , D2 , D3 , D4
30 A
15 A
30 A
15 A
10 A
35 A
H-Bridge Switch
H-Bridge Diode
Boost Switch
FWD
650 V
T5
D8
IGBT
FWD
650 V
650 V
650 V
1600 V
Boost Diode
D5
FWD
Boost Sw. Protection Diode
ByPass Diode
D7
Rectifier
NTC
NTC
Thermistor
Copyright Vincotech
32
08 Jan. 2018 / Revision 1
10-FZ07BIA030SG-P894E38
10-PZ07BIA030SG-P894E38Y
datasheet
Packaging instruction
Handling instruction
Standard packaging quantity (SPQ) 135
>SPQ
Standard
<SPQ
Sample
Handling instructions for flow 0 packages see vincotech.com website.
Package data
Package data for flow 0 packages see vincotech.com website.
UL recognition and file number
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.
Document No.:
Date:
Modification:
Pages
10-xZ07BIA030SG-P894E38x-D1-14
08 Jan. 2018
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine
the suitability of the information and the product for reader’s intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval
of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or effectiveness.
Copyright Vincotech
33
08 Jan. 2018 / Revision 1
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