70-W224NIA400SH-M400P [VINCOTECH]
Easy paralleling;High speed switching;Low switching losses;型号: | 70-W224NIA400SH-M400P |
厂家: | VINCOTECH |
描述: | Easy paralleling;High speed switching;Low switching losses |
文件: | 总32页 (文件大小:2767K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
70ꢀW224NIA400SHꢀM400P
datasheet
VINcoNPC X4
1500 V / 400 A
Features
VINco X4 housing
●
1500 V NPCꢀtopology
● High power screw interface
● Low inductive interface for external DCꢀcapacitors
and paralleling on component level
● Snubber diode for optional asymmetrical inductance
● High speed buck IGBT´s
● Temperature sensor
Target Applications
Schematic
● UPS
● Solar Inverters
Types
● 70ꢀW224NIA400SHꢀM400P
Maximum Ratings
T j = 25 °C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Buck Switch
V CE
I C
Collectorꢀemitter break down voltage
DC collector current
1200
326
V
A
T j = T jmax
T s = 80 °C
I CRM
t p limited by T jmax
V CE ≤ 1200 V, T j ≤ T op
T j = T jmax
Pulsed collector current
Turn off safe operating area
Power dissipation
1200
800
A
A
max
P tot
V GE
T s = 80 °C
881
W
V
Gateꢀemitter peak voltage
Short circuit ratings
±20
t SC
T j ≤ 150 °C
V GE = 15 V
10
µs
V
V CC
800
T jmax
Maximum Junction Temperature
175
°C
Buck Diode
V RRM
I F
Peak Repetitive Reverse Voltage
DC forward current
1200
270
800
565
175
V
A
T j = T jmax
T s = 80 °C
T s = 80 °C
I FRM
P tot
T jmax
t p = 10 ms, sin 180°
T j = T jmax
Repetitive peak forward current
Power dissipation
A
W
°C
Maximum Junction Temperature
copyright Vincotech
1
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Maximum Ratings
T j = 25 °C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Boost Switch
V CE
I C
Collectorꢀemitter break down voltage
DC collector current
1200
348
V
A
T j = T jmax
T s = 80 °C
I CRM
t p limited by T jmax
V CE ≤ 1200 V, T j ≤ T op
T j = T jmax
Pulsed collector current
Turn off safe operating area
Power dissipation
1200
800
A
A
max
P tot
V GE
T s = 80 °C
826
W
V
Gateꢀemitter peak voltage
Short circuit ratings
±20
t SC
T j ≤ 150 °C
V GE = 15 V
10
µs
V
V CC
800
T jmax
Maximum Junction Temperature
175
°C
Boost Inverse Diode
Peak Repetitive Reverse Voltage
DC forward current
V RRM
I F
I FRM
P tot
1200
242
600
423
175
V
A
T j = T jmax
T s = 80 °C
T s = 80 °C
t p limited by T jmax
T j = T jmax
Repetitive peak forward current
Power dissipation
A
W
°C
T jmax
Maximum Junction Temperature
Boost Diode
V RRM
I F
Peak Repetitive Reverse Voltage
DC forward current
1200
257
600
452
175
V
A
T j = T jmax
T s = 80 °C
T s = 80 °C
I FRM
P tot
T jmax
t p limited by T jmax
T j = T jmax
Repetitive peak forward current
Power dissipation
A
W
°C
Maximum Junction Temperature
copyright Vincotech
2
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Maximum Ratings
T j = 25 °C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Snubber Diode
V RRM
I FAV
I FSM
Repetitive peak reverse voltage
Forward average current
Surge forward current
I 2tꢀvalue
1200
90
V
A
A
T j = T jmax
T s = 80 °C
T j = 150 °C
T s = 80 °C
540
730
162
175
t p = 10 ms, sin 180°
T j = T jmax
I 2t
A2s
W
P tot
Power dissipation
T jmax
Maximum Junction Temperature
°C
Thermal Properties
T stg
T op
Storage temperature
ꢀ40…+125
°C
°C
Operation temperature under switching condition
ꢀ40…+(T jmax ꢀ 25)
Insulation Properties
t p = 2 s
DC Test Volage*
AC Voltage
4000
2500
V
V isol
Insulation voltage
t p = 1 min
V
Creepage distance
Clearance
min 12,7
min 12,7
>200
mm
mm
Comparative Tracking Index
*100 % tested in production
CTI
copyright Vincotech
3
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
V r [V]
V GE [V]
I C [A]
I F [A]
I D [A]
V CE [V]
T j [°C]
Min
Max
V GS [V]
V DS [V]
Buck Switch
V GE(th) V CE = V GE
Gate emitter threshold voltage
Collectorꢀemitter saturation voltage
Collectorꢀemitter cutꢀoff current incl. Diode
Gateꢀemitter leakage current
Integrated Gate resistor
Turnꢀon delay time
0,0136
400
25
5,2
1,7
5,8
6,4
V
V
25
125
2,14
2,44
V CEsat
I CES
I GES
R gint
t d(on)
t r
15
0
1200
0
25
0,048
960
mA
nA
ꢁ
20
25
0,5
25
125
25
125
25
125
25
125
25
125
25
171
172
24
Rise time
29
ns
238
290
21
t d(off)
Turnꢀoff delay time
R goff = 1 ꢁ
±15
600
398
R gon = 1 ꢁ
t f
Fall time
38
9,03
14,33
13,20
21,33
E on
E off
C ies
Turnꢀon energy loss per pulse
