SI3851DV [VISHAY]

P-Channel 30-V (D-S) MOSFET With Schottky Diode; P通道30 - V(D -S)的MOSFET利用肖特基二极管
SI3851DV
型号: SI3851DV
厂家: VISHAY    VISHAY
描述:

P-Channel 30-V (D-S) MOSFET With Schottky Diode
P通道30 - V(D -S)的MOSFET利用肖特基二极管

晶体 肖特基二极管 晶体管
文件: 总6页 (文件大小:72K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si3851DV  
Vishay Siliconix  
New Product  
P-Channel 30-V (D-S) MOSFET With Schottky Diode  
MOSFET PRODUCT SUMMARY  
VDS (V)  
rDS(on) (W)  
ID (A)  
0.200 @ V = –10 V  
"1.8  
"1.2  
GS  
–30  
0.360 @ V = –4.5 V  
GS  
SCHOTTKY PRODUCT SUMMARY  
Vf (v)  
VKA (V)  
IF (A)  
Diode Forward Voltage  
30  
0.5 V @ 0.5 A  
0.5  
S
K
TSOP-6  
Top View  
A
S
K
1
2
3
6
5
G
3 mm  
N/C  
D
G
4
2.85 mm  
D
A
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T= _2C5 UNLESS OTHERWISE NOTED)  
A
Parameter  
Symbol  
5 sec  
Steady State  
Unit  
Drain-Source Voltage (MOSFET and Schottky)  
Reverse Voltage (Schottky)  
V
–30  
30  
DS  
KA  
V
V
Gate-Source Voltage (MOSFET)  
V
GS  
"20  
"20  
T
= 25_C  
= 70_C  
"1.6  
"1.2  
"1.8  
"1.5  
A
a
Continuous Drain Current (T = 150_C) (MOSFET)  
I
J
D
T
A
Pulsed Drain Current (MOSFET)  
I
I
"7  
DM  
A
a
Continuous Source Current (MOSFET Diode Conduction)  
Average Foward Current (Schottky)  
I
–1.05  
–0.75  
S
I
0.5  
7
F
Pulsed Foward Current (Schottky)  
FM  
T
= 25_C  
= 70_C  
= 25_C  
= 70_C  
1.15  
0.73  
1.0  
0.83  
0.53  
0.76  
0.48  
A
a
Maximum Power Dissipation (MOSFET)  
T
A
P
W
D
T
A
a
Maximum Power Dissipation (Schottky)  
T
A
0.64  
Operating Junction and Storage Temperature Range  
T , T  
J
–55 to 150  
_C  
stg  
Notes  
a. Surface Mounted on 1” x 1” FR4 Board.  
Document Number: 70978  
S-61845—Rev. A, 11-Oct-99  
www.vishay.com S FaxBack 408-970-5600  
2-1  
Si3851DV  
New Product  
Vishay Siliconix  
THERMAL RESISTANCE RATINGS  
Parameter  
Device  
Symbol  
Typical  
Maximum Unit  
MOSFET  
Schottky  
MOSFET  
Schottky  
MOSFET  
Schottky  
93  
103  
130  
140  
75  
110  
125  
t v 5 sec  
Steady State  
Steady State  
Junction-to-Ambient  
Junction-to-Foot  
R
thJA  
thJF  
150  
_
C/W  
165  
90  
95  
R
80  
Notes  
a. Surface Mounted on 1” x 1” FR4 Board.  
MOSFET SPECIFICATIONS (T= _2C5 UNLESS OTHERWISE NOTED)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Static  
Gate Threshold Voltage  
Gate-Body Leakage  
V
V
= V , I = –250 mA  
–1.0  
V
GS(th)  
DS  
GS  
D
V
DS  
= 0 V, V = "20 V  
GS  
I
"100  
nA  
GSS  
V
= –24 V, V = 0 V  
–1  
DS  
GS  
Zero Gate Voltage Drain Current  
I
mA  
DSS  
V
DS  
= –24 V, V = 0 V, T = 75_C  
–10  
GS  
J
a
On-State Drain Current  
I
V
DS  
w –5 V, V = –10 V  
–5  
A
D(on)  
GS  
V
= –10 V, I = –1.8 A  
0.165  
0.298  
0.200  
0.360  
GS  
GS  
D
a
Drain-Source On-State Resistance  
r
W
DS(on)  
V
= –4.5 V, I = –1.2 A  
D
a
Forward Transconductance  
g
V
= –15 V, I = –1.8 A  
2.4  
S
V
fs  
DS  
D
a
Diode Forward Voltage  
V
SD  
I
S
= –1.05 A, V = 0 V  
–0.83  
–1.10  
3.6  
GS  
Dynamicb  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Q
2.4  
0.9  
0.8  
8
g
V
= –15 V, V = –5 V, I = –1.8 A  
nC  
ns  
Q
gs  
Q
gd  
DS  
GS  
D
t
12  
18  
18  
11  
60  
d(on)  
t
12  
12  
7
r
V
= –15 V, R = 15 W  
L
= –10 V, R = 6 W  
GEN G  
DD  
I
^ –1 A, V  
D
Turn-Off Delay Time  
Fall Time  
t
d(off)  
t
f
Source-Drain Reverse Recovery Time  
t
rr  
I
F
= –1.05 A, di/dt = 100 A/ms  
30  
Notes  
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.  
b. Guaranteed by design, not subject to production testing.  
SCHOTTKY SPECIFICATIONS (T= _2C5 UNLESS OTHERWISE NOTED)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
I
= 0.5 A  
0.45  
0.35  
0.002  
0.06  
1.5  
0.5  
0.4  
0.100  
1
F
Forward Voltage Drop  
V
V
F
I
= 0.5 A, T = 125_C  
F
J
V = 30 V  
r
V = 30 V, T = 75_C  
Maximum Reverse Leakage Current  
Junction Capacitance  
I
rm  
