CXD2424R [SONY]

Timing Generator for Progressive Scan CCD Image Sensor; 时序发生器逐行扫描CCD图像传感器
CXD2424R
型号: CXD2424R
厂家: SONY CORPORATION    SONY CORPORATION
描述:

Timing Generator for Progressive Scan CCD Image Sensor
时序发生器逐行扫描CCD图像传感器

传感器 换能器 图像传感器 CD
文件: 总31页 (文件大小:806K)
中文:  中文翻译
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CXD2424R  
Timing Generator for Progressive Scan CCD Image Sensor  
Description  
64 pin LQFP (Plastic)  
The CXD2424R is an IC developed to generate the  
timing pulses required by the Progressive Scan  
CCD image sensors as well as signal processing  
circuits.  
Features  
CCIR support  
Electronic shutter function  
Random trigger shutter function  
Sync signal generator  
Absolute Maximum Ratings  
Supply voltage  
Input voltage  
Output voltage  
VDD VSS – 0.5 to +7.0  
V
Supports external synchronization  
Supports non-interlaced operation  
Base oscillation 1888fh (29.5MHz)  
VI VSS – 0.5 to VDD + 0.5 V  
VO VSS – 0.5 to VDD + 0.5 V  
Operating temperature Topr  
Storage temperature Tstg  
–20 to +75  
°C  
°C  
–55 to +150  
Applications  
Progressive Scan CCD cameras  
Recommended Operating Conditions  
Supply voltage  
VDD  
4.75 to 5.25  
–20 to +75  
V
Structure  
Operating temperature Topr  
°C  
Silicon gate CMOS IC  
Applicable CCD Image Sensors  
ICX075AL, ICX075AK  
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
– 1 –  
E95306-PS  
CXD2424R  
Block Diagram  
46 45 44 43  
39 38 37 36  
58 61 60 57  
47  
42 41  
59  
54  
53 51 50 49  
VRI  
HRI  
63  
62  
RG  
11  
13  
OUTPUT CONTROL  
XH1  
TG  
G
XH2 14  
A
T
E
V-CONTROL  
28  
29  
30  
26  
25  
22  
XSHP  
XSHD  
XRS  
XV1  
PULSE GENERATOR  
V-DECODER  
1/625  
H-DECODER  
1/472  
XV2  
TEST1  
20  
XV3  
TEST2  
TEST3  
21  
31  
32  
48  
35  
34  
33  
52  
XSG 27  
XHHG1A  
15  
16  
1/2  
COUNTER  
DECODE  
TEST4  
TEST8  
TEST7  
TEST6  
XHHG1B  
XHHG2 17  
XVOG  
18  
19  
TEST CIRCUIT  
XVHOLD  
TEST5  
NC  
GATE  
64  
1
2
8 10  
3
4
5
6
7
9
12 23 24 40 55 56  
29.5MHz  
– 2 –  
CXD2424R  
Pin Configuration  
48  
47  
46 45 44 43  
42 41  
40  
39 38 37  
36  
35  
34 33  
TEST4  
TEST3  
XRS  
49  
50  
51  
52  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
CL  
CLD  
O2FH  
NC  
XSHD  
XSHP  
XSG  
XV1  
FLD 53  
BLK  
VSS  
54  
55  
XV2  
VDD 56  
CXD2424R (G/A)  
VDD  
57  
SYNC  
HDI  
VSS  
58  
59  
60  
61  
22 XV3  
VDI  
21 TEST2  
20 TEST1  
HDO  
VDO  
HRI  
19  
18  
17  
XVHOLD  
XVOG  
62  
63  
VRI  
XHHG2  
64  
CKI  
1
2
3
4
5
6
7
8
9
10 11 12  
13  
14 15 16  
– 3 –  
CXD2424R  
Pin Description  
Pin  
Symbol  
No.  
I/O  
Description  
1
2
OSCO  
OSCI  
O
I
Inverter output for oscillation.  
Inverter input for oscillation.  