Turnꢀoff energy loss per pulse
Input capacitance
mWs
pF
125
22160
1520
1280
3040
C oss
C rss
Q G
Output capacitance
f = 1 MHz
0
25
25
25
Reverse transfer capacitance
Gate charge
15
960
400
400
398
nC
phaseꢀchange
R th(j-s) material
Thermal resistance chip to heatsink
0,105
K/W
λ = 3,4 W/mK
Buck Diode
25
125
2,34
2,38
V F
I R
Diode forward voltage
V
µA
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
1200
600
25
480
25
125
25
125
25
125
25
125
25
125
506
624
86
I RRM
t rr
A
ns
117
34,86
57,89
14614
15212
15,14
26,14
Q rr
R gon=1 ꢁ
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovered energy
±15
µC
( di rf/dt )max
A/µs
mWs
E rec
phaseꢀchange
R th(j-s) material
Thermal resistance chip to heatsink
0,163
K/W
λ = 3,4 W/mK
copyright Vincotech
4
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
V r [V]
V GE [V]
I C [A]
I F [A]
I D [A]
V CE [V]
T j [°C]
Min
Max
V GS [V]
V DS [V]
Boost Switch
V GE(th)
V CEsat
I CES
I GES
R gint
t d(on)
t r
V CE = V GE
Gate emitter threshold voltage
Collectorꢀemitter saturation voltage
Collectorꢀemitter cutꢀoff incl diode
Gateꢀemitter leakage current
Integrated Gate resistor
Turnꢀon delay time
0,0152
400
25
5
5,80
6,5
V
V
25
125
25
1,91
2,14
15
0
1200
0
0,052
2400
mA
nA
ꢁ
125
20
25
1,875
25
125
25
125
25
125
25
125
25
125
25
233
242
44
Rise time
49
ns
334
405
43
t d(off)
t f
Turnꢀoff delay time
R goff = 1 ꢁ
R gon = 1 ꢁ
±15
600
398
Fall time
99
15,2
21,5
24,2
37,6
E on
Turnꢀon energy loss per pulse
Turnꢀoff energy loss per pulse
Input capacitance
mWs
pF
E off
C ies
C oss
C rss
Q G
125
24600
1620
1380
3200
Output capacitance
f = 1 MHz
0
25
398
400
25
25
Reverse transfer capacitance
Gate charge
±15
960
nC
phaseꢀchange
R th(j-s) material
Thermal resistance chip to heatsink
0,112
K/W
λ = 3,4 W/mK
Boost Inverse Diode
Diode forward voltage
Reverse leakage current
25
125
1,35
1,90
1,84
V F
I r
300
V
1200
25
56
µA
phaseꢀchange
R th(j-s) material
λ = 3,4 W/mK
Thermal resistance chip to heatsink
0,204
K/W
Boost Diode
25
125
1,35
1,90
1,84
V F
I r
Diode forward voltage
300
398
V
ꢂA
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
1200
600
25
56
25
125
25
125
25
125
25
125
125
125
368
403
251
341
34
I RRM
t rr
A
ns
Q rr
R gon = 1 ꢁ
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovery energy
±15
µC
59
3292
3343
13,60
24,53
( di rf/dt )max
A/µs
mWs
E rec
phaseꢀchange
R th(j-s) material
Thermal resistance chip to heatsink
0,204
K/W
λ = 3,4 W/mK
copyright Vincotech
5
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
V r [V]
V GE [V]
I C [A]
I F [A]
I D [A]
V CE [V]
T j [°C]
Min
Max
V GS [V]
V DS [V]
Snubber Diode
Forward voltage
Reverse current
25
125
1,91
1,85
V F
I r
100
V
1200
25
0,12
mA
phaseꢀchange
R th(j-s) material
λ = 3,4 W/mK
Thermal resistance chip to heatsink
0,588
22
K/W
Thermistor
R
ΔR/R
P
Rated resistance
Deviation of R 100
25
100
25
25
25
25
kꢁ
%
R 100 = 1484 ꢁ
ꢀ5
+5
5
Power dissipation
Power dissipation constant
Bꢀvalue
mW
mW/K
K
1,5
B (25/50)
Tol. ±1%
Tol. ±1%
3962
4000
B (25/100)
Bꢀvalue
K
I
Vincotech NTC Reference
Module Properties
Buck
15
28
L sCE C-PCB
Module inductance (from chips to PCB)
nH
nH
Boost
Module inductance (from PCB to PCB
using Intercon board)
L sCE PCB-PCB
5
Resistance of Intercon boards
(from PCB to PCB using Intercon board)
R cc'1+EE'
1,5
mΩ
g
G
Weight
580
copyright Vincotech
6
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Buck
Buck IGBT and Buck FWD
figure 1.
Typical output characteristics
IGBT
figure 2.
Typical output characteristics
IGBT
I C = f(V CE
)
I C = f(V CE)
1000
1000
800
600
400
200
800
600
400
200
0
0
0
0
1
2
3
4
5
1
2
3
4
5
V CE (V)
V CE (V)
At
At
t p
T j
=
=
t p
T j
=
=
350
25
ꢂs
350
125
ꢂs
°C
°C
V GE from
V GE from
7 V to 17 V in steps of 1 V
7 V to 17 V in steps of 1 V
figure 3.
Typical transfer characteristics
IGBT
figure 4.
FWD
Typical FWD forward current as
a function of forward voltage
I C = f(V GE
)
I F = f(V F
)
350
300
250
200
150
100
50
1000
800
600
400
200
Tj = 125°C
Tj = 125°C
Tj = 25°C
Tj = 25°C
0
0
0
0
2
4
6
8
10
12
1
2
3
4
V GE (V)
V F (V)
At
At
t p
=
t p =
350
10
ꢂs
350
ꢂs
V CE
=
V
copyright Vincotech
7
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Buck
Buck IGBT and Buck FWD
figure 5.
IGBT
figure 6.
