FGH40T120SMDL4 [ONSEMI]

IGBT,1200V,25A,FS 沟槽;
FGH40T120SMDL4
型号: FGH40T120SMDL4
厂家: ONSEMI    ONSEMI
描述:

IGBT,1200V,25A,FS 沟槽

局域网 双极性晶体管 功率控制
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IGBT - FS, Trench  
1200 V, 40 A  
FGH40T120SMDL4  
Description  
Using innovative field stop trench IGBT technology,  
ON Semiconductor’s new series of field stop trench IGBTs offer  
the optimum performance for hard switching application such as solar  
inverter, UPS, welder and PFC applications.  
www.onsemi.com  
V
I
C
CES  
Features  
1200 V  
40 A  
FS Trench Technology, Positive Temperature Coefficient  
Excellent Switching Performance due to Kelvin Emitter Pin  
C
Low Saturation Voltage: V  
= 1.8 V @ I = 40 A  
C
CE(sat)  
100% of the Parts Tested for I  
High Input Impedance  
LM  
E1: Kelvin Emitter  
E2: Power Emitter  
G
This Device is PbFree and is RoHS Compliant  
E1  
E2  
Applications  
Solar Inverter, Welder, UPS and PFC Applications  
C
E2  
E1  
G
TO2474LD  
CASE 340CJ  
MARKING DIAGRAM  
$Y&Z&3&K  
FGH40T120  
SMDL4  
$Y  
= ON Semiconductor Logo  
&Z  
&3  
&K  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
FGH40T120SMDL4= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
December, 2019 Rev. 2  
FGH40T120SMDL4/D  
FGH40T120SMDL4  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Description  
FGH40T120SMDL4  
Unit  
V
V
CES  
GES  
Collector to Emitter Voltage  
Gate to Emitter Voltage  
1200  
V
25  
V
Transient Gate to Emitter Voltage  
Collector Current  
30  
V
I
T
C
T
C
T
C
= 25°C  
= 100°C  
= 25°C  
80  
40  
A
C
A
I
(Note 1)  
(Note 2)  
Clamped Inductive Load Current  
Pulsed Collector Current  
160  
A
LM  
I
160  
A
CM  
I
Diode Continuous Forward Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Maximum Power Dissipation  
T
T
= 25°C  
80  
A
F
C
= 100°C  
40  
A
C
I
240  
A
FM  
P
T
T
= 25°C  
555  
W
W
°C  
°C  
°C  
D
C
= 100°C  
277  
C
T
Operating Junction Temperature  
Storage Temperature Range  
55 to +175  
55 to +175  
300  
J
T
STG  
T
Maximum Lead Temp. for Soldering Purposes, 1/8” from Case for 5 Seconds  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. V = 600 V, V = 15 V, I = 160 A, R = 20 W, Inductive Load.  
CC  
GE  
C
G
2. Limited by Tjmax.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
FGH75T65SQDTF155  
Unit  
R
R
(IGBT)  
(Diode)  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
0.27  
0.89  
40  
_C/W  
_C/W  
_C/W  
q
JC  
q
JC  
R
q
JA  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Mark  
Package  
Reel Size  
Tape Width  
Quantity  
FGH40T120SMDL4  
FGH40T120SMDL4  
TO2474LD  
30  
www.onsemi.com  
2
 
FGH40T120SMDL4  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Collector to Emitter Breakdown Voltage  
Collector CutOff Current  
V
GE  
V
CE  
V
GE  
= 0 V, I = 250 mA  
1200  
V
CES  
C
mA  
nA  
I
= V  
= V  
, V = 0 V  
250  
400  
CES  
CES  
GE  
I
GE Leakage Current  
, V = 0 V  
CE  
GES  
GES  
ON CHARACTERISTICS  
V
GE Threshold Voltage  
I
I
= 40 mA, V = V  
GE  
4.9  
6.2  
1.8  
7.5  
2.4  
V
V
GE(th)  
C
CE  
V
Collector to Emitter Saturation Voltage  
= 40 A, V = 15 V,  
CE(sat)  
C
T
GE  
= 25 °C  
C
2.0  
V
I
= 40 A, V = 15 V,  
GE  
C
C
T
= 175°C  
DYNAMIC CHARACTERISTICS  
V
= 30 V, V = 0 V,  
C
Input Capacitance  
4300  
180  
pF  
pF  
pF  
CE  
GE  
ies  
f = 1MHz  
C
Output Capacitance  
oes  
C
Reverse Transfer Capacitance  
100  
res  
SWITCHING CHARACTERISTICS  
V
= 600 V, I = 40 A,  
C
T
TurnOn Delay Time  
Rise Time  
CC  
G
44  
42  
ns  
