BD63821EFV [ROHM]
Moter Drivers for Printers Motor Drivers with Brush for Printers; 与刷机的打印机打印机电机驱动器启动子驱动器型号: | BD63821EFV |
厂家: | ROHM |
描述: | Moter Drivers for Printers Motor Drivers with Brush for Printers |
文件: | 总9页 (文件大小:259K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Moter Drivers for Printers
Motor Drivers with Brush
for Printers
BD63821EFV, BD63823EFV
No.12010EAT06
●Description
BD63821EFV/BD63823EFV series are built-in 2 channel H-bridge circuits that can drive 2pcs DC brush motor or 1pcs
stepping motor.
These drivers facilitate low power consumption by the direct PWM or PWM constant current control.
●Feature
1) Single power supply input (rated voltage of 36V)
2) Rated output current (peak): 1.0A(1.5A), 2.0A(2.8A)
3) Low ON resistance DMOS output
4) Forward, Reverse, Brake, Open
5) Power save function
6) External PWM control
7) PWM constant current control (current limit function)
8) Built-in spike noise cancel function (external noise filter is unnecessary)
9) Driver for 2 DC brush motor
10) Driver for 1 stepping motor
11) FULL STEP, HALF STEP (driving stepping motor)
12) µSTEP drive by external DAC (driving stepping motor)
13) Built-in logic input pull-down resistor
14) Cross-conduction prevention circuit
15) Signal output of detecting the motor lock state (Wired-OR)
16) Signal output of detecting the abnormal states (Wired-OR)
17) Thermal shutdown circuit (TSD)
18) Over current protection circuit (OCP)
19) Under voltage lock out circuit (UVLO)
20) Over voltage lock out circuit (OVLO)
21) Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
22) Electrostatic discharge: 8kV (HBM specification)
23) Adjacent pins short protection
24) Inverted mounting protection
25) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package
26) Pin-compatible line-up
●Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo
printer, FAX, scanner, mini printer, toy, and robot etc.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
1/8
Technical Note
BD63821EFV, BD63823EFV
●Absolute maximum ratings (Ta=25°C)
Item
Supply voltage
Symbol
BD63823
BD63821
Unit
V
VCC1,2
-0.3~+36.0
1
1.45※
W
Power dissipation
Pd
2
4.70※
W
Input voltage for control pin
RNF maximum voltage
Output current
VIN
VRNF
IOUT
-0.3~+7.0
0.7
V
V
3
3
2.0※
2.8※
1.0※
1.5※
A/ch
A/ch
V
4
3
3
Output current (peak)※
IOUTPEAK
VFAULT
IFAULT
Topr
FAULT, LOCK voltage
-0.3~7.0
5
FAULT, LOCK current
mA
°C
°C
°C
Operating temperature range
Storage temperature range
Junction temperature
-25~+85
-55~+150
+150
Tstg
Tjmax
※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.
※2 4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.
※3 Do not, however exceed Pd, ASO and Tjmax=150°C.
※4 Pulse width tw≦20ms
●Operating conditions (Ta= -25~+85°C)
Item
Supply voltage
Input voltage for control pin
PWM input frequency
Symbol
VCC1,2
VIN
Min.
19
0
Typ.
24
-
Max.
Unit
V
V
28
5.5
100
FIN
-
-
kHz
●Electrical characteristics (Unless otherwise specified Ta=25°C, VCC1.2=24V)
Limit
Item
Symbol
Unit
Condition
Min.
Typ.
Max.
Whole
Circuit current at standby
Circuit current
ICCST
ICC
-
-
1.0
2.5
2.5
5.0
mA PS=0V
mA PS=IN1A=IN1B=5V
Control input (IN1A, IN1B, IN2A, IN2B, PS)
H level input voltage
VINH
VINL
IINH
IINL
2.0
-
-
-
-
0.8
100
-
V
V
L level input voltage
H level input current
35
-10
50
0
µA
µA
VIN=5V
VIN=0V
L level input current
FAULT LOCK output (FAULT, LOCK)
Output low voltage
VFAULT
-
-
50
-
100
10
mV IFAULT=1mA
Output leak current
IFAULT_LEAK
µA
VFAULT=5V
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output on resistance (BD63823EFV)
Output on resistance (BD63821EFV)
Output leak current
IOUT=1.5A,sum of upper and lower
IOUT =0.5A,sum of upper and lower
RON
RON
ILEAK
-
-
0.65
1.90
-
0.90
2.50
10
Ω
Ω
µA
Current control
RNFXS input current
IRNFS
IRNF
-2.0
-40
-2.0
0
-0.1
-20
-0.1
-
-
-
µA
µA
µA
V
RNFXS=0V
RNFX=0V
VREFX=0V
RNFX input current
VREF input current
IVREF
VREF
tONMIN
-
VREF input voltage range
Minimum on time (Blank time)
3.0
3.0
0.7
1.5
µs
Current limit
Comparator threshold
VCTH
0.57
0.60
0.63
V
VREFX=3V
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
2/8
Technical Note
BD63821EFV, BD63823EFV
●Terminal function and Application circuit diagram
Pin No.