mA  
pF  
r
J
V = 30 V, T = 125_C  
10  
r
J
V = 10 V  
r
C
24  
T
Document Number: 70978  
S-61845—Rev. A, 11-Oct-99  
www.vishay.com S FaxBack 408-970-5600  
2-2  
Si3851DV  
Vishay Siliconix  
New Product  
TYPICAL CHARACTERISTICS (_2C5 UNLESS NOTED)  
MOSFET  
Output Characteristics  
Transfer Characteristics  
10  
8
6
4
2
0
6 V  
V
GS  
= 10 thru 7 V  
T
C
= –55_C  
8
25_C  
5 V  
6
4
2
0
125_C  
4 V  
3 V  
2 V  
0
1
2
3
4
5
0
1
2
3
4
5
6
V
DS  
– Drain-to-Source Voltage (V)  
V
GS  
– Gate-to-Source Voltage (V)  
On-Resistance vs. Drain Current  
Capacitance  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
300  
240  
180  
120  
60  
C
iss  
V
= 4.5 V  
GS  
V
GS  
= 10 V  
C
oss  
C
rss  
0
0
1
2
3
4
5
6
7
0
6
12  
18  
24  
30  
I
D
– Drain Current (A)  
V
DS  
– Drain-to-Source Voltage (V)  
Gate Charge  
On-Resistance vs. Junction Temperature  
10  
8
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
V
= 15 V  
V
GS  
= 10 V  
DS  
I
D
= 1.8  
A
I = 1.8 A  
D
6
4
2
0
0
1
2
3
4
5
–50 –25  
0
25  
50  
75  
100 125 150  
Q
g
Total Gate Charge (nC)  
T – Junction Temperature (_C)  
J
Document Number: 70978  
S-61845—Rev. A, 11-Oct-99  
www.vishay.com S FaxBack 408-970-5600  
2-3  
Si3851DV  
New Product  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (_2C5 UNLESS NOTED)  
MOSFET  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
10  
I
D
= 1.8 A  
I
D
= 1 A  
T = 150_C  
J
1
T = 25_C  
J
0.1  
0
2
4
6
– Gate-to-Source Voltage (V)  
GS  
8
10  
0.00  
0.3  
0.6  
0.9  
1.2  
1.5  
V
SD  
– Source-to-Drain Voltage (V)  
V
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
0.6  
8
0.4  
0.2  
6
I
D
= 250 mA  
4
2
0.0  
–0.2  
–0.4  
0
–50 –25  
0
25  
50  
75  
100 125 150  
0.01  
0.1  
1
10  
30  
Time (sec)  
T – Temperature (_C)  
J
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
Notes:  
P
DM  
0.1  
0.1  
t
1
0.05  
t
2
t
1
1. Duty Cycle, D =  
t
2
0.02  
2. Per Unit Base = R  
= 130_C/W  
thJA  
(t)  
3. T – T = P  
Z
JM  
A
DM thJA  
4. Surface Mounted  
Single Pulse  
0.01  
–4  
–3  
–2  
–1  
10  
10  
10  
10  
1
10  
100  
600  
Square Wave Pulse Duration (sec)  
Document Number: 70978  
S-61845—Rev. A, 11-Oct-99  
www.vishay.com S FaxBack 408-970-5600  
2-4  
Si3851DV  
Vishay Siliconix  
New Product  
TYPICAL CHARACTERISTICS (_2C5 UNLESS NOTED)  
MOSFET  
Normalized Thermal Transient Impedance, Junction-to-Foot  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
–4  
–3  
–2  
–1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (sec)  
TYPICAL CHARACTERISTICS (_2C5 UNLESS NOTED)  
SCHOTTKY  
Reverse Current vs. Junction Temperature  
Forward Voltage Drop  
20  
10  
5
1
1
T = 150_C  
J
0.1  
30 V  
T = 25_C  
J
0.01  
10 V  
0.001  
0.0001  
0.1  
0
25  
50  
75  
100  
125  
150  
0
0.2  
V
0.4  
0.6  
0.8  
1.0  
T
– Junction Temperature (_C)  
– Forward Voltage Drop (V)  
J
F
Capacitance  
125  
100  
75  
50  
25  
0
V
= 10 V  
= 1.8 A  
GS  
I
D
0
6
12  
18  
24  
30  
V
KA  
– Reverse Voltage (V  
Document Number: 70978  
S-61845—Rev. A, 11-Oct-99  
www.vishay.com S FaxBack 408-970-5600  
2-5  
Si3851DV  
New Product  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (_2C5 UNLESS NOTED)  
SCHOTTKY  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
Notes:  
P
DM  
0.1  
0.1  
t
1
0.05  
t
2
t
t
1
1. Duty Cycle, D =  
2
0.02  
2. Per Unit Base = R  
= 140_C/W  
thJA  
(t)  
3. T – T = P  
Z
JM  
A
DM thJA  
4. Surface Mounted  
Single Pulse  
0.01  
–4  
–3  
–2  
–1  
10  
10  
10  
10  
1
10  
100  
600  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
–4  
–3  
–2  
–1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (sec)  
Document Number: 70978  
S-61845—Rev. A, 11-Oct-99  
www.vishay.com S FaxBack 408-970-5600  
2-6  

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