SI7970DP-T1-E3 概述
Dual N-Channel 40-V (D-S) MOSFET 双N通道40 -V (D -S )的MOSFET 小信号场效应晶体管
SI7970DP-T1-E3 规格参数
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | SMALL OUTLINE, R-PDSO-C6 | Reach Compliance Code: | compliant |
风险等级: | 5.81 | Is Samacsys: | N |
外壳连接: | DRAIN | 配置: | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
最小漏源击穿电压: | 40 V | 最大漏极电流 (Abs) (ID): | 6.5 A |
最大漏极电流 (ID): | 6.5 A | 最大漏源导通电阻: | 0.019 Ω |
FET 技术: | METAL-OXIDE SEMICONDUCTOR | JESD-30 代码: | R-PDSO-C6 |
JESD-609代码: | e3 | 湿度敏感等级: | 1 |
元件数量: | 2 | 端子数量: | 6 |
工作模式: | ENHANCEMENT MODE | 最高工作温度: | 150 °C |
封装主体材料: | PLASTIC/EPOXY | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 3.5 W | 子类别: | FET General Purpose Power |
表面贴装: | YES | 端子面层: | Matte Tin (Sn) |
端子形式: | C BEND | 端子位置: | DUAL |
晶体管应用: | SWITCHING | 晶体管元件材料: | SILICON |
Base Number Matches: | 1 |
SI7970DP-T1-E3 数据手册
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PDF下载Si7970DP
Vishay Siliconix
New Product
Dual N-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
ꢀ
T
r
e
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c
h
F
E
T
ꢁ
P
o
w
e
r
M
O
S
F
E
T
ꢀ New Low Thermal Resistance PowerPAK
ꢀ Dual MOSFET for Space Savings
ꢀ 100% Rg Tested
ꢁ
Package
VDS (V)
rDS(on) (W)
ID (A)
0.019 @ V = 10 V
10.2
8.7
GS
40
0.026 @ V = 4.5 V
GS
APPLICATIONS
ꢀ Primary Side Switch
− Low Power Quarter Buck
ꢀ Intermediate BUS Switch
PowerPAK SO-8
D
1
D
2
S1
5.15 mm
6.15 mm
1
G1
2
S2
3
G2
4
D1
G
1
G
2
8
D1
7
D2
6
D2
5
S
1
S
Bottom View
Ordering Information: Si7970DP-T1—E3
2
N-Channel MOSFET
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T = 25ꢂ C UNLESS OTHERWISE NOTED)
A
Parameter
Symbol
10 secs
Steady State
Unit
Drain-Source Voltage
Gate-Source Voltage
V
40
DS
GS
V
V
"20
T
= 25ꢂC
= 70ꢂC
10.2
8.2
6.5
5.2
A
a
Continuous Drain Current (T = 150ꢂC)
I
D
J
T
A
Pulsed Drain Current
I
40
A
DM
a
Continuous Source Current (Diode Conduction)
Single Avalanche Current
I
2.9
1.2
S
L = 0.1 mH
I
AS
30
45
Single Avalanche Energy
E
mJ
AS
T
= 25ꢂC
= 70ꢂC
3.5
2.2
1.4
0.9
A
a
Maximum Power Dissipation
P
W
D
T
A
Operating Junction and Storage Temperature Range
T , T
−55 to 150
ꢂ
C
J
stg
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
t v 10 sec
Steady State
Steady State
26
60
35
85
a
Maximum Junction-to-Ambient
R
thJA
R
thJC
ꢂ
C
/
W
Maximum Junction-to-Case (Drain)
2.2
2.7
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 72826
S-40431—Rev. A, 15-Mar-04
www.vishay.com
1
Si7970DP
Vishay Siliconix
New Product
SPECIFICATIONS (T = 25ꢂ C UNLESS OTHERWISE NOTED)
J
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
V
V
= V , I = 250 mA
1
3
"100
1
V
GS(th)
DS
GS D
V
= 0 V, V = "20 V
GS
I
nA
DS
GSS
V
= 40 V, V = 0 V
GS
DS
Zero Gate Voltage Drain Current
I
mA
DSS
V
= 40 V, V = 0 V, T = 55ꢂC
5
DS
GS
J
a
On-State Drain Current
I
30
A
V
w 5 V, V = 10 V
GS
D(on)
DS
0.016
0.019
0.026
V
V
= 10 V, I = 10.2 A
D
GS
a
Drain-Source On-State Resistance
r
W
DS(on)
= 4.5 V, I = 8.7 A
