ICS9178-03 [ICSI]

245 MHz Clock Generator and Integrated Buffer for PowerPC™; 245 MHz的时钟发生器和缓冲器集成为PowerPC ™
ICS9178-03
型号: ICS9178-03
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

245 MHz Clock Generator and Integrated Buffer for PowerPC™
245 MHz的时钟发生器和缓冲器集成为PowerPC ™

时钟发生器 PC
文件: 总8页 (文件大小:529K)
中文:  中文翻译
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ICS9178-03  
Integrated  
Circuit  
Systems, Inc.  
245MHzClockGeneratorandIntegratedBufferforPowerPC™  
General Description  
Features  
•
Generates 2 PECL 2x processor, 2 TTL/CMOS 1x  
processor and 10 selectable bus clocks  
The ICS9178-03 generates all clocks required for high speed  
PowerPC RISC microprocessor systems. Generating clocks  
in phase with an external reference frequency allows the  
ICS9178-03 to be used as a multiplying zero delay buffer.  
Three different multiplying factors are externally selectable.  
These factors can be customized for specific applications. An  
external frequency can be directly applied to aid system  
testing. With 2X processor clock speeds up to 245 MHz,  
PECL outputs are provided. User selectable frequency ratios  
are available for PCLK/BCLK and PCLK/XCLK. Each pair of  
clocks outputs have separate supply pins to minimize output  
jitter and allow them to operate at 5V, 3.3V or custom voltage  
levels.  
•
2XPCLK ranges from 75 MHz to 245 MHz (5V or  
5V/3.3V mixed supply) or 60 to 170 MHz (3.3V only)  
Asymmetric duty cycle bus clock for PowerPC  
Bus to processor clock skews less than ±250ps  
2XPCLK to PCLK skew controlled at 300 ±300ps  
Selectable reference multiplying factors  
Selectable PCLK/BCLK and PCLK/XCLK ratios  
Separate supplies allow 5V and 3.3V output mix  
3.0V - 5.5V supply range  
•
•
•
•
•
•
•
•
44-pin PQFP package  
Applications  
•
Ideal for high-speed systems based on PowerPC  
Block Diagram  
PowerPC is a trademark of Motorola Corporation.  
ICS9178-03RevC02/12/98P  
ICS reserves the right to make changes in the device data identified in this publication  
without further notice. ICS advises its customers to obtain the latest version of all  
device data to verify that any information being relied upon by the customer is current  
and accurate.  
ICS9178-03  
Pin Configuration  
X_S1  
X_S0  
XCLK_(0,1)  
PCLK  
0
0
1
1
0
1
0
1
BCLK  
DCLK  
Tristate  
_=A,B,C  
44-Pin PQFP  
Functionality  
FS1  
0
FS0  
0
RST  
1
TEN  
0
*VCO  
6x REF  
8x REF  
4x REF  
X
2XPCLK  
VCO  
VCO  
VCO  
1
PCLK  
VCO/2  
VCO/2  
VCO/2  
1
ABCLK (H/L%)  
VCO/6 (66/33)  
VCO/8 (75/25)  
VCO/12 (50/50)  
1
BCLK  
DCLK  
VCO/4  
VCO/4  
VCO/4  
1
VCO/6  
VCO/8  
VCO/4  
1
0
1
1
0
1
0
1
0
1
1
1
0
X
0
X
0
0
X
1
X
0
0
0
0
0
1
TCLK  
TCLK  
TCLK  
TCLK  
TCLK  
TCLK  
TCLK  
TCLK  
TCLK/2  
TCLK/2  
TCLK/2  
TCLK/2  
TCLK/6 (66/33)  
TCLK/8 (75/25)  
TCLK/12 ( 66/33)  
TCLK/2  
TCLK/6  
TCLK/8  
TCLK/4  
TCLK/4  
0
1
1
1
1
0
1
1
TCLK/12 TCLK/4  
TCLK/2 TCLK/4  
1
1
1
1
*VCO range is limited from 75- 245 MHz at 5V±5% and 60 - 170 MHz at 3.3V±5%. Divide ratios assume BCLK is externally  
fed back to FBCLK.  
