MASW-001150-13160-V5 [TE]
SURMOUNT PIN Diode Switch Element; 众志成城的PIN二极管开关元件
| 型号： | MASW-001150-13160-V5 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | SURMOUNT PIN Diode Switch Element |
| 文件： | 总9页 (文件大小：202K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
Features
Specified Bandwidth: 45MHz—2.5GHz
Useable 30MHz to 3.0GHz
Low Loss <0.5dB
High isolation >40dB
High C.W. Incident Power, 50W at 500MHz
High Input IP3, +66dBm @ 500MHz
Unique Thermal Terminal for Series Diode
Surface Mount Device (No Wire Bonds)
Rugged Silicon-Glass Construction
Silicon Nitride Passivation Protective Polymer
Protective Polymer Scratch Protection
RoHS Compliant
Description
A PIN diode series-shunt switch element with a unique
integrated thermal terminal for dissipating heat in the
series diode created by the DC and RF input power.
The thermal terminal allows for optimum heat dissipa-
tion by providing a direct thermal connection between
the series diode and the circuit heatsink while also
being electrically isolated. The chip is designed to pro-
vide a heat transfer conduit that does not interfere with
the PIN diode anode (input) and cathode (output) elec-
Ordering Information 2
Part Number
trical terminals, especially with respect to RF
per-
Package
formance. The chip is fabricated using M/A-COM
Technology Solutions patented HMIC™ process and
MASW-001150-13160W
WAFFLE PACK
features silicon
pedestals embedded in a low loss,
MASW-001150-13160P
POCKET TAPE
low dispersion glass for low leakage current. The top-
side is fully encapsulated with silicon nitride and has
an additional polymer layer to protect against damage
during handling and assembly.
2. Reference Application Note M513 for reel size information.
Absolute Maximum Ratings
Parameter
Absolute Maximum
Applications
Forward Current
100mA
- 180V
This PIN diode series-shunt switch element is
particularly advantageous in high average power,
50W, switch applications from 30MHZ – 3GHz. The
backside RF, D.C., and thermal I/O ports allow for
direct solder re-flow, surface mount, attachment to a
micro-strip circuit assembly. The thermal terminal
design provides the, power dissipating, series diode a
direct connection to the circuit thermal ground for
unprecedented heat transfer. The thermal terminal
port is electrically isolated from the I/O ports and can
be configured as either a reflective or an absorptive
switch.
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated RF & DC Power
RF C.W. Incident Power
Mounting Temperature
-55°C to +125°C
-55°C to +150°C
+175°C
500MHz, 4W
500MHz, 50W
+260°C for 30 seconds
Class 1A — HBM
Class M3 — MM
ESD
ESD
ESD
Class C3 — CDM
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
Electrical Specifications @ TAMB = +25°C
Symbol
Parameter
Conditions
Units
Typical
Maximum
CT Series
CT Series
CT Shunt
CT Shunt
RS Series
RS Series
Total Capacitance
Total Capacitance
Total Capacitance
Total Capacitance
Series Resistance
Series Resistance
-25V ,30MHz
pF
pF
pF
pF
0.52
0.37
0.54
0.39
1.13
1.25
—
—
—
—
—
—
-25V, 1800MHz
-25V, 30MHz
-25V, 1800MHz
20mA, 30MHz
20mA,1800MHz
RS Series
Series Resistance
50mA, 30MHz
0.93
—
RS Series
RS Shunt
RS Shunt
Series Resistance
Series Resistance
Series Resistance
50mA,1800MHz
10mA, 30MHz
1.07
1.00
0.99
—
—
—
V
10mA, 1800MHz
Forward Voltage
Forward Voltage
20mA
50mA
0.82
0.88
—
0.85
0.90
-10.0
—
V
V
F
V
µA
F
Reverse Leakage Current
Thermal Resistance
Minority Carrier Lifetime
-180V
I
R
Steady State
°C/W
µs
36.0
8.5
R
qJL
1
L
—
T
I
/I
-
F 10mA R 6mA
1. Measured from 50% of control voltage to 90% of output voltage
Parameter Units Port 1 Port 2
Conditions
Minimum Typical
Maximum
-25V
-25V
-25V
-25V
- 50mA
- 50mA
- 50mA
- 50mA
45MHz
—
—
—
36
0.07
0.30
0.60
39
0.10
0.45
0.80
—
Insertion Loss
Return Loss
dB
dB
1000MHZ
2500MHz
45MHz
-25V
-25V
-25V
- 50mA
- 50mA
+ 50mA
1000MHZ
2500MHz
45MHz
18
11
60
20
13
63
—
—
—
-25V
-25V
+ 50mA
+ 50mA
1000MHZ
2500MHz
40
29
42
33
—
—
Isolation
Input IP3
dB
-50mA / -25V
F1 = 500MHz
F2 = 505MHz
PIN = +40dBm(each
tone)
—
dBm
-25V
- 50mA
+66
—
50mA / -25V
500MHz /+35dBm
2nd Harmonic
3rd Harmonic
dBc
dBc
-25V
-25V
- 50mA
- 50mA
—
—
-46
-60
—
—
50mA / -25V
500MHz /+35dBm
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
Typical RF Small Signal Performance
MASW-001150-13160
Insertion Loss, Isolation, Return Loss From 45-3000 MHz
Isolation_+5mA
Return loss_-50 mA
Insertion Loss_-50mA
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
0
-10
-20
-30
-40
-50
-60
-70
-80
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
MASW-001150-13160W
Configured as an Absorptive High Power SPST Switch
Note:
The bias circuits provided in the schematic above assumes current sources are available. If only voltage
sources are available, a resistor will need to be added to the RF Input (J1) Bias Return Network. When using a
D.C. voltage of 25V, a 500Ω resistor must be used to draw 50mA of current into the switch.
