SGM66099 [SGMICRO]
Synchronous Boost Converter with Ultra-Low Quiescent Current;
| 型号： | SGM66099 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Synchronous Boost Converter with Ultra-Low Quiescent Current |
| 文件： | 总20页 (文件大小：1094K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM66099
Synchronous Boost Converter
with Ultra-Low Quiescent Current
GENERAL DESCRIPTION
FEATURES
The SGM66099 is an ultra-low quiescent current
synchronous Boost converter. 0.9V to 5.2V operating
input voltage is suitable for Li-Mn battery, NiMH and
Li-Ion rechargeable batteries. The 0.6μA (TYP)
quiescent current maximizes the light load efficiency
and also increases the effective battery operation time.
In addition, the high-side synchronous rectifier provides
● Operating Input Voltage Range: 0.9V to 5.2V
● Ultra-Low Quiescent Current
0.6µA (TYP) Ultra-Low IQ into VOUT Pin
0.05µA (TYP) Ultra-Low IQ into VIN Pin
● 1.2MHz Fixed Frequency Operation
● Adjustable Output Voltage from 2.5V to 5.2V
● Fixed Output Voltage Versions Available
● Power-Save Mode for Improved Efficiency at Low
Output Power
output
disconnect
feature
which
minimizes
unnecessary current drawn from the battery during
shutdown mode.
● Regulated Output Voltage in Down Mode
● True Disconnection During Shutdown
● Up to 75% Efficiency at 10μA Load with Fixed
Output Voltage Version
The SGM66099 is able to deliver 300mA output current
from 3.3V to 5V conversion, and achieves up to 93%
efficiency at 200mA load.
The device offers down mode where the desired output
voltage is regulated even when input voltage is higher
than the output. In addition, when the input voltage is
300mV above the output voltage set point, the device
enters pass-through mode.
● Up to 93% Efficiency from 10mA to 300mA Load
● -40℃ to +85℃ Operating Ambient Temperature
Range
● Available in Green WLCSP-1.22×0.83-6B and
TDFN-2×2-6AL Packages
The device integrates various protection features such
as over-voltage protection and thermal shutdown. In
addition, the synchronous rectifier supports short circuit
protection which further improves the robustness of the
device.
APPLICATIONS
LCD and LED Bias
Portable and Wearable Applications
Low Power Wireless Applications
Battery Powered Systems
The SGM66099 offers both adjustable output voltage
and fixed output voltage versions. It is available in
Green WLCSP-1.22×0.83-6B and TDFN-2×2-6AL
packages.
TYPICAL APPLICATION
L
VIN
2.2μH
0.9V to 5.2V
CIN
10μF
SW
VOUT
2.5V to 5.2V
VIN
VOUT
REN
10kΩ
COUT1
10μF
COUT2
10μF
SGM66099-ADJ
R1
EN
CEN
10nF
FB
GND
R2
Figure 1. Typical Application Circuit
SG Micro Corp
MAY 2022 – REV. B. 1
www.sg-micro.com
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
DESCRIPTION
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
SGM66099-2.5YG/TR
SGM66099-2.5YTDI6G/TR
SGM66099-3.0YG/TR
FAXX
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
SGM66099-2.5
MG0
XXXX
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
FBXX
SGM66099-3.0
SGM66099-3.3
SGM66099-3.6
SGM66099-4.5
SGM66099-5.0
SGM66099-ADJ
MG1
XXXX
SGM66099-3.0YTDI6G/TR
SGM66099-3.3YG/TR
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
FCXX
MG2
XXXX
SGM66099-3.3YTDI6G/TR
SGM66099-3.6YG/TR
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
FDXX
MG3
XXXX
SGM66099-3.6YTDI6G/TR
SGM66099-4.5YG/TR
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
FEXX
MG4
XXXX
SGM66099-4.5YTDI6G/TR
SGM66099-5.0YG/TR
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
F9XX
MF8
XXXX
SGM66099-5.0YTDI6G/TR
SGM66099-ADJYG/TR
SGM66099-ADJYTDI6G/TR
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
FFXX
MG5
XXXX
MARKING INFORMATION
NOTE: XX = Date Code. XXXX = Date Code and Trace Code.
