AOL1440L [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOL1440L
型号: AOL1440L
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:124K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOL1440  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features
The AOL1440 uses advanced trench technology to  
provide excellent RDS(ON), shoot-through immunity  
and body diode characteristics. This device is ideally  
suited for use as a low side switch in CPU core  
power conversion.Standard Product AOL1440 is  
Pb-free (meets ROHS & Sony 259 specifications).  
AOL1440L is a Green Product ordering option.  
AOL1440 and AOL1440L are electrically identical.  
VDS(V)=25V
ID=75A(VGS=10V)
RDS(ON)<3.2m(VGS=20V)
RDS(ON)< 4.0m(V = 12V)  
GS  
R < 5.2m(V = 10V)  
GS  
DS(ON)  
UIS Tested  
Rg,Ciss,Coss,Crss Tested  
UltraSO-8TM Top View  
Fits SOIC8  
footprint !  
D
S
D
Bottom tab  
connected to  
drain  
G
S
G
Absolute Maximum Ratings T =25°C unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
Maximum  
25  
Units  
V
V
VGS  
±30  
TC=25°C G  
TC=100°C B  
85  
Continuous Drain  
Current B,G,  
A
ID  
66  
Pulsed Drain Current  
Continuous Drain  
Current G  
Avalanche CurrentC  
IDM  
200  
TA=25°C  
TA=70°C  
25  
A
IDSM  
IAR  
20  
30  
A
Repetitive avalanche energy L=0.3mHC  
EAR  
135  
mJ  
TC=25°C  
Power DissipationB  
TC=100°C  
75  
PD  
W
37  
TA=25°C  
5
3
PDSM  
W
Power DissipationA  
TA=70°C  
Junction and Storage Temperature Range TJ, TSTG  
Thermal Characteristics  
-55 to 175  
°C  
Parameter  
Symbol  
Typ  
19  
Max  
25  
55  
2
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-AmbientA  
t 10s  
RθJA  
Maximum Junction-to-AmbientA  
Maximum Junction-to-CaseC  
Steady-State  
45  
1.5  
Steady-State  
RθJC  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOL1440  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
0.005  
3
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
25  
V
V
DS=20V, VGS=0V  
1
5
IDSS  
Zero Gate Voltage Drain Current  
µA  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±30V  
100  
4
nA  
V
VGS(th)  
ID(ON)  
V
V
DS=VGS ID=250µA  
2
GS=12V, VDS=5V  
200  
A
VGS=20V, ID=20A  
VGS=12V, ID=20A  
2.7  
3.5  
4
3.2  
4
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
mΩ  
mΩ  
S
V
GS=10V, ID=20A  
5.2  
TJ=125°C  
5.6  
75  
0.7  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
VDS=5V, ID=20A  
IS=1A,VGS=0V  
1
V
Maximum Body-Diode Continuous Current  
55  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
2100  
850  
2400  
pF  
pF  
pF  
V
GS=0V, VDS=12.5V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
400  
VGS=0V, VDS=0V, f=1MHz  
0.35  
1
SWITCHING PARAMETERS  
Qg(12V)  
Qg(10V)  
Qgs  
Total Gate Charge  
40  
33  
11  
14  
12  
19  
15  
8.5  
42  
34  
50  
nC  
nC  
nC  
nC  
ns  
Total Gate Charge  
VGS=10V, VDS=12.5V, ID=20A  
Gate Source Charge  
Qgd  
Gate Drain Charge  
tD(on)  
tr  
tD(off)  
tf  
Turn-On DelayTime  
VGS=10V, VDS=12.5V, RL=0.68,  
Turn-On Rise Time  
ns  
R
GEN=3Ω  
Turn-Off DelayTime  
ns  
Turn-Off Fall Time  
ns  
trr  
IF=20A, dI/dt=100A/µs  
IF=20A, dI/dt=100A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
nC  
A: The value of RθJA is measured with the device in a still air environment with T A =25°C.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 ms pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=175°C.  
G. The maximum current rating is limited by bond-wires.  
H. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA  
curve provides a single pulse rating.  
Rev0. July 2006  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOL1440  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
200  
160  
120  
80  
100  
80  
60  
40  
20  
0
20V  
VDS=5V  
12V  
10V  
VGS=8V  
125°C  
40  
25°C  
7
0
0
1
2
3
4
5
3
4
5
V
6
8
VDS (Volts)  
GS(Volts)  
Figure 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
4.5  
1.4  
VGS=20V  
ID=20A  
VGS=10V  
VGS=12V  
4.0  
3.5  
3.0  
2.5  
2.0  
1.2  
1
VGS=12V  
VGS=10V  
VGS=10V  
VGS=12V  
VGS=20V  
0.8  
0.6  
VGS=20V  
0
5
10  
15  
D (A)  
20  
25  
30  
-50 -25  
0
25 50 75 100 125 150 175  
I
Temperature (°C)  
Figure 4: On-Resistance vs. Junction  
Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
14  
12  
10  
8
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
ID=20A  
125°C  
125°C  
25°C  
6
1.0E-03  
25°C  
4
1.0E-04  
1.0E-05  
2
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
6
8
10  
12  
GS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
14  
16  
18  
20  
VSD (Volts)  
V
Figure 6: Body-Diode Characteristics  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOL1440  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
3000  
2500  
2000  
1500  
1000  
500  
20  
16  
12  
8
VDS=12.5V  
ID=20A  
Ciss  
Coss  
Crss  
4
0
0
0
10  
20  
30  
40  
50  
60  
0
5
10  
15  
DS (Volts)  
20  
25  
30  
Qg (nC)  
V
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
1000.0  
100.0  
10.0  
1.0  
200  
TJ(Max)=175°C  
TC=25°C  
10µs  
100µ  
RDS(ON)  
limited  
150  
100  
50  
DC  
TJ(Max)=175°C  
TC=25°C  
0.1  
0.0  
0.01  
0.1  
1
10  
100  
0
VDS (Volts)  
0.0001 0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
Figure 9: Maximum Forward Biased  
Safe Operating Area (Note F)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=Tc+PDM.ZθJC.RθJC  
RθJC=2°C/W  
PD  
0.1  
0.01  
Ton  
T
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOL1440  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
80  
70  
TA=25°C  
80  
60  
25°C  
60  
40  
20  
50  
40  
30  
20  
10  
0
150°C  
0
0.00001  
0.0001  
Time in avalanche, tA (s)  
Figure 12: Single Pulse Avalanche capability  
0.001  
0
25  
50  
75  
CASE (°C)  
Figure 13: Power De-rating (Note B)  
100  
125  
150  
175  
T
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
0
25  
50  
75  
100  
125 150  
175  
0.01  
0.1  
1
10  
100  
1000  
T
CASE (°C)  
Pulse Width (s)  
Figure 14: Current De-rating (Note B)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
0.1  
PD  
D=Ton/T  
J,PK=TA+PDM.ZθJA.RθJA  
0.01  
Ton  
T
T
Single Pulse  
0.0001  
RθJA=55°C/W  
0.001  
0.00001  
0.001  
0.01  
0.1  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
1
10  
100  
1000  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  

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