N-HFA08TB60 [NELLSEMI]

FRED Ultrafast Soft Recovery Diode, 8 A; FRED超快软恢复二极管,一个8
N-HFA08TB60
型号: N-HFA08TB60
厂家: NELL SEMICONDUCTOR CO., LTD    NELL SEMICONDUCTOR CO., LTD
描述:

FRED Ultrafast Soft Recovery Diode, 8 A
FRED超快软恢复二极管,一个8

二极管 超快软恢复二极管
文件: 总6页 (文件大小:331K)
中文:  中文翻译
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RoHS  
RoHS  
N-HFA08TB60  
SEMICONDUCTOR  
Nell High Power Products  
FRED  
Ultrafast Soft Recovery Diode, 8 A  
Available  
RoHS*  
COMPLIANT  
FEATURES  
Ultrafast recovery  
Ultrasoft recovery  
Very low I  
Very low Q  
Specified at operating conditions  
RRM  
rr  
Lead (Pb)-free  
Designed and qualified for industrial level  
BENEFITS  
Reduced RFI and EMI  
Reduced power loss in diode and switching transistor  
Higher frequency operation  
Reduced snubbing  
cathode  
Reduced parts count  
2
DESCRIPTION  
HFA08TB60 is a state of the art ultrafast recovery  
diode. Employing the latest in epitaxial construction  
and advanced processing techniques it features  
a superb combination of characteristics which result  
in performance which is unsurpassed by any rectifier  
previously available. With basic ratings of 600V  
and 8 A continuous current, the HFA08TB60 is  
especially well suited for use as the companion  
diode for IGBTs and MOSFETs. In addition to ultrafast  
recovery time, the FRED product line features  
1
3
Cathode Anode  
TO-220AC  
PRODUCT SUMMARY  
extremely low values of peak recovery current (I  
)
RRM  
and does not exhibit any tendency to “snap-off” during  
VR  
VF at 8A at 25 ºC  
IF(AV)  
600 V  
the t portion of recovery. The FRED features combine  
b
1.7 V  
8 A  
to offer designers a rectifier with lower noise and  
significantly lower switching losses in both the diode  
and the switching transistor. These FRED advantages  
can help to significantly reduce snubbing, component  
count and heatsink sizes. The FRED HFA08TB60  
is ideally suited for applications in power supplies and  
conversion systems (such as inverters), motor drives,  
and many other similar applications where high speed,  
high efficiency is needed.  
18 ns  
150 ºC  
trr (typical)  
TJ (maximum)  
Qrr (typical)  
65 nC  
240 A/µS  
5.0A  
dI(rec)M/dt (typical)  
IRRM  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
VR  
TEST CONDITIONS  
VALUES  
UNITS  
Cathode to anode voltage  
Maximum continuous forward current  
Single pulse forward current  
Maximum repetitive forward current  
600  
V
IF  
Tc = 100 ºC  
8
IFSM  
IFRM  
60  
A
24  
Tc = 25 ºC  
36  
14  
Maximum power dissipation  
PD  
W
Tc = 100 ºC  
Operating junction and storage temperature range  
TJ, TStg  
- 55 to + 150  
ºC  
www.nellsemi.com  
Page 1 of 6  
RoHS  
RoHS  
N-HFA08TB60  
SEMICONDUCTOR  
Nell High Power Products  
ELECTRICAL SPECIFICATIONS  
(T = 25 ºC unless otherwise specified)  
J
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MAX.  
TYP.  
UNITS  
MIN.  