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
Serial Number
Y Y Y
X X X X
YY X X
Date Code - Week
Date Code - Year
Serial Number
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
SG Micro Corp
www.sg-micro.com
MAY 2022
2
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
VIN, SW, VOUT, FB, EN to GND...................... -0.3V to 6.0V
Package Thermal Resistance
WLCSP-1.22×0.83-6B, θJA ...................................... 143℃/W
TQFN-2×2-6AL, θJA ................................................. 105℃/W
Junction Temperature.................................................+150℃
Storage Temperature...................................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
HBM.............................................................................4000V
MM.................................................................................400V
CDM ............................................................................1000V
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range.......................................0.9V (1) to 5.2V
Output Voltage Range ........................................2.5V to 5.2V
Operating Ambient Temperature Range........-40℃ to +85℃
Operating Junction Temperature Range......-40℃ to +125℃
NOTE 1: Refer to the “Start-up and Low Supply Voltage
Operation” for detailed description.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
MAY 2022
3
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
1
2
GND
VOUT
FB
1
2
3
6
5
4
VIN
SW
EN
A
B
C
VIN
GND
GND
SW
EN
VOUT
FB
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
PIN DESCRIPTION
PIN
NAME
TYPE
FUNCTION
WLCSP-
TDFN-
1.22×0.83-6B
2×2-6AL
A1
6
1
5
2
4
3
VIN
GND
SW
P
G
O
O
I
Power Supply Input.
Ground.
A2
B1
B2
C1
C2
—
Switch Node. Drain connection of low-side power MOSFET.
Boost Converter Output.
VOUT
EN
Device Enable Node. Pulling this pin logic high enables the device, logic low
disables the device.
Voltage Feedback of Adjustable Output Voltage. Connect a resistive divider
to program the desired output voltage.
FB
I
Exposed
Pad
GND
—
Connect to GND.
NOTE: I: input, O: output, G: ground, P: power for the circuit.
SG Micro Corp
www.sg-micro.com
MAY 2022
4
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
ELECTRICAL CHARACTERISTICS
(VIN = 0.9V to 5.2V, CIN = 10μF, COUT = 20μF, Full = -40℃ to +85℃, typical values are at VIN = 3.7V, TA = +25℃, unless otherwise
noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Power Supply
Input Voltage Range
VIN
IQ
0.9
5.2
0.2
1.1
1
V
+25℃
Full
Quiescent Current into VIN Pin
Quiescent Current into VOUT Pin
Shutdown Current into VIN Pin
Output
No load, not switching
0.05
0.6
µA
µA
µA
No load, not switching, boost or down mode
EN = GND, VIN = 3.6V
Full
ISD
Full
0.1
Output Voltage Range
VOUT
Full
Full
2.5
5.2
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
SGM66099-5.0, VIN < VOUT, PWM mode
SGM66099-5.0, VIN < VOUT, PFM mode
SGM66099-4.5, VIN < VOUT, PWM mode
SGM66099-4.5, VIN < VOUT, PFM mode
SGM66099-3.6, VIN < VOUT, PWM mode
SGM66099-3.6, VIN < VOUT, PFM mode
SGM66099-3.3, VIN < VOUT, PWM mode
SGM66099-3.3, VIN < VOUT, PFM mode
SGM66099-3.0, VIN < VOUT, PWM mode
SGM66099-3.0, VIN < VOUT, PFM mode