Pin name
GND
Function
Ground terminal
Pin No.
15
Pin name
LOCK
Function
1
2
Motor lock signal output terminal
H bridge control terminal
OUT1B
H bridge output terminal
16
IN1A
Connection terminal of resistor
For output current detection
3
4
RNF1
17
18
IN1B
H bridge control terminal
Terminal for testing
Input terminal of current limit
comparator
RNF1S
TEST
5
6
7
8
9
OUT1A
NC
H bridge output terminal
Non connection
19
20
21
22
23
IN2A
IN2B
NC
H bridge control terminal
H bridge control terminal
Non connection
VCC1
NC
Power supply terminal
Non connection
VCC2
NC
Power supply terminal
Non connection
GND
Ground terminal
Connection terminal of CR
for setting chopping frequency
10
11
12
CR
24
25
26
OUT2A
RNF2S
RNF2
H bridge output terminal
Input terminal of current limit
comparator
VREF1
VREF2
Current limit value setting terminal
Current limit value setting terminal
Connection terminal of resistor
for output current detection
13
14
PS
Power save terminal
27
28
OUT2B
NC
H bridge output terminal
Non connection
FAULT
Fault signal output terminal
●Application circuit diagram
Constant voltage control or external PWM control (when not using the motor lock detection function)
3.3V or 5.0V
10kΩ
FAULT
VREF1
VREF2
+
-
14
11
12
+
-
1/5
Regulator
RNF1S
When using the fault output function
⇒Pull up resistor 5kΩ~100kΩ.
Not using
+
-
+
-
1/5
RNF2S
⇒Connect to GND.
TSD
OCP
Blank time
UVLO
OVLO
PWM control
Bypass capacitor.
Setting range is
100uF~470uF(electrolytic)
0.01uF~0.1uF(multilayer ceramic etc.)
Be sure to short VCC1 & VCC2.
LOCK
15
7
CR
10
OSC
Control input terminal.
VCC1
OUT1A
5
2
M
M
Forward
Reverse
BRAKE
Open
16
OUT1B
RNF1
IN1A
3
4
IN1B 17
100µF
0.1µF
RNF1S
VCC2
22
Power save terminal
Forward
Reverse
BRAKE
Open
OUT2A
19
24
27
IN2A
IN2B 20
OUT2B
RNF2
26
25
PS 13
Terminal for testing
Connect to GND.
RNF2S
GND
18
1,9
TEST
Fig.1Application circuit diagram of constant voltage control or external PWM control
(When not using the motor lock detection function)
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
3/8
Technical Note
BD63821EFV, BD63823EFV
●Points to notice for terminal description
○PS/ Power save terminal
PS can make circuit standby state and make motor output open
Please be careful of delay 40μs(max.) before it is returned from off state to normal state.
PS
State
POWER SAVE (STANDBY)
ACTIVE
L
H
○IN1A,I N1B, IN2A, IN2B/ H bridge control terminal
Input
Output
State
IN1A
IN2A
IN1B
IN2B
OUT1A
OUT2A
OUT1B
OUT2B
PS
L
X
L
X
L
OPEN
OPEN
POWER SAVE (STANDBY)
STOP
H
OPEN
OPEN
H
H
L
L
H
L
L
L
H
L
FORWARD
H
H
H
H
REVERSE
H
BRAKE
X: H or L
●Protection Circuits
○Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C
(Typ.), the motor output becomes open. Also, when the temperature returns to under 150°C (Typ.), it automatically
returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat
overdrive can lead to destruction.
○Over Current Protection (OCP)
This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted
each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to open condition
when the regulated threshold current flows for 4μs (typ.). It returns with power reactivation or a reset of the PS terminal.