Cathode to anode  
breakdown voltage  
-
-
VBR  
IR = 100 µA  
600  
IF = 8.0 A  
IF = 16 A  
-
-
1.4  
1.7  
1.4  
1.7  
2.1  
1.7  
V
VFM  
Maximum forward voltage  
IF = 8.0 A, TJ = 125 ºC  
-
VR = VR rated  
TJ = 125°C, VR = VR rated  
VR = 200V  
-
-
0.3  
100  
10  
5.0  
500  
Maximum reverse  
leakage current  
IRM  
µA  
Junction capacitance  
Series inductance  
pF  
nH  
CT  
LS  
25  
-
-
8.0  
Measured lead to lead 5 mm from package body  
-
DYNAMIC RECOVERY CHARACTERISTICS PERLEG (T = 25 ºC unless otherwise specified)  
J
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
MAX. UNITS  
TYP.  
IF = 0.5A, IR = 1.0A, IRR = 250mA (RG#1 CKT)  
IF = 1.0 A, dIF/dt = -200 A/µs, VR =30 V, TJ = 25°C  
-
-
-
25  
trr  
-
18  
ns  
Reverse recovery time  
trr1  
trr2  
-
-
TJ = 25 ºC  
TJ = 125 ºC  
TJ = 25 ºC  
37  
55  
55  
90  
IRRM1  
-
-
5.0  
3.5  
Peak recovery current  
A
IF= 8.0A  
dIF/dt = -200 A/µs  
VR = 200 V  
IRRM2  
Qrr1  
TJ = 125 ºC  
8.0  
4.5  
65  
-
-
TJ = 25 ºC  
138  
Reverse recovery charge  
nC  
Qrr2  
TJ = 125 ºC  
TJ = 25 ºC  
TJ = 125 ºC  
124  
240  
210  
360  
-
dl(rec)M/dt1  
dl(rec)M/dt2  
-
Peak rate of fall of recovery  
current during tb  
A/µs  
-
-
THERMAL - MECHANICAL SPECIFICATIONS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Lead temperature  
Tlead  
0.063" from case (1.6 mm) for 10 s  
-
-
300  
ºС  
Thermal resistance,  
junction to case  
Thermal resistance,  
junction to ambient  
Thermal resistance,  
case to heatsink  
RthJC  
RthJA  
RthCS  
-
-
3.5  
Typical socket mount  
-
-
-
80  
-
K/W  
Mounting surface, flat, smooth and greased  
0.5  
-
-
2.0  
-
-
g
Weight  
0.07  
oz.  
6.0  
(5.0)  
12  
(10)  
kgf . cm  
(lbf . in)  
Mounting torque  
Marking device  
-
Case style TO-220AC  
HFA08TB60  
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Page 2 of 6  
RoHS  
RoHS  
N-HFA08TB60  
SEMICONDUCTOR  
Nell High Power Products  
Fig.1 Maximum Forward Voltage Drop vs.  
Instantaneous Forward Current  
Fig.2 Typical Reverse Current vs. Reverse Voltage  
100  
10  
1000  
T
= 150 °С  
J
100  
10  
T
= 125 °C  
J
1
0.1  
1
T
= 25 ºC  
J
T
T
T
= 150 °С  
= 125 °С  
= 25 °С  
J
J
J
0.01  
0.001  
0.1  
0.4  
100  
200  
300  
400  
500  
600  
0
0.8  
1.2  
1.6  
2.0  
2.4  
2.8  
3.2  
Reverse Voltage (V)  
V
-
Forward Voltage Drop (V)  
FM  
Fig.3 Typical Junction Capacitance vs. Reverse Voltage  
100  
T
= 25 °С  
J
10  
1
1
10  
100  
1000  
V
- Reverse Voltage (V)  
R
Fig.4 Maximum Thermal Impedance Z  
Characteristics  
thJC  
1
P
DM  
t1  
D = 0.50  
D = 0.20  
D = 0.10  
D = 0.05  
D = 0.02  
D = 0.01  
t2  
0.1  
Notes:  
Single pulse  
(thermal response)  
1. Duty factor D = t1/ t 2  