SGM66099-2.5, VIN < VOUT, PWM mode
SGM66099-2.5, VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
4.85
5.00
5.08
4.50
4.57
3.60
3.65
3.30
3.35
3.00
3.04
2.50
2.54
1.000
1.020
5.09
+25℃
Full
4.37
3.50
3.21
2.92
2.44
0.975
4.58
3.67
3.35
3.05
2.54
1.025
+25℃
Full
+25℃
Full
Output Voltage
+25℃
Full
+25℃
Full
+25℃
Full
Feedback Reference Voltage
VREF
VOVP
VIN < VOUT, PFM mode
+25℃
Output Over-Voltage Protection
Threshold
VOUT rising
5.50
5.8
5.95
V
+25℃
OVP Hysteresis
100
10
mV
nA
+25℃
Leakage Current into FB Pin
Switching
IFB_LKG
VFB = 1.1V
VIN = 3.7V
Full
50
Switching Frequency
Power Switch
fSW
Full
1
1.2
1.35
MHz
VOUT = 5.0V (TDFN)
280
220
340
290
270
250
350
330
1.3
400
310
480
390
350
350
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
A
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
+25℃
VOUT = 5.0V (WLCSP)
VOUT = 3.3V (TDFN)
Low-side Switch On-Resistance
RDS(ON)_LS
VOUT = 3.3V (WLCSP)
VOUT = 5.0V (TDFN)
VOUT = 5.0V (WLCSP)
VOUT = 3.3V (TDFN)
Rectifier On-Resistance
Current Limit Threshold
RDS(ON)_HS
VOUT = 3.3V (WLCSP)
VOUT > 2.5V, boost operation
VOUT = 2.5V, boost operation
0.89
0.57
1.62
1.06
ILIM
0.8
A
SG Micro Corp
www.sg-micro.com
MAY 2022
5
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 0.9V to 5.2V, CIN = 10μF, COUT = 20μF, Full = -40℃ to +85℃, typical values are at VIN = 3.7V, TA = +25℃, unless otherwise
noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
Control Logic
VIN ≤ 1.5V
VIN > 1.5V
VIN ≤ 1.5V
VIN > 1.5V
VEN = 5.0V
Full
Full
0.18 × VIN
0.4
V
V
EN Input Low Voltage Threshold
EN Input High Voltage Threshold
VIL
Full
0.8 × VIN
1.2
V
VIH
Full
V
Leakage Current into EN Pin
Over-Temperature Protection
Over-Temperature Hysteresis
IEN_LKG
300
nA
℃
℃
+25℃
150
25
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MAY 2022
6
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
TYPICAL PERFORMANCE CHARACTERISTICS
TA = +25℃, CIN = 10μF, COUT = 20μF, unless otherwise noted.
Load Efficiency with Different Inputs
Load Efficiency with Different Inputs
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 0.7V
VIN = 0.7V
V
V
V
V
IN = 1.5V
IN = 3.0V
IN = 3.6V
IN = 4.2V
V
V
V
V
IN = 1.5V
IN = 3.0V
IN = 3.6V
IN = 4.2V
SGM66099-ADJ
OUT = 5.0V
SGM66099-5.0
0.001 0.01
V
0.1
1
10
100
1000
0.001 0.01
0.1
1
10
100
1000
Output Current (mA)
Output Current (mA)
Load Efficiency with Different Inputs
Load Efficiency with Different Inputs
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 0.7V
V
V
V
V
IN = 1.5V
IN = 3.0V
IN = 3.6V
IN = 4.2V
VIN = 0.7V
V
V
V
IN = 1.5V
IN = 2.7V
IN = 3.3V
SGM66099-4.5
0.001 0.01
SGM66099-3.6
0.001 0.01
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current (mA)
Output Current (mA)
Load Efficiency with Different Inputs
Load Efficiency with Different Inputs
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 0.4V
V
V
V
V
IN = 0.7V
IN = 1.5V
IN = 2.2V
IN = 2.5V
VIN = 0.7V
V
V
V
IN = 1.5V
IN = 2.5V
IN = 3.0V
SGM66099-3.3
0.001 0.01
SGM66099-3.0
0.001 0.01
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current (mA)
Output Current (mA)
SG Micro Corp
www.sg-micro.com
MAY 2022
7
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, CIN = 10μF, COUT = 20μF, unless otherwise noted.
