N-HFA08TB120 [NELLSEMI]

FRED Ultrafast Soft Recovery Diode, 8 A; FRED超快软恢复二极管,一个8
N-HFA08TB120
型号: N-HFA08TB120
厂家: NELL SEMICONDUCTOR CO., LTD    NELL SEMICONDUCTOR CO., LTD
描述:

FRED Ultrafast Soft Recovery Diode, 8 A
FRED超快软恢复二极管,一个8

二极管 超快软恢复二极管
文件: 总6页 (文件大小:324K)
中文:  中文翻译
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RoHS  
RoHS  
N-HFA08TB120  
SEMICONDUCTOR  
Nell High Power Products  
FRED  
Ultrafast Soft Recovery Diode, 8 A  
Available  
RoHS*  
FEATURES  
COMPLIANT  
Ultrafast recovery  
Ultrasoft recovery  
Very low IRRM  
Very low Qrr  
Specified at operating conditions  
Lead (Pb)-free  
Designed and qualified for industrial level  
BENEFITS  
Reduced RFI and EMI  
Reduced power loss in diode and switching transistor  
Higher frequency operation  
Reduced snubbing  
Reduced parts count  
cathode  
2
DESCRIPTION  
HFA08TB120 is a state of the art ultrafast recovery  
diode. Employing the latest in epitaxial construction  
and advanced processing techniques it features  
a superb combination of characteristics which result  
in performance which is unsurpassed by any rectifier  
previously available. With basic ratings of 1200V  
and 8 A continuous current, the HFA08TB120 is  
especially well suited for use as the companion  
diode for IGBTs and MOSFETs. In addition to ultrafast  
recovery time, the FRED product line features  
1
3
Cathode Anode  
TO-220AC  
PRODUCT SUMMARY  
extremely low values of peak recovery current (I  
)
RRM  
VR  
VF at 8A at 25 ºC  
IF(AV)  
1200 V  
3.3 V  
8 A  
and does not exhibit any tendency to “snap-off” during  
the t portion of recovery. The FRED features combine  
b
to offer designers a rectifier with lower noise and  
significantly lower switching losses in both the diode  
and the switching transistor. These FRED advantages  
can help to significantly reduce snubbing, component  
count and heatsink sizes. The FRED HFA08TB120  
is ideally suited for applications in power supplies and  
conversion systems (such as inverters), motor drives,  
and many other similar applications where high speed,  
high efficiency is needed.  
trr (typical)  
30 ns  
150 ºC  
140 nC  
85 A/µS  
4.5 A  
TJ (maximum)  
Qrr (typical)  
dI(rec)M/dt (typical) at 125 ºC  
I
RRM (typical)  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
VR  
TEST CONDITIONS  
UNITS  
VALUES  
V
Cathode to anode voltage  
Maximum continuous forward current  
Single pulse forward current  
Maximum repetitive forward current  
1200  
IF  
Tc = 100 ºC  
8
IFSM  
A
130  
IFRM  
PD  
32  
Tc = 25 ºC  
73  
29  
Maximum power dissipation  
W
Tc = 100 ºC  
TJ, TStg  
Operating junction and storage temperature range  
- 55 to + 150  
°C  
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Page 1 of 6  
RoHS  
RoHS  
N-HFA08TB120  
SEMICONDUCTOR  
Nell High Power Products  
ELECTRICAL SPECIFICATIONS  
(T = 25 ºC unless otherwise specified)  
J
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MAX.  
TYP.  
UNITS  
MIN.  
