AP9T15GJ [A-POWER]
N-CHANNEL ENHANCEMENT MODE POWER MOSFET; N沟道增强型功率MOSFET![AP9T15GJ](http://pdffile.icpdf.com/pdf1/p00169/img/icpdf/AP9T1_947012_icpdf.jpg)
型号: | AP9T15GJ |
厂家: | ![]() |
描述: | N-CHANNEL ENHANCEMENT MODE POWER MOSFET |
文件: | 总4页 (文件大小:110K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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AP9T15GH/J
Pb Free Plating Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Low Gate Charge
BVDSS
RDS(ON)
ID
20V
50mΩ
12.5A
D
S
▼ Capable of 2.5V gate drive
▼ Single Drive Requirement
▼ RoHS Compliant
G
Description
The Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, ultra low on-resistance and
cost-effectiveness.
G
D
S
TO-252(H)
G
D
TO-251(J)
S
Absolute Maximum Ratings
Symbol
Parameter
Drain-Source Voltage
Rating
20
Units
V
VDS
VGS
Gate-Source Voltage
±16
V
Continuous Drain Current, VGS @ 4.5V
Continuous Drain Current, VGS @ 4.5V
Pulsed Drain Current1
ID@TC=25℃
ID@TC=100℃
IDM
12.5
8
60
A
A
A
PD@TC=25℃
Total Power Dissipation
12.5
W
Linear Derating Factor
Storage Temperature Range
Operating Junction Temperature Range
0.1
-55 to 150
-55 to 150
W/℃
℃
℃
TSTG
TJ
Thermal Data
Symbol
Parameter
Value
10
110
Units
℃/W
℃/W
Rthj-c
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Max.
Max.
Rthj-a
Data and specifications subject to change without notice
200908052-1/4
AP9T15GH/J
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
Parameter
Test Conditions
VGS=0V, ID=250uA
Min. Typ. Max. Units
Drain-Source Breakdown Voltage
20
-
-
0.02
-
-
-
V
ΔBVDSS/ΔTj
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA
V/℃
mΩ
RDS(ON)
Static Drain-Source On-Resistance
VGS=4.5V, ID=6A
GS=2.5V, ID=5.2A
-
50
V
-
0.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
10
-
-
-
5
1
2
8
80
1.5
-
1
25
±100
8
-
-
-
-
-
-
mΩ
V
S
VGS(th)
gfs
IDSS
Gate Threshold Voltage
VDS=VGS, ID=250uA
VDS=5V, ID=10A
VDS=20V, VGS=0V
VDS=16V ,VGS=0V
VGS=±16V
ID=10A
VDS=16V
VGS=4.5V
VDS=10V
ID=10A
RG=3.3Ω,VGS=5V
RD=1Ω
VGS=0V
VDS=20V
Forward Transconductance
Drain-Source Leakage Current (Tj=25oC)
Drain-Source Leakage Current (Tj=150oC)
uA
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
Ω
IGSS
Gate-Source Leakage
Total Gate Charge2
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time2
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Rg
55
10
3
360 580
70
50
-
-
-
f=1.0MHz
f=1.0MHz
1.67
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min. Typ. Max. Units
VSD
trr
Qrr
Forward On Voltage2
IS=10A, VGS=0V
IS=10A, VGS=0V,
dI/dt=100A/µs
-
-
-
-
17
9
1.3
-
-
V
ns
nC
Reverse Recovery Time2
Reverse Recovery Charge
Notes:
1.Pulse width limited by safe operating area.
2.Pulse width <300us , duty cycle <2%.
2/4
AP9T15GH/J
40
30
20
10
0
50
40
30
20
10
0
T C =25 o C
T C = 150 o
C
5.0V
4.5V
5.0V
4.5V
3.5V
3.5V
2.5V
2.5V
V G =1.5V
V G =1.5V
0
1
2
3
4
5
0
1
2
3
4
5
6
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
45
1.8
1.6
1.4
1.2
1.0
0.8
0.6
I D =6A
I D = 5.2 A
43
41
39
37
35
33
V
G =4.5V
T
C =25 o C
Ω
Ω
Ω
Ω
0
2
4
6
8
10
-50
0
50
100
150
T j , Junction Temperature ( o C)
V GS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
10
2.0
1.5
1.0
0.5
0.0
8
6
T j =150 o C
T j =25 o C
4
2
0
-50
0
50
100
150
0
0.2
0.4
0.6
0.8
1
1.2
T j , Junction Temperature ( o C)
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3/4
AP9T15GH/J
f=1.0MHz
C iss
14
1000
100
10
I D =10A
12
V DS =10V
10
8
V
V
DS =12V
DS =16V
6
C oss
C rss
4
2
0
0
2
4
6
8
10
12
1
5
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
10
1
1
Duty factor = 0.5
100us
1ms
0.2
0.1
0.1
0.05
10ms
100ms
DC
0.02
PDM
0.01
t
T
T c =25 o C
Single Pulse
Duty Factor = t/T
Single Pulse
Peak Tj = PDM x Rthjc + TC
0.01
0.1
0.00001
0.0001
0.001
0.01
0.1
1
0.1
1
10
100
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
4.5V
QGD
QGS
10%
VGS
tr
t
Q
td(on)
d(off)tf
Charge
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
4/4
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