Switching for electronic shutter speed input method. (With pull-down resistor)  
Low: Parallel input, High: Serial input  
3
PS  
I
4
ED0  
I
I
Shutter speed setting. Strobe input for serial mode. (With pull-up resistor)  
Shutter speed setting. Clock input for serial input. (With pull-up resistor)  
Shutter speed setting. Data input for serial input. (With pull-up resistor)  
Shutter mode setting. (With pull-up resistor)  
GND  
5
ED1  
6
ED2  
I
7
SMD1  
Vss  
I
8
I
9
SMD2  
TRIG  
RG  
Shutter mode setting. (With pull-up resistor)  
Trigger input for random trigger shutter.  
Reset gate pulse output.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
I
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
XSUB  
XH1  
CCD discharge pulse output.  
Clock output for CCD horizontal register drive.  
Clock output for CCD horizontal register drive.  
Clock output for transfer between CCD horizontal registers.  
Clock output for transfer between CCD horizontal registers.  
Clock output for transfer between CCD horizontal registers.  
Clock output for transfer from CCD vertical register to CCD horizontal register.  
Clock output for adjusting timing of transfer to CCD horizontal register.  
Test output. Normally open.  
XH2  
XHHG1A  
XHHG1B  
XHHG2  
XVOG  
XVHOLD  
TEST1  
TEST2  
XV3  
Test output. Normally open.  
Clock output for CCD vertical register drive.  
GND  
Vss  
VDD  
Power supply.  
XV2  
Clock output for CCD vertical register drive.  
Clock output for CCD vertical register drive.  
CCD sensor charge readout pulse output.  
Precharge level sample-and-hold pulse.  
Data sample-and-hold pulse.  
XV1  
XSG  
XSHP  
XSHD  
XRS  
Sample-and-hold pulse.  
TEST3  
TEST4  
TEST5  
TEST6  
TEST7  
Test output. Normally open.  
Test output. Normally open.  
Test output. Normally open.  
Test output. Normally open.  
Test input. Set at Low in normal operation. (With pull-down resistor)  
– 4 –  
CXD2424R  
Pin  
No.  
Symbol  
EXT  
I/O  
Description  
Internal synchronization/external synchronization switching. (With pull-down resistor)  
Low: Internal synchronization, High: External synchronization  
36  
37  
38  
I
I
I
Normal reset/direct reset switching. (With pull-down resistor)  
Low: Normal reset, High: Direct reset  
REND  
REVH  
V reset/HV reset switching. (With pull-down resistor)  
Low: V reset, High: HV reset  
O2FH output control. (With pull-down resistor)  
Low: No output, High: Output  
39  
40  
41  
OCTL  
Vss  
I
I
GND  
Normal operation/random trigger shutter switching. (With pull-down resistor)  
Low: Normal operation, High: Random trigger shutter  
RDM  
Switching for output mode. (With pull-down resistor)  
Low: Non-interlaced, High: Interlaced  
42  
RM  
I
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
XCPDM  
XCPOB  
PBLK  
ID  
O
O
O
O
O
I
Clamp pulse output.  
Clamp pulse output.  
Blanking cleaning pulse output.  
Line identification output.  
Write enable output.  
WEN  
TEST8  
CL  
Test input. (With pull-down resistor)  
fck clock output. (0°)  
O
O
O
O
O
O
I
CLD  
O2FH  
NC  
fck clock output. (180°)  
2 fH output.  
FLD  
Field pulse output.  
BLK  
Composite blanking output.  
GND  
Vss  
VDD  
Power supply.  
SYNC  
HDI  
Composite sync output.  
Horizontal sync signal input.  
Vertical sync signal input.  
Horizontal sync signal output.  
Vertical sync signal output.  
Horizontal reset signal input.  
Vertical reset signal input.  
2 fck clock input.  
VDI  
I
HDO  
VDO  
HRI  
O
O
I
VRI  
I
CKI  
I
– 5 –  
CXD2424R  
Electrical Characteristics  
DC Characteristics  
(VDD = 4.75 to 5.25V, Topr = –20 to +75°C)  
Item  
Symbol  
VDD  
Conditions  
Min.  
4.75  
Typ.  
5.0  
Max.  