Cathode to anode  
breakdown voltage  
-
-
VBR  
IR = 100 µA  
1200  
IF = 8.0 A  
IF = 16 A  
-
-
2.5  
3.0  
2.3  
3.3  
4.1  
3.1  
V
VFM  
Maximum forward voltage  
IF = 8.0 A, TJ = 125 ºC  
-
VR = VR rated  
TJ = 125°C, VR = VR rated  
VR = 200V  
-
-
0.31  
135  
11  
10  
1000  
Maximum reverse  
leakage current  
IRM  
µA  
Junction capacitance  
Series inductance  
pF  
nH  
CT  
LS  
20  
-
-
8.0  
Measured lead to lead 5 mm from package body  
-
DYNAMIC RECOVERY CHARACTERISTICS PERLEG (T = 25 ºC unless otherwise specified)  
J
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
MAX. UNITS  
TYP.  
IF = 0.5A, IR = 1.0A, IRR = 250mA (RG#1 CKT)  
IF = 1.0 A, dIF/dt = -200 A/µs, VR =30 V, TJ = 25°C  
-
-
28  
35  
trr  
-
30  
ns  
Reverse recovery time  
trr1  
trr2  
-
-
TJ = 25 ºC  
TJ = 125 ºC  
TJ = 25 ºC  
63  
105  
4.5  
95  
160  
IRRM1  
-
-
8
Peak recovery current  
A
IF= 8.0A  
dIF/dt = -200 A/µs  
VR = 200 V  
IRRM2  
Qrr1  
TJ = 125 ºC  
11  
6.1  
140  
335  
133  
85  
-
-
TJ = 25 ºC  
380  
Reverse recovery charge  
nC  
Qrr2  
TJ = 125 ºC  
TJ = 25 ºC  
TJ = 125 ºC  
880  
-
dl(rec)M/dt1  
dl(rec)M/dt2  
-
Peak rate of fall of recovery  
current during tb  
A/µs  
-
-
THERMAL - MECHANICAL SPECIFICATIONS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Lead temperature  
Tlead  
0.063" from case (1.6 mm) for 10 s  
-
-
300  
ºC  
Thermal resistance,  
junction to case  
Thermal resistance,  
junction to ambient  
Thermal resistance,  
case to heatsink  
RthJC  
RthJA  
RthCS  
-
-
1.7  
-
-
-
Typical socket mount  
K/W  
40  
-
Mounting surface, flat, smooth and greased  
0.25  
g
-
-
-
-
6
Weight  
oz.  
0.21  
.
6.0  
(5.0)  
12  
(10)  
kgf cm  
Mounting torque  
Marking device  
-
.
(lbf in)  
Case style TO-220AC  
HFA08TB120  
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Page 2 of 6  
RoHS  
RoHS  
N-HFA08TB120  
SEMICONDUCTOR  
Nell High Power Products  
Fig.1 Maximum Forward Voltage Drop Characteristics  
Fig.2 Typical Values of Reverse Current vs.  
Reverse Voltage  
100  
1000  
T
= 150ºC  
J
T
= 125ºC  
100  
10  
J
T
= 100ºC  
J
10  
1
T
= 25ºC  
J
0.1  
0.01  
T
T
T
= 150 ºC  
= 125 ºC  
= 25 ºC  
J
J
J
1
0
300  
600  
900  
1200  
0
2
4
6
8
10  
Forward Voltage Drop - V  
(V)  
Reverse Voltage - V (V)  
R
FM  
Fig.3 Typical Junction Capacitance vs. Reverse Voltage  
100  
T
= 25ºC  
J
10  
1
1
10  
100  
10000  
Reverse Voltage - VR (V)  
Fig.4 Maximum Thermal Impedance ZthJC  
Characteristics  
10  
1
P
DM  
D = 0.50  
D = 0.20  
D = 0.10  
D = 0.05  
D = 0.02  
D = 0.01  
t
1
t
0.1  
2
Notes:  
Single pulse  
(thermal resistance)  
1. Duty factor D = t1/ t 2  
2. Peak T = Pdm x ZthJC + Tc  
J
0.01  
