SGM6609 [SGMICRO]
High-Current, Synchronous Boost Converter with Adjustable Current Limit;
| 型号： | SGM6609 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | High-Current, Synchronous Boost Converter with Adjustable Current Limit |
| 文件： | 总12页 (文件大小：675K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM6609
High-Current, Synchronous Boost
Converter with Adjustable Current Limit
GENERAL DESCRIPTION
FEATURES
The SGM6609 is a high-current, synchronous boost
DC/DC converter with a programmable peak current
limit. The peak current limit is programmed from 0.5A to
3.5A by an external resistor from ISET pin to ground.
The device also uses an external resistive divider to set
the output voltage from 3V to 5V.
● 2.4V to 5V Input Voltage Range
● 3V to 5V Adjustable Output Voltage
● 0.5A to 3.5A Programmable N-MOSFET Peak
Current Limit
● Up to 95%Efficiency
● 1.2MHz Switching Frequency
This device has the input current protection to avoid
overload of system power. When applying a large load
pulse, it uses a selectable large capacitor to ensure that
the output voltage meets the load power requirement.
At light loads, the light load switching frequency
modulation and low IQ help the device maintain high
efficiency. It also has the features like synchronous
boost rectification and internal compensation. And the
internal compensation offers a fast transient response
with no external components.
● Synchronous Boost Rectification and Internal
Compensation
● Reverse Current Blocking
● True Load Disconnection in Shutdown
● Power-Good Indication
● Programmable Over-Voltage Protection
● Over-Temperature and Short-Circuit Protection
● Available in a Green TDFN-3×3-12L Package
● -40℃ to +85℃ Operating Temperature Range
This device also integrates a reverse current blocking
to avoid current flowing back to the input. In shutdown
mode, the input and output are isolated by the true load
disconnection function. The device also includes
over-temperature protection, short-circuit protection
and programmable over-voltage protection.
APPLICATIONS
Industry and USB Modems
PC (PCMCIA) Modems Cards
PCI-E Modem Cards
WCDMA/Edge/GPRS/TD-SCDMA
CDMA/Evdo-A/Evdo-B
The SGM6609 is available in Green TDFN-3×3-12L
package and is rated over the -40 ℃ to +85 ℃
temperature range.
SG Micro Corp
FEBRUARY 2015 – REV. A
www.sg-micro.com
High Current Synchronous Boost
SGM6609
Converter with Adjustable Current Limit
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM
6609DF
XXXXX
SGM6609
TDFN-3×3-12L
-40℃ to +85℃
SGM6609YTDF12G/TR
Tape and Reel, 4000
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
X X X X X
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Input Supply Voltage Range................................ -0.3V to 6V
Supply Voltage on SW, VOUT, EN, FB,
PG
............................................................................. -0.3V to 6V
PGND to AGND................................................ -0.3V to 0.3V
Package Thermal Resistance
TDFN-3×3-12L, θJA................................................. 52.1℃/W
Junction Temperature...................................................150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)..............................260℃
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
ESD Susceptibility
HBM.............................................................................4000V
MM.................................................................................200V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range ...........................................2.4V to 5.0V
Operating Temperature Range .......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
FEBRUARY 2015
2
High Current Synchronous Boost
SGM6609
Converter with Adjustable Current Limit
PIN CONFIGURATION
(TOP VIEW)
SW
SW
EN
1
2
3
4
5
6
12 PGND
11 PGND
10 VOUT
GND
IN
9
8
7
ISET
FB
OVP
PG
AGND
TDFN-3×3-12L
PIN DESCRIPTION
PIN
NAME
SW
FUNCTION
Switching Node. Connect to the drain of internal N-MOSFET and source of internal P-MOSFET.
Connect an external power inductor.
1, 2
3
EN
Input Enable Pin. Logic high to enable this circuit and logic low to disable it.
Input Voltage. When starts up, this pin supplies the device.
4
IN
Over-Voltage Protection Pin. An external resistor divider is used to set the over-voltage threshold.
Short this pin to ground to stop this function.
5
OVP
Power-Good Signal (Active Low). When the feedback voltage exceeds 95% of the target voltage, this
pin is pulled low.
6
PG
AGND
FB
7
8
Non-Power Signal Ground Pin.
Feedback Input Pin. An external resistor divider is used to program the output voltage.
Peak Current Limit Programmable Input. An external resistor from this pin to ground is used to
program the low-side MOSFET peak current limit.
9
ISET
VOUT
PGND
GND
Boost Converter Output Voltage. Connect to the P-Channel synchronous MOSFET source. This pin is
bypassed to GND with a ceramic capacitor.
