IRDC3629A [INFINEON]
USER GUIDE FOR IR3629A EVALUATION BOARD; 用户指南IR3629A评估板
| 型号： | IRDC3629A |
| 厂家： | 
Infineon |
| 描述： | USER GUIDE FOR IR3629A EVALUATION BOARD |
| 文件： | 总16页 (文件大小：947K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IRDC3629A
USER GUIDE FOR IR3629A EVALUATION BOARD
(Vin=12V, Vo=1.8V, Io=25A)
DESCRIPTION
An output over-current protection function is
implemented by sensing the voltage developed
across the on-resistance of the synchronous
rectifier MOSFET for optimum cost and
performance.
The IR3629A is a synchronous buck controller,
providing a compact, high performance and
flexible solution in a small 3mmx4mm MLPD
package.
Key features offered by the IR3629A include
programmable soft-start ramp, precision 0.6V
reference voltage, thermal protection, fixed
This user guide contains the schematic and bill of
materials for the IR3629A evaluation board. The
guide describes operation and use of the
300kHz switching frequency requiring
no
evaluation board itself. Detailed
application
external component, input under-voltage
lockout for proper start-up, and pre-bias start-
up.
information for the IR3629A integrated circuit is
available in the IR3629A data sheet.
BOARD FEATURES
• Vin = +12V (13.2V Max)
• Vout = +1.8V @ 0-25A
• IRF6712 as Controller MOSFET
• IRF6715 as Synchronous MOSFET
• L = 0.6uH
• Cin=2x270uF (OS-CON cap) + 2x10uF (ceramic 1206)
• Cout=2x330uF(SP cap)
• Optional external supply connection for Vc
• Optional Power-good output connection
1
IRDC3629A
CONNECTIONS and OPERATING INSTRUCTIONS
A well regulated +12V input supply should be connected to VIN+ and VIN-. A maximum of 20A load can be
connected to VOUT+ and VOUT-. The connection diagram is shown in Fig. 1
IR3629A demo board can also be powered by two separate power supplies, one is the input voltage (Vin)
between VIN+ and VIN-, the other is bias voltage (Vcc) between Vc-ext and PGND. In this case, a well
regulated 5V~12V power supply should be connected to Vc-ext and PGND and R14 should be removed.
Inputs and outputs of the board are listed in Table I.
Table I. Connections
Connection
VIN+
Signal Name
Vin (+12V)
VIN-
Ground of Vin
Vc-ext
Optional Vcc input
PGND
VOUT-
VOUT+
GND
Ground for optional Vcc input
Ground of Vout
Vout (+1.8V)
Bias Voltage Ground
LAYOUT
The PCB is a 6-layer board. All of layers are 2 Oz. copper. Power supply decoupling capacitors, the charge-
pump capacitor and feedback components are located close to the IR3629A. The feedback resistors are
connected to the output voltage at the point of regulation and are located close to the IC.
The input and output energy storage capacitors and the power inductor are located on bottom side of the
board, to improve efficiency, the circuit board is designed to minimize the length of the on-board power
ground current path.