2. Peak T = Pdm x ZthJC + Tc  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
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Page 3 of 6  
RoHS  
RoHS  
N-HFA08TB60  
SEMICONDUCTOR  
Nell High Power Products  
Fig.5 Typical Reverse Recovery Time vs. dIF/dt  
Fig.6 Typical Recovery Current vs. dIF/dt  
20  
15  
10  
5
80  
60  
40  
20  
0
V
T
= 200 V  
= 125 °С  
= 25 °С  
R
I
I
I
= 16 A  
= 8 A  
= 4 A  
F
F
F
J
J
T
I
I
I
= 16 A  
= 8 A  
= 4 A  
F
F
F
V
T
= 200 V  
= 125 °С  
= 25 °С  
R
J
J
T
0
100  
1000  
100  
1000  
dIF/dt (A/µs)  
dIF/dt (A/µs)  
Fig.8 Typical dI(rec)M/dt vs. dIF/dt  
Fig.7 Typical Stored Charge vs. dIF/dtI  
500  
400  
300  
10 000  
1000  
100  
V
= 200 V  
= 125 °С  
= 25 °С  
R
J
T
I
I
I
= 16 A  
= 8 A  
= 4 A  
F
F
F
T
J
I
F
F
= 16 A  
= 8 A  
= 4 A  
F
I
I
200  
100  
0
V
T
= 200 V  
= 125 °С  
= 25 °С  
R
J
J
T
100  
1000  
100  
1000  
dIF/dt (A/µs)  
dI /dt (A/µs)  
F
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Page 4 of 6  
RoHS  
RoHS  
N-HFA08TB60  
SEMICONDUCTOR  
Nell High Power Products  
Fig.9 Reverse Recovery Parameter Test Circuit  
VR = 200 V  
0.01 Ω  
L = 70 μH  
D.U.T.  
D
/dt  
dI  
F
adjust  
IRFP250  
G
S
Fig.10 Reverse Recovery Waveform and Definitions  
(3)  
trr  
IF  
ta  
tb  
0
(4)  
Qrr  
(2)  
IRRM  
0.5 IRRM  
(5)  
dI(rec)M/dt  
0.75 IRRM  
dIF/dt  
(1)  
(4) Qrr - area under curve defined by trr  
(1) dI /dt - rate of change of current  
F
and IRRM  
through zero crossing  
t
x l  
2
rr  
RRM  
(2) IRRM - peak reverse recovery current  
Q
=
rr  
(3) t - reverse recovery time measured  
rr  
(5) dI(rec)M/dt - peak rate of change of  
from zero crossing point of negative  
current during t portion of trr  
b
going I to point where a line passing  
F
through 0.75 IRRM and 0.50RIRM  
extrapolated to zero current.  
www.nellsemi.com  
Page 5 of 6  
RoHS  
RoHS  
N-HFA08TB60  
SEMICONDUCTOR  
Nell High Power Products  
ORDERING INFORMATION TABLE  
Device code  
-
HFA 08 TB  
N
60  
1
2
3
4
5
1
2
3
4
5
-
-
-
Nell Semiconductors product  
FRED family  
Current rating (08 = 8 A)  
-
-
Package : TB = TO-220AC  
Voltage rating (60 = 600 V)  
TO-220AC Package Outline  
0.404 [10.26]  
0.393 [9.98]  
0.186 [4.72]  
0.174 [4.42]  
Cathode  
0.114 [2.90]  
0.102 [2.59]  
0.058 [1.47]  
0.047 [1.19]  
Ø0.153 [3.89]  
Ø0.149 [3.78]  
0.508 [12.90]  
0.492 [12.50]  
0.362 [9.19]  
0.354 [8.99]  
0.154 [3.91]  
0.134 [3.40]  
0.110 [2.79]  
0.099 [2.51]  
0.531 [13.49]  
0.515 [13.08]  
0.057 [1.45]  
0.047 [1.19]  
Cathode  
Anode  
0.034 [0.86]  
0.030 [0.76]  
0.018 [0.46]  
0.014 [0.36]  
0.100 [2.54] TYP  
0.204 [5.18]  
0.196 [4.98]  
www.nellsemi.com  
Page 6 of 6  

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