0.00001  
1
0.0001  
0.001  
0.01  
0.1  
Rectangular Pulse Duration (sec)- t1  
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Page 3 of 6  
RoHS  
RoHS  
N-HFA08TB120  
SEMICONDUCTOR  
Nell High Power Products  
Fig.5 Typical Reverse Recovery Time vs.dI /dt  
Fig.7 Typical Stored Charge vs. dI /dt  
F
F
1200  
1000  
800  
600  
400  
200  
0
160  
140  
120  
100  
80  
V = 160 V  
R
I = 8A  
F
T =125 ºC  
F
J
I =  
4A  
T =25 ºC  
J
I = 8 A  
F
I = 4 A  
F
60  
V = 160 V  
R
T =125 ºC  
J
T =25 ºC  
J
20  
100  
1000  
100  
1000  
F
F
Fig.6 Typical Recovery Current vs. di /dt  
Fig.8 Typical dI(rec)M/dt vs. dIF/dt  
F
20  
16  
12  
8
1000  
100  
10  
V = 160 V  
R
T =125 ºC  
I = 8 A  
F
J
F
T =25 ºC  
I = 4 A  
J
I = 8 A  
F
I = 4 A  
F
V = 160 V  
4
R
T =125 ºC  
J
T =25 ºC  
J
0
100  
1000  
100  
1000  
F
F
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Page 4 of 6  
RoHS  
RoHS  
N-HFA08TB120  
SEMICONDUCTOR  
Nell High Power Products  
Fig.9 Reverse Recovery Parameter Test Circuit  
VR = 200 V  
Ω
0.01  
L = 70 µH  
D.U.T.  
D
dI /dt  
F
adjust  
IRFP250  
G
S
Fig.10 Reverse Recovery Waveform and Definitions  
(3)  
trr  
IF  
ta  
tb  
0
(4)  
Qrr  
(2)  
IRRM  
0.5 IRRM  
(5)  
dI(rec)M/dt  
0.75 IRRM  
dIF/dt  
(1)  
(4) Qrr  
-
area under curve defined by t  
RRM  
(1) dI /dt - rate of change of current  
rr  
F
through zero crossing  
and I  
t
x I  
rr  
RRM  
(2) IRRM - peak reverse recovery current  
Q
=
rr  
2
(3) t - reverse recovery time measured  
rr  
/ -  
dt peak rate of change of  
(5) dI(rec)M  
current during t portion of trr  
from zero crossing point of negative  
b
going I to point where a line passing  
F
through 0.75 IRRM and 0.50 IRRM  
extrapolated to zero current.  
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Page 5 of 6  
RoHS  
RoHS  
N-HFA08TB120  
SEMICONDUCTOR  
Nell High Power Products  
ORDERING INFORMATION TABLE  
Device code  
-
HFA 08 TB  
N
120  
1
2
3
4
5
1
2
3
4
5
-
-
-
Nell Semiconductors product  
FRED family  
Current rating (08 = 8 A)  
-
-
Package : TB = TO-220AC  
Voltage rating (120 = 1200 V)  
TO-220AC Package Outline  
0.404 [10.26]  
0.393 [9.98]  
0.186 [4.72]  
0.174 [4.42]  
Cathode  
0.114 [2.90]  
0.102 [2.59]  
0.058 [1.47]  
0.047 [1.19]  
Ø0.153 [3.89]  
Ø0.149 [3.78]  
0.508 [12.90]  
0.492 [12.50]  
0.362 [9.19]  
0.354 [8.99]  
0.154 [3.91]  
0.134 [3.40]  
0.110 [2.79]  
0.099 [2.51]  
0.531 [13.49]  
0.515 [13.08]  
0.057 [1.45]  
0.047 [1.19]  
Cathode  
Anode  
0.034 [0.86]  
0.030 [0.76]  
0.018 [0.46]  
0.014 [0.36]  
0.100 [2.54] TYP  
0.204 [5.18]  
0.196 [4.98]  
www.nellsemi.com  
Page 6 of 6  

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