0.021
26
GS
D
a
Forward Transconductance
g
fs
V
= 15 V, I = 10.2 A
S
V
DS
D
a
Diode Forward Voltage
V
I
S
= 2.9 A, V = 0 V
0.8
1.2
35
SD
GS
Dynamicb
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Q
g
23
4.4
5.6
2.3
15
15
50
16
30
Q
gs
Q
gd
V
=20 V, V = 10 V, I = 10.2 A
nC
DS
GS
D
f = 1 MHz
R
g
1
3.9
25
25
75
25
60
W
t
d(on)
t
r
V
= 20 V, R = 20 W
L
DD
I
^ 1 A, V
= 10 V, R = 6 W
GEN g
D
Turn-Off Delay Time
Fall Time
t
d(off)
ns
t
f
Source-Drain Reverse Recovery Time
t
rr
I = 2.9 A, di/dt = 100 A/ms
F
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25ꢂ C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
40
40
32
24
16
8
V
= 10 thru 6 V
GS
32
24
16
8
5 V
T
C
= 125ꢂC
25ꢂC
4 V
−55ꢂC
0
0
0
1
2
3
4
5
0
1
2
3
4
5
V
− Drain-to-Source Voltage (V)
V
− Gate-to-Source Voltage (V)
GS
DS
Document Number: 72826
S-40431—Rev. A, 15-Mar-04
www.vishay.com
2
Si7970DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25ꢂ C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
0.05
2000
1600
1200
800
400
0
0.04
0.03
C
iss
V
= 4.5 V
GS
V
= 10 V
0.02
0.01
0.00
GS
C
oss
C
rss
0
8
16
24
32
40
25
1.2
0
10
20
30
40
I
− Drain Current (A)
V
DS
− Drain-to-Source Voltage (V)
D
Gate Charge
On-Resistance vs. Junction Temperature
10
8
1.8
1.6
1.4
1.2
1.0
0.8
0.6
V
D
= 20 V
= 10.2 A
V
D
= 10 V
GS
I = 10.2 A
DS
I
6
4
2
0
0
5
10
15
20
−50 −25
0
25
50
75
100 125 150
Q
g
− Total Gate Charge (nC)
T
J
− Junction Temperature (ꢂC)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.06
0.05
0.04
0.03
0.02
0.01
0.00
40
10
T = 150ꢂC
J
I
= 10.2 A
D
T = 25ꢂC
J
1
0.0
0.2
0.4
0.6
0.8
1.0
0
2
4
6
8
10
V
− Source-to-Drain Voltage (V)
V
GS
− Gate-to-Source Voltage (V)
SD
Document Number: 72826
S-40431—Rev. A, 15-Mar-04
www.vishay.com
3
Si7970DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25ꢂ C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
100
80
0.2
−0.0
−0.2
−0.4
−0.6
−0.8
−1.0
−1.2
I
D
= 250 mA
60
40
20
0
−50 −25
0
25
50
75
100 125 150
0.001
0.01
0.1
10
100
600
1
T
J
− Temperature (ꢂC)
Time (sec)
Safe Operating Area, Junction-To-Ambient
I
100
DM
Limited
r
Limited
DS(on)
P(t) = 0.0001
10
1
P(t) = 0.001
P(t) = 0.01
I
D(on)
Limited
P(t) = 0.1
P(t) = 1
T
= 25ꢂC
A
P(t) = 10
0.1
Single Pulse
dc
BV
DSS
Limited
10
0.01
0.1
1
100
V
− Drain-to-Source Voltage (V)
DS
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Duty Cycle = 0.5
0.2
0.1
Notes:
P
DM
0.1
0.05
t
1
t
2
t
t
1
2
1. Duty Cycle, D =
0.02
2. Per Unit Base = R
= 60ꢂ C/W
thJA
(t)
3. T − T = P
Z
JM
A
DM thJA
Single Pulse
4. Surface Mounted
0.01
−4
−3
−2
−1
10
10
10
10
1
10
100
600
Square Wave Pulse Duration (sec)
Document Number: 72826
S-40431—Rev. A, 15-Mar-04
www.vishay.com
4
Si7970DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25ꢂ C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
−4
−3
−2
−1
10
10
10
Square Wave Pulse Duration (sec)
10
1
Document Number: 72826
S-40431—Rev. A, 15-Mar-04
www.vishay.com
5
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