NVHL040N120SC1 [ONSEMI]

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 40 mohm, 1200 V, M1, TO247−3L;
NVHL040N120SC1
型号: NVHL040N120SC1
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) MOSFET, N‐Channel - EliteSiC, 40 mohm, 1200 V, M1, TO247−3L

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
MOSFET – 40 mohm,  
1200ꢀV, M1, TO-247-3L  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
1200 V  
56 m@ 20 V  
60 A  
NCHANNEL MOSFET  
NVHL040N120SC1  
D
Features  
Typ. R  
= 40 mꢀ  
Ultra Low Gate Charge (typ. Q  
DS(on)  
= 106 nC)  
G(tot)  
Low Effective Output Capacitance (typ. C = 140 pF)  
oss  
G
100% UIL Tested  
AECQ101 Qualified and PPAP Capable  
This Device is Halide Free and RoHS Compliant with exemption 7a,  
S
PbFree 2LI (on second level interconnection)  
Typical Applications  
Automotive On Board Charger  
Automotive DCDC converter for EV/HEV  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
G
D
Parameter  
DraintoSource Voltage  
Symbol  
Value  
Unit  
S
TO2473LD  
CASE 340CX  
V
DSS  
1200  
15/+25  
5/+20  
V
V
V
GatetoSource Voltage  
V
GS  
Recommended Opera-  
tion Values of Gateto−  
Source Voltage  
T
C
< 175°C  
V
GSop  
MARKING DIAGRAM  
Continuous Drain  
Current R  
Steady  
State  
T
C
= 25°C  
I
D
60  
A
JC  
Power Dissipation R  
P
348  
42  
W
A
D
JC  
JC  
$Y&Z&3&K  
NVHL040  
N120SC1  
Continuous Drain  
Current R  
Steady  
State  
T
= 100°C  
I
D
C
JC  
Power Dissipation R  
P
D
174  
240  
W
A
Pulsed Drain Current  
(Note 2)  
T = 25°C  
A
I
DM  
Single Pulse Surge Drain T = 25°C, t = 10 s,  
I
416  
A
A
p
DSC  
Current Capability  
R
= 4.7  
G
$Y  
= onsemi Logo  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
&Z  
&3  
&K  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
J
stg  
+175  
Source Current (Body Diode)  
I
S
34  
A
NVHL040N120SC1 = Specific Device Code  
Single Pulse DraintoSource Avalanche  
E
AS  
613  
mJ  
Energy (I  
= 23 A, L = 1 mH) (Note 3)  
L(pk)  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
Package  
Shipping  
30 Units /  
Tube  
TO2473L  
NVHL040N120SC1  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
JunctiontoCase (Note 1)  
JunctiontoAmbient (Note 1)  
Symbol  
Value  
0.43  
40  
Unit  
°C/W  
°C/W  
R
JC  
R
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Repetitive rating, limited by max junction temperature.  
3. E of 613 mJ is based on starting T = 25°C; L = 1 mH, I = 35 A,  
AS  
DD  
J
AS  
V
= 120 V, V = 20 V.  
GS  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
May, 2022 Rev. 2  
NVHL040N120SC1/D  
 
