AOL1448_11 [AOS]

30V N-Channel MOSFET; 30V N沟道MOSFET
AOL1448_11
型号: AOL1448_11
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

30V N-Channel MOSFET
30V N沟道MOSFET

文件: 总6页 (文件大小:385K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOL1448  
30V N-Channel MOSFET  
General Description  
Product Summary  
VDS  
30V  
The AOL1448 uses advanced trench technology to  
provide excellent RDS(ON) with low gate charge.  
This device is suitable for high side switch in SMPS and  
general purpose applications.  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
36A  
< 9.5m  
< 14mΩ  
RDS(ON) (at VGS = 4.5V)  
100% UIS Tested  
100% Rg Tested  
D
UltraSO-8TM  
Top View  
Bottom View  
D
G
S
G
S
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
30  
±20  
36  
V
V
VGS  
TC=25°C  
Continuous Drain  
Current G  
Pulsed Drain Current C  
ID  
TC=100°C  
28  
A
A
IDM  
90  
TA=25°C  
TA=70°C  
11  
Continuous Drain  
Current  
Avalanche Current C  
Avalanche energy L=0.1mH C  
IDSM  
9
IAS, IAR  
20  
A
EAS, EAR  
20  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
30  
PD  
W
15  
2
TA=25°C  
PDSM  
W
°C  
Power Dissipation A  
1.3  
TA=70°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 175  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
20  
Max  
25  
60  
5
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
t
10s  
RθJA  
Steady-State  
Steady-State  
48  
RθJC  
3.5  
Rev 4: Nov 2011  
www.aosmd.com  
Page 1 of 6  
AOL1448  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
30  
V
VDS=30V, VGS=0V  
1
IDSS  
Zero Gate Voltage Drain Current  
µA  
5
TJ=55°C  
VDS=0V, VGS= ±20V  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
VGS=10V, ID=20A  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
±100  
2.2  
nA  
V
VGS(th)  
ID(ON)  
1.2  
90  
1.7  
A
7.5  
11.5  
11  
9.5  
14  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
VGS=4.5V, ID=20A  
VDS=5V, ID=20A  
IS=1A,VGS=0V  
14  
mΩ  
S
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
43  
0.7  
1
V
Maximum Body-Diode Continuous Current  
30  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
770  
240  
77  
pF  
pF  
pF  
VGS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
VGS=0V, VDS=0V, f=1MHz  
0.4  
0.8  
1.6  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
14.8  
7.1  
2.2  
3.1  
5
18  
9
nC  
nC  
nC  
nC  
ns  
Qg(4.5V) Total Gate Charge  
VGS=10V, VDS=15V, ID=20A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
VGS=10V, VDS=15V, RL=0.75,  
RGEN=3Ω  
3
ns  
tD(off)  
tf  
18  
3
ns  
ns  
trr  
IF=20A, dI/dt=500A/µs  
IF=20A, dI/dt=500A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
11  
23  
ns  
Qrr  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends  
on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep  
initial TJ =25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming  
a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.  
G. The maximum current rating is package limited.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev 4: Nov 2011  
www.aosmd.com  
Page 2 of 6  
AOL1448  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
60  
50  
40  
30  
20  
10  
0
6V  
10V  
VDS=5V  
4.5V  
4V  
7V  
3.5V  
125°C  
25°C  
VGS=3V  
4
0
1
2
3
4
5
0
1
2
3
5
VGS(Volts)  
VDS (Volts)  
Fig 1: On-Region Characteristics (Note E)  
Figure 2: Transfer Characteristics (Note E)  
16  
14  
12  
10  
8
2
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
ID=20A  
VGS=4.5V  
VGS=4.5V  
ID=20A  
VGS=10V  
6
0.8  
4
0
25  
50  
75  
100 125 150 175 200  
0
5
10  
15  
ID (A)  
20  
25  
30  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
35  
30  
25  
20  
15  
10  
5
1.0E+02  
1.0E+01  
ID=20A  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
25°C  
25°C  
0
0.0  
0.2  
0.4  
VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Rev 4: Nov 2011  
www.aosmd.com  
Page 3 of 6  
AOL1448  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
1200  
VDS=15V  
ID=20A  
1000  
800  
600  
400  
200  
0
8
Ciss  
6
4
Coss  
2
Crss  
0
0
4
8
12  
16  
0
5
10  
15  
20  
25  
30  
Qg (nC)  
VDS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
200  
160  
120  
80  
1000.0  
100.0  
10.0  
1.0  
10µs  
TJ(Max)=175°C  
TC=25°C  
RDS(ON)  
100µs  
1ms  
10ms  
DC  
TJ(Max)=175°C  
TC=25°C  
0.1  
40  
0.0  
0
0.01  
0.1  
1
10  
100  
0.0001  
0.001  
0.01  
0.1  
1
10  
VDS (Volts)  
Pulse Width (s)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
10  
1
D=Ton/T  
TJ,PK=TC+PDM.ZθJC.RθJC  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJC=5°C/W  
PD  
0.1  
0.01  
Ton  
T
Single Pulse  
0.0001  
0.00001  
0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev 4: Nov 2011  
www.aosmd.com  
Page 4 of 6  
AOL1448  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
35  
TA=25°C  
30  
25  
20  
15  
10  
5
TA=150°C  
TA=100°C  
TA=125°C  
10  
1
0
1
10  
100  
1000  
0
25  
50  
75  
TCASE (°C)  
Figure 13: Power De-rating (Note F)  
100  
125  
150  
175  
Time in avalanche, tA (µs)  
Figure 12: Single Pulse Avalanche capability  
(Note C)  
10000  
1000  
100  
10  
40  
TA=25°C  
30  
20  
10  
0
1
0.00001  
0.001  
0.1  
10  
1000  
0
25  
50  
75  
100  
125  
150  
175  
Pulse Width (s)  
TCASE (°C)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
Figure 14: Current De-rating (Note F)  
10  
1
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJA=60°C/W  
0.1  
PD  
0.01  
Single Pulse  
Ton  
T
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
Rev 4: Nov 2011  
www.aosmd.com  
Page 5 of 6  
AOL1448  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
Rev 4: Nov 2011  
www.aosmd.com  
Page 6 of 6  

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