2
IRDC3629A
IR3629A Demo Board
Vin= 12V
Vo=1.8V
Fig. 1 Connection diagram of the evaluation board for IR3629A (Top view)
Fig. 2 Bottom view of the evaluation board for IR3629A
3
IRDC3629A
IR3629A PCB Layers
Top Layer
Bottom Layer
4
IRDC3629A
IR3629A PCB Layers
AGND
PGND
Single point
connection
between PGND
and AGND
Mid-layer1
Mid-layer2
5
IRDC3629A
IR3629A PCB Layers
Mid-layer3
Mid-layer4
6
IRDC3629A
IR3629A Demo Board Schematic
PGND
Vc-ext
Vin
Vin+
Vin+
Vin-
1
1
R14
68
+
C6
10uF
C1
C4
0.1uF
C3
10uF
C2
10uF
C5
10uF
270uF
3
D1
1
1
R15
N/A
BAT54S
PGND
C22
Vin-
C25
0.1uF
C12
0.1uF
1uF
U1
En
2
11
10
6
Vcc
Vc
HDrv
R17
Q1
C23
PGood
4.99K
Vout
Vout+
Vout+
SS/SD
GND
N3064730
Vout
5
5
IRF6712 SQ
1
1
0.1uF
C24
SW
L1
12
3
R7
10K
OCSet
No Stuff
1
7
N3065200
Q2
1
2
PGood
Vsens
IR3629A
N3065372
5
0.6uH
IRF6715 MX
C14
0.1uF
C21
330uF
C20
330uF
C16
C17
C18
C19
C15
LDrv
Vout-
Vout-
C10
C11
No Stuff No Stuff No Stuff No Stuff No Stuff
R5
9
8
4
1
0.1uF
AGND
3.09K
Comp
Fb
PGND
39pF
13
C26
1nF
Thermal
R1
R12
3.65K
1
26.7K
C9
N/A
R9
0
R10
No Stuff
C8
R4
3.57K
0.56nF
R2
R6
20
31.6k
R3
15.8K
R*
0
A
B
Fig. 3 Schematic of the IR3629A evaluation board with 12Vin and1.8V output voltage
7
IRDC3629A
BILL OF MATERIALS
Item
Quantity
Reference
Value
Description
Size
-
Manufacturer
Part Number
16SVPC270M
OS-CON CAP, 16V,
20%
1
2
1
C1
270uF
Sanyo
Murata
C2,C3,
C5,C6
Ceramic, 25V, X7R,
10%
4
10uF
1206
GRM31CR61C106KA88
C4,C10,C12
C14,C23,C2
5
Ceramic, 25V, X7R,
10%
3
4
5
6
6
1
1
2
0.1uF
560pF
39pF
603
603
603
-
TDK
Murata
C1608X7R1H104K
GRM1885C1H561JA01D
GRM1885C1H390JA01D
EEFSX0D331XE
C8
Ceramic, 50V, C0G, 5%
Ceramic, 50V, C0G, 5%
SP-CAP, 2V, 6mOhm
C11
Murata
C20,C21
330uF
Panasonic
Ceramic, 16V, X5R,
10%
7
1
C22
1uF
603
TDK
C1608X5R1C105K
Ceramic, 50V, X7R,
10%
8
1
1
1
C26
D1
1000pF
BAT54S
0.6uH
603
SOT-23
-
Panasonic
Vishay
ECJ1VB1H102K
BAT54S
9
Dual Schottky Diode
1.5mOhm
10
L1
Delta
MPL104-0R6
IRF6712
SQ
NFET, 25V, 3.8mOhm,
12nC
DirectFET
SQ
11
1
Q1
IR
IRF6712SPbF
IRF6715
MX
NFET, 25V, 1.3mOhm,
40nC
DirectFET
MX
12
13
14
15
16
17
18
19
20
21
22
23
1
1
1
1
1
1
1
1
1
1
1
1
Q2
R9
IR
IRF6715MPbF
0
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/10W
Thick film, 1%, 1/4W
603
603
603
603
603
603
603
603
603
603
1206
any
any
any
any
any
any
any
any
any
any
any
any
any
any
any
any
any
any
any
any
any
any
R1
26.7K
31.6K
10K
R2
R7
R3
15.8K
3.57K
3.09K
20
R4
R5
R6
R12
R17
R14
3.65K
4.99K
68
8
IRDC3629A
BILL OF MATERIALS (cont.)
