FDD6035AL [FAIRCHILD]
N-Channel, Logic Level, PowerTrench MOSFET; N沟道逻辑电平的PowerTrench MOSFET型号: | FDD6035AL |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | N-Channel, Logic Level, PowerTrench MOSFET |
文件: | 总6页 (文件大小:121K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
July 2003
FDD6035AL
30V N-Channel PowerTrenchÒ MOSFET
General Description
Features
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s advanced PowerTrench process that
has been especially tailored to minimize the on state
resistance and yet maintain low gate charge for
superior switching performance.
·
46 A, 30 V
RDS(ON) = 12 mW @ VGS = 10 V
RDS(ON) = 14 mW @ VGS = 4.5 V
·
·
·
Low gate charge
Fast Switching Speed
Applications
·
·
DC/DC converter
Motor Drives
High performance trench technology for extremely
low RDS(ON)
D
D
G
G
S
D-PAK
(TO-252)
S
Absolute Maximum Ratings TA=25oC unless otherwise noted
Symbol
VDSS
Parameter
Drain-Source Voltage
Ratings
Units
30
V
V
A
VGSS
Gate-Source Voltage
Continuous Drain Current @TC=25°C
@TA=25°C
±20
ID
(Note 3)
(Note 1a)
(Note 1a)
(Note 3)
46
12
100
Pulsed
PD
W
Power Dissipation
@TC=25°C
@TA=25°C
@TA=25°C
56
(Note 1a)
(Note 1b)
3.3
1.5
TJ, TSTG
Operating and Storage Junction Temperature Range
–55 to +175
°C
Thermal Characteristics
Thermal Resistance, Junction-to-Case
(Note 1)
(Note 1a)
(Note 1b)
2.7
45
96
RqJC
RqJA
RqJA
°C/W
Thermal Resistance, Junction-to-Ambient
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape width
12mm
Quantity
2500 units
FDD6035AL
FDD6035AL
D-PAK (TO-252)
13’’
FDD6035AL Rev. D(W)
Ó2003 Fairchild Semiconductor Corporation
Electrical Characteristics
TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Drain-Source Avalanche Ratings (Note 2)
EAS
IAS
Drain-Source Avalanche Energy
Drain-Source Avalanche Current
Single Pulse, VDD = 15 V, ID= 12A
180
12
mJ
A
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
30
V
VGS = 0 V,
ID = 250 mA
DBVDSS
DTJ
Breakdown Voltage Temperature
Coefficient
24
ID = 250 mA,Referenced to 25°C
mV/°C
IDSS
Zero Gate Voltage Drain Current
Gate–Body Leakage
VDS = 24 V,
VGS = 0 V
1
mA
IGSS
nA
VGS = ±20 V, VDS = 0 V
±100
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
1
1.9
–5
3
V
VDS = VGS
,
ID = 250 mA
Gate Threshold Voltage
Temperature Coefficient
DVGS(th)
DTJ
ID = 250 mA,Referenced to 25°C
mV/°C
7.7
9.9
11.4
12
14
19
RDS(on)
Static Drain–Source
On–Resistance
VGS = 10 V,
VGS = 4.5 V, ID = 10 A
VGS = 10 V, ID = 12 A,TJ=125°C
ID = 12 A
mW
ID(on)
gFS
On–State Drain Current
VGS = 10 V,
VDS = 10 V,
VDS = 5 V
ID = 12 A
50
A
S
Forward Transconductance
47
Dynamic Characteristics
Ciss
Coss
Crss
RG
Input Capacitance
1230
325
150
1.5
pF
pF
pF
pF
VDS = 15 V,
f = 1.0 MHz
V GS = 0 V,
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
VGS = 15 mV, f = 1.0 MHz
Switching Characteristics (Note 2)
td(on)
tr
td(off)
tf
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
10
7
19
13
46
21
18
ns
ns
VDD = 15 V,
VGS = 10 V,
ID = 1 A,
RGEN = 6 W
29
12
13
3.5
5.1
ns
ns
Qg
Qgs
Qgd
nC
nC
nC
VDS = 15V,
VGS = 5 V
ID = 12 A,
FDD6035AL Rev. D(W)
Electrical Characteristics
TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
2.3
1.2
A
V
VSD
trr
Drain–Source Diode Forward Voltage
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
0.76
24
V
GS = 0 V, IS = 2.3 A
(Note 2)
IF = 12 A, diF/dt = 100 A/µs
nS
nC
Qrr
13
Notes:
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RqJC is guaranteed by design while RqCA is determined by the user's board design.