10
11, 12
Power Ground. Internally connect to the source of the low-side NMOSFET.
Power Ground Exposed Pad. Must be connected to ground plane.
Exposed
Pad
SG Micro Corp
www.sg-micro.com
FEBRUARY 2015
3
High Current Synchronous Boost
SGM6609
Converter with Adjustable Current Limit
ELECTRICAL CHARACTERISTICS
(VIN = 3.3V, VOUT = 3.8V, L = 2.2μH, AGND = PGND, TA = +25℃, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Voltage Range
VIN
2.4
5.0
V
V
Minimum Start-Up Voltage
Output Voltage Range
VIN(MIN)
VOUT
VUVLO
IQ
2.3
3.0
5.0
2.35
70
V
Input Under-Voltage Lockout
Quiescent Supply Current
Shutdown Supply Current
VIN Rising, Hysteresis = 0.2V
No-Load Current; Not Switching
VEN = GND, VIN = 5.0V
2.15
2.25
50
V
μA
μA
ISHDN
1
TA = +25℃, VFB = 600mV
TA = -40℃ to +85℃, VFB = 600mV
VFB = 0 to 1.0V
-2
-3
-1
+2
+3
+1
Feedback Accuracy
VFB
%
Feedback Leakage Current
Load Regulation
IFB
μA
%/A
%/V
V
VIN = 3.3V, VOUT = 3.8V,
0 to 2.5A Load
ΔVOUT/IOUT
ΔVOUT/VIN
VOVP
1
Line Regulation
VIN = 2.4V to VOUT, IOUT = 10mA
0.3
Output Over-Voltage Protection
Threshold
0.55
0.60
0.65
Switching Frequency
fSW
D
1.2
90
MHz
%
Maximum Duty Cycle
Minimum On-Time
tON(MIN)
RON(PMOS)
RON(NMOS)
ILIMPK
80
ns
High-side P-Channel On-Resistance
Low-side N-Channel On-Resistance
Low-side Peak Current Limit Threshold
Enable, Power-Good and Start-Up Features
Logic Input Threshold High for EN
Logic Input Threshold Low for EN
EN Input Low Current
140
80
mΩ
mΩ
A
TA = +25℃, RSET = 60.4kΩ
1.9
1.5
-1
2.55
3.2
VIH
VIL
IEN
V
V
0.4
4
VEN = GND or 5.0V
0.01
95
μA
%
Ω
Power-Good Threshold
FB Rising, Hysteresis = 10%
VFB = 0.62V, ISINK = 10μA
On-Resistance
RPG
450
PG
Thermal
Over-Temperature Shutdown Threshold
Over-Temperature Shutdown Hysteresis
TSD
Temperature Rising
150
20
℃
℃
THYS
SG Micro Corp
www.sg-micro.com
FEBRUARY 2015
4
High Current Synchronous Boost
SGM6609
Converter with Adjustable Current Limit
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.3V, VOUT = 3.8V, L = 2.2μH, AGND = PGND, TA = +25℃, unless otherwise noted.
Quiescent Current vs. Temperature
Open Loop
Quiescent Current vs. Input Voltage
Open Loop
70
65
60
55
50
45
40
35
30
70
65
60
55
50
45
40
35
30
TA = 85℃
TA = 25℃
TA = -40℃
-50
-25
0
25
50
75
100
2.4 2.7
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1
Input Voltage (V)
Temperature (℃)
Enable Threshold vs. Temperature
Enable Threshold vs. Input Voltage
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
VIH
VIH
VIL
VIL
-50
-25
0
25
50
75
100
2.4 2.7
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1
Input Voltage (V)
Temperature (℃)
Feedback Voltage vs. Temperature
Feedback Voltage vs. Input Voltage
0.609
0.606
0.603
0.600
0.597
0.594
0.591
0.609
0.606
0.603
0.600
0.597
0.594
0.591
-50
-25
0
25
50
75
100
2.4 2.7
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1
Input Voltage (V)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
FEBRUARY 2015
5
High Current Synchronous Boost
SGM6609
Converter with Adjustable Current Limit
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.3V, VOUT = 3.8V, L = 2.2μH, AGND = PGND, TA = +25℃, unless otherwise noted.