IGBT
Typical switching energy losses
as a function of collector current
Typical switching energy losses
as a function of gate resistor
E = f(I C
)
E = f(R G)
50
140
Eoff High T
120
100
80
Eon High T
40
30
20
10
Eon Low T
Eon High T
Eoff Low T
60
Eon Low T
40
Eoff High T
Eoff Low T
20
0
0
0
0
200
400
600
800
1000
2
4
6
8
10
I C(A)
R G ( Ω)
With an inductive load at
With an inductive load at
T j
=
T j =
°C
V
V
J
°C
V
25/125
600
±15
1
25/125
600
V CE
=
=
V CE
V GE
=
=
V GE
R gon
R goff
±15
V
=
I C =
398
A
=
1
J
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery energy loss
as a function of collector current
Typical reverse recovery energy loss
as a function of gate resistor
E rec = f(I c
)
E rec = f(R G)
40
40
Erec High T
32
24
16
8
32
24
16
8
Erec Low T
Erec High T
Erec Low T
0
0
0
0
2
4
6
8
10
200
400
600
800
1000
I C(A)
R G ( Ω)
With an inductive load at
With an inductive load at
T j
=
T j =
25/125
600
°C
V
25/125
600
°C
V
V CE
V GE
R gon
=
=
V CE
V GE
=
=
±15
V
±15
V
=
I C =
1,0
J
398
A
copyright Vincotech
8
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Buck
Buck IGBT and Buck FWD
figure 9.
IGBT
figure 10.
IGBT
Typical switching times as a
function of collector current
Typical switching times as a
function of gate resistor
t = f(I C
)
t = f(R G)
1,00
1,00
tdoff
tdon
tdoff
tdon
tr
0,10
0,10
tf
tf
tr
0,01
0,01
0,00
0
0,00
0
2
4
6
8
10
200
400
600
800
1000
R G ( Ω)
I C(A)
With an inductive load at
With an inductive load at
T j
=
T j =
125
600
±15
1
°C
V
V
J
125
600
±15
398
°C
V
V CE
V GE
=
=
V CE
V GE
=
=
V
R gon
R goff
=
=
I C =
A
1
J
figure 11.
FWD
figure 12.
Typical reverse recovery time as a
function of IGBT turn on gate resistor
FWD
Typical reverse recovery time as a
function of collector current
t rr = f(I c
)
t rr = f(R gon)
0,2
1,0
trr High T
0,8
0,6
0,4
0,2
0,2
0,1
0,1
0,0
trr High T
trr Low T
trr Low T
0,0
0
0,0
0
2
4
6
8
10
R gon( Ω)
200
400
600
800
1000
I C(A)
At
At
T j
=
T j =
V R =
I F =
25/125
600
°C
V
25/125
600
°C
V
V CE
V GE
=
=
±15
V
398
A
R gon
=
V GE =
1,0
J
±15
V
copyright Vincotech
9
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Buck
Buck IGBT and Buck FWD
figure 13.
FWD
figure 14.
FWD
Typical reverse recovery charge as a
function of collector current
Typical reverse recovery charge as a
function of IGBT turn on gate resistor
Q rr = f(I C
)
Q rr = f(R gon)
100
100
Qrr High T
80
60
40
20
80
60
40
20
Qrr Low T
Qrr High T
Qrr Low T
0
0
0
0
200
400
600
800
1000
2
4
6
8
10
I C(A)
R gon( Ω)
At
At
T j
=
T j =
V R =
I F =
25/125
600
°C
V
25/125
600
°C
V
V CE
V GE
=
=
±15
V
398
A
R gon
=
V GE =
1,0
J
±15
V
figure 15.
FWD
figure 16.
FWD
Typical reverse recovery current as a
function of collector current
Typical reverse recovery current as a
function of IGBT turn on gate resistor
I RRM = f(I C
)
I RRM = f(R gon)
1000
1000
800
600
400
200
800
600
400
200
IRRM High T
IRRM Low T
IRRM High T
IRRM Low T
0
0
0
0
2
4
6
8
10
200
400
600
800
1000
I C(A)
R gon( Ω)
At
At
T j
=
T j =
V R =
I F =
25/125
600
°C
V
25/125
600
°C
V
V CE
V GE
=
=
±15
V
398
A
R gon
=
V GE =
1,0
J
±15
V
copyright Vincotech
10
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Buck
Buck IGBT and Buck FWD
figure 17.
FWD
figure 18.
FWD
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI 0/dt ,dI rec/dt = f(I c
)
dI 0/dt ,dI rec/dt = f(R gon
)
20000
28000
dIrec/dt T
dI0/dt T
dIo/dt T
dIrec/dt T
24000
20000
16000
12000
8000
4000
0
16000
12000
8000
4000
0
0
200
400
600
800
1000
0
2
4
6
8
10
I C(A)
R gon( Ω)
At
T j
At
T j
=
=
=
2
5
/
1
2
5
°C
V
2
5
/
1
2
5
°C
V
V CE
V GE
=
=
V R
600
600
398
I F
=
±15
1,0
V
A
R gon
=
V GE
=
J
±15
V
figure 19.
IGBT
figure 20.