ns  
d(on)  
R
= 10 W, V = 15 V,  
GE  
T
r
Inductive Load, T = 25°C  
C
T
TurnOff Delay Time  
Fall Time  
464  
24  
ns  
d(off)  
T
f
ns  
E
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
2.24  
1.02  
3.26  
mJ  
mJ  
mJ  
on  
off  
E
E
ts  
V
= 600 V, I = 40 A,  
C
T
TurnOn Delay Time  
Rise Time  
CC  
G
42  
48  
ns  
ns  
d(on)  
R
= 10 W, V = 15 V,  
GE  
T
r
Inductive Load, T = 25°C  
C
T
TurnOff Delay Time  
Fall Time  
518  
24  
ns  
d(off)  
T
f
ns  
E
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
3.11  
2.01  
5.12  
mJ  
mJ  
mJ  
on  
off  
E
E
ts  
V
CE  
V
GE  
= 600 V, I = 40 A,  
Q
Total Gate Charge  
370  
23  
nC  
nC  
nC  
C
g
= 15 V  
Q
ge  
Q
gc  
Gate to Emitter Charge  
Gate to Collector Charge  
210  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGH40T120SMDL4  
ELECTRICAL CHARACTERISTICS OF THE DIODE (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
3.8  
Max  
4.8  
Unit  
I = 40 A  
F
T
= 25°C  
V
V
FM  
Diode Forward Voltage  
C
C
T
= 175°C  
2.7  
V
= 600 V, I = 40 A  
F
ns  
A
T
Diode Reverse Recovery Time  
R
65  
rr  
di /dt = 200 A/ms, T = 25°C  
F
C
I
rr  
Diode Peak Reverse Recovery Current  
Diode Reverse Recovery Charge  
Diode Reverse Recovery Charge  
Diode Peak Reverse Recovery Current  
Diode Reverse Recovery Charge  
7.2  
nC  
ns  
A
Q
234  
200  
18.0  
1800  
rr  
V
R
= 600 V, I = 40 A  
T
rr  
F
di /dt = 200 A/ms, T = 175°C  
F
C
I
rr  
nC  
Q
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
4
FGH40T120SMDL4  
TYPICAL PERFORMANCE CHARACTERISTICS  
300  
250  
200  
150  
100  
50  
300  
TC = 25oC  
TC = 175oC  
17V  
20V  
20V  
15V  
17V  
250  
200  
15V  
12V  
150  
12V  
100  
VGE=10V  
VGE=10V  
50  
0
0
0
1
2
3
4
5
6
7
8
9
10  
0
1
2
3
4
5
6
7
8
9
10  
CollectorEmitter Voltage, V [V]  
CollectorEmitter Voltage, V [V]  
CE  
CE  
Figure 1. Typical Output  
Characteristics  
Figure 2. Typical Output  
Characteristics  
160  
120  
80  
40  
0
4
3
2
1
Common Emitter  
VGE = 15V  
Common Emitter  
VGE = 15V  
TC  
=
25oC  
TC = 175oC −−−  
80A  
40A  
IC=20A  
0
1
2
3
4
5
25  
50  
75  
100  
125  
150  
175  
Case Temperature TC[oC]  
CollectorEmitter Voltage, VCE [V]  
Figure 3. Typical Saturation  
Voltage Characteristics  
Figure 4. Saturation Voltage vs. Case  
Temperature at Variant Current Level  
20  
16  
12  
8
20  
Common Emitter  
TC = 25oC  
Common Emitter  
TC = 175oC  
16  
80A  
80A  
40A  
12  
40A  
8
IC=20A  
IC=20A  
4
4
0
0
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
GateEmitter Voltage, VGE [V]  
GateEmitter Voltage, VGE [V]  
Figure 5. Saturation Voltage vs. VGE  
Figure 6. Saturation Voltage vs. VGE  
www.onsemi.com  
5
FGH40T120SMDL4  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
15  
6000  
5000  
4000  
3000  
2000  
1000  
Common Emitter  
V
T
= 0 V, f = 1Mhz  
GE  
= 25 C  
C
Cies  
12  
9
200V  
400V  
VCC = 600V  
6
Coes  
Crss  
3
Common Emitter  
TC = 25oC  
0
1
10  
0
50 100 150 200 250 300 350 400  
Gate Charge, Qg [nC]  
CollectorEmitter Voltage, VCE [V]  
Figure 7. Capacitance Characteristics  
Figure 8. Gate Charge Characteristics  
300  
10000  
1000  
100  
10  
tr  
td(off)  
100  
td(on)  
tf  
Common Emitter  
VCC = 600V, VGE = 15V  
IC = 40A  
Common Emitter  
VCC = 600V, VGE = 15V  
IC = 40A  
TC = 25oC  
TC = 175oC  
TC = 25oC  
TC = 175oC  
10  
1
0
10  
20  
30  
40  
50  
[W]  
60  
70  
0
10  
20  
30  
40  
50  
[W]  
60  
70  
Gate Resistance, RG  
Gate Resistance, RG  
Figure 9. Turnon Characteristics vs.  