5.25  
Unit  
V
Supply voltage  
VIH1  
0.7VDD  
V
Input voltage 1  
(Input pins other than those below)  
VIL1  
0.3VDD  
0.3VDD  
0.4  
V
VIH2  
0.7VDD  
–0.8  
V
Input voltage 2  
(Pins 7, 9, 10, 58, 59, 62, 63, and 64)  
VIL2  
V
VOH1  
VOL1  
VOH2  
VOL2  
VOH3  
VOL3  
VOH4  
VOL4  
RFB  
IOH = –2mA  
V
Output voltage 1  
(Output pins other than those below)  
IOL = 4mA  
V
IOH = –4mA  
IOL = 8mA  
–0.8  
V
Output voltage 2 (Pins 28, 29, 30,  
31, 32, 33, 34, 49 and 50)  
0.4  
V
IOH = –12mA  
IOL = 12mA  
IOH = –12mA  
IOL = 12mA  
VIN = Vss or VDD  
VIL = 0V  
VDD – 0.8  
VDD/2  
250k  
V
Output voltage 3  
(Pins 11, 13, and 14)  
0.4  
V
V
Output voltage 4  
(Pin 1)  
VDD/2  
2.5M  
V
1M  
50k  
50k  
Feedback resistor  
Pull-up resistor  
RPU  
RPD  
VIN = VDD  
Pull-down resistor  
VDD = 5V  
IDD  
ICX075AL in normal  
operating state  
40  
mA  
Current consumption  
I/O Pin Capacitances  
Item  
(VDD = V = 0V, fM = 1MHz)  
Symbol  
CIN  
Min.  
Typ.  
Max.  
9
Unit  
pF  
Input pin capacitance  
Output pin capacitance  
COUT  
11  
pF  
– 6 –  
CXD2424R  
AC Characteristics  
1) Phase characteristics of XH1, RG, XSHP, XSHD, XRS, CL, and CLD  
tCK  
CK  
Vpp/2  
tpd2  
tpd1  
0.7VDD  
tpd3  
XH1  
RG  
0.3VDD  
0.7VDD  
tpd4  
0.3VDD  
0.3VDD  
tpd6  
tpd5  
XSHP  
0.7VDD  
tpd8  
tpd7  
XSHD  
XRS  
0.7VDD  
0.3VDD  
tpd9  
tpd10  
0.7VDD  
0.3VDD  
tpd12  
tpd11  
0.7VDD  
CL  
0.3VDD  
tpd14  
tpd13  
0.7VDD  
CLD  
0.3VDD  
(VDD = 5.0V, Topr = 25°C, Load capacity of CL and CLD = 30pF, Load capacity of XH1, XSHP, XSHD, XRS, and RG = 10pF)  
Symbol  
Definition  
Typ.  
35  
8
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCK  
CK cycle  
tpd1  
tpd2  
tpd3  
tpd4  
tpd5  
tpd6  
tpd7  
tpd8  
tpd9  
tpd10  
tpd11  
tpd12  
tpd13  
tpd14  
XH1 rising delay, activated by the falling edge of CK  
XH1 falling delay, activated by the falling edge of CK  
RG falling delay, activated by the rising edge of CK  
RG rising delay, activated by the falling edge of CK  
XSHP falling delay, activated by the rising edge of CK  
XSHP rising delay, activated by the falling edge of CK  
XSHD falling delay, activated by the rising edge of CK  
XSHD rising delay, activated by the falling edge of CK  
XRS falling delay, activated by the falling edge of CK  
XRS rising delay, activated by the rising edge of CK  
CL falling delay, activated by the rising edge of CK  
CL rising delay, activated by the rising edge of CK  
CLD falling delay, activated by the rising edge of CK  
CLD rising delay, activated by the falling edge of CK  
9
11  
15  
18  
18  
20  
11  
17  
15  
32  
0
26  
20  
– 7 –  
CXD2424R  
Waveform Characteristics of XH1 and RG  
0.9VDD  
XH1  
0.1VDD  
tfH1  
trH1  
0.9VDD  
RG  
0.1VDD  
trRG  
tfRG  
(VDD = 5.0V, Topr = 25°C, Load capacity of XH1 = 10pF, Load capacity of RG = 10pF)  
Symbol  
trH1  
Definition  
Typ.  
Unit  
ns  
XH1 rise time  
2
3
2
2
tfH1  
XH1 fall time  
RG rise time  
RG fall time  
ns  
trRG  
tfRG  
ns  
ns  
– 8 –  
CXD2424R  
In the normal reset mode, the signal output is reset to ODD or EVEN field depending on the input timing of  
the vertical reset signal as shown in the figure below.  
