AP93T03AGMT-HF [A-POWER]
Simple Drive Requirement, SO-8 Compatible with Heatsink; 简单的驱动要求, SO- 8兼容散热器![AP93T03AGMT-HF](http://pdffile.icpdf.com/pdf1/p00195/img/icpdf/AP93T0_1102846_icpdf.jpg)
型号: | AP93T03AGMT-HF |
厂家: | ![]() |
描述: | Simple Drive Requirement, SO-8 Compatible with Heatsink |
文件: | 总4页 (文件大小:58K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AP93T03AGMT-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
D
S
▼ Simple Drive Requirement
BVDSS
RDS(ON)
ID
30V
4.5mΩ
86A
▼ SO-8 Compatible with Heatsink
▼ Low On-resistance
G
▼ RoHS Compliant & Halogen-Free
D
D
D
Description
D
AP93T03A series are from Advanced Power innovated design and silicon
process technology to achieve the lowest possible on-resistance and fast
switching performance. It provides the designer with an extreme efficient
device for use in a wide range of power applications.
S
S
S
G
The PMPAK ® 5x6 ppackage is special for voltage conversion application
using standard infrared reflow technique with the backside heat sink to
achieve the good thermal performance.
PMPAK® 5x6
Absolute Maximum Ratings
Symbol
Parameter
Rating
30
Units
V
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
+20
V
Continuous Drain Current (Chip), VGS @ 10V5
Continuous Drain Current3
Continuous Drain Current3
Pulsed Drain Current1
ID@TC=25℃
ID@TA=25℃
ID@TA=70℃
IDM
86
A
25.7
A
20.6
A
160
A
PD@TC=25℃
PD@TA=25℃
EAS
Total Power Dissipation
56.8
W
W
mJ
℃
℃
Total Power Dissipation
5
Single Pulse Avalanche Energy4
Storage Temperature Range
Operating Junction Temperature Range
45
TSTG
-55 to 150
-55 to 150
TJ
Thermal Data
Symbol
Parameter
Value
Unit
℃/W
℃/W
Rthj-c
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient3
2.2
25
Rthj-a
Data and specifications subject to change without notice
1
201303121
AP93T03AGMT-HF
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
RDS(ON)
Parameter
Test Conditions
Min. Typ. Max. Units
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance2 VGS=10V, ID=20A
VGS=0V, ID=250uA
30
-
-
-
V
3.7
4.9
4.5
6.5
mΩ
mΩ
VGS=4.5V, ID=20A
-
VGS(th)
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Gate-Source Leakage
Total Gate Charge
VDS=VGS, ID=250uA
VDS=10V, ID=20A
VDS=24V, VGS=0V
VGS=+20V, VDS=0V
ID=20A
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.4
40
-
3
V
gfs
-
S
IDSS
IGSS
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
Ω
10
-
+100
Qg
19
4.5
10
12
11
38
23
30.4
Qgs
Qgd
td(on)
tr
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
VDS=15V
-
-
-
-
-
-
VGS=4.5V
VDS=15V
ID=1A
td(off)
tf
Turn-off Delay Time
Fall Time
RG=3.3Ω
VGS=10V
Ciss
Coss
Crss
Rg
Input Capacitance
VGS=0V
1820 2900
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
VDS=15V
540
220
1.6
-
-
f=1.0MHz
f=1.0MHz
3.2
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min. Typ. Max. Units
VSD
trr
Forward On Voltage2
IS=20A, VGS=0V
IS=10A, VGS=0V,
dI/dt=100A/µs
-
-
-
-
1.2
V
Reverse Recovery Time
Reverse Recovery Charge
36
27
-
-
ns
nC
Qrr
Notes:
1.Pulse width limited by Max. junction temperature
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 60oC/W at steady state.
4.Starting Tj=25oC , VDD=30V , L=0.1mH , RG=25Ω , IAS=30A.
5.Package limitation current is 60A .
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP93T03AGMT-HF
120
100
80
60
40
20
0
200
160
120
80
C =25 o C
T C = 150 o
C
10V
7.0V
6.0V
10V
7.0V
6.0V
T
5.0V
5.0V
V G = 4.0V
V
G = 4.0V
40
0
0
4
8
12
16
0
2
4
6
8
10
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
5.4
1.8
1.6
1.4
1.2
1.0
0.8
0.6
I D =20A
I D = 20 A
C =25 o C
V
G =10V
T
5
4.6
4.2
3.8
3.4
Ω
2
4
6
8
10
-50
0
50
100
150
T j , Junction Temperature ( o C)
V GS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
20
16
12
8
2.0
1.6
1.2
0.8
0.4
0.0
I D =250uA
T j =150 o C
T j =25 o C
4
0
-50
0
50
100
150
0
0.2
0.4
0.6
0.8
1
1.2
1.4
T j , Junction Temperature ( o C)
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP93T03AGMT-HF
f=1.0MHz
2400
2000
1600
1200
800
400
0
8
I D = 20 A
V
DS =15V
6
4
2
0
C iss
C oss
C rss
1
5
9
13
17
21
25
29
0
8
16
24
32
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
1000
100
10
Duty factor=0.5
Operation in this area
limited by R
DS(ON)
100us
1ms
0.2
0.1
0.1
0.05
PDM
10ms
t
0.02
100ms
DC
T
1
0.01
Duty factor = t/T
T C =25 o C
Peak Tj = PDM x Rthjc + Tc
Single Pulse
Single Pulse
0.01
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
0.1
1
10
100
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
100
120
100
80
60
40
20
0
V
DS =5V
80
Limited by package
60
40
20
0
T j =150 o C
T j =25 o C
T j = -40 o
C
0
1
2
3
4
5
6
25
50
75
100
125
150
T C , Case Temperature ( o C )
V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Maximum Continuous Drain Current
v.s. Case Temperature
4
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