Figure 10. Turnoff Characteristics  
Gate Resistance  
vs. Gate Resistance  
300  
100  
8
Eon  
tr  
Eoff  
Common Emitter  
VCC = 600V, VGE = 15V  
IC = 40A  
Common Emitter  
td(on)  
VGE = 15V, RG = 10W  
1
TC = 25oC  
TC = 175oC  
TC = 25oC  
TC = 175oC  
10  
10  
0.5  
20  
30  
40  
50  
60  
70  
80  
0
10  
20  
30  
40  
50  
[W]  
60  
70  
Gate Resistance, RG  
Collector Current, IC [A]  
Figure 11. Switching Loss vs.  
Gate Resistance  
Figure 12. Turnon Characteristics  
vs. Collector Current  
www.onsemi.com  
6
FGH40T120SMDL4  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
10  
1000  
100  
10  
Eon  
td(off)  
Eoff  
1
tf  
Common Emitter  
VGE = 15V, RG = 10  
Common Emitter  
VGE = 15V, RG = 10  
W
W
TC = 25oC  
TC = 25oC  
TC = 175oC  
TC = 175oC  
0.1  
10  
1
10  
20  
30  
40  
50  
60  
70  
80  
20  
30  
40  
50  
60  
70  
80  
Collector Current, I C [A]  
Collector Current, IC [A]  
Figure 13. Turnoff Characteristics  
Figure 14. Switching Loss  
vs. Collector Current  
vs. Collector Current  
200  
160  
120  
80  
VCC = 600V  
IcMAX (Pulsed)  
load Current : peak of square wave  
100  
10  
10ms  
100ms  
1ms  
10 ms  
IcMAX (Continuous)  
TC = 100oC  
DC Operation  
1
Single Nonrepetitive  
Pulse Tc = 25 C  
0.1  
Duty cycle : 50%  
TC = 100 oC  
40  
Curves must be derated  
linearly with increase  
in temperature  
Power Dissipation = 277 W  
0.01  
0
1k  
10k  
100k  
1M  
0.1  
1
10  
100  
1000  
CollectorEmitter Voltage, VCE [V]  
Switching Frequency, f [Hz]  
Figure 15. Load Current vs. Frequency  
Figure 16. SOA Characteristics  
21  
18  
15  
12  
9
TC = 25oC  
TC = 175oC  
ms  
diF/dt = 200A/  
100  
10  
1
ms  
diF/dt = 100A/  
ms  
diF/dt = 200A/  
diF/dt = 100A/  
6
ms  
TC = 25oC  
TC = 175oC −−−  
3
0
0
1
2
3
4
5
0
20  
40  
60  
80  
Forward Voltage, VF[V]  
Forward Current, IF[A]  
Figure 17. Forward Characteristics  
Figure 18. Reverse Recovery Current  
www.onsemi.com  
7
FGH40T120SMDL4  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
3000  
360  
300  
240  
180  
120  
60  
TC = 25oC  
C = 175oC ---  
TC = 25oC  
TC = 175oC ---  
2500  
2000  
1500  
1000  
500  
T
di/dt = 100A/  
ms  
di/dt = 100A/  
ms  
ms  
di/dt = 200A/  
ms  
di/dt = 200A/  
0
0
0
20  
40  
60  
80  
0
20  
40  
60  
80  
Forward Curren,t, I [A]  
Forward Curren,t, I [A]  
F
F
Figure 19. Reverse Recovery Time  
Figure 20. Stored Charge  
1
0.5  
0.1  
0.3  
0.1  
PDM  
0.01  
0.05  
t1  
t2  
0.02  
0.01  
Duty Factor, D = t1/t2  
single pulse  
Peak T = Pdm x Zthjc + T  
j
C
1E3  
1E6  
1E5  
1E4  
1E3  
0.01  
0.1  
1
t1, Rectangular Pulse Duration [sec]  
Figure 21. Transient Thermal Impedance of IGBT  
2
1
0.5  
0.2  
0.1  
0.1  
0.01  
1E3  
0.05  
0.02  
0.01  
PDM  
t1  
single pulse  
t2  
Duty Factor, D = t1/t2  
Peak T = Pdm x Zthjc + T  
j
C
1E5  
1E4  
1E3  
0.01  
0.1  
1
t1, Rectangular Pulse Duration [sec]  
Figure 22. Transient Thermal Impedance of Diode  
www.onsemi.com  
8
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2474LD  
CASE 340CJ  
ISSUE A  
DATE 16 SEP 2019  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13852G  
TO2474LD  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
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