The 2XPCLK series or Thevinen trace terminations must be optimized for the specific operating frequency and board  
layout. The rising edge of ABCLK is coincident with the rising edges of 2XPCLK, PCLK and other BCLKs.  
2
ICS9178-03  
Pin Description  
PIN NUMBER  
PIN NAME  
TYPE  
Input  
Input  
Output  
Output  
Input  
Input  
Output  
Output  
DESCRIPTION  
LSB Programmable Group A frequency selector.  
MSB Programmable Group A frequency selector.  
TTL/CMOS group A programmable clock output.  
TTL/CMOS group A programmable clock output.  
LSB Programmable Group B frequency selector.  
MSB Programmable Group B frequency selector.  
TTL/CMOS Group B programmable clock output.  
TTL/CMOS Group B programmable clock output.  
32  
31  
6
XAS0  
XAS1  
XCLKA0  
XCLKA1  
XBS0  
5
30  
29  
3
XBS1  
XCLKB0  
XCLKB1  
VDDXBA  
GNDXBA  
GNDXC  
XCLKC0  
XCLKC1  
VDDXC  
XCS0  
2
1
Power for programmable Group A and B buffers (Pins 2, 3, 5, 6).  
Ground for programmable Group A and B buffers (Pins 2, 3, 5, 6).  
Ground for the programmable Group C buffers (Pins 42 and 43).  
TTL/CMOS Group C programmable clock output.  
TTL/CMOS Group C programmable clock output.  
Power for the XC signal output buffers (Pins 42 and 43).  
LSB Programmable Group C frequency selector.  
MSB Programmable Group C frequency selector.  
TTL/CMOS 1X Processor clock output.  
4
44  
43  
42  
41  
28  
27  
11  
10  
8
Output  
Output  
Input  
Input  
Output  
Output  
XCS1  
PCLK0  
PCLK1  
GNDP  
TTL/CMOS 1X Processor clock output.  
Ground for PCLK output buffers (Pins 11 and 10).  
Power for PCLK output buffers (Pins 11 and 10).  
PECL 2X Processor clock output.  
7
VDDP  
22  
21  
24  
23  
20  
38*  
37*  
36  
35  
25  
26  
19  
16  
17  
15  
14  
13  
12  
18  
40  
39  
9
2XPCLK0  
2XPCLK1  
EVDD  
Output  
Output  
PECL 2X Processor clock output.  
Power for PECL buffers (Pins 21 and 22).  
Ground for PECL buffers (Pins 21 and 22).  
Ground for PECL buffers (Pins 21 and 22).  
LSB frequency select PLL (divider mode control).  
MSB frequency select PLL (divider mode control).  
External PLL feedback path from one of the BCLK outputs.  
External reference clock input.  
EGND  
EGND  
FS0  
Input  
Input  
Input  
Input  
FS1  
FBCLK  
REFCLK  
AVDD  
Power for the analog PLL circuitry.  
AGND  
DCLK  
Ground for the analog PLL circuitry.  
Output  
TTL/CMOS D clock output.  
VDDD  
GNDD  
BCLK0  
BCLK1  
GNDBAB  
VDDBAB  
ABCLK  
TCLK  
Power for D output buffers (Pin 19).  
Ground for D output buffer (Pin 19).  
Output  
Output  
TTL/CMOS B (Bus) clock output.  
TTL/CMOS B (Bus) clock output.  
Ground for output buffers AB and B clocks (Pins 14, 15 & 18).  
Power for output buffers AB and B clocks (Pins 14, 15 & 18).  
TTL/CMOS AB Bus clock (has Asymmetric duty cycle).  
External test clock input.  
Output  
Input  
Input  
Input  
TEN#  
Test enable (tie low).  
RESET#  
VDD  
Sync register reset (active low).  
33  
34  
Digital power supply for 5.0 or 3.3V.  
GND  
Digital ground supply.  
*=Pin is pulled-up to VDD internally by the device.  