The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor
output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to
take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power
reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly and the IC may
generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over
current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as
a result, there is a possibility of destruction. Also, when current which is over the output current rating and under the OCP
detection current flows, the IC can heat up to over Tjmax=150°C and can deteriorate, so current which exceeds the
output rating should not be applied.
○Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage. When the applied voltage to the VCC terminal goes under 15V (Typ.), the motor output is set to open. This
switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit
does not operate during power save mode.
○Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over
voltage. When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This
switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc. Although
this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power
supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this
circuit does not operate during power save mode.
○Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
If a signal (IN1A, IN1B, IN2A, IN2B, PS, VREF1, VREF2) is input when there is no power supplied to this IC, there is a
function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from
these input terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the
circuit even when voltage is supplied to these input terminals while there is no power supply.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
4/8
Technical Note
BD63821EFV, BD63823EFV
●Thermal derating curve
HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the
back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power
dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a
possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation
efficiency.
Measurement machine:TH156(Kuwano Electric)
Measurement condition:ROHM board
Board size:70mm*70mm*1.6mm
(With through holes on the board)
The exposed metal of the backside is connected to the board with solder.
5.0
4.70W
3.30W
4
3
Board①:1-layer board (Copper foil on the back 0mm)
Board②:2-layer board (Copper foil on the back 15mm*15mm)
Board③:2-layer board (Copper foil on the back 70mm*70mm)
Board④:4-layer board (Copper foil on the back 70mm*70mm)
4.0
3.0
2.0
1.0
Board①:θja=86.2°C/W
Board②:θja=67.6°C/W /W
Board③:θja=37.9°C/W
Board④:θja=26.6°C/W
1.85W
1.45W
2
1
0
25
50
75 85 100
125
150
Ambient temperature:Ta[°C]
Fig. 2 HTSSOP-B28 Thermal derating curve
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
5/8
Technical Note
BD63821EFV, BD63823EFV
●Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
(3) Power supply lines
As return of current regenerated by back EMF of FET output happens, take steps such as putting capacitor between
power supply and GND as an electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the
connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage
on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute
maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp
diode between the power supply and GND pins.
(4) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(5) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND. Be aware that
there is a possibility of malfunction or destruction if it is shorted with any potential other than GND.
(6) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
This IC exposes the metal on the backside of package. Note that this part is assumed to use after providing heat
dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation
pattern not only on the board surface but also the backside.
(7) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
(8) Operation in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(9) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(10) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.
TSD on temperature [°C] (typ.)
175
Hysteresis temperature [°C] (typ.)
25
(11) Over current protection circuit
The IC has a built-in over current protection circuit (OCP circuit). The OCP circuit is designed only to shut the IC off to
prevent abnormal situations, when absolute maximum output current is exceeded. It is not designed to protect or
indemnify peripheral equipment. Do not use the OCP function to protect peripheral equipment.
(12) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
6/8
Technical Note
BD63821EFV, BD63823EFV
(13) Input terminal of IC
This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 3,
○When GND>(Terminal A) at the resistance and GND>(Terminal B) at the transistor (NPN),
the P-N junction operates as a parasitic diode.
○Also, when GND>(Terminal B) at the transistor (NPN)
The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned
parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
C
B
E
Pin A
C
E
B
N
N
P+
N
P+
P
P
P+
P+
N
N
N
Parasitic
element
Parasitic
element
P substrate
P substrate
GND
GND
GND
GND
Parasitic element
Parasitic element
Other adjacent elements
Fig. 3 Pattern diagram of parasitic element
(14) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.
(15) TEST pin
Be sure to connect TEST pin to GND.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
7/8
Technical Note
BD63821EFV, BD63823EFV
●Ordering part number
E F
V
B D 6 3 8 2 1
-
E 2
パッケージ
EFV=HTSSOP-B28
包装、フォーミング仕様
形名
E2: リール状エンボステーピング
HTSSOP-B28
<Tape and Reel information>
9.7 0.1
(MAX 10.05 include BURR)
Tape
Embossed carrier tape (with dry pack)
(5.5)
+
6
−4
°
°
Quantity
2500pcs
4°
28
15
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
14
+0.05
1PIN MARK
0.625
0.17
-
0.03
S
0.08
S
M
0.65
+0.05
Direction of feed
1pin
0.24
-
0.04
0.08
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
8/8
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2012 ROHM Co., Ltd. All rights reserved.
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