Field identification  
VRI  
1
2
HDO  
tp2  
tp1  
tp3  
fH  
fH L: ODD H: EVEN  
tp5  
tp4  
1
2
VDO  
VDO  
ODD  
309.5H  
EVEN  
309.5H  
Symbol  
Definition  
Specified value Unit  
tp1  
tp2  
tp3  
tp4  
tp5  
Range of resetting to ODD  
Range of resetting to EVEN  
Range of resetting to ODD  
Prohibited area  
22.0  
31.8  
9.8  
µs  
µs  
µs  
ns  
ns  
200  
200  
Prohibited area  
– 9 –  
CXD2424R  
In the direct reset mode, the signal output is reset to ODD or EVEN field depending on the input timing of the  
vertical reset signal as shown in the figure below.  
Field identification  
VRI  
1
2
HDO  
tp2  
tp1  
tp3  
fH  
fH L: ODD H: EVEN  
tp5  
tp4  
1
2
VDO  
VDO  
EVEN  
ODD  
Symbol  
Definition  
Specified value Unit  
tp1  
tp2  
tp3  
tp4  
tp5  
Range of resetting to ODD  
22.0  
31.8  
µs  
µs  
µs  
ns  
ns  
Range of resetting to EVEN  
Range of resetting to ODD  
Prohibited area  
1
200  
200  
Prohibited area  
1
In the direct reset mode, the cycle of HD can be arbitrary. Therefore, tp3 is not specified.  
– 10 –  
CXD2424R  
Description of Operation  
1. Mode Control  
Symbol  
RM  
Pin No.  
42  
L
H
Remarks  
1/25s non-interlaced  
Normal operation  
Parallel  
1/50s interlaced  
Random trigger shutter  
Serial  
RDM  
PS  
41  
3
Electronic shutter speed input method  
EXT  
36  
Internal synchronization External synchronization  
REND  
REVH  
37  
Normal reset  
V reset  
Direct reset  
HV reset  
38  
2. Mode Relationships  
L
H
RM  
1/25s non-interlaced  
1/50s interlaced  
H
L
H
L
EXT  
Internal synchronization External synchronization Internal synchronization External synchronization  
L
H
L
H
Random  
trigger  
shutter  
Random  
trigger  
shutter  
RDM  
Normal  
operation  
Normal  
operation  
Normal operation  
Direct reset  
Normal operation  
L
H
REND  
REVH  
Normal  
reset  
Direct reset  
H
L
L
H
V
HV  
V
HV  
reset  
reset  
reset reset  
: Disabled  
– 11 –  
CXD2424R  
3. Electronic Shutter  
<Shutter Modes>  
SMD1 SMD2  
L
L
L
H
L
Flickerless: Eliminates fluorescent frequency-induced flicker.  
High-speed shutter: Shutter speed faster than 1/50  
Low-speed shutter: Shutter speed slower than 1/50  
No shutter operation  
H
H
H
<Shutter Mode and Speed Setting Method>  
PS = Low : Parallel input; set by ED0 to ED2, SMD1, and SMD2.  
PS = High : Serial input; set by inputting ED0 (strobe), ED1 (clock), and ED2 (data) to each pin.  
3-1. Parallel input  
Shutter Speed Compatibility Chart  
Mode  
PS  
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
SMD1  
H
L
SMD2  
H
L
ED0  
X
X
H
L
ED1  
X
X
H
H
L
ED2  
X
X
H
H
H
H
L
Shutter speed  
OFF  
Shutter off  
1/120 (s)  
1/50 (s)  
1/125 (s)  
1/250 (s)  
1/500 (s)  
1/1000 (s)  
1/2000 (s)  
1/4000 (s)  
1/10000 (s)  
2FLD  
Flickerless  
L
H
H
H
H
H
H
H
H
L
L
L
H
L
L
L
High-speed  
shutter  
L
H
L
H
H
L
L
L
L
H
L
L
L
L
L
H
H
H
H
H
H
H
H
H
L
H
H
L
H
H
H
H
L
L
4FLD  
L
H
L
6FLD  
L
L
8FLD  
Low-speed  
shutter  
L
H
L
H
H
L
10FLD  
L
L
12FLD  
L
H
L
L
14FLD  
L
L
L
16FLD  
– 12 –  
CXD2424R  
3-2. Serial input  
For serial input (PS = High), SMD1 and SMD2 bits within ED2 (DATA) take priority over SMD1 (Pin 7) and  
SMD2 (Pin 9) pins as SMD1 and SMD2 (shutter mode control). In this case, control by SMD1 and SMD2 pins  
is invalid.  