FWD
IGBT transient thermal impedance
as a function of pulse width
FWD transient thermal impedance
as a function of pulse width
Z th(j-s) = f(t p
)
Z th(j-s) = f(t p)
100
100
10-1
10-1
D = 0,5
0,2
D = 0,5
10-2
10-2
0,2
0,1
0,1
0,05
0,02
0,01
0,005
0,000
0,05
0,02
0,01
0,005
0,000
10-3
10-5
10-3
10-5
t p (s)
t p (s)
10-4
10-3
10-2
10-1
100
101
10-4
10-3
10-2
10-1
100
101
At
At
t p / T
t p / T
D =
D =
R th(j-s)
=
R th(j-s) =
0,105
K/W
0,163
K/W
IGBT thermal model values
With thermal grease With phase change material
(K/W) Tau (s) (K/W) Tau (s)
FWD thermal model values
With thermal grease With phase change material
(K/W) Tau (s) (K/W) Tau (s)
R
R
R
R
1,07Eꢀ02 5,24E+00
3,45Eꢀ02 1,19E+00
2,47Eꢀ02 2,95Eꢀ01
2,81Eꢀ02 3,03Eꢀ02
6,37Eꢀ03 7,56Eꢀ03
3,43Eꢀ03 7,59Eꢀ04
1,04Eꢀ02 5,24E+00
3,34Eꢀ02 1,19E+00
2,40Eꢀ02 2,95Eꢀ01
2,73Eꢀ02 3,03Eꢀ02
6,18Eꢀ03 7,56Eꢀ03
3,33Eꢀ03 7,59Eꢀ04
1,83Eꢀ02 7,43E+00
3,13Eꢀ02 1,59E+00
3,19Eꢀ02 2,90Eꢀ01
4,29Eꢀ02 6,32Eꢀ02
3,32Eꢀ02 2,05Eꢀ02
1,04Eꢀ02 1,83Eꢀ03
1,77Eꢀ02 7,43E+00
3,03Eꢀ02 1,59E+00
3,09Eꢀ02 2,90Eꢀ01
4,17Eꢀ02 6,32Eꢀ02
3,22Eꢀ02 2,05Eꢀ02
1,01Eꢀ02 1,83Eꢀ03
copyright Vincotech
11
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Buck
Buck IGBT and Buck FWD
figure 21.
IGBT
figure 22.
IGBT
Power dissipation as a
function of heatsink temperature
Collector current as a
function of heatsink temperature
P tot = f(T s
)
I C = f(T s)
1800
500
400
300
200
100
1200
600
0
0
0
0
o C)
T s (
o C)
50
100
150
200
50
100
150
200
T s
(
At
At
T j
=
T j
=
175
°C
175
15
°C
V
V GE
=
figure 23.
Power dissipation as a
function of heatsink temperature
FWD
figure 24.
Forward current as a
function of heatsink temperature
FWD
P tot = f(T s
)
I F = f(T s)
1200
500
1000
800
600
400
200
400
300
200
100
0
0
0
0
o C)
T s (
o C)
50
100
150
200
50
100
150
200
T s
(
At
At
T j
=
T j =
175
°C
175
°C
copyright Vincotech
12
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Buck
Buck IGBT and Buck FWD
figure 25.
IGBT
figure 26.
Gate voltage vs Gate charge
IGBT
Safe operating area as a function
of collectorꢀemitter voltage
I C = f(V CE
)
V GE = f(Q g)
17,5
15
12,5
10
103
10uS
240 V
102
100uS
960 V
1mS
101
7,5
5
10mS
100
100mS
DC
2,5
10-1
0
0
400
800
1200
1600
2000
102
103
Q g (nC)
101
100
V CE(V)
At
At
D =
I C
=
400
A
single pulse
T s
V GE
T j
=
80
±15
T jmax
ºC
V
=
=
figure 27.
Reverse bias safe operating area
IGBT
I C = f(V CE
)
1000
IC MAX
800
600
400
200
0
0
200
400
600
800
1000
1200
1400
V CE(V)
At
U ccminus
= U ccplus
Switching mode :
3 level switching
copyright Vincotech
13
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Boost
Boost IGBT and Boost FWD
figure 1.
IGBT
figure 2.
Typical output characteristics
IGBT
Typical output characteristics
I C = f(V CE
)
I C = f(V CE)
1000
1000
800
600
400
200
800
600
400
200
0
0
0
0
1
2
3
4
5
1
2
3
4
5
V CE (V)
V CE (V)
At
At
t p
T j
=
=
t p
T j
=
=
350
25
ꢂs
°C
350
125
ꢂs
°C
V GE from
V GE from
7 V to 17 V in steps of 1 V
7 V to 17 V in steps of 1 V
figure 3.
Typical transfer characteristics
IGBT
figure 4.
FWD
Typical FWD forward current as
a function of forward voltage
I C = f(V GE
)
I F = f(V F
)
400
350
300
250
200
150
100
50
1000
800
600
400
200
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
0
0
0
0
2
4
6
8
10
12
1
2
3
4
V GE (V)
V F (V)
At
At
t p
=
t p =
350
10
ꢂs
350
ꢂs
V CE
=
V
copyright Vincotech
14
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Boost
Boost IGBT and Boost FWD
figure 5.
IGBT
figure 6.
IGBT
Typical switching energy losses
as a function of collector current
Typical switching energy losses
as a function of gate resistor
E = f(I C
)
E = f(R G)
100
100
Eon High T
80
60
40
20
80
60
40
20
Eon Low T
Eoff High T
Eoff Low T
Eon High T
Eoff High T
Eon Low T
Eoff Low T
0
0
0
0
2
4
6
8
10
R G ( Ω )
I C(A)
200
400
600
800
1000
With an inductive load at
With an inductive load at
T j
=
T j =
25/125
600
°C
V
V
J
25/125
600
°C
V
V CE
=
=
V CE
V GE
=
=
V GE
R gon
R goff
±15
1,0
±15
V
=
I C =
398
A
=
1,0
J
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery energy loss
as a function of collector current
Typical reverse recovery energy loss
as a function of gate resistor
E rec = f(I c
)
E rec = f(R G)
40
40
Erec High T
30
20
10
30
20
10
Erec Low T
Erec High T
Erec Low T
0
0
0
0
2
4
6
8
10
200
400
600
800
1000
R G
(
Ω
)
I C (A)
With an inductive load at
With an inductive load at
T j
=
T j =
25/125
600
°C
V
25/125
600
°C
V
V CE
V GE
R gon
=
=
V CE
V GE
=
=
±15
V
±15
V
=
I C =
1,0
J
398
A
copyright Vincotech
15
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Boost
Boost IGBT and Boost FWD
figure 9.
IGBT
figure 10.
