BD63821EFV_12_技术文档

Moter Drivers for Printers

Motor Drivers with Brush

for Printers

BD63821EFV, BD63823EFV

No.12010EAT06

●Description

BD63821EFV/BD63823EFV series are built-in 2 channel H-bridge circuits that can drive 2pcs DC brush motor or 1pcs

stepping motor.

These drivers facilitate low power consumption by the direct PWM or PWM constant current control.

●Feature

1) Single power supply input (rated voltage of 36V)

2) Rated output current (peak): 1.0A(1.5A), 2.0A(2.8A)

3) Low ON resistance DMOS output

4) Forward, Reverse, Brake, Open

5) Power save function

6) External PWM control

7) PWM constant current control (current limit function)

8) Built-in spike noise cancel function (external noise filter is unnecessary)

9) Driver for 2 DC brush motor

10) Driver for 1 stepping motor

11) FULL STEP, HALF STEP (driving stepping motor)

12) µSTEP drive by external DAC (driving stepping motor)

13) Built-in logic input pull-down resistor

14) Cross-conduction prevention circuit

15) Signal output of detecting the motor lock state (Wired-OR)

16) Signal output of detecting the abnormal states (Wired-OR)

17) Thermal shutdown circuit (TSD)

18) Over current protection circuit (OCP)

19) Under voltage lock out circuit (UVLO)

20) Over voltage lock out circuit (OVLO)

21) Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

22) Electrostatic discharge: 8kV (HBM specification)

23) Adjacent pins short protection

24) Inverted mounting protection

25) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package

26) Pin-compatible line-up

●Application

PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo

printer, FAX, scanner, mini printer, toy, and robot etc.

www.rohm.com

2012.02 - Rev.A

1/8

Technical Note

BD63821EFV, BD63823EFV

●Absolute maximum ratings (Ta=25°C)

Item

Supply voltage

Symbol

BD63823

BD63821

Unit

V

V_CC1,2

-0.3~+36.0

1

1.45^※

W

Power dissipation

Pd

2

4.70^※

W

Input voltage for control pin

RNF maximum voltage

Output current

V_IN

V_RNF

I_OUT

-0.3~+7.0

0.7

V

3

2.0^※

2.8^※

1.0^※

1.5^※

A/ch

V

4

3

Output current (peak)^※

I_OUTPEAK

V_FAULT

I_FAULT

T_opr

FAULT, LOCK voltage

-0.3~7.0

5

FAULT, LOCK current

mA

°C

Operating temperature range

Storage temperature range

Junction temperature

-25~+85

-55~+150

+150

T_stg

T_jmax

※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.

※2 4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.

※3 Do not, however exceed Pd, ASO and Tjmax=150°C.

※4 Pulse width tw≦20ms

●Operating conditions (Ta= -25~+85°C)

Item

Supply voltage

Input voltage for control pin

PWM input frequency

Symbol

V_CC1,2

V_IN

Min.

19

0

Typ.

24

-

Max.

Unit

V

28

5.5

100

F_IN

-

kHz

●Electrical characteristics (Unless otherwise specified Ta=25°C, V_CC1.2=24V)

Limit

Item

Symbol

Unit

Condition

Min.

Typ.

Max.

Whole

Circuit current at standby

Circuit current

I_CCST

I_CC

-

1.0

2.5

5.0

mA PS=0V

mA PS=IN1A=IN1B=5V

Control input (IN1A, IN1B, IN2A, IN2B, PS)

H level input voltage

V_INH

V_INL

I_INH

I_INL

2.0

-

0.8

100

-

V

L level input voltage

H level input current

35

-10

50

0

µA

V_IN=5V

V_IN=0V

L level input current

FAULT LOCK output (FAULT, LOCK)

Output low voltage

V_FAULT

-

50

-

100

10

mV I_FAULT=1mA

Output leak current

I_{FAULT_LEAK}

µA

V_FAULT=5V

Output (OUT1A, OUT1B, OUT2A, OUT2B)

Output on resistance (BD63823EFV)

Output on resistance (BD63821EFV)

Output leak current

I_OUT=1.5A,sum of upper and lower

I_OUT=0.5A,sum of upper and lower

R_ON

I_LEAK

-

0.65

1.90

-

0.90

2.50

10

Ω

µA

Current control

RNFXS input current

I_RNFS

I_RNF

-2.0

-40

-2.0

0

-0.1

-20

-0.1

-

µA

V

RNFXS=0V

RNFX=0V

VREFX=0V

RNFX input current

VREF input current

I_VREF

V_REF

t_ONMIN

-

VREF input voltage range

Minimum on time (Blank time)

3.0

0.7

1.5

µs

Current limit

Comparator threshold

V_CTH

0.57

0.60

0.63

V

VREFX=3V

www.rohm.com

2012.02 - Rev.A

2/8

Technical Note

BD63821EFV, BD63823EFV

●Terminal function and Application circuit diagram

Pin No.