Load Regulation
Quiescent Current into VOUT Pin vs. Temperature
5.4
5.3
5.2
5.1
5.0
4.9
4.8
4.7
1.0
0.8
0.6
0.4
0.2
0.0
VIN = 3.7V
No Switching
VIN = 0.7V
V
V
V
V
IN = 1.5V
IN = 3.0V
IN = 3.6V
IN = 4.2V
VOUT = 5.0V
0.001 0.01
0.1
1
10
100
1000
-50 -25
0
25
50
75 100 125 150
Output Current (mA)
Temperature (℃)
Shutdown Current vs. Temperature
Reference Voltage vs. Temperature
VIN = 3.7V
0.06
0.05
0.04
0.03
0.02
0.01
0.00
1.009
1.007
1.005
1.003
1.001
0.999
0.997
0.995
VIN = 3.7V
Into VIN and SW
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Temperature (℃)
Output Voltage vs. Temperature
VIN = 3.7V, VOUT = 5.0V
Temperature (℃)
Output Voltage vs. Temperature
VIN = 3.7V, VOUT = 3.3V
5.010
5.008
5.006
5.004
5.002
5.000
4.998
4.996
4.994
4.992
4.990
3.310
3.308
3.306
3.304
3.302
3.300
3.298
3.296
3.294
3.292
3.290
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Temperature (℃)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
MAY 2022
8
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, CIN = 10μF, COUT = 20μF, unless otherwise noted.
Switching Waveform at Heavy Load
Switching Waveform at Light Load
VIN = 3.7V, VOUT = 5.0V, IOUT = 200mA
VIN = 3.7V, VOUT = 5.0V, IOUT = 10mA
AC Coupled
AC Coupled
VOUT
VOUT
VSW
VSW
IL
IL
Time (500ns/div)
Time (50μs/div)
Start-up by VIN Pin
Start-up by EN Pin
VIN = 3.7V, VOUT = 5.0V, RL = 100Ω
VIN = 3.7V, VOUT = 5.0V, IOUT = 100mA
VIN
VEN
VOUT
VOUT
IL
IL
Time (500μs/div)
Time (500μs/div)
Line Transient Response
Load Transient Response
VIN = 2.4V to 3.7V, VOUT = 5.0V, IOUT = 200mA
VIN = 3.7V, VOUT = 5.0V, IOUT = 50mA to 200mA
AC Coupled
AC Coupled
VOUT
VOUT
VIN
IL
IL
IOUT
Time (200μs/div)
Time (200μs/div)
SG Micro Corp
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MAY 2022
9
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
TA = +25℃, CIN = 10μF, COUT = 20μF, unless otherwise noted.
Load Regulation
Line Regulation
AC Coupled
AC Coupled
VOUT
VOUT
VIN
IL
IL
IOUT
VIN = 3.7V, VOUT = 5.0V, IOUT = 0mA to 250mA
VIN = 2.4V to 5.2V, VOUT = 5.0V, IOUT = 200mA
Time (50ms/div)
Time (50ms/div)
Current Limit vs. Temperature
VIN = 3.7V, VOUT = 5.0V
1.36
1.34
1.32
1.30
1.28
1.26
1.24
1.22
1.20
-50 -25
0
25
50
75 100 125 150
Temperature (℃)
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MAY 2022
10
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
FUNCTIONAL BLOCK DIAGRAM
SW
VOUT
Fixed
Current
Sense
Boost
Gate
Voltage
Start-up
VIN
Driver
Fixed
Voltage
PWM
Control
-
FB
Adjustable
+
VREF
VDOWN
+
2.2V
-
Down Mode
-
VIN
+
-
VOUT
VOUT
+
Pass-Through
Logic
Control
+
-
VOUT
OCP, OVP,
VPSTH
Thermal
Shutdown
GND
EN
Current Sense
Figure 2. Block Diagram
SG Micro Corp
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MAY 2022
11
Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
DETAILED DESCRIPTION
The SGM66099 synchronous Boost converter is
designed for Li-Ion battery powered systems, where the
compact solution size and battery operation time are
key criterions. The device employs peak current mode
control with 1.3A (TYP) peak switch current limit. The
SGM66099 is capable of disconnecting the output from
input when the device is disabled to avoid unnecessary
current consumption. The integrated down mode and
pass-through mode ensure a smooth operation when
input voltage is close to or higher than the set output
voltage. The device is available in an adjustable output
voltage version.
the current limit to about 200mA to reduce power
dissipation within the device. As the short circuit
condition is removed, the device resumes operation
and goes through a soft-start sequence to regulate the
set output voltage.