3
ICS9178-03  
Absolute Maximum Ratings  
VDD referenced to GND . . . . . . . . . . . . . . . . . . . . . . 7V  
Operating temperature under bias. . . . . . . . . . . . . . . . 0°C to +70°C  
Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C  
Voltage on I/O pins referenced to GND. . . . . . . . . . . GND -0.5V to VDD +0.5V  
Power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 Watts  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating  
only and functional operation of the device at these or any other conditions above those indicated in the operational sections  
of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product  
reliability.  
Electrical Characteristics  
Device Specifications  
Maximum Ratings  
DESCRIPTION  
Supply voltage relative to GND  
SYMBOL  
VDD  
VIN  
MIN  
-0.5  
-0.5  
0
MAX  
7.0  
UNITS  
V
Input voltage with respect to GND  
Operating temperature  
VDD +0.5  
+70  
V
TOPER  
TSTOR  
TSOL  
°C  
Storage temperature  
-65  
+150  
°C  
Max soldering temperature (10 sec)  
Junction temperature  
+260  
+135  
900  
°C  
Tj  
°C  
Package power dissipation  
PDISS  
800  
mWatts  
DC Characteristics  
VDD =+5V ±5%, 0°C TAMBIENT +70°C unless otherwise stated  
PARAMETER  
High level input voltage  
SYMBOL  
VIH  
TEST CONDITIONS  
MIN  
TYP  
MAX  
0.8  
UNITS  
2.0  
V
V
V
V
Low level input voltage  
VIL  
High level CMOS output voltage  
Low level CMOS output voltage  
VOH  
IOH=-25mA  
IOL=25mA  
2.4  
VOL  
0.4  
High level PECL output voltage  
(2XPCLK) (Note 1)  
VOHP  
VOLP  
110 ohm load to ground  
110 ohm load to ground  
1.9  
-10  
2.2  
0.3  
V
V
Low level PECL output voltage  
(2XPCLK) (Note 1)  
0.5  
Input high current  
IIH  
IIL1  
IIL2  
IOZ  
VIH=VDD  
VIL=0V  
VIL=0V  
(tristate)  
10  
-150  
10  
µA  
µA  
µA  
µA  
Input low current (MSX pins, pull-up)  
Input low current (other inputs)  
Output leakage current (XCLKs)  
-10  
-10  
10  
@240 MHz on  
2XPCLK  
Power supply current  
IDD  
145  
80  
185  
mA  
Power supply current (typical) (Note 1)  
Input capacitance (Note 1)  
IDD-TYP  
CIN  
@75 MHz on 2XPCLK  
100  
8
mA  
pF  
Note 1: Parameter is guaranteed by design and characterization. Not tested 100% in production.  
4
ICS9178-03  
AC Characteristics  
VDD =+5V ±5%, 0°C TAMBIENT +70°C unless otherwise stated  
PARAMETER  
SYMBOL  
fi  
TEST CONDITIONS  
MIN  
TYP  
MAX  
50.0  
3
UNITS  
MHz  
ns  
Input Frequency (Note 1)  
8
-
40.0  
Input Clock Rise time (Note 1)  
Input Clock Fall time (Note 1)  
Output Frequency (2XPCLK)  
ICLKr  
ICLKf  
-
-
-
3
ns  
fo2XPCLK 6X mode, 8X mode  
4X mode  
75  
75  
-
245  
240  
1.0  
1.5  
1.0  
1.5  
MHz  
tr2XPCLK 15pF load  
0.8 to 2.0V  
20% to 80%  
2.0 to 0.8V  
80% to 20%  
-
-
-
ns  
ns  
Output Rise time, 0.8 to 2.0V 20%  
to 80% (Note 1)  
-
tf2XPCLK 15pF load  
-