ED1 (CLK)  
Dummy  
ED2 (DATA)  
ED0 (STB)  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8 SMD1 SMD2  
ED2 data is latched to the register at the rise of ED1, and transferred to the within at the rise of ED0.  
AC Characteristics  
ED2  
ED1  
ED0  
ts2  
th2  
ts0  
tw1  
ts1  
tw0  
Definition  
Symbol  
ts2  
Min.  
20ns  
20ns  
20ns  
20ns  
20ns  
20ns  
Max.  
ED2 set-up time, activated by the falling edge of ED1  
ED2 hold time, activated by the rising edge of ED1  
ED1 rising set-up time, activated by the rising edge of ED0  
ED0 pulse width  
th2  
ts1  
tw0  
ts0  
50µs  
ED0 rising set-up time, activated by the rising edge of ED1  
ED1 pulse width (serial input)  
tw1  
– 13 –  
CXD2424R  
3-3. Shutter speed calculation formula  
High-speed shutter  
T = [31210 – (1FF16 – L16)] × 64 + 35.6 (µs)  
( L16 = Load value)  
Load value Shutter speed  
Calculated value  
1/10040  
1/4394  
1/2068  
1/1004  
1/495  
0C816  
0CA16  
0CE16  
0D616  
0E616  
10516  
14316  
14916  
1/10000  
1/4000  
1/2000  
1/1000  
1/500  
1/250  
1/250  
1/125  
1/125  
1/120  
1/120  
Low-speed shutter  
N = 2 × (1FF16 – L16) FLD  
However, “FF” cannot be used as the load value.  
Load value Shutter speed (FLD)  
1FE16  
1FD16  
:
2
4
:
10116  
10016  
508  
510  
Note) In case of starting with serial input setting (PS = H), be sure to transfer shutter speed data in the range  
of specification after power is turned on, and then use it.  
– 14 –  
CXD2424R  
4. Random Trigger Shutter  
The random trigger shutter is different from the conventional electronic shutter in that the exposure beginning  
can be freely set. The exposure period (shutter speed) can be set as with the conventional electronic shutter.  
In this mode, XSUB rises for each 1H, and the charge stored in the sensor is discharged. Because the V clock  
(XV1 to XV3) is continuously operating, any unneeded charge in the vertical CCD is eliminated.  
XSG pulse is stopped until the external trigger is detected. The image cannot be monitored until the external  
trigger is detected and the signal is read out.  
When an external trigger is input in this state, HD is forcibly reset when the trigger falls, and XSUB falls once to  
clear the charge and then halts. XV1 to XV3, XCPDM, XCPOB, and PBLK are reset with HD. From this point,  
exposure begins, and after the preset exposure period has passed, the XSG pulse falls, the charge is  
transferred from the sensor to the vertical CCD, and exposure ends. The XSG pulse falls with the time set as  
in conventional electronic shutters, regardless of VD. Because HD is reset, the exposure period is accurate in  
1H units. The WEN pulse is generated synchronously with the XSG pulse. As the WEN pulse specifies the  
signal start, it can be used as the sync signal for writing image data into the frame memory.  
In the random trigger shutter mode, V-direction functions of a sync signal generator are halted. As a result,  
sync signals VD and FLD are also halted.  
TRIG  
HD reset  
HD  
XSUB reset  
XSG  
XSUB  
Shutter speed  
XV1  
XV2  
XV3  
WEN  
– 15 –  
CXD2424R  
5. External Synchronization - Reset  
HD and VD are reset to synchronize with the external sync signal.  
Resetting is done to synchronize a plural number of camera systems whose clock frequencies are the same.  
There are two reset inputs: HRI and VRI. When their falling edge is detected, resetting is carried out. The  
CXD2424R has two reset modes: normal reset and direct reset. Details of the reset modes are described in  
the following pages.  
In the 1/25s non-interlaced readout mode, the normal reset mode is not supported, and although the direct  
reset mode is supported, the field is not identified.  
