BGA2712,115 [NXP]
BGA2712 - MMIC wideband amplifier TSSOP 6-Pin;
| 型号： | BGA2712,115 |
| 厂家： | 
NXP |
| 描述： | BGA2712 - MMIC wideband amplifier TSSOP 6-Pin 射频 微波 |
| 文件： | 总12页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
BGA2712
MMIC wideband amplifier
Product specification
2002 Sep 10
Supersedes data of 2002 Jan 31
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
FEATURES
PINNING
PIN
Internally matched to 50
DESCRIPTION
Wide frequency range (3.2 GHz at 3 dB bandwidth)
Flat 21 dB gain (DC to 2.6 GHz at 1 dB flatness)
1
2, 5
3
VS
GND2
RF out
GND1
RF in
5 dBm saturated output power at 1 GHz
Good linearity (11 dBm IP3(out) at 1 GHz)
Unconditionally stable (K > 1.5).
4
6
APPLICATIONS
6
1
5
2
4
3
1
LNB IF amplifiers
Cable systems
ISM
6
3
4
2, 5
General purpose.
Top view
MAM455
DESCRIPTION
Marking code: E2-.
Silicon Monolithic Microwave Integrated Circuit (MMIC)
wideband amplifier with internal matching circuit in a 6-pin
SOT363 SMD plastic package.
Fig.1 Simplified outline (SOT363) and symbol.
QUICK REFERENCE DATA
SYMBOL
VS
PARAMETER
DC supply voltage
CONDITIONS
TYP.
MAX.
UNIT
5
6
V
IS
s212
DC supply current
insertion power gain
noise figure
12.3
21.3
3.9
mA
dB
f = 1 GHz
NF
f = 1 GHz
f = 1 GHz
dB
PL(sat)
saturated load power
4.8
dBm
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
SYMBOL
VS
PARAMETER
DC supply voltage
CONDITIONS
MIN.
MAX.
UNIT
RF input AC coupled
6
V
IS
supply current
35
mA
mW
C
Ptot
Tstg
Tj
total power dissipation
storage temperature
operating junction temperature
maximum drive power
Ts 90 C
200
+150
150
10
65
C
PD
dBm
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
2002 Sep 10
2
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-s
thermal resistance from junction to
solder point
Ptot = 200 mW; Ts 90 C
300
K/W
CHARACTERISTICS
VS = 5 V; IS = 12.3 mA; Tj = 25 C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS
IS supply current
MIN.
TYP.
12.3
MAX.
UNIT
9
15
22
22
23
23
22
21
mA
s212
insertion power gain
f = 100 MHz
f = 1 GHz
20
20
20
20
19
16
12
8
20.8
21.3
22
dB
dB
f = 1.8 GHz
f = 2.2 GHz
f = 2.6 GHz
f = 3 GHz
dB
22
dB
21.2
19.3
14
dB
dB
RL IN
RL OUT
s122
NF
return losses input
return losses output
isolation
f = 1 GHz
dB
f = 2.2 GHz
f = 1 GHz
10
dB
17
15
31
36
20
dB
f = 2.2 GHz
f = 1.6 GHz
f = 2.2 GHz
f = 1 GHz
18
dB
33
dB
39
dB
noise figure
3.9
4.3
3.2
2
4.3
4.7
dB
f = 2.2 GHz
dB
BW
K
bandwidth
at s212 3 dB below flat gain at 1 GHz 2.8
GHz
stability factor
f = 1 GHz
1.5
2.5
3
f = 2.2 GHz
3
PL(sat)
PL 1 dB
IP3(in)
IP3(out)
saturated load power f = 1 GHz
f = 2.2 GHz
4.8
1.3
0.2
2
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
0
load power
at 1 dB gain compression; f = 1 GHz
2
4
12
14
9
at 1 dB gain compression; f = 2.2 GHz
input intercept point
f = 1 GHz
10
16
11
f = 2.2 GHz
output intercept point f = 1 GHz
f = 2.2 GHz
4
6
2002 Sep 10
3
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
APPLICATION INFORMATION
Figure 2 shows a typical application circuit for the
BGA2712 MMIC. The device is internally matched to 50 ,
and therefore does not need any external matching. The
value of the input and output DC blocking capacitors C2
and C3 should not be more than 100 pF for applications
above 100 MHz. However, when the device is operated
below 100 MHz, the capacitor value should be increased.