Pin name

GND

Function

Ground terminal

Pin No.

15

Pin name

LOCK

Function

1

2

Motor lock signal output terminal

H bridge control terminal

OUT1B

H bridge output terminal

16

IN1A

Connection terminal of resistor

For output current detection

3

4

RNF1

17

18

IN1B

H bridge control terminal

Terminal for testing

Input terminal of current limit

comparator

RNF1S

TEST

5

6

7

8

9

OUT1A

NC

H bridge output terminal

Non connection

19

20

21

22

23

IN2A

IN2B

NC

H bridge control terminal

Non connection

VCC1

NC

Power supply terminal

Non connection

VCC2

NC

Power supply terminal

Non connection

GND

Ground terminal

Connection terminal of CR

for setting chopping frequency

10

11

12

CR

24

25

26

OUT2A

RNF2S

RNF2

H bridge output terminal

Input terminal of current limit

comparator

VREF1

VREF2

Current limit value setting terminal

Connection terminal of resistor

for output current detection

13

14

PS

Power save terminal

27

28

OUT2B

NC

H bridge output terminal

Non connection

FAULT

Fault signal output terminal

●Application circuit diagram

Constant voltage control or external PWM control (when not using the motor lock detection function)

3.3V or 5.0V

10kΩ

FAULT

VREF1

VREF2

＋

－

14

11

12

＋

－

1/5

Regulator

RNF1S

When using the fault output function

⇒Pull up resistor 5kΩ~100kΩ.

Not using

＋

－

＋

－

1/5

RNF2S

⇒Connect to GND.

TSD

OCP

Blank time

UVLO

OVLO

PWM control

Bypass capacitor.

Setting range is

100uF~470uF(electrolytic)

0.01uF~0.1uF(multilayer ceramic etc.)

Be sure to short VCC1 & VCC2.

LOCK

15

7

CR

10

OSC

Control input terminal.

VCC1

OUT1A

5

2

M

Forward

Reverse

BRAKE

Open

16

OUT1B

RNF1

IN1A

3

4

IN1B 17

100µF

0.1µF

RNF1S

VCC2

22

Power save terminal

Forward

Reverse

BRAKE

Open

OUT2A

19

24

27

IN2A

IN2B 20

OUT2B

RNF2

26

25

PS 13

Terminal for testing

Connect to GND.

RNF2S

GND

18

1,9

TEST

Fig.1Application circuit diagram of constant voltage control or external PWM control

(When not using the motor lock detection function)

www.rohm.com

2012.02 - Rev.A

3/8

Technical Note

BD63821EFV, BD63823EFV

●Points to notice for terminal description

○PS/ Power save terminal

PS can make circuit standby state and make motor output open

Please be careful of delay 40μs(max.) before it is returned from off state to normal state.

PS

State

POWER SAVE (STANDBY)

ACTIVE

L

H

○IN1A,I N1B, IN2A, IN2B/ H bridge control terminal

Input

Output

State

IN1A

IN2A

IN1B

IN2B

OUT1A

OUT2A

OUT1B

OUT2B

PS

L

X

L

X

L

OPEN

POWER SAVE (STANDBY)

STOP

H

OPEN

H

L

H

L

H

L

FORWARD

H

REVERSE

H

BRAKE

X: H or L

●Protection Circuits

○Thermal Shutdown (TSD)

This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C

(Typ.), the motor output becomes open. Also, when the temperature returns to under 150°C (Typ.), it automatically

returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat

overdrive can lead to destruction.

○Over Current Protection (OCP)

This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted

each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to open condition

when the regulated threshold current flows for 4μs (typ.). It returns with power reactivation or a reset of the PS terminal.

The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor

output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to

take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power

reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly and the IC may

generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over

current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as

a result, there is a possibility of destruction. Also, when current which is over the output current rating and under the OCP

detection current flows, the IC can heat up to over Tjmax=150°C and can deteriorate, so current which exceeds the

output rating should not be applied.

○Under Voltage Lock Out (UVLO)

This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the VCC terminal goes under 15V (Typ.), the motor output is set to open. This

switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit

does not operate during power save mode.

○Over Voltage Lock Out (OVLO)

This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This

switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc. Although

this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power

supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this

circuit does not operate during power save mode.

○Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a signal (IN1A, IN1B, IN2A, IN2B, PS, VREF1, VREF2) is input when there is no power supplied to this IC, there is a

function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from

these input terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the

circuit even when voltage is supplied to these input terminals while there is no power supply.

www.rohm.com

2012.02 - Rev.A

4/8

Technical Note

BD63821EFV, BD63823EFV

●Thermal derating curve

HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the

back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power

dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a

possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is

recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this

product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation

efficiency.