– 16 –  
CXD2424R  
5-1. Normal reset  
In the normal reset mode, the reset signal is input for resetting, and the sync signal is output continuously from  
that time. Only the mode which resets both HD and VD (HV reset) is supported, and the mode which does not  
accept the HD reset (V reset) is not supported.  
When the H reset signal HRI is continuously with an H cycle, resetting is triggered at the first falling edge, and  
after that point no resets are triggered at edges unless HD after resetting exceeds 2bits (136ns) on the internal  
clock. In other words, the HRI input jitter is absorbed when it is up to 136 ns. The HRI minimum reset pulse  
width is 0.3µs.  
In the V direction, counting begins from VRI fall, and V is reset to cause VDO to fall after 312.5 – 3 = 309.5H.  
The VRI minimum reset pulse width is 2H.  
Resetting is done for ODD or EVEN field, depending on the input timing of the V reset signal. The identification  
timing is shown in Electrical Characteristics.  
FIELD.E  
FIELD.O  
HRI  
HDO  
VRI  
7.5H  
VDO  
309.5H  
FIELD.O  
FIELD.E  
HRI  
HDO  
VRI  
7.5H  
VDO  
309.5H  
H reset  
57.6 to 57.7µs (850 to 851bit)  
HRI  
HD OUT  
Reset  
6.3 to 6.37µs  
– 17 –  
CXD2424R  
5-2. Direct reset  
In the direct reset mode, when the reset signal is input for resetting, a sync signal is output, but there is no  
continuous output.  
There are two direct reset modes: one to direct reset VD only, and one to reset both HD and VD. (However,  
note that even for V reset, the HD signal is acceptable and the reset timing is the same as in normal reset  
mode.) In both modes, the VD reset timing is the same.  
When the external input V reset signal VRI fall is detected, a judgment is made as to ODD or EVEN. If ODD, V  
is reset to cause VDO to fall simultaneously in the middle of HD, and if EVEN, V is reset to cause VDO to fall  
simultaneously with HD fall. VRI requires a minimum pulse width of 2H.  
H direct reset detects the fall of H reset signal HRI, and resets H so that HDO falls at the next CL falling edge.  
The minimum HRI reset pulse width is 0.3µs.  
Resetting is done for ODD or EVEN field, depending on the input timing of the V reset signal. The identification  
timing is shown in Electrical Characteristics.  
5-2-1. V reset  
FIELD.E  
FIELD.O  
HRI  
HDO  
VRI  
7.5H  
VDO  
FIELD.O  
FIELD.E  
HRI  
HDO  
VRI  
7.5H  
VDO  
– 18 –  
CXD2424R  
5-2-2. HV reset (1/50s interlaced readout mode)  
FIELD.E  
FIELD.O  
HDO  
HRI  
7.5H  
VDO  
VRI  
XSG  
ID  
FIELD.O  
FIELD.E  
HDO  
HRI  
7.5H  
VDO  
VRI  
XSG  
ID  
CL  
HRI  
HDO  
– 19 –  
CXD2424R  
5-2-3. HV reset (1/25s non-interlaced readout mode)  
HDO  
HRI  
7.5H  
VDO  
VRI  
XSG  
ID  
HDO  
HRI  
7.5H  
VDO  
VRI  
XSG  
ID  
CL  
HRI  
HDO  
– 20 –  
CXD2424R  
Timing Chart (1) <Vertical direction> 1/50s interlaced readout (RM = High)  
FLD  
VDO  
BLK  
HDO  
XV1  
XV2  
XV3  
OUT1  
OUT2  
XSG  
XVHOLD  
XVOG  
XHHG1A  
XHHG1B  
XHHG2  
PBLK  
XCPOB  
XCPDM  
ID  