a)
R
qJA = 45°C/W when mounted on a
b)
R
qJA = 96°C/W when mounted
1in2 pad of 2 oz copper
on a minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%
PD
3. Maximum current is calculated as:
RDS(ON)
where PD is maximum power dissipation at TC = 25°C and RDS(on) is at TJ(max) and VGS = 10V. Package current limitation is 21A
FDD6035AL Rev. D(W)
Typical Characteristics
100
1.8
1.6
1.4
1.2
1
VGS = 10.0V
6.0V
4.5V
5.0V
VGS = 3.5V
4.0V
80
60
40
20
0
4.0V
4.5V
3.5V
5.0V
6.0V
10.0V
3.0V
0.8
0
20
40
ID, DRAIN CURRENT (A)
60
80
0
0.5
1
1.5
2
2.5
3
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. On-Region Characteristics
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage
0.03
1.6
1.4
1.2
1
ID = 12A
VGS = 10V
ID = 6A
0.025
0.02
TA = 125oC
0.015
0.01
TA = 25oC
0.8
0.6
0.005
-50
-25
0
25
50
75
100
125
150
2
4
6
8
10
TJ, JUNCTION TEMPERATURE (oC)
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. On-Resistance Variation
withTemperature
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage
1000
90
VGS = 0V
TA =-55oC
VDS = 5V
100
10
75
60
45
30
15
0
TA = 125oC
125oC
25oC
1
-55oC
25oC
0.1
0.01
0.001
0.0001
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.5
2
2.5
3
3.5
4
4.5
VGS, GATE TO SOURCE VOLTAGE (V)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature
FDD6035AL Rev. D(W)
Typical Characteristics
10
1800
1500
1200
900
600
300
0
f = 1MHz
VGS = 0 V
ID = 12 A
VDS = 10V
20V
8
6
4
2
0
Ciss
15V
Coss
Crss
0
5
10
15
20
25
30
0
5
10
15
20
25
Qg, GATE CHARGE (nC)
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate Charge Characteristics
Figure 8. Capacitance Characteristics
1000
100
10
100
80
60
40
20
0
SINGLE PULSE
RqJA = 96°C/W
RDS(ON) LIMIT
100µs
TA = 25°C
1ms
10ms
100ms
1s
10
1
DC
VGS = 4.5V
SINGLE PULSE
R
qJA = 96oC/W
TA = 25oC
0.1
0.01
0.1
1
10
100
0.01
0.1
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
t1, TIME (sec)
Figure 9. Maximum Safe Operating Area
Figure 10. Single Pulse Maximum
Power Dissipation
1
D = 0.5
R
qJA(t) = r(t) * RqJA
0.2
RqJA = 96 °C/W
0.1
0.1
0.05
0.02
P(pk)
0.01
0.01
t1
t2
TJ - TA = P * RqJA(t)
Duty Cycle, D = t1 / t2
SINGLE PULSE
0.001
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, TIME (sec)
Figure 11. Transient Thermal Response Curve
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
FDD6035AL Rev. D(W)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Power247™
PowerTrench
QFET
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC
OPTOPLANAR™
PACMAN™
POP™
FACT Quiet Series™
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
ActiveArray™
Bottomless™
CoolFET™
CROSSVOLT™
DOME™
EcoSPARK™
E2CMOSTM
EnSignaTM
FACT™
QS™
QT Optoelectronics™ TINYOPTO™
Quiet Series™
RapidConfigure™
RapidConnect™
TruTranslation™
UHC™
UltraFET
HiSeC™
I2C™
SILENT SWITCHER VCX™
SMART START™
SPM™
ImpliedDisconnect™
ISOPLANAR™
Across the board. Around the world.™
The Power Franchise™
ProgrammableActive Droop™
Stealth™
SuperSOT™-3
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I5
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