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
MASW-001150-13160W
Configured as a Reflective SPST Switch
Note:
The bias circuits provided in the schematic above assumes current sources are available. If only voltage
sources are available, a resistor will need to be added to the RF Input (J1) Bias Return Network. When using a
D.C. voltage of 25V, a 500Ω resistor must be used to draw 50mA of current into the switch.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
RF , DC, and Thermal Circuit Footprint ( Topview )
22 +0/-2 mil
(4) PL
RF Output
Trace
Direction
RF Input
Trace
Direction
22 +0/-2 mil
(4) PL
RF Input
RF Output
20 ±1 mil
(4) PL
Thermal
Terminal
Shunt
Cathode
Return
Thermal
Circuit Vias
D.C Ground
or RF Trace
Direction
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
Chip Outline and Port Designations
Top View
Dimension
Inches
Millimeters
min.
max.
min.
max.
1.71
1.71
A
B
C
D
E
F
0.0665
0.0665
0.0045
0.0195
0.0195
0.0195
0.0195
0.0673
0.0673
0.0053
0.0205
0.0205
0.0205
0.0205
1.69
1.69
0.115
0.495
0.495
0.495
0.495
0.135
0.520
0.520
0.520
0.520
G
Ports
Function
RF Input
1
Thermal Terminal for Series Diode
(Electrically isolated from other ports)
2
3
4
Shunt Diode (Cathode Return)
RF Output / D.C. bias
Notes:
Backside Metal: 2.5μm thick Au
Hatched yellow areas are I/O ports (die solder pads)
Bottom View
Ordering Information
Part Number
Packaging
Waffle Tray
Pocket Tape
MASW-001150-13160W
MASW-001150-13160P
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
Component
C1, C2
Value
0.01μF
100pF
390nH
Case Size
0402
Manufacturer
Murata
C3, C4
L1, L2, L3, L4
0402
0603
Murata
Coilcraft
Ordering Information for Test Board
Part Number
MASW-001150-001SMB
8
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-001150-1316
SURMOUNT PIN Diode Switch Element
with Thermal Terminal
V5
Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard or soft substrates. The use of
60Pb/40Sn, 80Au/20Sn or any RoHS lead-free solder is recommended to achieve the lowest series resistance
and optimum heat sink. The thermal terminal is not electrically conductive and may be soldered directly to any
appropriate heat sink without affecting RF performance.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. When soldering, position the
die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. All mounting pads should be heated simultaneously so that the solder under the pads flows evenly and at the
same time. Avoid soldering the pads one at a time as doing so may produce non-uniform heat flow which
potentially could create thermal stress to the chip.
Die should be uniformly heated in a re-flow oven and not by causing heat to flow directly through the top surface
of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through
the top surface of the die to ensure proper solder flow and attachment. A typical soldering process profile and
handling instructions are provided in Application Notes, M538 Surface Mounting Instructions and M541
Bonding and Handling Procedures on the MA/COM Technology Solutions website at www.macomtech.com
Conductive silver epoxy may also be used for die attachment in lower Incident power applications where the
average power is <1W. Apply a thin controlled amount, approximately 1- 2 mils thick, to minimize ohmic and
thermal stresses and maximize heat transfer. Take care not to bridge the gap between the chip pads with epoxy.
A thin epoxy fillet should be visible around the perimeter of the pads after placement to ensure full coverage. Cure
epoxy per manufacturer’s recommended schedule. Typically 150°C for one hour.
9
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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