Fall time 2.0 to 0.8 80% to 20%  
(Note 1)  
Output Rise time 80% to 20%  
(Note 1)  
t(TTL)r  
t(TTL)f  
dt1  
15pF load  
15pF load  
-
-
3.0  
2.0  
57.5  
-
ns  
ns  
%
ns  
ns  
Output Fall time 80% to 20%  
(Note 1)  
-
-
50  
-
200 to 240 MHz @ 1.4V 110  
ohm, 15pF load  
Duty cycle 2XPCLK (Note 1)  
42.5  
1.2  
1.0  
Pulse Width, High, 2XPCLK  
(Note 1, 2)  
Tpwr  
Tpwr  
@ 1.8V, 110Load 2  
@ 0.6V, 110Load 2  
Pulse Width, Low, 2XPCLK  
(Note 1, 2)  
-
-
Duty cycle ABCLK (Note 1)  
Duty cycle ABCLK (Note 1)  
dt3  
dt4  
15pF load @ 1.4V (8X mode)  
15pF load @ 1.4V 6X mode  
15pF load @ 1.4V 4X mode  
70  
61  
45  
75  
66  
50  
80  
71  
55  
%
%
Duty cycle TTL (other clocks)  
(Note 1)  
dt5  
15pF load @ 1.4V  
45  
-
50  
40  
55  
%
ps  
ps  
ps  
ps  
ps  
ps  
Jitter 1 Sigma 2XPCLK (10,000  
samples) (Note 1)  
for 200 to 240 MHz on  
2XPCLK  
Tj1s1  
Tj1s2  
Tj1s3  
Tjabs1  
Tjabs2  
Tjabs3  
-
Jitter 1 Sigma 1XPCLK B & D  
(10,000 samples) (Note 1)  
for 200 to 240 MHz on  
2XPCLK  
-
50  
-
Jitter 1 Sigma AB clock (10,000  
samples) (Note 1)  
for 200 to 240 MHz on  
2XPCLK  
-
60  
-
for 200 to 240 MHz on  
2XPCLK  
Jitter Absolute 2XPCLK (Note 1)  
-150  
-200  
-250  
80  
+150  
+200  
+250  
Jitter Absolute 1XPCLK, B, D  
clocks (Note 1)  
for 200 to 240 MHz on  
2XPCLK  
110  
120  
for 200 to 240 MHz on  
2XPCLK  
Jitter Absolute AB clock (Note 1)  
Note 1: Parameter is guaranteed by design and characterization. Not tested 100% in production.  
Note 2: For 70Load, 2XPCLK level may be pulled-up with a 390resistor to meet minimum pulse width requirements  
at both 1.8V and 0.6V at 240 MHz.  
5
ICS9178-03  
AC Characteristics (continued)  
VDD =+5V ±5%, 0°C TAMBIENT +70°C unless otherwise stated  
PARAMETER  
SYMBOL  
Tjabs4  
TEST CONDITIONS  
MIN  
-125  
TYP  
80  
MAX  
+125  
UNITS  
ps  
for 200 to 240 MHz on  
2XPCLK at VDD 4.9 to  
5.2V  
Jitter Absolute 2XPCLK (Note 1)  
for 200 to 240 MHz on  
2XPCLK at VDD 4.9 to  
5.2V  
Jitter Absolute 1XPCLK, B, D clocks  
(Note 1)  
Tjabs5  
-160  
110  
+160  
ps  
Jitter Absolute 2XPCLK (Note 1)  
Jitter Absolute 1XPCLK (Note 1)  
Jitter Absolute AB clock (Note 1)  
Tjabs6  
Tjabs7  
Tjabs8  
for < 200 MHz on 2XPCLK  
for < 200 MHz on 2XPCLK  
for < 200 MHz on 2XPCLK  
-200  
-250  
-300  
-
-
-
+200  
+250  
+300  
ps  
ps  
ps  
Skew, output to output (P, B, D , AB abd  
XCLKs) (Note 1)  
Tskew1  
Tskew2  
@ 1.4V  
@ 1.4V  
-250  
-600  
-
+250  
0
ps  
ps  
Skew, 2XPCLK to PCLK (2XPCLK is  
earlier than PCLK) (Note 1)  
-300  
Skew, 2XPCLK to REFCLK (2XPCLK is  
earlier) (Note 1)  
for 240 MHz on 2XPCLK  
@ 1.4V  
Tskew3  
Tskew4  
-600  
-600  
-300  
-100  
0
ps  
ps  
Skew, 2XPCLK to DCLK (Notes 1,3)  
@ 1.4V  
100  
Note 1: Parameter is guaranteed by design and characterization. Not tested 100% in production.  