DC-block
100 pF
DC-block
100 pF
DC-block
100 pF
handbook, halfpage
input
output
MGU437
The 22 nF supply decoupling capacitor C1 should be
located as closely as possible to the MMIC.
Fig.3 Easy cascading application circuit.
Separate paths must be used for the ground planes of the
ground pins GND1 and GND2, and these paths must be as
short as possible. When using vias, use multiple vias per
pin in order to limit ground path inductance.
mixer
handbook, halfpage
from RF
circuit
to IF circuit
or demodulator
wideband
amplifier
MGU438
V
handbook, halfpage
s
oscillator
C1
V
s
Fig.4 Application as IF amplifier.
RF in
RF out
RF input
RF output
C2
C3
GND1
GND2
MGU435
mixer
handbook, halfpage
to IF circuit
or demodulator
antenna
Fig.2 Typical application circuit.
LNA
wideband
amplifier
MGU439
oscillator
Figure 3 shows two cascaded MMICs. This configuration
doubles overall gain while preserving broadband
characteristics. Supply decoupling and grounding
conditions for each MMIC are the same as those for the
circuit of Fig.2.
Fig.5 Application as RF amplifier.
The excellent wideband characteristics of the MMIC make
it an ideal building block in IF amplifier applications such
as LBNs (see Fig.4).
mixer
handbook, halfpage
from modulation
or IF circuit
to power
amplifier
As a buffer amplifier between an LNA and a mixer in a
receiver circuit, the MMIC offers an easy matching, low
noise solution (see Fig.5).
wideband
amplifier
MGU440
oscillator
In Fig.6 the MMIC is used as a driver to the power amplifier
as part of a transmitter circuit. Good linear performance
and matched input and output offer quick design solutions
in such applications.
Fig.6 Application as driver amplifier.
2002 Sep 10
4
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
90°
+1
1.0
0.8
0.6
0.4
0.2
0
135°
45°
+2
+0.5
+0.2
+5
100 MHz
4 GHz
0.2
0.5
2
5
180°
0
0°
−5
−0.2
−0.5
−2
−45°
−135°
−1
MLD904
1.0
−90°
IS = 12.3 mA; VS = 5 V; PD = 30 dBm; ZO = 50
Fig.7 Input reflection coefficient (s11); typical values.
90°
+1
1.0
0.8
0.6
0.4
0.2
0
135°
+0.2
45°
+2
+0.5
+5
4 GHz
0.2
0.5
2
5
180°
0
0°
100 MHz
−5
−0.2
−0.5
−2
−45°
−135°
−1
−90°
MLD905
1.0
IS = 12.3 mA; VS = 5 V; PD = 30 dBm; ZO = 50
Fig.8 Output reflection coefficient (s22); typical values.
5
2002 Sep 10
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
MLD906
MLD907
0
25
handbook, halfpage
handbook, halfpage
2
s
12
(dB)
2
s
21
−10
(dB)
20
−20
−30
(1)
(2)
15
(3)
−40
−50
10
0
0
1000
2000
3000
4000
1000
2000
3000
4000
f (MHz)
f (MHz)
PD = 30 dBm; ZO = 50
(1) IS = 15.1 mA; VS = 5.5 V.
(2) IS = 12.3 mA; VS = 5 V.
(3) IS = 10.1 mA; VS = 4.5 V.
IS = 12.3 mA; VS = 5 V; PD = 30 dBm; ZO = 50
Fig.9 Isolation (s122) as a function of frequency;
Fig.10 Insertion gain (s212) as a function of
typical values.
frequency; typical values.
MLD908
MLD909
10
10
handbook, halfpage
handbook, halfpage
P
L
P
L
(dBm)
(dBm)
(1)
5
5
(2)
(1)
(2)
(3)
0
0
(3)
−5
−5
−10
−10
−30
−20
−10
0
−30
−20
−10
0
P
(dBm)
P
(dBm)
D
D
f = 1 GHz; ZO = 50
(1) VS = 5.5 V.
(2) VS = 5 V.
f = 2.2 GHz; ZO = 50
(1) VS = 5.5 V.
