IRDC3629_技术文档

IRDC3629

USER GUIDE FOR IR3629 EVALUATION BOARD

(V_in=12V, V_o=1.8V, I_o=20A)

DESCRIPTION

An output over-current protection function is

implemented by sensing the voltage developed

across the on-resistance of the synchronous

rectifier MOSFET for optimum cost and

performance.

The IR3629 is a synchronous buck controller,

providing a compact, high performance and

flexible solution in a small 3mmx4mm MLPD

package.

Key features offered by the IR3629 include

programmable soft-start ramp, precision 0.6V

reference voltage, thermal protection, fixed

This user guide contains the schematic and bill of

materials for the IR3629 evaluation board. The

guide describes operation and use of the

600kHz switching frequency requiring

no

evaluation board itself. Detailed

application

external component, input under-voltage

lockout for proper start-up, and pre-bias start-

up.

information for the IR3629 integrated circuit is

available in the IR3629 data sheet.

BOARD FEATURES

• V_in= +12V (13.2V Max)

• V_out= +1.8V @ 0-20A

• IRF6712 as Controller MOSFET

• IRF6715 as Synchronous MOSFET

• L = 0.36uH

• C_in=33uF (SP cap) + 2x10uF (ceramic 1206)

• C_out=6x22uF(ceramic 1206)

• Optional external supply connection for Vc

• Optional Power-good output connection

1

IRDC3629

CONNECTIONS and OPERATING INSTRUCTIONS

A well regulated +12V input supply should be connected to VIN+ and VIN-. A maximum of 20A load can be

connected to VOUT+ and VOUT-. The connection diagram is shown in Fig. 1

IR3629 demo board can also be powered by two separate power supplies, one is the input voltage (Vin)

between VIN+ and VIN-, the other is bias voltage (Vcc) between Vc-ext and PGND. In this case, a well

regulated 5V~12V power supply should be connected to Vc-ext and PGND and R14 should be removed.

Inputs and outputs of the board are listed in Table I.

Table I. Connections

Connection

VIN+

Signal Name

V_in(+12V)

VIN-

Ground of V_in

Vc-ext

Optional Vcc input

PGND

VOUT-

VOUT+

GND

Ground for optional Vcc input

Ground of V_out

V_out(+1.8V)

Bias Voltage Ground

LAYOUT

The PCB is a 6-layer board. All of layers are 2 Oz. copper. Power supply decoupling capacitors, the charge-

pump capacitor and feedback components are located close to the IR3629. The feedback resistors are

connected to the output voltage at the point of regulation and are located close to the IC.

The input and output energy storage capacitors and the power inductor are located on bottom side of the

board, to improve efficiency, the circuit board is designed to minimize the length of the on-board power

ground current path.

2

IRDC3629

IR3629 Demo Board

V_o=1.8V

V_in= 12V

Fig. 1 Connection diagram of the evaluation board for IR3629 (Top view)