IGBT
Typical switching times as a
function of collector current
Typical switching times as a
function of gate resistor
t = f(I C
)
t = f(R G)
1
1
tdoff
tdon
tdoff
tdon
tf
tr
tr
tf
0,1
0,1
0,01
0,01
0,001
0,001
0
0
2
4
6
8
10
200
400
600
800
1000
I C(A)
R G ( Ω )
With an inductive load at
With an inductive load at
T j
=
T j =
125
600
±15
1,0
°C
V
V
J
125
600
±15
398
°C
V
V CE
V GE
=
=
V CE
V GE
=
=
V
R gon
R goff
=
=
I C =
A
1,0
J
figure 11.
FWD
figure 12.
Typical reverse recovery time as a
function of IGBT turn on gate resistor
FWD
Typical reverse recovery time as a
function of collector current
t rr = f(I c
)
t rr = f(R gon)
0,8
0,8
µ
µ
µ
µ
µ
µ
µ
µ
trr High T
0,6
0,4
0,2
0,0
0,6
0,4
0,2
0
trr High T
trr Low T
trr Low T
0
2
4
6
8
10
0
200
400
600
800
1000
I C(A)
R gon( Ω)
At
T j
At
T j
=
=
=
25/125
600
°C
V
25/125
600
°C
V
V CE
V GE
=
=
V R
I F
=
±15
V
398
A
R gon
=
V GE =
1,0
J
±15
V
copyright Vincotech
16
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Boost
Boost IGBT and Boost FWD
figure 13.
FWD
figure 14.
FWD
Typical reverse recovery charge as a
function of collector current
Typical reverse recovery charge as a
function of IGBT turn on gate resistor
Q rr = f(I C
)
Q rr = f(R gon)
100
100
µ
µ
µ
µ
µ
µ
µ
µ
Qrr High T
80
60
40
20
0
80
60
40
20
0
Qrr High T
Qrr Low T
Qrr Low T
0
2
4
6
8
10
0
200
400
600
800
1000
I C(A)
R gon( Ω)
At
T j
At
T j
=
=
=
25/125
600
°C
V
25/125
600
°C
V
V CE
V GE
R gon
=
V R
=
I F
=
±15
V
398
A
=
V GE
=
1,0
J
±15
V
figure 15.
FWD
figure 16.
FWD
Typical reverse recovery current as a
function of collector current
Typical reverse recovery current as a
function of IGBT turn on gate resistor
I RRM = f(I C
)
I RRM = f(R gon)
500
500
IRRM High T
IRRM Low T
400
300
200
100
400
300
200
100
IRRM High T
IRRM Low T
0
0
0
0
2
4
6
8
10
200
400
600
800
1000
I C(A)
R gon( Ω)
At
At
T j
=
T j =
V R =
I F =
25/125
600
°C
V
25/125
600
°C
V
V CE
V GE
=
=
±15
V
398
A
R gon
=
V GE =
1,0
J
±15
V
copyright Vincotech
17
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Boost
Boost IGBT and Boost FWD
figure 17.
FWD
figure 18.
FWD
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI 0/dt ,dI rec/dt = f(I c
)
dI 0/dt ,dI rec/dt = f(R gon
)
15000
15000
dI0/dt T
dIrec/dt T
di0/dt T
dIrec/dt T
12000
12000
9000
6000
3000
0
9000
6000
3000
0
0
200
400
600
800
1000
0
2
4
6
8
10
I C(A)
R gon( Ω)
At
T j
At
T j
=
=
=
2
5
/
1
2
5
°C
V
2
5
/
1
2
5
°C
V
V CE
V GE
=
=
V R
600
600
398
I F
=
±15
1,0
V
A
R gon
=
V GE
=
J
±15
V
figure 19.
IGBT
figure 20.
FWD
IGBT transient thermal impedance
as a function of pulse width
FWD transient thermal impedance
as a function of pulse width
Z th(j-s) = f(t p
)
Z th(j-s) = f(t p)
100
100
10-1
10-1
D = 0,5
D = 0,5
0,2
0,2
0,1
10-2
10-2
0,1
0,05
0,02
0,01
0,005
0,000
0,05
0,02
0,01
0,005
0,000
10-3
10-5
10-3
10-5
10-4
10-3
10-2
10-1
100
101 10
10-4
10-3
10-2
10-1
100
101 10
t p (s)
t p (s)
At
At
t p / T
t p / T
D =
D =
R th(j-s)
=
R th(j-s) =
0,112
K/W
0,074
0,204
K/W
0,135
IGBT thermal model values
With thermal grease With phase change material
(K/W) Tau (s) (K/W) Tau (s)
FWD thermal model values
With thermal grease With phase change material
(K/W) Tau (s) (K/W) Tau (s)
R
R
R
R
1,19Eꢀ02 6,35E+00
4,76Eꢀ02 1,77E+00
2,06Eꢀ02 3,94Eꢀ01
1,32Eꢀ02 8,72Eꢀ02
2,00Eꢀ02 1,94Eꢀ02
1,78Eꢀ03 2,24Eꢀ03
1,16Eꢀ02 6,35E+00
4,61Eꢀ02 1,77E+00
2,00Eꢀ02 3,94Eꢀ01
1,28Eꢀ02 8,72Eꢀ02
1,94Eꢀ02 1,94Eꢀ02
1,72Eꢀ03 2,24Eꢀ03
2,09Eꢀ02 5,24E+00
6,72Eꢀ02 1,19E+00
4,82Eꢀ02 2,95Eꢀ01
5,49Eꢀ02 3,03Eꢀ02
1,24Eꢀ02 7,56Eꢀ03
6,70Eꢀ03 7,59Eꢀ04
2,03Eꢀ02 5,24E+00
6,52Eꢀ02 1,19E+00
4,67Eꢀ02 2,95Eꢀ01
5,32Eꢀ02 3,03Eꢀ02
1,20Eꢀ02 7,56Eꢀ03
6,49Eꢀ03 7,59Eꢀ04
copyright Vincotech
18
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Boost
Boost IGBT and Boost FWD
figure 21.