Over-Voltage Protection
SGM66099 integrates over-voltage protection (OVP) to
protect the device in the event of feedback resistor
short-to-ground or incorrect feedback resistor value
being populated. The SGM66099 stops switching when
the OVP threshold of 5.8V (TYP) is reached. The
device implements 100mV OVP hysteresis. When the
output voltage is 100mV lower than the OVP threshold,
the device resumes switching.
Start-up and Enable
Logic high on EN pin enables the SGM66099, while a
logic low disables the device. During logic low state, the
device stops operation, and the output voltage is
completely disconnected from the input voltage. During
logic low state, the shutdown current is less than 1μA
Power-Save Mode under Light Load
Condition
SGM66099 enters power-save mode under light load
condition.
The SGM66099 is able to start up from 0.9V input
voltage with larger than 3kΩ load. Before the output
voltage reaches 2.2V during the start-up phase, the
switch current is limited to about 200mA. Therefore, if
the load during start-up is too heavy, the device will fail
to charge the output voltage to above 2.2V after
soft-start time expires, and it will not be able to start up
successfully.
Down Mode and Pass-Through Mode
SGM66099 offers down mode feature where the device
can still regulate the set output voltage even when the
input voltage is higher than output voltage. If the input
voltage continues increasing in down mode, the device
automatically enters pass-through mode. Care should
be taken in pass-through mode, where the input
voltage should not exceed the recommended maximum
input voltage.
Over-Current and Short Circuit Protection
The SGM66099 implements cycle-by-cycle current limit
during an over-current event. When the current limit
threshold (ILIM) is reached, the low-side power MOSFET
is turned off to prevent the inductor current from further
increase. During over-current event, the output voltage
will drop until a constant power state is reached
between input and output. If the current limit causes the
output to drop below the input voltage, the SGM66099
enters down mode, where the peak current is still
limited by ILIM cycle-by-cycle. If the output continues
dropping below 2.2V, the device enters start-up
process again.
In down mode, the control logic pulls the gate of PMOS
to the input voltage rather than ground. This method
allows effective control of inductor current when VIN
>
VOUT. Thermal consideration should be taken in down
mode, where the voltage drop across the PMOS
increases as the delta of VIN and VOUT increases.
In pass-through mode, the complimentary switching
action stops. The gate of PMOS is pulled to ground for
always-on and the low-side switch remains off. The
output voltage is equal to the input voltage minus the
voltage drop across the DC resistance (DCR) of the
inductor and the on-resistance of the rectifying PMOS.
During the output short-to-ground case, as output
voltage declines below 2.2V, the SGM66099 reduces
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Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
DETAILED DESCRIPTION (continued)
The SGM66099 enters down mode when the input
voltage is equal to or higher than VOUT - 100mV. It
Thermal Shutdown
A thermal shutdown function is implemented to prevent
damage caused by excessive heat and power
dissipation. Once a junction temperature of +150℃
(TYP) is exceeded, the device is shut down. The device
is released from shutdown automatically when the
junction temperature decreases by 25℃.
remains in down mode until the VIN is more than VOUT
+
0.3V and then automatically enters pass-through mode.
In pass-through mode, the high-side PMOS is always
turned on to pass the input voltage to the output. As VIN
drops below 1% above the target output voltage, the
device exits pass-through mode and returns to down
mode. The device exits down mode and returns to
normal boost switching operation as VIN drops 150mV
below the target output voltage.
Voltage (V)
Down
Mode
Down
Mode
Pass-Through
300mV
1% VOUT
VOUT
VIN
100mV
150mV
t
Figure 3. Down Mode and Pass-Through Mode
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Synchronous Boost Converter
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SGM66099
APPLICATION INFORMATION
L
VIN
2.2μH
2.7V to 4.2V
CIN
10μF
SW
VOUT
5V
VIN
VOUT
REN
10kΩ
COUT1
10μF
COUT2
10μF
SGM66099-ADJ
R1
EN
CEN
10nF
FB
GND
R2
Figure 4. 5V Output Boost Converter
For fixed output voltage version, connect the FB pin to
GND and do not leave FB pin floating. The SGM66099
offers diverse fixed voltage versions.