Load Regulation
Load Regulation
1.0
0.5
1.0
0.5
0.0
0.0
-0.5
-1.0
-1.5
-2.0
-0.5
-1.0
-1.5
-2.0
VIN = 2.4V
VIN = 2.7V
VIN = 3.0V
VIN = 3.3V
VIN = 4.2V
VIN = 2.4V
VIN = 2.7V
VIN = 3.0V
VIN = 3.3V
VOUT = 5.0V
1
VOUT = 3.8V
1
0.1
10
100
1000
10000
0.1
10
100
1000
10000
Output Current (mA)
Output Current (mA)
Efficiency vs. Output Current
Efficiency vs. Output Current
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.4V
VIN = 2.7V
VIN = 3.0V
VIN = 3.3V
VIN = 2.4V
VIN = 2.7V
VIN = 3.0V
VOUT = 3.8V
1
VOUT = 3.3V
1
0.1
10
100
1000
10000
0.1
10
100
1000
10000
Output Current (mA)
Output Current (mA)
Efficiency vs. Output Current
Switching Frequency vs. Temperature
1280
1240
1200
1160
1120
1080
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.4V
VIN = 2.7V
VIN = 3.0V
VIN = 3.3V
VIN = 4.2V
VOUT = 5.0V
1
0.1
10
100
1000
10000
-50
-25
0
25
50
75
100
Temperature (℃)
Output Current (mA)
SG Micro Corp
www.sg-micro.com
FEBRUARY 2015
6
High Current Synchronous Boost
SGM6609
Converter with Adjustable Current Limit
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.3V, VOUT = 3.8V, L = 2.2μH, AGND = PGND, TA = +25℃, unless otherwise noted.
RDS(ON)_P vs. Input Voltage
RDS(ON)_N vs. Input Voltage
190
170
150
130
110
90
110
100
90
TA = 85℃
TA = 25℃
TA = 85℃
TA = 25℃
80
70
TA = -40℃
TA = -40℃
60
70
50
2.4 2.7
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1
Input Voltage (V)
2.4 2.7
3
3.3 3.6 3.9 4.2 4.5 4.8 5.1
Input Voltage (V)
Output Ripple
Output Ripple
VIN = 3.3V, VOUT = 3.8V, IOUT = 500mA
VIN = 3.3V, VOUT = 3.8V, IOUT = 1mA
ISW
ISW
VOUT
VOUT
AC Coupled
AC Coupled
Time (400ns/div)
Time (100μs/div)
Load Transient Response
Line Transient Response
VIN = 2.8V to 3.4V
VIN = 3.3V, VOUT = 3.8V
V
OUT = 3.8V, IOUT = 0.3A
VOUT
VOUT
AC Coupled
VIN
IOUT
IOUT = 50mA to 500mA
Time (100μs/div)
Time (400μs/div)
SG Micro Corp
www.sg-micro.com
FEBRUARY 2015
7
High Current Synchronous Boost
SGM6609
Converter with Adjustable Current Limit
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.3V, VOUT = 3.8V, L = 2.2μH, AGND = PGND, TA = +25℃, unless otherwise noted.
Soft Start
VEN
VOUT
IIN
VIN = 3.6V, VOUT = 5V
OUT = 100mA
I
Time (200μs/div)
SG Micro Corp
www.sg-micro.com
FEBRUARY 2015
8
High Current Synchronous Boost
SGM6609
Converter with Adjustable Current Limit
TYPICAL APPLICATIONS
L
2.2μH
VIN
SW
IN
2.4V to 5.0V
CIN
10μF
VOUT
Continuous Load
RPG
100kΩ
OUT
CFF
6.8pF
COUT
22μF
RFB1
PG
EN
FB
SGM6609
10kΩ
ON
RFB2
OFF
OVP
PGND
AGND
RSET
ISET
L
2.2μH
VIN
SW
IN
2.4V to 5.0V
CIN
10μF
VOUT
High Load Plus
RPG
100kΩ
OUT
COUT2
UltraCap
or SuperCap
CFF
6.8pF
COUT1
22μF
RFB1
PG
FB
SGM6609
10kΩ
ON
RFB2
EN
OFF
OVP
RSET
PGND
AGND
ISET
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (FEBRUARY 2015) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
FEBRUARY 2015
9
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-3×3-12L
D
e
N7
N12
E1
N1
D1
k
E
N6
L
b
BOTTOM VIEW
TOP VIEW
2.55
1.60
2.8
A
A1
0.6
A2
SIDE VIEW
0.2
0.45
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
2.924
2.450
2.924
1.500
3.076
2.650
3.076
1.700
0.115
0.096
0.115
0.059
0.121
0.104
0.121
0.067
D1
E
E1
k
0.200 MIN
0.450 TYP
0.008 MIN
0.018 TYP
b
0.150
0.324
0.250
0.476
0.006
0.013
0.010
0.019
e
L
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00062.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-3×3-12L
13″
12.4
3.30
3.30
1.10
4.0
8.0
2.0
12.0
Q1
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
相关型号：
©2020 ICPDF网 联系我们和版权申明