IGBT
figure 22.
IGBT
Power dissipation as a
function of heatsink temperature
Collector current as a
function of heatsink temperature
P tot = f(T s
)
I C = f(T s)
1800
500
1500
1200
900
400
300
200
100
600
300
0
0
0
0
50
100
150
200
50
100
150
200
T s
(
o C)
T s(
o C)
At
At
T j
=
T j
=
175
ºC
175
15
ºC
V
V GE
=
figure 23.
Power dissipation as a
function of heatsink temperature
FWD
figure 24.
Forward current as a
function of heatsink temperature
FWD
P tot = f(T s
)
I F = f(T s)
1200
500
1050
900
750
600
450
300
150
400
300
200
100
0
0
0
0
50
100
150
200
50
100
150
200
T s
(
o C)
T s (
o C)
At
At
T j
=
T j =
175
ºC
175
ºC
copyright Vincotech
19
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Boost
Boost IGBT
figure 25.
IGBT
Reverse bias safe operating area
I C = f(V CE
)
1000
IC MAX
800
600
400
200
0
0
200
400
600
800
1000
1200
1400
V CE (V)
At
U ccminus
L s
=
U ccplus
=
12
nH
3 level switching
Switching mode :
copyright Vincotech
20
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Boost Inverse Diode
figure 25.
Boost Inverse Diode
figure 26.
Boost Inverse Diode
Typical FWD forward current as
a function of forward voltage
FWD transient thermal impedance
as a function of pulse width
I F = f(V F
)
Z th(j-s) = f(t p)
100
1000
800
600
400
200
10-1
D = 0,5
0,2
10-2
0,1
0,05
0,02
0,01
0,005
0,000
Tj = Tjmax-25°C
Tj = 25°C
0
0
10-3
10-5
1
2
3
4
V F (V)
t p (s)
10-4
10-3
10-2
10-1
102
100
101
At
At
t p
=
t p / T
250
ꢂs
D =
R th(j-s)
=
0,204
K/W
figure 27.
Power dissipation as a
function of heatsink temperature
Boost Inverse Diode
figure 28.
Forward current as a
function of heatsink temperature
Boost Inverse Diode
P tot = f(T s
)
I F = f(T s)
2000
450
400
350
300
250
200
150
100
50
1600
1200
800
400
0
0
0
0
50
100
150
200
50
100
150
200
T s
(
o C)
T s (
o C)
At
At
T j
=
T j =
175
ºC
175
ºC
copyright Vincotech
21
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Snubber Diode
figure 1.
Snubber Diode
figure 2.
Snubber Diode
Typical diode forward current as
a function of forward voltage
Diode transient thermal impedance
as a function of pulse width
I F = f(V F
)
Z th(j-s) = f(t p)
100
600
500
400
300
200
100
10-1
Tj = 25°C
D = 0,5
0,2
Tj = Tjmax-25°C
10-2
0,1
0,05
0,02
0,01
0,005
0,000
0
0
10-3
10-5
1
2
3
4
5
10-4
10-3
10-2
10-1
100
101
V F (V)
t p (s)
102
At
At
t p
=
t p / T
250
ꢂs
D =
R th(j-s)
=
0,588
K/W
figure 3.
Power dissipation as a
function of heatsink temperature
Snubber Diode
figure 4.
Forward current as a
function of heatsink temperature
Snubber Diode
P tot = f(T s
)
I F = f(T s)
300
150
250
200
150
100
50
120
90
60
30
0
0
0
0
50
100
150
200
o C)
T s (
o C)
50
100
150
200
T s
(
At
At
T j
=
T j =
175
ºC
175
ºC
copyright Vincotech
22
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Thermistor
figure 1.
Thermistor
Typical NTC characteristic
as a function of temperature
R
= f(T )
NTC-typical temperature characteristic
24000
20000
16000
12000
8000
4000
0
25
50
75
100
125
T (°C)
copyright Vincotech
23
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Switching Definitions Buck
General conditions
T j
=
=
=
125 °C
1 ꢁ
1 ꢁ
R gon
R goff
Test setup inductance: 9 nH
IGBT figure 2.
Turnꢀoff Switching Waveforms & definition of t doff, t Eoff Turnꢀon Switching Waveforms & definition of t don, t Eon
figure 1.
IGBT
(t E off = integrating time for E off
)
(t E on = integrating time for E on)
150
%
300
%
VCE
125
250
200
150
tdoff
IC
100
VGE 90%
VCE 90%
75
VGE
IC
50
VCE
VGE
tEoff
100
25
0
tdon
50
IC 1%
VCE 3%
VGE 10%
IC 10%
tEon
0
-25
-50
-50
3,8
3,95
4,1
4,25
4,4
4,55
-0,3
-0,15
0
0,15
0,3
0,45
0,6
time (µs)
time(µs)
V GE (0%) =
ꢀ15
15
V
V GE (0%) =
ꢀ15
15
V
V GE (100%) =
V C (100%) =
I C (100%) =
V
V GE (100%) =
V C (100%) =
I C (100%) =
V
600
402
0,29
0,45
V
600
402
0,17
0,30
V
A
A
t doff
=
=
ꢂs
ꢂs
t don
=
=
ꢂs
ꢂs
t E off
t E on
figure 3.
IGBT
figure 4.
IGBT
Turnꢀoff Switching Waveforms & definition of t f
Turnꢀon Switching Waveforms & definition of t r
150
%
300
%
Ic
125
250
VCE
fitted
IC
200
100
75
50
25
0
IC 90%
150
IC 60%
VCE
100
IC 90%
tr
IC 40%
50
IC 10%
IC 10%
0
tf
-50
-25
4,1
4,15
4,2
4,25
4,3
4,35
0,1
0,15
0,2
0,25
0,3
0,35
0,4
time(µs)
time(µs)
V C (100%) =
I C (100%) =
600
402
0,04
V
V C (100%) =
I C (100%) =
600
402
0,03
V
A
A
t f
=
ꢂs
t r
=
ꢂs
copyright Vincotech
24
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Switching Definitions Buck
figure 5.