Design Requirements
5V output at 1mA load current is used to provide
system bias power or LED bias voltage from a single
cell Li-Ion battery as an example. The selection of
external component values for the SGM66099 can
reference the following design procedure.
Maximum Output Current
The maximum output load capability of SGM66099
depends on the minimum desired operation input
voltage and the current limit of the device. The
maximum load current can be estimated by Equation 2,
Table 1. Design Requirements
PARAMETERS
Input Voltage
VALUES
2.7V ~ 4.2V
5V
I
V ⋅(ILIM
-
LH ) ⋅η
Output Voltage
IN
2
(2)
IOUT(MAX)
=
Output Current
1mA
VOUT
Output Voltage Ripple
±50mV
where η is the conversion efficiency, using 85% for
estimation; ILH is the inductor peak-to-peak ripple
current and ILIM is the switch current limit.
Programming the Output Voltage
External resistor dividers R1 and R2 (see Figure 4) can
be used to set the output voltage. The typical voltage at
the FB pin is VREF of 1.0V.
For worst-case condition analysis, the minimum input
voltage, maximum Boost output voltage and minimum
current limit (ILIM) should be used.
R1 + R2
(1)
VOUT = VREF
×
R2
Inductor Selection
Inductor selection is one of the most important
criterions for switch mode power supply, because the
inductor selection may affect the power supply’s
transient response, loop stability, efficiency and
steady-state operation. Inductor parameters of DC
resistance (DCR), inductance and saturation current
are critical for a smooth and efficient power supply
operation.
The leakage current into the FB pin affects the
accuracy of output voltage. To minimize the leakage
current effect, the current flowing through R2 should be
100 times greater than FB pin leakage current. Small
R2 increases the noise immunity, while large R2
reduces the leakage current flowing through feedback
resistors, which improves the no load efficiency of the
device. 1MΩ and 249kΩ resistors are selected for R1
and R2 respectively in this case. ±1% accuracy
resistors are recommended for R1 and R2 to improve
output voltage accuracy.
The internal compensation of the device is optimized
with 1μH and 2.2μH. When VOUT is higher than 3V,
2.2μH inductance should be selected. When VOUT is
less than 3V, 1.1μH inductance should be selected.
An external feed-forward capacitor (CFWD) from 10pF to
22pF in parallel with R1 is recommended to improve
device’s stability.
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Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
APPLICATION INFORMATION (continued)
Table 2. List of Inductors
Inductance
(µH)
Saturation
Current (A)
DC Resistance
Size
VOUT (V)
Part Number
Manufacturer
(MΩ)
L × W × H (mm3)
2.2
2.2
2.2
1.0
1.0
1.0
1.95
1.7
80
92
2.5 × 2.0 × 1.2
2.5 × 2.0 × 1.1
2.0 × 1.6 × 1.0
2.5 × 2.0 × 1.2
2.5 × 2.0 × 1.0
2.0 × 1.2 × 1.0
74404024022
LQH2HPN2R2MJR
VLS201610CX-2R2M
74404024010
Würth Elektronik
muRata
> 3.0
1.45
2.6
163
37
TDK
Würth Elektronik
TDK
≤ 3.0
2.3
48
MLP2520W1R0MT0S1
LQM21PN1R0MGH
1.5
80
muRata
Capacitor Selection
Layout
The input capacitor of boost converter not only
minimizes input voltage ripple, but also reduces any
voltage spike presenting on IC’s VIN pin. A 10μF, low
ESR and X5R or higher temperature coefficient
ceramic capacitor is recommended to place as close to
the VIN and GND pins as possible to improve transient
response and EMI behavior.
In addition to component selection, layout is a critical
step to ensure the performance of any switch mode
power supplies. Poor layout could result in system
instability, EMI failure, and device damage. Thus, place
the inductor, input and output capacitors as close to the
IC as possible, and use wide and short traces for
current carrying traces to minimize PCB inductance.