Fig. 2 Bottom view of the evaluation board for IR3629

3

IRDC3629

IR3629 PCB Layers

Top Layer

Bottom Layer

4

IRDC3629

IR3629 PCB Layers

AGND

PGND

Single point

connection

between PGND

and AGND

Mid-layer1

Mid-layer2

5

IRDC3629

IR3629 PCB Layers

Mid-layer3

Mid-layer4

6

IRDC3629

IR3629 Demo Board Schematic

PGND

Vc-ext

Vin

Vin+

Vin-

1

R14

33

+

C1

C4

C3

C2

0.1uF

10uF

33uF

3

D1

1

R15

N/A

BAT54S

PGND

C22

Vin-

C25

0.1uF

C12

0.1uF

1uF

U1

En

2

11

10

6

Vcc

Vc

HDrv

R17

Q1

C23

PGood

4.99K

Vout

Vout+

SS/SD

GND

N3064730

Vout

5

IRF6712 SQ

1

0.1uF

C24

SW

L1

12

3

R7

31.6K

OCSet

LDrv

No Stuff

1

7

N3065200

1

Q2

2

PGood

Vsens

IR3629

N3065372

5

0.36uH

IRF6715 MX

C14

0.1uF

C15

C16

22uF

C17

22uF

C18

22uF

C19

C20

Vout-

C10

C11

22uF

R5

9

8

4

1

0.1uF

AGND

13.3K

Comp

Fb

PGND

39pF

13

C26

Thermal

R1

R12

2.94K

1

13.3K

1.8nF

C9

N/A

R9

0

R10

No Stuff

C8

R4

1.96K

180pF

R2

R6

20

60.4K

R3

30.1K

R*

0

A

B

Fig. 3 Schematic of the IR3629 evaluation board with 12Vin and1.8V output voltage

7

IRDC3629

BILL OF MATERIALS

Item

Quantity

Reference

C1

Value

33uF

Description

Size

Manufacturer

Part Number

1

POSCAP, 25V, 20%

-

Sanyo

25TQC33M

Ceramic, 25V, X7R,

10%

2

C2,C3

10uF

1206

Murata

GRM31CR61C106KA88

C4,C10,C12

C14,C23,

C25

Ceramic, 25V, X7R,

10%

3

4

5

6

1

0.1uF

180pF

39pF

603

TDK

C1608X7R1H104K

GRM1885C1H181JA01D

GRM1885C1H390JA01D

Ceramic, 50V, C0G,

5%

C8

Murata

Ceramic, 50V, C0G,

5%

C11

C15,C16,

C17,C18,

C19,C20

Ceramic, 6.3V, X5R,

20%

6

7

6

1

22uF

1uF

1206

603

Panasonic

TDK

ECJDV50J226M

Ceramic, 16V, X5R,

10%

C22

C1608X5R1C105K

Ceramic, 50V, C0G,

5%

8

9

1

C26

D1

1.8nF

603

Murata

Vishay

GRM1885C1H182JA01D

BAT54S

Dual Schottky Diode

1.1mOhm

SOT-23

10

11

1

L1

0.36uH

-

Panasonic

IR

ETQP4LR36WFC

IRF6712SPbF

IRF6712

SQ

NFET, 25V, 3.8mOhm,

12nC

DirectFET

SQ

Q1

IRF6715

MX

NFET, 25V, 1.3mOhm,

40nC

DirectFET

MX

12

13

14

15

16

17

18

19

20

21

22

1

Q2

R9

R1

R2

R7

R3

R4

R5

R6

R12

R17

IR

IRF6715MPbF

0

Thick film, 1%, 1/10W

603

any

13.3K

60.4K

31.6K

30.1K

1.96K

13.3K

20

2.94K

4.99K

8

IRDC3629

BILL OF MATERIALS (cont.)

Item

Quantity

Reference

Value

33

Description

Size

Manufacturer

Part Number

23

1

R14

Thick film, 1%, 1/4W

1206

any

MLPD

3x4

24

25

26

27

1

2

1

2

U1

IR3629

No Stuff

PWM Controller

IR

IR3629MPbF

C9, C24

C21

603

-

R10,R15

603

Banana Jack,

Insulated, Solder

Terminal, Black

Johnson

Components

28

29

30

2

1

-

105-0853-001

105-0852-001

105-0854-001

Banana Jack,

Insulated, Solder

Terminal, Red

Johnson

Components

Banana Jack,

Insulated, Solder

Terminal, Green

Johnson

Components

9

IRDC3629

TRACKING OPERATING PERFORMANCE

Vin=12.0V, Vo=1.8V, Fs=600kHz, Room Temperature, No Air Flow

Fig. 4 Start Up at 20A

Fig. 5 Prebias Start Up

Ch1:Vin, Ch2:Vss, Ch3:PGood, Ch4:Vout

Ch1:Vin, Ch2:Vss, Ch4:Vout

Fig. 6 Output Voltage Ripple at 20A Load

Ch1:Vout, Ch3:SW

Fig. 7 Gate Signals at 20A Load

Ch1:LDRV, Ch2:HDRV, Ch3:SW

Fig. 8 Transient Response

Ch1:Vout, Ch2:Io(0-10A)