Note 2: For 70Load, 2XPCLK level may be pulled-up with a 390resistor to meet minimum pulse width requirements  
at both 1.8Vand 0.6Vat 240 Mhz.  
Note 3: 2XPCLK is normally earlier than DCLK by up to 600ps and can be later by up to  
6
ICS9178-03  
Applications  
PwrPC 601/601+Processor Modules  
Frequency Combinations  
(XCLK pairs selectable)  
SYS  
BUS  
9178  
MODE  
2XPCLK  
(2XCPU)  
PCLK(0,1)  
(CPU)  
XCLK(0,5)  
(BUS)  
BCLK(0,1)  
ABCLK  
F
F
F
x4  
x6  
8F  
4F  
6F  
8F  
2F  
3F  
4F  
2F, 1F  
1F  
1.5F  
2F  
3F, 1.5F, 1F  
4F, 2F, 1F  
PwrPC 601\601+ System Clock Diagram  
Frequency Combinations  
(selectable SCLK)  
9178  
MODE  
2XPCLK  
(2XCPU)  
PCLK  
(CPU)  
XCLK  
(BUS)  
OSC  
Q (PCI)  
F
x4  
x6  
8F  
x4  
x6  
x8  
x4  
x6  
x8  
x4  
x6  
x8  
4F  
6F  
2F  
3F  
4F  
66  
2F, 1F  
3F, 1.5F, 1F  
4F, 2F, 1F  
66, 33  
1F  
1.5F  
2F  
33  
F
F
8F  
33  
33  
33  
30  
30  
30  
25  
25  
25  
132  
196  
264  
120  
180  
240  
100  
150  
200  
99  
99, 48, 33  
132, 66, 33  
60, 30  
33  
132  
60  
33  
30  
90  
90, 45, 30  
120, 60, 30  
50, 25  
30  
120  
50  
30  
25  
75  
75, 37, 25  
100, 50, 25  
25  
100  
25  
PwrPC 603/604 System Clock Diagram  
Frequency Combinations  
(9178 x4 mode)  
PCLK,  
DCLK  
(CPU)  
PwrPC  
INTERNAL XCLK(0,3)  
CLOCK  
-
PCLK(0,1)  
ABCLK,  
BCLK(0,1)  
XCLK(4,5)  
PwrPC  
MODE  
OSC  
(BUS)  
2F, 1F  
66, 33  
80, 40  
66, 33  
60, 30  
80, 40  
66, 33  
F
-
2F, 1F  
66, 33  
80, 40  
-, 33  
F
33  
40  
33  
30  
40  
33  
x1, x2  
x1, x2  
x3  
66  
33 PCI)  
40 (VL)  
33 (PCI)  
30 (PCI)  
40 (VL)  
33 (PCI)  
80  
100  
120  
120  
132  
x2, x4  
x3  
60, 30  
-, 40  
x2, x4  
66, 33  
7
ICS9178-03  
PQFP Package  
LEAD COUNT  
44L  
2.0  
BODY THICKNESS  
FOOTPRINT (BODY+)  
3.20  
DIMENSIONS  
TOLERANCE  
MAX.  
A
A1  
A2  
D
2.45  
0.25  
MAX.  
±0.10  
2.00  
±0.25  
13.20  
10.0  
D1  
E
±0.10  
±0.25  
13.20  
10.0  
E1  
L
±0.10  
±0.15/-0.10  
BASIC  
+0.05  
0.70  
e
0.80  
b
0.35  
ccc  
MAX.  
0.10  
0° - 7°  
Ordering Information  
ICS9178Y-03  
Example:  
ICS XXXX- M PPP  
Pattern Number (2 or 3 digit number for parts with ROM code patterns)  
Package Type  
Y=QFP  
Device Type (consists of 3 or 4 digit numbers)  
Prefix  
ICS,AV=Standard  
ICS reserves the right to make changes in the device data identified in this publication  
without further notice. ICS advises its customers to obtain the latest version of all  
device data to verify that any information being relied upon by the customer is current  
and accurate.  
8

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