IGBT
figure 6.
IGBT
Turnꢀoff Switching Waveforms & definition of t Eoff
Turnꢀon Switching Waveforms & definition of t Eon
125
125
%
Poff
%
Eoff
Eon
100
75
100
75
Pon
50
50
25
25
IC
1%
VGE 10%
VGE90%
VCE 3%
0
0
tEon
tEoff
-25
-25
3,95
4,05
4,15
4,25
4,35
-0,2
-0,05
0,1
0,25
0,4
0,55
time (µs)
time(µs)
P off (100%) =
E off (100%) =
241,06
21,33
0,45
kW
mJ
ꢂs
P on (100%) =
E on (100%) =
241,06
14,33
0,30
kW
mJ
ꢂs
t E off
=
t E on =
figure 7.
FWD
Turnꢀoff Switching Waveforms & definition of t rr
150
%
Id
100
trr
50
Vd
0
I
10%
RRM
-50
-100
-150
-200
IRRM 90%
IRRM 100%
fitted
4
4,1
4,2
4,3
4,4
4,5
time(µs)
V d (100%) =
I d (100%) =
I RRM (100%) =
600
V
402
A
ꢀ624
0,12
A
t rr
=
ꢂs
copyright Vincotech
25
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Switching Definitions Buck
figure 8.
FWD
figure 10.
FWD
Turnꢀon Switching Waveforms & definition of t Qrr
(t Q rr = integrating time for Q rr)
Turnꢀon Switching Waveforms & definition of t Erec
(t Erec= integrating time for E rec
)
150
200
Prec
Qrr
%
Id
%
100
150
100
tQrr
50
0
Erec
tErec
-50
50
0
-100
-150
-200
-50
4
4,2
4,4
4,6
4,8
5
5,2
5,4
time(µs)
4
4,2
4,4
4,6
4,8
5
5,2
time(µs)
5,4
I d (100%) =
Q rr (100%) =
402
A
P rec (100%) =
E rec (100%) =
241,06
kW
mJ
ꢂs
57,89
1,00
ꢂC
ꢂs
26,14
1,00
t Q rr
=
t E rec =
copyright Vincotech
26
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Switching Definitions Boost
General conditions
T j
=
=
=
125 °C
1 ꢁ
1 ꢁ
R gon
R goff
Test setup inductance: 9 nH
Boost IGBT figure 2.
Turnꢀon Switching Waveforms & definition of t don, t Eon
figure 1.
Boost IGBT
Turnꢀoff Switching Waveforms & definition of t doff, t Eoff
(t E off = integrating time for E off
)
(t E on = integrating time for E on)
150
200
IC
%
%
125
tdoff
150
100
VCE
90%
VGE 90%
VCE
100
75
VGE
IC
tdon
50
50
tEoff
25
VCE 3%
IC 10%
VGE 10%
IC
1%
VCE
0
tEon
0
VGE
0,6
-25
-50
-0,2
0
0,2
0,4
0,8
1
2,7
2,9
3,1
3,3
3,5
3,7
3,9
time (µs)
time(µs)
V GE (0%) =
ꢀ15
15
V
V GE (0%) =
ꢀ15
15
V
V GE (100%) =
V C (100%) =
I C (100%) =
V
V GE (100%) =
V C (100%) =
I C (100%) =
V
600
398
0,40
0,76
V
600
398
0,24
0,48
V
A
A
t doff
=
=
ꢂs
ꢂs
t don
=
=
ꢂs
ꢂs
t E off
t E on
figure 3.
Boost IGBT
figure 4.
Boost IGBT
Turnꢀoff Switching Waveforms & definition of t f
Turnꢀon Switching Waveforms & definition of t r
125
200
Ic
fitted
%
%
VCE
IC
100
150
Ic
90%
75
VCE
100
Ic
60%
IC
90%
50
25
0
tr
Ic
40%
50
Ic 10%
IC 10%
0
tf
-25
-50
0,1
0,2
0,3
0,4
0,5
0,6
time (µs)
0,7
3,1
3,2
3,3
3,4
3,5
3,6
time(µs)
V C (100%) =
I C (100%) =
600
V
V C (100%) =
I C (100%) =
600
398
V
398
A
A
t f
=
0,099
ꢂs
t r
=
0,049
ꢂs
copyright Vincotech
27
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Switching Definitions Boost
figure 5.
Boost IGBT
figure 6.
Boost IGBT
Turnꢀoff Switching Waveforms & definition of t Eoff
Turnꢀon Switching Waveforms & definition of t Eon
125
125
%
%
IC
1%
Eon
Poff
Eoff
100
100
75
50
25
0
Pon
75
50
25
Uce 3%
Uge 90%
Uge 10%
0
tEoff
tEon
-25
-25
2,9
3,05
3,2
3,35
3,5
3,65
-0,2
0
0,2
0,4
0,6
0,8
1
time(µs)
time (µs)
P off (100%) =
E off (100%) =
238,67
37,62
0,76
kW
mJ
ꢂs
P on (100%) =
E on (100%) =
238,672 kW
13,39
0,48
mJ
t E off
=
t E on
=
ꢂs
figure 7.
Boost FWD
Turnꢀoff Switching Waveforms & definition of t rr
150
%
Id
100
trr
50
Ud
fitted
0
IRRM 10%
-50
IRRM 90%
IRRM 100%
-100
-150
2,9
3,1
3,3
3,5
3,7
3,9
time(µs)
V d (100%) =
I d (100%) =
I RRM (100%) =
600
V
398
A
ꢀ403
0,34
A
t rr
=
ꢂs
copyright Vincotech
28
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Switching Definitions Boost
figure 8.