Fig. 9 Shorted Hiccup Condition Recovery

Ch2:Vout, Ch3:Vss, Ch4:Io

10

IRDC3629

TYPICAL OPERATING PERFORMANCE

Vin=12.0V, Vo=1.8V, Io=0-20A, Fs=600kHz, Air Flow=200LFM

Fig. 10 Bode Plot of Control Loop

11

IRDC3629

TYPICAL OPERATING PERFORMANCE

Vin=12.0V, Vo=1.8V, Fs=600kHz, Room Temp, No Air Flow

IR3629 Efficiency

100

90

80

70

60

50

0.0

2.5

5.0

7.5

10.0

12.5

15.0

Iout(A)

Fig. 11 Efficiency vs. Load

2

1

Fig. 12 Thermal Image of IR3629 Demo Board at Io=15A

(1: IR3629, 2: IRF6715, 3: IRF6712)

12

IRDC3629

PCB Metal and Components Placement

. The lead land width should be equal to the nominal part lead width. The minimum lead to lead spacing should be

≥ 0.2mm to minimize shorting.

. The lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm

inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard extension will

accommodate any part misalignment and ensure a fillet.

. The center pad land length and width should be equal to maximum part pad length and width. However, the

minimum metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for 1 oz. Copper and ≥ 0.23mm for

3 oz. Copper).

. Two 0.30mm diameter via should be placed in the center of the pad land and connected to ground to minimize the

noise effect on the IC.

13

IRDC3629

Solder Resist

. The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist mis-

alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder Mask Defined

(NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.

. The minimum solder resist width is 0.13mm.

At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a fillet so a

solder resist width of ≥ 0.17mm remains.

. The land pad should be Non Solder Mask Defined (NSMD), with a minimum pullback of the solder resist off the

copper of 0.06mm to accommodate solder resist mis-alignment.

.Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of

the solder resist strip separating the lead lands from the pad land.

.Each via in the land pad should be tented or plugged from bottom boardside with solder resist.

14

IRDC3629

Stencil Design

. The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the

amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the leads are

only 0.25mm wide, the stencil apertures should not be made narrower; openings in stencils < 0.25mm wide are

difficult to maintain repeatable solder release.

. The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead land.

. The land pad aperture should deposit approximately 50% area of solder on the center pad. If too much solder is

deposited on the center pad the part will float and the lead lands will be open.

. The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus

an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands when the part is

pushed into the solder paste.

15

IRDC3629

IR3629 MLPD Package

3x4-12Lead

D

E/2

E

S

Y

VGED-4

M

B

O

L

MILLIMETERS

INCHES

MIN

0.80

0.00

NOM

0.90

MAX

MIN

NOM

.035

MAX

.039

A

A1

A3

b

1.00 .032

0.02

0.05 .000 .0008

.008 REF

.0019

0.20 REF

0.25

A

0.18

3.0

0.30 .0071 .0096

.0118

.145

A3

SEATING PLANE

D2

D

_

3.70 .118

_

A1

4.00 BSC

3.00 BSC

_

.157 BSC

E

.118 BSC

D2

E2

L

1.40

0.30

1.80 .055

0.50 .012

_

.070

.019

0.40

.016

e

0.50 PITCH

12

.020 PITCH

N

10

6

E2

ND

6

Terminal 1

Identifier

Leads on 2 sides

b

e

L

(ND-1) x e

TAPE & REEL ORIENTATION

Figure A

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105

TAC Fax: (310) 252-7903

This product has been designed and qualified for the Industrial market.

Visit us at www.irf.com for sales contact information

Data and specifications subject to change without notice. 02/01

16


型号：	IRDC3629
厂家：	Infineon
描述：	USER GUIDE FOR IR3629 EVALUATION BOARD 用户指南IR3629评估板
文件：	总16页 (文件大小：708K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IRDC3629 [INFINEON]

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