Boost converter’s output capacitor plays a significant
role in ensuring good system performance. The
location of output capacitor will have an effect on the
switching spikes on the SW pin, which ultimately affects
EMI performance and potentially damages the IC due
to large switching spikes. The current loop formed by
the output capacitor flowing from the VOUT pin and
back to the GND pin should be as small as possible.
Therefore, a ceramic cap should be placed as close to
the VOUT and GND pins of the IC as possible.
For Boost converter, the current loop of the output
capacitor from VOUT pin back to the GND pin of the
device should be as small as possible.
ADJ ONLY
GND
VOUT
COUT
GND
COUT
Boost topology presents right-half-plane-zero which is
dictated by inductance. In addition, the output capacitor
sets the corner frequency of the converter for current
mode controlled method. Consequently, with a larger
inductor, a larger output capacitor must be used. The
device’s internal compensation is optimized to operate
with inductance values between 1μH and 2.2μH,
CIN
resulting in the minimum output capacitor value of 20μF
(nominal value). Increasing the output capacitor can
reduce output ripple in PWM mode.
EN
Due to the nature of ceramic capacitors’ DC bias effect,
effective capacitance at the bias voltage should be
verified. GRM188R60J106ME84D is used for VOUT rail.
It is a 10μF ceramic capacitor and has high effective
capacitance value at DC biased condition.
VIN
SW
Figure 5. SGM66099 PCB Layout
In the case of load hot-plugging, the input capacitance
of load device needs to be less than 1/10 of the output
capacitance of SGM66099.
SG Micro Corp
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MAY 2022
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Synchronous Boost Converter
with Ultra-Low Quiescent Current
SGM66099
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
MAY 2022 ‒ REV.B to REV.B.1
Page
Added PCB Layout............................................................................................................................................................................................15
Updated General Description, Detailed Description and Application Information sections.............................................................1, 12, 13, 14, 15
FEBRUARY 2021 ‒ REV.A.4 to REV.B
Page
Updated FB pin function ................................................................................................................................................................................4, 14
JUNE 2020 ‒ REV.A.3 to REV.A.4
Page
Deleted Temperature Grade X...........................................................................................................................................................................All
OCTOBER 2019 ‒ REV.A.2 to REV.A.3
Page
Added RC circuit for EN pin and corresponding description............................................................................................................... 1, 12, 14, 15
Updated Typical Performance Characteristics .....................................................................................................................................................7
JULY 2019 ‒ REV.A.1 to REV.A.2
Page
Added Temperature Grade X.............................................................................................................................................................................All
APRIL 2019 ‒ REV.A to REV.A.1
Page
Updated FB pin function ................................................................................................................................................................................4, 13
Changes from Original (DECEMBER 2018) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
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MAY 2022
16
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
WLCSP-1.22×0.83-6B
A1 CORNER
0.23
0.21
6 × Φ
0.4
0.4
RECOMMENDED LAND PATTERN
TOP VIEW
0.830± 0.025
6 × Φ0.270± 0.020
2
1
A
B
C
0.4
0.198± 0.020
0.040± 0.005
0.362± 0.013
0.600± 0.038
0.4
BOTTOM VIEW
SIDE VIEW
NOTE: All linear dimensions are in millimeters.
SG Micro Corp
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PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6AL
D
e
N6
L
D1
E1
E
N3
N1
b
BOTTOM VIEW
TOP VIEW
1.60
0.55
1.00
2.60
A
A1
A2
SIDE VIEW
0.30
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.028
0.000
0.203 REF
0.008 REF
1.900
1.500
1.900
0.900
0.250
2.100
1.700
2.100
1.100
0.350
0.075
0.059
0.075
0.035
0.010
0.083
0.067
0.083
0.043
0.014
D1
E
E1
b
e
0.650 BSC
0.026 BSC
L
0.174
0.326
0.007
0.013
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PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
WLCSP-1.22×0.83-6B
TDFN-2×2-6AL
7″
7″
9.5
9.5
0.91
2.30
1.31
2.30
0.71
1.10
4.0
4.0
4.0
4.0
2.0
2.0
8.0
8.0
Q1
Q1
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PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
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