Measurement machine：TH156（Kuwano Electric）

Measurement condition：ROHM board

Board size：70mm*70mm*1.6mm

(With through holes on the board)

The exposed metal of the backside is connected to the board with solder.

5.0

4.70W

3.30W

4

3

Board①：1-layer board (Copper foil on the back 0mm)

Board②：2-layer board (Copper foil on the back 15mm*15mm)

Board③：2-layer board (Copper foil on the back 70mm*70mm)

Board④：4-layer board (Copper foil on the back 70mm*70mm)

4.0

3.0

2.0

1.0

Board①：θ_ja=86.2°C/W

Board②：θ_ja=67.6°C/W /W

Board③：θ_ja=37.9°C/W

Board④：θ_ja=26.6°C/W

1.85W

1.45W

2

1

0

25

50

75 85 100

125

150

Ambient temperature:Ta[°C]

Fig. 2 HTSSOP-B28 Thermal derating curve

www.rohm.com

2012.02 - Rev.A

5/8

Technical Note

BD63821EFV, BD63823EFV

●Operation Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If

any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply

lines. An external direction diode can be added.

(3) Power supply lines

As return of current regenerated by back EMF of FET output happens, take steps such as putting capacitor between

power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each

property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the

connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage

on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute

maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp

diode between the power supply and GND pins.

(4) GND potential

The potential of GND pin must be minimum potential in all operating conditions.

(5) Metal on the backside (Define the side where product markings are printed as front)

The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that

there is a possibility of malfunction or destruction if it is shorted with any potential other than GND.

(6) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

This IC exposes the metal on the backside of package. Note that this part is assumed to use after providing heat

dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation

pattern not only on the board surface but also the backside.

(7) Inter-pin shorts and mounting errors

When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper

attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be

caused by foreign matter entering between outputs or an output and the power supply or GND.

(8) Operation in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

(9) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(10) Thermal shutdown circuit

The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C, and higher,

coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal

operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect

peripheral equipment.

TSD on temperature [°C] (typ.)

175

Hysteresis temperature [°C] (typ.)

25

(11) Over current protection circuit

The IC has a built-in over current protection circuit (OCP circuit). The OCP circuit is designed only to shut the IC off to

prevent abnormal situations, when absolute maximum output current is exceeded. It is not designed to protect or

indemnify peripheral equipment. Do not use the OCP function to protect peripheral equipment.

(12) Inspection of the application board

During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility

that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a

measure again electrostatic discharge, it should be earthed during the assembly process and special care should be

taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power

supply should first be turned off and then removed before the inspection.

www.rohm.com

2012.02 - Rev.A

6/8

Technical Note

BD63821EFV, BD63823EFV

(13) Input terminal of IC

This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.

This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.

For example, when the resistance and transistor are connected to the terminal as shown in figure 3,

○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),

the P-N junction operates as a parasitic diode.

○Also, when GND＞(Terminal B) at the transistor (NPN)

The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned

parasitic diode.

Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The

operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.

Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage

that is lower than the GND (P substrate) to the input terminal.

Resistor

Transistor (NPN)

Pin A

Pin B

C

B

E

Pin A

C

E

B

N

P⁺

N

P⁺

P

P⁺

N

Parasitic

element

Parasitic

element

P substrate

GND

Parasitic element

Other adjacent elements

Fig. 3 Pattern diagram of parasitic element

(14) Ground Wiring Pattern

When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern of any external components, either.

(15) TEST pin

Be sure to connect TEST pin to GND.

www.rohm.com

2012.02 - Rev.A

7/8

Technical Note

BD63821EFV, BD63823EFV

●Ordering part number

E F

V

B D 6 3 8 2 1

-

E 2

パッケージ

EFV=HTSSOP-B28

包装、フォーミング仕様

形名

E2: リール状エンボステーピング

HTSSOP-B28

9.7 0.1

(MAX 10.05 include BURR)

Tape

Embossed carrier tape (with dry pack)

(5.5)

+

6

−4

°

Quantity

2500pcs

4°

28

15

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

14

+0.05

1PIN MARK

0.625

0.17

-

0.03

S

0.08

S

M

0.65

+0.05

Direction of feed

1pin

0.24

-

0.04

0.08

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

2012.02 - Rev.A

8/8

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1120

A


型号：	BD63821EFV_12
厂家：	ROHM
描述：	Moter Drivers for Printers Motor Drivers with Brush for Printers 与刷机的打印机打印机电机驱动器启动子驱动器驱动器电机
文件：	总9页 (文件大小：259K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD63821EFV_12 [ROHM]

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