Item
Quantity
Reference
Value
Description
Size
Manufacturer
Part Number
MLPD
3x4
24
25
1
2
U1
IR3629A
No Stuff
PWM Controller
IR
IR3629AMPbF
C9, C24
603
C15,C16,C1
7,C18,C19
26
27
6
2
No Stuff
No Stuff
1206
603
R10, R15
Banana Jack,
Insulated, Solder
Terminal, Black
Johnson
Components
28
29
30
2
1
1
-
-
-
-
-
-
-
-
-
105-0853-001
105-0852-001
105-0854-001
Banana Jack,
Insulated, Solder
Terminal, Red
Johnson
Components
Banana Jack,
Insulated, Solder
Terminal, Green
Johnson
Components
9
IRDC3629A
TRACKING OPERATING PERFORMANCE
Vin=12.0V, Vo=1.8V, Fs=300kHz, Room Temperature, No Air Flow
Fig. 5 Prebias Start Up
Ch1:Vin, Ch2:Vout, Ch3:Vss
Fig. 4 Start Up at 25A
Ch1:PGood, Ch2:Vss, Ch3:Vin, Ch4:Vout
Fig. 7 Gate Signals at 25A Load
Ch1:SW, Ch2:HDRV, Ch3:LDRV
Fig. 6 Output Voltage Ripple at 25A Load
Ch1:Vout, Ch3:SW
Fig. 8 Transient Response
Ch1:Vout, Ch4:Io(0-12.5A)
Fig. 9 Shorted Hiccup Condition Recovery
Ch2:Vout, Ch3:Vss, Ch4:Io
10
IRDC3629A
TYPICAL OPERATING PERFORMANCE
Vin=12.0V, Vo=1.8V, Io=0-25A, Fs=300kHz, Air Flow=200LFM
Fig. 10 Bode Plot of Control Loop
11
IRDC3629A
TYPICAL OPERATING PERFORMANCE
Vin=12.0V, Vo=1.8V, Fs=300kHz, Room Temp, No Air Flow
IR3629A Efficiency
100
90
80
70
60
50
40
0.0
2.5
5.0
7.5
10.0
12.5
15.0
17.5
20.0
Iout(A)
Fig. 11 Efficiency vs. Load
2
1
Fig. 12 Thermal Image of IR3629A Demo Board at Io=20A
(1: IR3629A, 2: IRF6715, 3: IRF6712)
12
IRDC3629A
PCB Metal and Components Placement
. The lead land width should be equal to the nominal part lead width. The minimum lead to lead spacing should be
≥ 0.2mm to minimize shorting.
. The lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm
inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard extension will
accommodate any part misalignment and ensure a fillet.
. The center pad land length and width should be equal to maximum part pad length and width. However, the
minimum metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for 1 oz. Copper and ≥ 0.23mm for
3 oz. Copper).
. Two 0.30mm diameter via should be placed in the center of the pad land and connected to ground to minimize the
noise effect on the IC.
13
13
IRDC3629A
Solder Resist
. The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist mis-
alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder Mask Defined
(NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
. The minimum solder resist width is 0.13mm.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a fillet so a
solder resist width of ≥ 0.17mm remains.
. The land pad should be Non Solder Mask Defined (NSMD), with a minimum pullback of the solder resist off the
copper of 0.06mm to accommodate solder resist mis-alignment.
.Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of
the solder resist strip separating the lead lands from the pad land.
.Each via in the land pad should be tented or plugged from bottom boardside with solder resist.
14
14
IRDC3629A
Stencil Design
. The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the
amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the leads are
only 0.25mm wide, the stencil apertures should not be made narrower; openings in stencils < 0.25mm wide are
difficult to maintain repeatable solder release.
. The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead land.
. The land pad aperture should deposit approximately 50% area of solder on the center pad. If too much solder is
deposited on the center pad the part will float and the lead lands will be open.
. The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus
an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands when the part is
pushed into the solder paste.
15
15
IRDC3629A
IR3629A MLPD Package
3x4-12Lead
D
E/2
E
S
Y
VGED-4
M
B
O
L
MILLIMETERS
INCHES
MIN
0.80
0.00
NOM
0.90
MAX
MIN
NOM
.035
MAX
.039
A
A1
A3
b
1.00 .032
0.02
0.05 .000 .0008
.008 REF
.0019
0.20 REF
0.25
A
0.18
3.0
0.30 .0071 .0096
.0118
.145
A3
SEATING PLANE
D2
D
_
3.70 .118
_
A1
4.00 BSC
3.00 BSC
_
.157 BSC
E
.118 BSC
D2
E2
L
1.40
0.30
1.80 .055
0.50 .012
_
.070
.019
0.40
.016
e
0.50 PITCH
12
.020 PITCH
N
10
6
E2
ND
6
Terminal 1
Identifier
Leads on 2 sides
b
e
L
(ND-1) x e
TAPE & REEL ORIENTATION
Figure A
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
This product has been designed and qualified for the Industrial market.
Visit us at www.irf.com for sales contact information
Data and specifications subject to change without notice. 02/01
16
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