NSVMSA1162GT1G [ONSEMI]

PNP 双极晶体管;
NSVMSA1162GT1G
型号: NSVMSA1162GT1G
厂家: ONSEMI    ONSEMI
描述:

PNP 双极晶体管

放大器 光电二极管 小信号双极晶体管
文件: 总2页 (文件大小:42K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MSA1162GT1, MSA1162YT1  
General Purpose Amplifier  
Transistors  
PNP Surface Mount  
http://onsemi.com  
Features  
Moisture Sensitivity Level: 1  
ESD Rating: TBD  
Pb−Free Packages are Available  
COLLECTOR  
3
MAXIMUM RATINGS (T = 25°C)  
A
Rating  
Symbol  
Value  
60  
Unit  
Vdc  
2
1
Collector−Base Voltage  
V
(BR)CBO  
(BR)CEO  
(BR)EBO  
BASE  
EMITTER  
Collector−Emitter Voltage  
Emitter−Base Voltage  
V
V
50  
Vdc  
7.0  
Vdc  
3
Collector Current − Continuous  
Collector Current − Peak  
THERMAL CHARACTERISTICS  
I
100  
200  
mAdc  
mAdc  
C
2
I
1
C(P)  
SC−59  
Characteristic  
Power Dissipation  
Symbol  
Max  
200  
Unit  
mW  
°C  
CASE 318D  
STYLE 1  
P
D
Junction Temperature  
Storage Temperature  
T
150  
J
MARKING DIAGRAM  
T
stg  
55 to +150  
°C  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
62x M G  
G
1
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
62x = Device Code  
x = G or Y  
Characteristic  
Symbol  
Min  
Max  
Unit  
M
G
= Date Code*  
= Pb−Free Package  
Collector−Emitter Breakdown Voltage  
(I = 2.0 mAdc, I = 0)  
V
50  
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
C
B
(Note: Microdot may be in either location)  
Collector−Base Breakdown Voltage  
(I = 10 mAdc, I = 0)  
V
V
60  
7.0  
Vdc  
Vdc  
*Date Code orientation may vary depending  
upon manufacturing location.  
C
E
Emitter−Base Breakdown Voltage  
(I = 10 mAdc, I = 0)  
E
C
ORDERING INFORMATION  
Collector−Base Cutoff Current  
(V = 45 Vdc, I = 0)  
I
I
0.1  
mAdc  
CBO  
CEO  
Device*  
Package  
Shipping  
CB  
E
Collector−Emitter Cutoff Current  
(V = 10 Vdc, I = 0)  
MSA1162GT1  
MSA1162GT1G  
SC−59  
3000/Tape & Reel  
3000/Tape & Reel  
0.1  
2.0  
1.0  
mAdc  
mAdc  
mAdc  
CE  
B
(V = 30 Vdc, I = 0)  
SC−59  
(Pb−Free)  
CE  
B
(V = 30 Vdc, I = 0, T = 80°C)  
CE  
B
A
DC Current Gain (Note 1)  
(V = 6.0 Vdc, I = 2.0 mAdc)  
h
FE  
MSA1162YT1  
SC−59  
3000/Tape & Reel  
3000/Tape & Reel  
CE  
C
MSA1162YT1  
MSA1162GT1  
120  
200  
240  
400  
MSA1162YT1G  
SC−59  
(Pb−Free)  
Collector−Emitter Saturation Voltage  
(I = 100 mAdc, I = 10 mAdc)  
V
0.5  
Vdc  
CE(sat)  
*The “T1” suffix refers to a 7 inch reel.  
C
B
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
CurrentGain − Bandwidth Product  
(I = 1 mA, V = 10.0 V, f = 10 MHz)  
f
MHz  
T
80  
C
CE  
1. Pulse Test: Pulse Width 300 ms, D.C. 2%.  
1
©
Semiconductor Components Industries, LLC, 2006  
Publication Order Number:  
January, 2006 − Rev. 5  
MSA1162GT1/D  
 
MSA1162GT1, MSA1162YT1  
PACKAGE DIMENSIONS  
SC−59  
CASE 318D−04  
ISSUE G  
NOTES:  
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI  
D
Y14.5M, 1982.  
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.  
MILLIMETERS  
INCHES  
NOM  
3
DIM  
A
A1  
b
c
D
E
e
L
MIN  
1.00  
0.01  
0.35  
0.09  
2.70  
1.30  
1.70  
0.20  
2.50  
NOM  
1.15  
0.06  
0.43  
0.14  
2.90  
1.50  
1.90  
0.40  
2.80  
MAX  
1.30  
0.10  
0.50  
0.18  
3.10  
1.70  
2.10  
0.60  
3.00  
MIN  
MAX  
0.051  
0.004  
0.020  
0.007  
0.122  
0.067  
0.083  
0.024  
0.118  
E
H
E
0.039  
0.001  
0.014  
0.003  
0.106  
0.051  
0.067  
0.008  
0.099  
0.045  
0.002  
0.017  
0.005  
0.114  
0.059  
0.075  
0.016  
0.110  
2
1
b
e
H
E
STYLE 1:  
C
PIN 1. EMITTER  
2. BASE  
3. COLLECTOR  
A
L
A1  
SOLDERING FOOTPRINT*  
0.95  
0.037  
0.95  
0.037  
2.4  
0.094  
1.0  
0.039  
0.8  
0.031  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MSA1162GT1/D  

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