(2) VS = 5 V.
(3)
V
S = 4.5 V.
(3) VS = 4.5 V.
Fig.11 Load power as a function of drive power at
1 GHz; typical values.
Fig.12 Load power as a function of drive power at
2.2 GHz; typical values.
2002 Sep 10
6
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
MLD903
MLD902
6
10
handbook, halfpage
handbook, halfpage
NF
K
8
(dB)
5
6
4
(1)
(3)
4
(2)
3
2
2
0
0
0
1000
2000
3000
1000
2000
3000
4000
f (MHz)
f (MHz)
ZO = 50
(1) IS = 15.1 mA; VS = 5.5 V.
(2) IS = 12.3 mA; VS = 5 V.
(3) IS = 10.1 mA; VS = 4.5 V.
IS = 12.3 mA; VS = 5 V; ZO = 50
Fig.13 Noise figure as a function of frequency;
typical values.
Fig.14 Stability factor as a function of frequency;
typical values.
2002 Sep 10
7
Scattering parameters
VS = 5 V; IS = 12.3 mA; PD = 30 dBm; ZO = 50 ; Tamb = 25 C;
s11
MAGNITUDE
s21
MAGNITUDE
s12
MAGNITUDE
s22
MAGNITUDE
K-
FACTOR
f (MHz)
ANGLE
(deg)
ANGLE
(deg)
ANGLE
(deg)
ANGLE
(deg)
(ratio)
(ratio)
(ratio)
(ratio)
100
200
0.04752
0.05643
0.09546
0.13547
0.17466
0.20739
0.24036
0.26469
0.29368
0.31261
0.31986
0.32544
0.31554
0.29374
0.26599
0.21222
0.17076
0.14479
0.11730
0.08946
0.06606
13.48
22.73
10.9826
11.0172
11.0842
11.1812
11.3239
11.5760
11.8439
12.1222
12.3892
12.5808
12.6359
12.4802
12.2649
11.5087
10.4126
9.17830
8.12024
7.38827
6.96284
6.62125
6.32249
1.753
6.898
15.64
24.08
32.64
41.38
50.97
61.14
72.07
83.89
96.79
110.7
125.2
139.8
152.8
163.8
171.0
176.5
177.3
0.03355
0.03308
0.03111
0.02829
0.02501
0.02145
0.01788
0.01489
0.01262
0.01132
0.01102
0.01151
0.01238
0.01322
0.01362
0.01335
0.01239
0.01150
0.01108
0.01107
0.01178
2.342
7.340
15.47
21.84
26.57
30.44
31.20
28.60
22.41
12.86
2.369
5.585
0.07706
0.07237
0.07314
0.07471
0.08218
0.10113
0.11792
0.13314
0.14376
0.14606
0.13749
0.11928
0.08992
0.05626
0.02424
0.02731
0.04752
0.06279
0.07643
0.09760
0.12925
170.0
164.8
130.7
101.8
72.30
47.04
25.82
10.96
1.624
13.51
24.90
37.21
51.50
68.53
110.2
159.1
135.0
132.1
142.1
153.5
160.6
1.5
1.5
1.6
1.7
1.9
2.0
2.3
2.6
3.0
3.2
3.2
3.1
3.0
3.1
3.3
4.0
4.9
5.8
6.4
6.7
6.6
400
39.62
600
37.16
800
32.62
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000
3200
3400
3600
3800
4000
27.40
23.23
18.36
13.54
8.127
1.984
4.878
13.05
21.53
28.39
31.80
31.52
32.14
35.25
46.06
64.65
9.990
11.44
10.70
9.622
10.22
15.36
19.97
171.3
27.62
165.6
34.46
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
PACKAGE OUTLINE
Plastic surface-mounted package; 6 leads
SOT363
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
1
2
3
c
e
1
b
L
p
w
M B
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT363
SC-88
2002 Sep 10
9
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DEFINITIONS
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Product specification The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
2002 Sep 10
10
NXP Semiconductors
Product specification
MMIC wideband amplifier
BGA2712
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Export control This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
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Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Semiconductors’ product specifications.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
2002 Sep 10
11
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
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© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/02/pp12
Date of release: 2002 Sep 10
相关型号：
BGA2748T/R
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