WEN  
– 21 –  
CXD2424R  
Timing Chart (2) <Vertical direction> 1/25s non-interlaced readout (RM = Low)  
FLD  
VDO  
BLK  
HDO  
XV1  
XV2  
XV3  
OUT1  
XSG  
XVHOLD  
XVOG  
XHHG1A  
XHHG1B  
XHHG2  
PBLK  
XCPOB  
XCPDM  
ID  
WEN  
– 22 –  
CXD2424R  
– 23 –  
CXD2424R  
– 24 –  
CXD2424R  
Timing Chart (5) <V2/V3 simultaneous readout timing> 1/50s interlaced (RM = High)  
HD  
2.58µs (38 bits)  
43.25µs (638 bits)  
2.58µs (38 bits)  
3.25µs (48 bits)  
15.59µs (230 bits)  
ODD Field  
XV1  
XV2  
XV3  
XSG  
EVEN Field  
XV1  
XV2  
XV3  
XSG  
Timing Chart (6) <V2/V3 simultaneous readout timing> 1/25s non-interlaced (RM = Low)  
HD  
2.58µs (38 bits)  
43.25µs (638 bits)  
2.58µs (38 bits)  
3.25µs (48 bits)  
15.59µs (230 bits)  
ODD Field  
XV1  
XV2  
XV3  
XSG  
– 25 –  
CXD2424R  
Timing Chart (7) <High-speed phase>  
HD  
CKI  
CL  
XH1  
XH2  
RG  
XSHP  
XSHD  
XRS  
CLD  
– 26 –  
CXD2424R  
Timing Chart (8) <SG vertical direction>  
O: ODD  
E: EVEN  
Field E  
Field O  
HDO  
7.5H  
VDO  
SYNC  
BLK  
25H  
FLD  
Field O  
Field E  
HDO  
7.5H  
VDO  
SYNC  
BLK  
25H  
FLD  
– 27 –  
CXD2424R  
Timing Chart (9) <SG horizontal direction>  
HDO  
BLK  
6.92µs (102 bits)  
12.0µs (177 bits)  
HSYNC  
1.48µs  
(22 bits)  
4.93µs (73 bits)  
2.47µs (36 bits)  
EQ  
VSYNC  
VDO  
27.07µs (399 bits)  
4.93µs (73 bits)  
FLD  
ODD  
EVEN  
9.87µs  
(145 bits)  
11.91µs  
(176 bits)  
10.22µs  
(151 bits)  
O2FH  
64.0µs (944 bits)  
1/2H 32.0µs  
(472 bits)  
9.87µs  
(146 bits)  
22.13µs (326 bits)  
FH  
– 28 –  
CXD2424R  
Setting Up during Power ON  
During power on, after setting random trigger shutter mode once, switch to normal operation mode, and then  
use it. To be concrete, control supply voltage of two pins as shown below. The period to set random trigger  
shutter mode must be 1 clock (68ns) or more.  
Pin No.  
Symbol  
Supply voltage of pin  
during power on  
7
SMD1 (with pull-up resistor)  
RDM (with pull-down resistor)  
Low  
High  
Low  
High  
41  
(random trigger shutter)  
(normal operation)  
<Timing Example>  
+5V power supply  
(TG power supply)  
SMD1 pin voltage  
RDM pin voltage  
Low  
High  
0.3VDD  
0.7VDD  
High  
Low  
68ns or more  
– 29 –  
CXD2424R  
A N A L O G O U T 2  
A N A L O G O U T 1  
N . .  
N . .  
4 7 p  
4 7 p  
4 7 p  
4 7 p  
4 7 p  
2 . 2 K  
2 . 2 K  
2 . 2
2 . 2
2 . 2 K  
N . C .  
1 0 0 0 p  
– 30 –  
CXD2424R  
Package Outline  
Unit: mm  
64PIN LQFP (PLASTIC)  
12.0 ± 0.2  
10.0 ± 0.1  
48  
33  
49  
32  
A
17  
(0.22)  
64  
16  
1
+ 0.08  
0.18 – 0.03  
+ 0.05  
0.127 – 0.02  
0.5 ± 0.08  
+ 0.2  
1.5 – 0.1  
0.1  
0.1 ± 0.1  
0° to 10°  
NOTE: Dimension “ ” does not include mold protrusion.  
DETAIL A  
PACKAGE STRUCTURE  
EPOXY RESIN  
PACKAGE MATERIAL  
LEAD TREATMENT  
LEAD MATERIAL  
SOLDER/PALLADIUM  
LQFP-64P-L01  
SONY CODE  
EIAJ CODE  
PLATING  
LQFP064-P-1010  
42/COPPER ALLOY  
0.3g  
JEDEC CODE  
PACKAGE MASS  
– 31 –  

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