NVHL040N120SC1  
ELECTRICAL CHARACTERISTICS  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
I
= 0 V, I = 1 mA  
1200  
V
(BR)DSS  
GS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
= 1 mA, referenced to 25_C  
450  
mV/_C  
(BR)DSS  
J
D
Zero Gate Voltage Drain Current  
I
100  
250  
1
A  
V
GS  
V
GS  
V
GS  
= 0 V, V = 1200 V, T = 25_C  
DSS  
DS  
J
= 0 V, V = 1200 V, T = 175_C  
DS  
J
GatetoSource Leakage Current  
ON CHARACTERISTICS  
I
= +25/15 V, V = 0 V  
DS  
A
GSS  
Gate Threshold Voltage  
V
R
V
= V , I = 10 mA  
1.8  
5  
2.97  
4.3  
+20  
56  
V
V
GS(th)  
GS  
DS  
D
Recommended Gate Voltage  
DraintoSource On Resistance  
V
GOP  
V
GS  
V
GS  
V
DS  
= 20 V, I = 35 A, T = 25_C  
39  
67  
20  
mꢀ  
DS(on)  
D
J
= 20 V, I = 35 A, T = 175_C  
100  
D
J
Forward Transconductance  
g
FS  
= 20 V, I = 35 A  
S
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
= 0 V, f = 1 MHz, V = 800 V  
1781  
140  
12  
pF  
nC  
ISS  
GS  
GS  
DS  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C
OSS  
RSS  
C
Q
V
= 5/20 V, V = 600 V, I = 47 A  
106  
16  
G(tot)  
DS  
D
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Gate Resistance  
Q
G(th)  
Q
34  
GS  
GD  
Q
26  
R
f = 1 MHz  
2.2  
G
SWITCHING CHARACTERISTICS  
Turn-On Delay Time  
Rise Time  
t
t
V
D
= 5/20 V, V = 800 V,  
18  
41  
ns  
d(on)  
GS  
DS  
I
= 47 A, R = 4.7 ,  
G
t
r
Inductive Load  
TurnOff Delay Time  
Fall Time  
33  
d(off)  
t
f
10.4  
1003  
247  
1248  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
E
J
ON  
OFF  
TOT  
E
E
DRAINSOURCE DIODE CHARACTERISTICS  
Continuous DraintoSource Diode  
I
V
V
= 5 V, T = 25_C  
34  
A
A
SD  
GS  
J
Forward Current  
Pulsed DraintoSource Diode  
Forward Current (Note 2)  
I
= 5 V, T = 25_C  
240  
SDM  
GS  
J
Forward Diode Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Charge Time  
V
V
V
= 5 V, I = 17.5 A, T = 25_C  
3.8  
24  
V
ns  
nC  
J  
A
SD  
GS  
SD  
J
t
= 5/20 V, I = 47 A,  
RR  
GS  
S
SD  
dI /dt = 1000 A/s  
Q
125  
8.5  
RR  
E
REC  
RRM  
I
10.4  
12.4  
11.6  
t
t
ns  
ns  
a
Discharge Time  
b
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
NVHL040N120SC1  
TYPICAL CHARACTERISTICS  
100  
90  
80  
70  
60  
50  
40  
30  
20  
4.0  
V
GS  
= 20 V  
V
= 10 V  
V
= 12 V  
GS  
GS  
3.5  
3.0  
2.5  
2.0  
1.5  
15 V  
19 V  
18 V  
15 V  
16 V  
17 V  
17 V  
16 V  
18 V  
19 V  
12 V  
10 V  
V
= 20 V  
1.0  
0.5  
GS  
10  
0
0
2
4
6
8
10  
0
10  
20  
30 40 50 60  
70  
80 90 100  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
300  
200  
1.9  
1.7  
1.5  
1.3  
1.1  
I
V
= 35 A  
I
= 35 A  
D
D
= 20 V  
GS  
100  
0
T = 150°C  
J
0.9  
0.7  
T = 25°C  
J
75 50 25  
0
25 50 75 100 125 150 175  
9
10 11 12 13 14 15 16 17 18 19 20  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 3. OnResistance Variation with  
Figure 4. OnResistance vs. GatetoSource  
Temperature  
Voltage  
100  
80  
300  
V
GS  
= 5 V  
V
DS  
= 20 V  
60  
T = 175°C  
J
T = 25°C  
J
30  
40  
T = 55°C  
J
T = 175°C  
J
T = 25°C  
J
20  
0
T = 55°C  
J
3
2
4
6
8
10  
12  
14  
16  
18  
2
3
4
5
6
7
8
9
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Diode Forward Voltage vs. Current  
www.onsemi.com  
3
NVHL040N120SC1  
TYPICAL CHARACTERISTICS (continued)  
10K  
20  
I
D
= 47 A  
V
DD  
= 400 V  
C
iss  
15  
10  
5
1K  
V
= 800 V  
= 600 V  
DD  
C
oss  
V
DD  
100  
10  
1
C
rss  
0
f = 1 MHz  
= 0 V  
V
GS  
5  
0
10 20 30 40 50 60 70 80 90 100 110  
0.1  
1
10  
100  
800  
175  
0.1  
V
, DRAINTOSOURCE VOLTAGE (V)  
Q , GATE CHARGE (nC)  
DS  
g
Figure 7. GatetoSource Voltage vs. Total  
Figure 8. Capacitance vs. DraintoSource  
Charge  
Voltage  
60  
50  
40  
30  
20  
500  
100  
V
GS  
= 20 V  
T = 25°C  
J
T = 150°C  
J
10  
1
10  
0
Typical performance based  
on characterization data  
R
= 0.43°C/W  
JC  
0.001  
0.01  
0.1  
1
10  
100  
25  
50  
75  
100  
125  
150  
t
AV  
, TIME IN AVALANCHE (ms)  
T , CASE TEMPERATURE (°C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
500  
100K  
10K  
1K  
Single Pulse  
100  
10  
R
= 0.43°C/W  
JC  
T
C
= 25°C  
10 s  
100 s  
1
1 ms  
10 ms  
100 ms  
Single Pulse  
T = Max Rated  
100  
10  
0.1  
J
Curve bent to  
measured data  
R
= 0.43°C/W  
JC  
T
C
= 25°C  
0.01  
0.1  
1
10  
100  
1K  
5K  
0.00001  
0.0001  
0.001  
0.01  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
www.onsemi.com  
4
NVHL040N120SC1  
TYPICAL CHARACTERISTICS (continued)  
2
1
50% Duty Cycle  
20%  
10%  
5%  
0.1  
2%  
Notes:  
(t) = r(t) x R  
1%  
P
DM  
Z
JC  
JC  
0.01  
Single Pulse  
R
= 0.43°C/W  
JC  
t
Peak T = P  
x Z  
(t) + T  
JC C  
1
J
DM  
Duty Cycle, D = t /t  
t
1
2
2
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. JunctiontoAmbient Thermal Response  
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5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
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