Boost FWD
figure 9.
Boost FWD
Turnꢀon Switching Waveforms & definition of t Qrr
(t Qrr= integrating time for Q rr)
Turnꢀon Switching Waveforms & definition of t Erec
(t Erec= integrating time for E rec
)
150
%
125
%
Erec
Id
Qrr
100
75
50
25
0
100
tErec
tQint
50
0
-50
Prec
-25
-100
3
3,2
3,4
3,6
3,8
4
4,2
3
3,2
3,4
3,6
3,8
4
4,2
time(µs)
time(µs)
I d (100%) =
Q rr (100%) =
398
A
P rec (100%) =
E rec (100%) =
238,67
24,53
0,69
kW
mJ
ꢂs
58,83
0,69
ꢂC
ꢂs
t Qint
=
t E rec =
copyright Vincotech
29
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Ordering Code & Marking
Version
Ordering Code
without thermal paste
with thermal paste
70ꢀW224NIA400SHꢀM400P
70ꢀW224NIA400SHꢀM400P-/3/
Name
NNꢀNNNNNNNNNNNNNNꢀNNNNNNNN
Date code
UL & Vinco
Lot
Serial
Name
Text
Date code
Lot
Serial
WWYY
UL VIN
LLLLL
SSSS
Type&Ver
Lot number
Serial
Date code
Datamatrix
TTTTꢀTTT
LLLLL
SSSS
WWYY
Vincotech
UL
Outline
Pin table [mm]
Pin
X
Y
Function
Group
1.1
1.2
ꢀ2,15
ꢀ2,15
46,15
46,15
19,45
24,55
ꢀ7,65
ꢀ7,65
51,65
51,65
16,75
27,25
ꢀ2,55
ꢀ5,45
46,55
49,45
ꢀ4,8
84,85
81,95
84,85
81,95
93,05
93,05
70,05
67,15
70,05
67,15
75,35
75,35
28
G1ꢀ1
E1ꢀ1
G1ꢀ2
E1ꢀ2
T1
T1
T1
T1
T1
T1
T2
T2
T2
T2
D5
D5
T3
T3
T3
T3
T4
T4
T4
T4
1.3
1.4
1.5
DC+ desat
1.6
DC+ desat
G2ꢀ1
1.7
1.8
E2ꢀ1
1.9
G2ꢀ2
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
1.19
1.20
1.21
1.22
E2ꢀ2
GND desat
GND desat
G3ꢀ1
28
E3ꢀ1
28
G3ꢀ2
28
E3ꢀ2
50,85
49,05
50,85
49,05
89,8
G4ꢀ1
ꢀ1,6
E4ꢀ1
48,8
G4ꢀ2
45,6
E4ꢀ2
67,65
67,65
NTC1
86,7
NTC2
Low current connections
M4 screw
X3
Y3
Function
3.1
3.2
ꢀ39,1
ꢀ39,1
ꢀ39,1
83,1
83,1
83,1
ꢀ39,1
ꢀ39,1
ꢀ39,1
83,1
83,1
83,1
89,8
89,8
89,8
89,8
89,8
89,8
65,2
65,2
65,2
65,2
65,2
65,2
TR+
GND
DC+
TR+
3.3
3.4
3.5
GND
DC+
T2C
3.6
3.7
3.8
GND
Phase
T2C
3.9
3.10
3.11
3.12
GND
Phase
Power connections
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
ꢀ39,1
ꢀ39,1
ꢀ39,1
83,1
45,2
45,2
45,2
45,2
45,2
45,2
20,6
20,6
Phase
GND
DK
Function
M6 screw
X2
Y2
2.1
2.2
2.3
2.4
2.5
2.6
0
0
0
Phase
Phase
Phase
DC+
Phase
GND
DK
22
44
0
83,1
0
83,1
110,4
110,4
110,4
ꢀ39,1
ꢀ39,1
DCꢀ
22
44
GND
GND
DCꢀ
3.21
3.22
3.23
3.24
ꢀ39,1
83,1
83,1
83,1
20,6
20,6
20,6
20,6
TRꢀ
DCꢀ
GND
TRꢀ
copyright Vincotech
30
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Pinout
Identification
Current
ID
Component
Voltage
Function
Comment
T11, T12
D11, D12
T13, T14
D15, D16
D13, D14
D61, D62
Rt
IGBT
FWD
IGBT
FWD
FWD
FWD
NTC
1200 V
1200 V
1200 V
1200 V
1200 V
1200 V
400 A
400 A
400 A
300 A
300 A
50 A
Buck Switch
Buck Diode
Boost Switch
Boost Inverse Diode
Boost Diode
Snubber Diode
Thermistor
copyright Vincotech
31
10 Jul. 2019 / Revision 7
70ꢀW224NIA400SHꢀM400P
datasheet
Packaging instruction
Handling instruction
Standard packaging quantity (SPQ)
8
>SPQ
Standard
<SPQ
Sample
Handling instructions for VINco X4 packages see vincotech.com website.
Package data
Package data for VINco X4 packages see vincotech.com website.
UL recognition and file number
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.
Document No.:
Date:
Modification:
Pages
1
Marketing application voltage modified
10 Jul. 2019
70ꢀW224NIA400SHꢀM400PꢀD7-14
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to reader in good
faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations that may exist or occur.
Vincotech reserves the right to make any changes without further notice to any products to improve reliability, function or design. No representation,
guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said information or that the application or use of any of the same
will avoid hazards, accidents, losses, damages or injury of any kind to persons or property or that the same will not infringe third parties rights or give
desired results. It is reader’s sole responsibility to test and determine the suitability of the information and the product for reader’s intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c)
whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in significant
injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the
life support device or system, or to affect its safety or effectiveness.
copyright Vincotech
32
10 Jul. 2019 / Revision 7
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